A Silicon-to-System Thermo-Mechanical Review of ElectronicsKamal Karimanal
A Silicon-to-System Review of Thermo-Mechanical Considerations in Electronics
Author: Kamal Karimanal, Cielution LLC
Thermal and Mechanical challenges to IC package reliability has been addressed with a sufficiently working system of information exchange across a supply chain that spans the foundries to system level assembly plants.The never ending market demand for miniaturization, performance, functionality and cost reduction invariably translates to manufacturing, design, assembly, and reliability challenges to the engineer. Within the Thermal and Mechanical realm these challenges manifest to the engineer in the form of seemingly disconnected problems areas such as BEOL yield, flipchip interconnect reliability, warpage mitigation, heat sink retention design, interface choice, thermally aware board and chassis layout, fan sizing and system level optimization. Evolving technology also introduces newer puzzles such as heterogeneous packaging using 3D ICs. The talk will focus on the tools, methodologies and information exchange protocols used by the thermal management and mechanical reliability professionals across the supply chain to address the various challenges.
A Silicon-to-System Thermo-Mechanical Review of ElectronicsKamal Karimanal
A Silicon-to-System Review of Thermo-Mechanical Considerations in Electronics
Author: Kamal Karimanal, Cielution LLC
Thermal and Mechanical challenges to IC package reliability has been addressed with a sufficiently working system of information exchange across a supply chain that spans the foundries to system level assembly plants.The never ending market demand for miniaturization, performance, functionality and cost reduction invariably translates to manufacturing, design, assembly, and reliability challenges to the engineer. Within the Thermal and Mechanical realm these challenges manifest to the engineer in the form of seemingly disconnected problems areas such as BEOL yield, flipchip interconnect reliability, warpage mitigation, heat sink retention design, interface choice, thermally aware board and chassis layout, fan sizing and system level optimization. Evolving technology also introduces newer puzzles such as heterogeneous packaging using 3D ICs. The talk will focus on the tools, methodologies and information exchange protocols used by the thermal management and mechanical reliability professionals across the supply chain to address the various challenges.
Choosing the right PCB laminate is key to a quality product, You must consider application, assembly techniques, etc. But don't get caught by the "latest & greatest" fad. Make sensible decisions and save yourself money without compromising quality.
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
Metal bonding alternatives to frit and anodic technologies for wlpSUSS MicroTec
* Overview of frit and anodic bond processing
* Mechanics of metal bonding options
* Process requirement comparisons
* Hermetic capabilities
* Equipment requirements for metal bonding
More technical papers on www.suss.com
We, Asp Ultra Coating, Pune are counted amongst the leading service providers of a wide range of metal polishing, nickel chrome plating, black nickel plating, satin nickel plating, metal buffing and glass bead blasting services, coating services, ED coating, powder coating services, industrial coating services. These coating services, ED coating, powder coating services, industrial coating services are catering to the requirements of chemicals, machinery, food and pharmaceutical industries. Apart from this, we also offer silver plating, tin plating nickel chrome plating, black nickel plating, satin nickel plating and railing fabrication services.
Direct Bond Interconnect (DBI) Technology as an Alternative to Thermal Compre...Invensas
DBI® is a low temperature hybrid direct bonding technology that allows wafers or die to be bonded with exceptionally fine pitch 3D electrical interconnect.
UV-curable polyurethane dispersions (UV-PUDs) have become a well established and commercially successful class of products because of their combination of low environmental impact, range of achievable properties and ease of use. This presentation provides an overview of Sartomer's UV-PUDs, including end applications, liquid properties, processing and curing conditions, performance rankings and other features. For more information, go to www.sartomer.com and follow Sartomer on Twitter @SartomerGlobal.
What is CAF?
A growth consisting of a conductive copper-containing salt. It is created electrochemically and grows from the anode toward the cathode subsurface along the epoxy/glass interface.
Conductive Anodic Filament (CAF) formation does happen
o When it happens, it can cause a lot of pain
CAF behavior is relatively stable
o Limited change in key PCB technology (pitch, materials,
assembly)
CAF mitigation is well known (execute it!)
o Evaluate your designs
o Qualify your suppliers
TRINAR® is a high-performance fluoropolymer coating containing 70% polyvinylidene (PVDF) resin.
This unique resin is combined with other proprietary resins and the highest quality ceramic and select
inorganic pigments for the finest metal finish available.
Choosing the right PCB laminate is key to a quality product, You must consider application, assembly techniques, etc. But don't get caught by the "latest & greatest" fad. Make sensible decisions and save yourself money without compromising quality.
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
Metal bonding alternatives to frit and anodic technologies for wlpSUSS MicroTec
* Overview of frit and anodic bond processing
* Mechanics of metal bonding options
* Process requirement comparisons
* Hermetic capabilities
* Equipment requirements for metal bonding
More technical papers on www.suss.com
We, Asp Ultra Coating, Pune are counted amongst the leading service providers of a wide range of metal polishing, nickel chrome plating, black nickel plating, satin nickel plating, metal buffing and glass bead blasting services, coating services, ED coating, powder coating services, industrial coating services. These coating services, ED coating, powder coating services, industrial coating services are catering to the requirements of chemicals, machinery, food and pharmaceutical industries. Apart from this, we also offer silver plating, tin plating nickel chrome plating, black nickel plating, satin nickel plating and railing fabrication services.
Direct Bond Interconnect (DBI) Technology as an Alternative to Thermal Compre...Invensas
DBI® is a low temperature hybrid direct bonding technology that allows wafers or die to be bonded with exceptionally fine pitch 3D electrical interconnect.
UV-curable polyurethane dispersions (UV-PUDs) have become a well established and commercially successful class of products because of their combination of low environmental impact, range of achievable properties and ease of use. This presentation provides an overview of Sartomer's UV-PUDs, including end applications, liquid properties, processing and curing conditions, performance rankings and other features. For more information, go to www.sartomer.com and follow Sartomer on Twitter @SartomerGlobal.
What is CAF?
A growth consisting of a conductive copper-containing salt. It is created electrochemically and grows from the anode toward the cathode subsurface along the epoxy/glass interface.
Conductive Anodic Filament (CAF) formation does happen
o When it happens, it can cause a lot of pain
CAF behavior is relatively stable
o Limited change in key PCB technology (pitch, materials,
assembly)
CAF mitigation is well known (execute it!)
o Evaluate your designs
o Qualify your suppliers
TRINAR® is a high-performance fluoropolymer coating containing 70% polyvinylidene (PVDF) resin.
This unique resin is combined with other proprietary resins and the highest quality ceramic and select
inorganic pigments for the finest metal finish available.
José Antonio Mira, asesor en ciberseguridad del CCN, presenta el informe anual de ciberamenazas 2015 y las tendencias para 2016, durante la III Jornada de Ciberseguridad en Andalucía, realizada el pasado 14 de junio en Sevilla
Open communities of innovation pioneers: the Musigen case studyGiuseppe Naccarato
We call innovation pioneers the experts in a scientific or technical domain in the early stages
of its development. Advances in information technologies allow networks of organizations
and individuals to exchange ideas and knowledge. Not differently from what has happened in
communities of consumers with the emergence of the so called prosumers, ICT can support
communities of innovation pioneers.
However, the role of IT in this domain has not been studied extensively in the management
literature. Understanding the dynamics of communities of innovation pioneers, instead, can
provide companies with precious knowledge on future breakthrough innovations.
This paper means to deepen our understanding of communities of innovation pioneers and the
role of IT in supporting them.
To achieve this goal, we investigate the case of Musigen, a new web platform with the
purpose to support knowledge sharing in the generative music field.
Webinarium: CRM w produkcji niskoseryjnej i jednostkowej z MS Dynamics CRMguest1f0c04
Jak oprogramowanie CRM może wesprzeć proces ofertowania i odciążyć "wąskie gardło" tego procesu -technologów znających uwarunkowania produkcji, których zadaniem jest dobór wariantu produkcji, stworzenie listy materiałowej (BoM) i sekwencji operacji jednostkowych (SoE).
"Introduction to Epoxies" by Hubert Monteiro, Royce InternationalRoyceIntl
Hubert presents an introduction to epoxies.
Hubert Monteiro is a Technical Consultant for Royce International and, as an active member of the Thermoset Resin Formulators Association (TRFA) since it was founded 10 years ago, has a unique perspective on the role industry associations play in the technical community.
Solving Problems with Reliability in the Lead-Free EraCheryl Tulkoff
This presentation provides a focused but comprehensive discussion on potential reliability issues that can arise within Pb-free processes. Areas of potential high risk are examined. For each reliability concern, a brief description is provided, followed by the current state of industry knowledge and an opportunity for risk mitigation based upon the product design, materials, complexity, volumes, and customer expectations of reliability. A final summary provides the attendees a roadmap for ensuring the reliability of Pb-free product.
Use of UV curable adhesives for precision placement of micro-opticsguest83eea
This presentation discusses work done at the Microelectronics Group of Lucent/Agere Systems. It focuses on the problems we overcame to qualify a dimensionally stable adhesive for high volume manufacturing.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Search and Society: Reimagining Information Access for Radical FuturesBhaskar Mitra
The field of Information retrieval (IR) is currently undergoing a transformative shift, at least partly due to the emerging applications of generative AI to information access. In this talk, we will deliberate on the sociotechnical implications of generative AI for information access. We will argue that there is both a critical necessity and an exciting opportunity for the IR community to re-center our research agendas on societal needs while dismantling the artificial separation between the work on fairness, accountability, transparency, and ethics in IR and the rest of IR research. Instead of adopting a reactionary strategy of trying to mitigate potential social harms from emerging technologies, the community should aim to proactively set the research agenda for the kinds of systems we should build inspired by diverse explicitly stated sociotechnical imaginaries. The sociotechnical imaginaries that underpin the design and development of information access technologies needs to be explicitly articulated, and we need to develop theories of change in context of these diverse perspectives. Our guiding future imaginaries must be informed by other academic fields, such as democratic theory and critical theory, and should be co-developed with social science scholars, legal scholars, civil rights and social justice activists, and artists, among others.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
3. Introduction to Requirements
Industry standardization
Low cost method to bump die
Cost-competitive substrates
High yield assembly process
4. Two basic types of low melt flip-
chip interconnections
63/37 Low melt
97/3 High melt
chip chip
laminate laminate
Conventional Pb-rich Eutectic Sn-Pb
5. Problems
Reliability is problem for bigger dies.
Failure modes are either
delamination of encapsulant, most
often at the die passivation
interface, or chip cracking.
Or combination of both delamination
or chip cracking.
6. Definition of a solder
A solder alloy consists of two or more
elements that can wet to a surface,
most often copper, and then react to
form an adhesion layer, and, upon
solidification of the alloy, produces an
interconnection that has good
mechanical properties.
7. Phase diagram on binary solder alloys
L
e u a ep m T
e
Eutectic
temperature, Te, Proeutectic phase
the alloy is a
Te
r t r
homogeneous a β
liquid consisting of
A and B atoms.
A XA Xe XB B
Composition
9. No-lead solder alloys
Sn-Ag-Bi
Sn-Ag-In
Sn-Ag-Bi-In
Sn0.965Ag0.035 – melts at 221°C
Environmental concerns to eliminate Pb.
Cost too high though.
No government pressure.
Pb use is not high compared to industrial paint and batteries
10. Flux
Flux; when it is applied to surfaces that are
to be joined by soldering; flux cleans the
surfaces and results in a better bond
Helps transfer heat.
Prevents oxidation.
Oxidation prevents any flow of molten
solder and prevents wetting.
11. Description of solder pastes
It is a homogeneous mixtures of solder
powder, flux, and a vehicle.
Must be able to withstand prolonged open
exposure to temperature and humidity without
undergoing changes that degrade its
performance.
Must be able to withstand long delays or
pauses in the process and resume printing
with the print quality being equal to that
before the pause.
13. Types of solder pastes
No clean chemistries – consist of either
rosin- or resin-based flux system with a
suitable vehicle system.
Water soluble fluxes – contain organic
or inorganic acids in the flux.
14. Key factors for solder paste
performance
Equipment and setup parameters
Stencil fabrication method
Pitch of components
Lead density of components
Operator skills
Component and card solderability
Temperature and humidity
15. Characterize solder pastes
Solder ball testing – solder paste on ceramic
substrate
Residue – amount of clarity of the remaining flux
after reflow
Solder paste wetting – hot air soldered leaded
(HASL) surface is more difficult to differentiate
Slump – ability of paste to stay well defined after
screening
Tack – certain amount of adhesive strength to hold
the component in place prior to reflow operation
Worklife – how long the paste can remain on the
stencil before it can no longer print adequately
16. Conductive adhesives – 2 types
Anisotropic – conductive in only one
direction
Isotropic – conducting in all 3
directions
Materials development of the conductive
adhesives
Assembly process development
Development of equipment set to form
reliable flip-chip attach interconnections.
19. Post assembly cleaning
Incoming hardware must be clean
and highly solderable.
Flux residue and other
contaminations must be removed.
Post assembly cleaning is required.
Post assembly cleaning eliminates
a lot of unknowns in the soldering
process.
21. Environmental survey
Low water usage and sewer costs have high adjusted
production-based flow rates.
Common pollutants: Cu, Pb, Ni, Ag and total toxic
organics (TTO).
Two basic wastewater treatment configurations:
conventional metals precipitation and ion exchange
systems.
½ of survey have a formal pollution prevention.
Water is wasted by unnecessary flow rates in their
rinse tanks.
¾ of survey implemented recycling, recovery, and bath
maintenance.
Off-site recycling is commonly used.
22. Problems to POT (publicly
owned treatment)
Pollutants that create fire or explosive
hazard.
That cause corrosive structure damage.
That will obstruct the flow in the POTW.
Biological oxygen demand, released at
a flow rate or concentration.
Materials hot enough to cause POTW to
exceed 104°F.
23. Pollutions Limitations in US
Geographical Federal Federal Federal State AQMD's
Area Destination “Serious” “Severe” “Extreme” California
VOC Emissions
to be major 50 tons/year 25 tons/year 10 tons/year 1 lb/day
VOC – Volatile Organic Compounds
AQMD’s – Air Quality Management District
24. Pollution Prevention
It is defined as the prevention of the generation
of pollutants by minimizing or eliminating the
steps or materials that produce them.
Circuit boards require a lot of water. Reduction
of water use is one goal for pollution
prevention.
5lb (12kg) laptop represent about 40,000lb of
materials, resources, and wastes.
Few PWB manufacturers use ozone depleting
substances in their products and process.
25. Things to Consider
You do not need so much water.
Determine the sources of waste.
Ask employees to provide pollution
prevention solutions.
Environmental management system –
requires documentation.
Know costs of waste and pollution