Intel Roadmap Overview
August 20th 2008
Stephen L. Smith
Corporate Vice President
Director of Group Operations
Digital Enterprise Group
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS
AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO
FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED
NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD
CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All products, computer systems, dates, and figures specified are preliminary based on current
expectations, and are subject to change without notice
This information is provided "as is" with no warranties whatsoever, including any warranty of
merchantability, non-infringement, fitness for any particular purpose, or any warranty
otherwise arising out of any proposal, specification or sample.
The hardware vendor remains solely responsible for the design, sale and functionality of its
product, including any liability arising from product infringement or product warranty.
Intel, the Intel logo, Centrino, Centrino Duo, Celeron, Intel Core, Intel Core Duo Intel Viiv, and
Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
Other names and brands may be claimed as the property of others
Copyright © Intel Corporation 2008
Legal InformationLegal Information
Risk Factors
Intel’s Roadmap Update Meeting presentations may contain forward-looking
statements. All statements made that are not historical facts are subject to a
number of risks and uncertainties, and actual results may differ materially.
Please refer to our recent Earnings Release and Form 10-Q for more
information on the risk factors that could cause actual results to differ.
Agenda
Server Roadmap
Client Roadmap
Netbook / Nettop
Ultra Mobile
Server Products
2009
Intel®
Xeon®
Enterprise Roadmap
Stoakley Platform
45nm Quad-Core & Dual-Core
Intel® Xeon® Processor
(shipping)
Intel® 5400 Chipsets
65nm Quad-Core
Intel® Xeon® 7300 Series
45nm 6-core (Dunnington)
Intel® Xeon® 7400 Series
Intel® 7300 Chipset & OEM
Caneland Platform
Bensley & Cranberry Lake Platforms
Boxboro-EX Chipset
Nehalem-EX
Processor
Boxboro-EX Platform
Tylersburg & Dual-IOH Chipsets
Nehalem-EP Processor
Tylersburg Platform
45nm Quad-Core & Dual-Core
Intel® Xeon® Processor
(shipping)
Intel® 5000 P/V and 5100 P/V Chipsets
Tylersburg Chipset
Nehalem-EP Processor
Tylersburg Platform
Garlow Platform
45nm Quad-Core & Dual-Core Intel® Xeon® Processor
(shipping)
Intel® 3000 P/V Chipsets
Lynnfield Processor
Havendale Processor
2009 Platform
Ibex Peak Chipset
ExpandableExpandable
7000 Sequence7000 Sequence
Efficient PerformanceEfficient Performance
5000 Sequence5000 Sequence
EntryEntry
3000 Sequence3000 Sequence
Workstation & HPCWorkstation & HPC
5000 Sequence5000 Sequence
2008
All products, dates, and programs are based on current expectations and subject to change without notice.
Timeline refers to Intel component production dates
Enterprise: 2008 Nehalem Based
Two Socket System Architecture
Nehalem-EP Platform:
Two sockets each with Integrated
Memory Controller
Turbo mode operation
Intel®
QuickPath Architecture
DDR3 Memory: 3 Channel, 3 DIMMs
per channel
Intel®
Virtualization Technology
PCI Express* Gen 2
IntelIntel®® QuickPath InterconnectQuickPath Interconnect
PCI Express*PCI Express*
Gen 2Gen 2
X58X58
I/O HubI/O Hub
ICH 9/10ICH 9/10
Nehalem
EP
Nehalem
EP
* Other names and brands may be claimed as the property of others
World’s Most Adaptable Server Platform
Enterprise: 2009 Nehalem Based
Four Socket System ArchitecturePCIExpressPCIExpress**
Gen2Gen2
PCIExpressPCIExpress**
Gen2Gen2
I/OI/O
HubHub
I/OI/O
HubHub
IntelIntel®® QuickPath InterconnectQuickPath Interconnect
Nehalem
EX
Nehalem
EX
Nehalem
EX
Nehalem
EX
BoxboroBoxboro--EXEX BoxboroBoxboro--EXEX
Boxboro-EX Platform:
Four processors with Intel®
QuickPath Interconnects
PCI Express*
Gen 2, Integrated Memory Controller
* Other names and brands may be claimed as the property of others
Intel
®
Xeon
®
7400-based Server Platform Dunnington Extends
Caneland Technology Leadership
Latest Intel virtualization
capabilities
6 cores,16 MB L3 cache
– 4-core/large cache versions
available
Socket compatible with
Caneland platform
45nm Hi-K technology
1.9 billion transistors
Introduction Sep. 2008
Caneland with Dunnington delivers higher virtualization performance
for consolidation and data demanding applications offering more
cores, cache and large memory footprint
10
SPECjbbSPECjbb*2005*2005 –– JavaJava HotSpotHotSpot JVMJVM
531,669 bops531,669 bops
IntelIntel®® XeonXeon®® 7400 Series (Dunnington)7400 Series (Dunnington)
BestBest--ofof--class benchmark performanceclass benchmark performance
TPC Benchmark* CTPC Benchmark* C –– SQL Server*SQL Server*
634,825634,825 tpmCtpmC
First 1 million+ TPCFirst 1 million+ TPC--C result for Xeon!C result for Xeon!
4S/24C/24T, $1.10/tpcC - Availability September 15, 2008
8S TPC Benchmark* C8S TPC Benchmark* C –– DB2DB2
1,200,6321,200,632 tpmCtpmC
8S/48C/48T, $1.99/tpcC - Availability December 10, 2008
#1#1
44--socketsocket
TPC Benchmark* ETPC Benchmark* E –– SQL Server*SQL Server*
671.4671.4 tpsEtpsE
4S/24C/24T, $502/tpsE - Availability September 15, 2008
#1#1
44--socketsocket
SPECintSPECint*_rate2006*_rate2006
277 peak score277 peak score
#1#1
44--socketsocket
vConsolidatevConsolidate -- VMwareVMware* ESX* ESX
39% better**39% better**
#1#1
44--socketsocket
Expandable Server Leadership
**Intel Xeon X7460 (16M cache, 2.66GHz, 1066FSB) 6-Core compared
to Intel Xeon X7350 (4M cache, 2.93GHz, 1066FSB) Quad-Core.
Client Products
Santa Rosa & Montevina Platforms
45nm Mobile Intel® Core™2 Extreme processors
(Dual-Core shipping today, Quad-Core Q3’08)
Intel® 96x and 4 Series Chipsets Ibex Peak-M
Clarksfield Processor (4C/8T)
Calpella Platform
Santa Rosa & Montevina Platforms
45nm Intel® Core™2 Duo processors
(shipping)
Intel® 96x and 4 Series Chipsets
Ibex Peak-M
Clarksfield (4C/8T)
Auburndale (2C/4T)
Calpella Platform
Desktop Extreme /Desktop Extreme /
HighHigh--End DesktopEnd Desktop
DesktopDesktop
Performance /Performance /
MainstreamMainstream
MobileMobile
Performance /Performance /
MainstreamMainstream
Mobile ExtremeMobile Extreme
Intel Notebook / Desktop Roadmap
2009
2007 and 2008 Desktop Platforms
45nm Intel® Core™2 Extreme proc.
45nm Intel® Core™2 Quad proc.
(shipping)
Intel® X48, X38, P45, and P35 Chipsets Intel® X58 Express Chipset
Intel® Core i7 Extreme Processor (4C/8T)
Intel® Core i7 Processor (4C/8T)
X58 Platform
2007 & 2008 Desktop Platforms
45nm Intel® Core™2 Quad and Duo processors
(shipping)
Intel® 3 and 4 Series Chipsets
Ibex Peak
Lynnfield (4C/8T)
Havendale (2C/4T)
Nehalem Drives Next Wave of Leadership in the Client
Piketon / Kings Creek Platforms
2008
All products, dates, and programs are based on current expectations and subject to change without notice.
Timeline refers to Intel component production dates
Intel’s Most Advanced
Processors Ever!
INTRODUCING
NEW INTEL® CORE™
PROCESSOR FAMILY
2008 Nehalem Desktop Platform
Intel® Hyper-Threading Technology
– 4 cores, 8 threads
Turbo mode enabled
8M Intel® Smart Cache
Intel® QuickPath Interconnect
Extreme SKU has overspeed protection
removed for overclocking1
Integrated Memory Controller
– 3 Channels of DDR3 Memory
– 2 DIMMs per channel
Dual x16 PCI Express* Gen 2 configurable as
quad x8
Intel QuickPath InterconnectIntel QuickPath Interconnect
QPI
3Ch
DDR3
Discrete
Graphics
OR
The Intel® Core™ i7 Desktop Platform Architecture Delivers New
Levels of Performance and Bandwidth
X58 ChipsetX58 Chipset
( ICH10 )( ICH10 )
Intel® Core™ i7
Processor
2x16
4x8
* Other names and brands may be claimed as the property of others
1Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system
components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not
warranty, the operation of the processor beyond its specifications.
Ibex Peak
Processor
ICH10
CPU
ME
iGFX IMC
ME
DDR3
IMC
Display
DISPLAY Display
I/O
PCIe*
Graphics
iGFX
Graphics moves
into Processor
Memory Controller
moves into the
Processor
Display moves
into Ibex Peak
Intel® Manageability
Engine moves into
Ibex Peak
Intel® 4 Series Chipset
DMI
Intel®
Flexible Display
Interface
(Intel® FDI)
DMI
FSB
I/O
Mainstream Client Platform Partitioning
Today’s 3-Chip Solution New 2-Chip Solution
Smaller boards, lower power, simplified power delivery
Greater performance via higher integration (igfx/IMC)
** 2009 mainstream Nehalem processors available with and without igfx
2009 Mainstream Client Processors
New 2 Chip: Discrete GPU New 2 Chip: CPU/GPU OR Discrete GPU
Graphics
Ibex Peak
Lynnfield (4C/8T)
Clarksfield(4C/8T)
Memory
One Common Processor Socket & Platform
Havendale(2C/4T)
Auburndale(2C/4T)
Graphics
Memory
Ibex Peak
2x8
or
1x16
1x16
Netbook / Nettop
A New Category of Devices
Get a NetbookGet a Netbook
oror
NettopNettop
Get a NotebookGet a Notebook
oror
DesktopDesktop
*Other brand and names are the property of their respective owners
Entertainment, ProductivityEntertainment, Productivity
and Multitaskingand Multitasking
Want theWant the ““Best InternetBest Internet
Experience in Your PocketExperience in Your Pocket””??
Internet useInternet useMID: Infotainment,MID: Infotainment,
On The GoOn The Go
Get a MobileGet a Mobile
Internet DeviceInternet Device
Want a Richer, FullerWant a Richer, Fuller
Experience?Experience?
Want a Simple Device forWant a Simple Device for
Internet Use?Internet Use?
Target SPPTarget SPP
Netbook: ~$249Netbook: ~$249--349349
Nettop: ~$199Nettop: ~$199--299299
Nettop / Netbook Roadmap
Celeron 220Celeron 220
65nm65nm
Low CostLow Cost
Purpose BuiltPurpose Built
PlatformPlatform
IntelIntel®® AtomAtom
45nm45nm
Nettop SolutionsNettop Solutions
Lower PowerLower Power
Lower CostLower Cost
Single and Dual CoreSingle and Dual Core
SolutionsSolutions
ContinuedContinued
innovation at theinnovation at the
silicon and platformsilicon and platform
levellevel
20072007 20082008 2009+2009+
All products, computer systems, dates, and figures specified are preliminary based
on current expectations, and are subject to change without notice.
* DC on Nettop only
Intel® Atom™ Processor Based Platform
• New low-power architecture designed
from the ground up to enable simple,
purpose-built devices for the Internet
• Manufactured using Intel’s industry-
leading
Hi-K Metal Gate 45nm process
technology
• Single core and Dual core proc*
• With Intel®945GC and 945GSE chipsets
• 50+ OEM & ODM design wins
Available Today!
For Netbook and Nettop PlatformsFor Netbook and Nettop Platforms
* DC on Nettop only
Ultra Mobile
Ultra Mobile Roadmap
45nm45nm
Silverthorne andSilverthorne and
PoulsboPoulsbo
Responsive InternetResponsive Internet
ExperienceExperience
First Grounds UpFirst Grounds Up
Low Power CPU andLow Power CPU and
ChipsetChipset
45nm45nm
Projected >10XProjected >10X
Reduction In IdleReduction In Idle
Power Compared toPower Compared to
2008 Platform2008 Platform
First Entry IntoFirst Entry Into
Phone Form FactorsPhone Form Factors
32nm32nm
Higher Levels OfHigher Levels Of
IntegrationIntegration
Continued BenefitsContinued Benefits
From Leading EdgeFrom Leading Edge
ProcessProcess
20082008 2009/20102009/2010 FutureFuture
All products, computer systems, dates, and figures specified are preliminary based
on current expectations, and are subject to change without notice.
Thanks
Q & A
NEHALEMNEHALEM
processorsprocessors
TOCK
SANDYSANDY
BRIDGEBRIDGE
processorsprocessors
TOCK
WESTMEREWESTMERE
processorsprocessors
2009-10
32nm
TICK
Intel’s Tick Tock Development Model
2005-06
IntelIntel ®®
CoreCore™™ 2,2,
XeonXeon®®
processorsprocessors
IntelIntel®®
PentiumPentium®® D,D,
XeonXeon®®,,
CoreCore™™
processorsprocessors
65nm
TICK TOCK
2007-08
PENRYNPENRYN
processorsprocessors
45nm
TICK
Significant Market Opportunity For
Netbooks and Nettops
Emerging MarketsEmerging Markets Mature MarketsMature Markets
Majority of households surveyed in
emerging markets have zero PCs
Opportunity: First time buyer, primary device
Minority of households surveyed in
mature markets have > 1 PC
Opportunity: Nth time buyer, secondary device
Source: 2004-2006 Intel Consumer Tech Metrics Overview; Q4 2006 Results; Mercury Research, Jan 2008; Gartner Quarterly, Dec 2007; IDC Research, Dec 2007
*Survey limited to major cities in Emerging Markets and do not represent all emerging market populations
Segment expected to grow to over 100Mu by 2011
Diamondville
Integrated Board Solution
2008 2009
Higher Integration
Integrated Board Solution
Q9000 and E8000 Series
Core Micro-architecture on 45nm
Core Micro-architecture on 45nm
Lynnfield (4C/8T)
Havendale (2C/4T)
Ibex Peak
Nehalem Based
Basic
Value
Performance
Extreme
Mainstream
Client: 2008 2009 Desktop Transition
Core i7 ExtremeCore i7 Extreme
Core i7Core i7
Core i7Core i7
Intel® Core i7 (4c/8T)
Intel® X58
Nehalem Based

Intel Roadmap

  • 1.
    Intel Roadmap Overview August20th 2008 Stephen L. Smith Corporate Vice President Director of Group Operations Digital Enterprise Group
  • 2.
    INFORMATION IN THISDOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice This information is provided "as is" with no warranties whatsoever, including any warranty of merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification or sample. The hardware vendor remains solely responsible for the design, sale and functionality of its product, including any liability arising from product infringement or product warranty. Intel, the Intel logo, Centrino, Centrino Duo, Celeron, Intel Core, Intel Core Duo Intel Viiv, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other names and brands may be claimed as the property of others Copyright © Intel Corporation 2008 Legal InformationLegal Information
  • 3.
    Risk Factors Intel’s RoadmapUpdate Meeting presentations may contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our recent Earnings Release and Form 10-Q for more information on the risk factors that could cause actual results to differ.
  • 4.
  • 5.
  • 6.
    2009 Intel® Xeon® Enterprise Roadmap Stoakley Platform 45nmQuad-Core & Dual-Core Intel® Xeon® Processor (shipping) Intel® 5400 Chipsets 65nm Quad-Core Intel® Xeon® 7300 Series 45nm 6-core (Dunnington) Intel® Xeon® 7400 Series Intel® 7300 Chipset & OEM Caneland Platform Bensley & Cranberry Lake Platforms Boxboro-EX Chipset Nehalem-EX Processor Boxboro-EX Platform Tylersburg & Dual-IOH Chipsets Nehalem-EP Processor Tylersburg Platform 45nm Quad-Core & Dual-Core Intel® Xeon® Processor (shipping) Intel® 5000 P/V and 5100 P/V Chipsets Tylersburg Chipset Nehalem-EP Processor Tylersburg Platform Garlow Platform 45nm Quad-Core & Dual-Core Intel® Xeon® Processor (shipping) Intel® 3000 P/V Chipsets Lynnfield Processor Havendale Processor 2009 Platform Ibex Peak Chipset ExpandableExpandable 7000 Sequence7000 Sequence Efficient PerformanceEfficient Performance 5000 Sequence5000 Sequence EntryEntry 3000 Sequence3000 Sequence Workstation & HPCWorkstation & HPC 5000 Sequence5000 Sequence 2008 All products, dates, and programs are based on current expectations and subject to change without notice. Timeline refers to Intel component production dates
  • 7.
    Enterprise: 2008 NehalemBased Two Socket System Architecture Nehalem-EP Platform: Two sockets each with Integrated Memory Controller Turbo mode operation Intel® QuickPath Architecture DDR3 Memory: 3 Channel, 3 DIMMs per channel Intel® Virtualization Technology PCI Express* Gen 2 IntelIntel®® QuickPath InterconnectQuickPath Interconnect PCI Express*PCI Express* Gen 2Gen 2 X58X58 I/O HubI/O Hub ICH 9/10ICH 9/10 Nehalem EP Nehalem EP * Other names and brands may be claimed as the property of others World’s Most Adaptable Server Platform
  • 8.
    Enterprise: 2009 NehalemBased Four Socket System ArchitecturePCIExpressPCIExpress** Gen2Gen2 PCIExpressPCIExpress** Gen2Gen2 I/OI/O HubHub I/OI/O HubHub IntelIntel®® QuickPath InterconnectQuickPath Interconnect Nehalem EX Nehalem EX Nehalem EX Nehalem EX BoxboroBoxboro--EXEX BoxboroBoxboro--EXEX Boxboro-EX Platform: Four processors with Intel® QuickPath Interconnects PCI Express* Gen 2, Integrated Memory Controller * Other names and brands may be claimed as the property of others
  • 9.
    Intel ® Xeon ® 7400-based Server PlatformDunnington Extends Caneland Technology Leadership Latest Intel virtualization capabilities 6 cores,16 MB L3 cache – 4-core/large cache versions available Socket compatible with Caneland platform 45nm Hi-K technology 1.9 billion transistors Introduction Sep. 2008 Caneland with Dunnington delivers higher virtualization performance for consolidation and data demanding applications offering more cores, cache and large memory footprint
  • 10.
    10 SPECjbbSPECjbb*2005*2005 –– JavaJavaHotSpotHotSpot JVMJVM 531,669 bops531,669 bops IntelIntel®® XeonXeon®® 7400 Series (Dunnington)7400 Series (Dunnington) BestBest--ofof--class benchmark performanceclass benchmark performance TPC Benchmark* CTPC Benchmark* C –– SQL Server*SQL Server* 634,825634,825 tpmCtpmC First 1 million+ TPCFirst 1 million+ TPC--C result for Xeon!C result for Xeon! 4S/24C/24T, $1.10/tpcC - Availability September 15, 2008 8S TPC Benchmark* C8S TPC Benchmark* C –– DB2DB2 1,200,6321,200,632 tpmCtpmC 8S/48C/48T, $1.99/tpcC - Availability December 10, 2008 #1#1 44--socketsocket TPC Benchmark* ETPC Benchmark* E –– SQL Server*SQL Server* 671.4671.4 tpsEtpsE 4S/24C/24T, $502/tpsE - Availability September 15, 2008 #1#1 44--socketsocket SPECintSPECint*_rate2006*_rate2006 277 peak score277 peak score #1#1 44--socketsocket vConsolidatevConsolidate -- VMwareVMware* ESX* ESX 39% better**39% better** #1#1 44--socketsocket Expandable Server Leadership **Intel Xeon X7460 (16M cache, 2.66GHz, 1066FSB) 6-Core compared to Intel Xeon X7350 (4M cache, 2.93GHz, 1066FSB) Quad-Core.
  • 11.
  • 12.
    Santa Rosa &Montevina Platforms 45nm Mobile Intel® Core™2 Extreme processors (Dual-Core shipping today, Quad-Core Q3’08) Intel® 96x and 4 Series Chipsets Ibex Peak-M Clarksfield Processor (4C/8T) Calpella Platform Santa Rosa & Montevina Platforms 45nm Intel® Core™2 Duo processors (shipping) Intel® 96x and 4 Series Chipsets Ibex Peak-M Clarksfield (4C/8T) Auburndale (2C/4T) Calpella Platform Desktop Extreme /Desktop Extreme / HighHigh--End DesktopEnd Desktop DesktopDesktop Performance /Performance / MainstreamMainstream MobileMobile Performance /Performance / MainstreamMainstream Mobile ExtremeMobile Extreme Intel Notebook / Desktop Roadmap 2009 2007 and 2008 Desktop Platforms 45nm Intel® Core™2 Extreme proc. 45nm Intel® Core™2 Quad proc. (shipping) Intel® X48, X38, P45, and P35 Chipsets Intel® X58 Express Chipset Intel® Core i7 Extreme Processor (4C/8T) Intel® Core i7 Processor (4C/8T) X58 Platform 2007 & 2008 Desktop Platforms 45nm Intel® Core™2 Quad and Duo processors (shipping) Intel® 3 and 4 Series Chipsets Ibex Peak Lynnfield (4C/8T) Havendale (2C/4T) Nehalem Drives Next Wave of Leadership in the Client Piketon / Kings Creek Platforms 2008 All products, dates, and programs are based on current expectations and subject to change without notice. Timeline refers to Intel component production dates
  • 13.
    Intel’s Most Advanced ProcessorsEver! INTRODUCING NEW INTEL® CORE™ PROCESSOR FAMILY
  • 14.
    2008 Nehalem DesktopPlatform Intel® Hyper-Threading Technology – 4 cores, 8 threads Turbo mode enabled 8M Intel® Smart Cache Intel® QuickPath Interconnect Extreme SKU has overspeed protection removed for overclocking1 Integrated Memory Controller – 3 Channels of DDR3 Memory – 2 DIMMs per channel Dual x16 PCI Express* Gen 2 configurable as quad x8 Intel QuickPath InterconnectIntel QuickPath Interconnect QPI 3Ch DDR3 Discrete Graphics OR The Intel® Core™ i7 Desktop Platform Architecture Delivers New Levels of Performance and Bandwidth X58 ChipsetX58 Chipset ( ICH10 )( ICH10 ) Intel® Core™ i7 Processor 2x16 4x8 * Other names and brands may be claimed as the property of others 1Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.
  • 15.
    Ibex Peak Processor ICH10 CPU ME iGFX IMC ME DDR3 IMC Display DISPLAYDisplay I/O PCIe* Graphics iGFX Graphics moves into Processor Memory Controller moves into the Processor Display moves into Ibex Peak Intel® Manageability Engine moves into Ibex Peak Intel® 4 Series Chipset DMI Intel® Flexible Display Interface (Intel® FDI) DMI FSB I/O Mainstream Client Platform Partitioning Today’s 3-Chip Solution New 2-Chip Solution Smaller boards, lower power, simplified power delivery Greater performance via higher integration (igfx/IMC) ** 2009 mainstream Nehalem processors available with and without igfx
  • 16.
    2009 Mainstream ClientProcessors New 2 Chip: Discrete GPU New 2 Chip: CPU/GPU OR Discrete GPU Graphics Ibex Peak Lynnfield (4C/8T) Clarksfield(4C/8T) Memory One Common Processor Socket & Platform Havendale(2C/4T) Auburndale(2C/4T) Graphics Memory Ibex Peak 2x8 or 1x16 1x16
  • 17.
  • 18.
    A New Categoryof Devices Get a NetbookGet a Netbook oror NettopNettop Get a NotebookGet a Notebook oror DesktopDesktop *Other brand and names are the property of their respective owners Entertainment, ProductivityEntertainment, Productivity and Multitaskingand Multitasking Want theWant the ““Best InternetBest Internet Experience in Your PocketExperience in Your Pocket””?? Internet useInternet useMID: Infotainment,MID: Infotainment, On The GoOn The Go Get a MobileGet a Mobile Internet DeviceInternet Device Want a Richer, FullerWant a Richer, Fuller Experience?Experience? Want a Simple Device forWant a Simple Device for Internet Use?Internet Use? Target SPPTarget SPP Netbook: ~$249Netbook: ~$249--349349 Nettop: ~$199Nettop: ~$199--299299
  • 19.
    Nettop / NetbookRoadmap Celeron 220Celeron 220 65nm65nm Low CostLow Cost Purpose BuiltPurpose Built PlatformPlatform IntelIntel®® AtomAtom 45nm45nm Nettop SolutionsNettop Solutions Lower PowerLower Power Lower CostLower Cost Single and Dual CoreSingle and Dual Core SolutionsSolutions ContinuedContinued innovation at theinnovation at the silicon and platformsilicon and platform levellevel 20072007 20082008 2009+2009+ All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. * DC on Nettop only
  • 20.
    Intel® Atom™ ProcessorBased Platform • New low-power architecture designed from the ground up to enable simple, purpose-built devices for the Internet • Manufactured using Intel’s industry- leading Hi-K Metal Gate 45nm process technology • Single core and Dual core proc* • With Intel®945GC and 945GSE chipsets • 50+ OEM & ODM design wins Available Today! For Netbook and Nettop PlatformsFor Netbook and Nettop Platforms * DC on Nettop only
  • 21.
  • 22.
    Ultra Mobile Roadmap 45nm45nm SilverthorneandSilverthorne and PoulsboPoulsbo Responsive InternetResponsive Internet ExperienceExperience First Grounds UpFirst Grounds Up Low Power CPU andLow Power CPU and ChipsetChipset 45nm45nm Projected >10XProjected >10X Reduction In IdleReduction In Idle Power Compared toPower Compared to 2008 Platform2008 Platform First Entry IntoFirst Entry Into Phone Form FactorsPhone Form Factors 32nm32nm Higher Levels OfHigher Levels Of IntegrationIntegration Continued BenefitsContinued Benefits From Leading EdgeFrom Leading Edge ProcessProcess 20082008 2009/20102009/2010 FutureFuture All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
  • 23.
  • 24.
    NEHALEMNEHALEM processorsprocessors TOCK SANDYSANDY BRIDGEBRIDGE processorsprocessors TOCK WESTMEREWESTMERE processorsprocessors 2009-10 32nm TICK Intel’s Tick TockDevelopment Model 2005-06 IntelIntel ®® CoreCore™™ 2,2, XeonXeon®® processorsprocessors IntelIntel®® PentiumPentium®® D,D, XeonXeon®®,, CoreCore™™ processorsprocessors 65nm TICK TOCK 2007-08 PENRYNPENRYN processorsprocessors 45nm TICK
  • 25.
    Significant Market OpportunityFor Netbooks and Nettops Emerging MarketsEmerging Markets Mature MarketsMature Markets Majority of households surveyed in emerging markets have zero PCs Opportunity: First time buyer, primary device Minority of households surveyed in mature markets have > 1 PC Opportunity: Nth time buyer, secondary device Source: 2004-2006 Intel Consumer Tech Metrics Overview; Q4 2006 Results; Mercury Research, Jan 2008; Gartner Quarterly, Dec 2007; IDC Research, Dec 2007 *Survey limited to major cities in Emerging Markets and do not represent all emerging market populations Segment expected to grow to over 100Mu by 2011
  • 26.
    Diamondville Integrated Board Solution 20082009 Higher Integration Integrated Board Solution Q9000 and E8000 Series Core Micro-architecture on 45nm Core Micro-architecture on 45nm Lynnfield (4C/8T) Havendale (2C/4T) Ibex Peak Nehalem Based Basic Value Performance Extreme Mainstream Client: 2008 2009 Desktop Transition Core i7 ExtremeCore i7 Extreme Core i7Core i7 Core i7Core i7 Intel® Core i7 (4c/8T) Intel® X58 Nehalem Based