This document provides information about Eric Schulte, a focal plane engineering consultant with over 30 years of experience in research and development related to infrared, visible, and UV focal plane detectors, hybrid assemblies, MEMS, and 3-D stacked structures. The document includes information on Eric Schulte's areas of technical expertise, including indium bump bonding, hybrid focal plane layout, packaging and stress control, contact metallization, compound semiconductor plasma etching, device processing, resume, patents, and publications. It also provides contact information for Eric Schulte.
Anyone involved within the printed circuit board (PCB) industry understand that PCB's have copper finishes on their surface. If they are left unprotected then the copper will oxidize and deteriorate, making the circuit board unusable. The surface finish forms a critical interface between the component and the PCB. The finish has two essential functions, to protect the exposed copper circuitry and to provide a solderable surface when assembling (soldering) the components to the printed circuit board.
From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
Take a look into the reliability of plated through-holes and compare the impact of various amounts of copper plating in the through holes. Results of the thermal stress testing will be presented.
Learn about the critical factors of Heavy Copper Printed Circuit Boards for determining the appropriate Heavy Copper elements such as acceptable heat rise, copper thickness, hole-size, and if capable of support vias.
Flexible heaters are just that…heaters designed to be flexible enough to accommodate tight areas and intricate geometries that need heating properties. These highly-customized heaters are engineered specifically to meet your specific requirements. They’re thin, bendable, and can be designed using the most complex shapes, geometries, and curves to fit almost any type of application.
Rigid-flex circuit technology and construction methods allow for a wide variety of advanced design options that can further expand the extent of design integration possible. Common rigid-flex circuit design typically consists of 4 to 8 layer rigid sections with 2 flex layers.
Options including higher flex layer counts, blind /buried vias, ZIF connections, flex area components, attachment PSAs, asymmetrical constructions and multiple rigid area thicknesses provide many opportunities to achieve higher levels of packaging density.
In this webinar we introduce and discuss the benefits and application of advanced rigid-flex circuit board constructions.
For more information on our flex and rigid-flex PCB solutions visit http://www.epectec.com/flex/
Epec Engineered Technologies manufactures custom cables for specific applications based upon customer design and print requirements. We can assist with cable and connector selection, layout and manufacturing techniques, and computer aided design (CAD).
Anyone involved within the printed circuit board (PCB) industry understand that PCB's have copper finishes on their surface. If they are left unprotected then the copper will oxidize and deteriorate, making the circuit board unusable. The surface finish forms a critical interface between the component and the PCB. The finish has two essential functions, to protect the exposed copper circuitry and to provide a solderable surface when assembling (soldering) the components to the printed circuit board.
From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
Take a look into the reliability of plated through-holes and compare the impact of various amounts of copper plating in the through holes. Results of the thermal stress testing will be presented.
Learn about the critical factors of Heavy Copper Printed Circuit Boards for determining the appropriate Heavy Copper elements such as acceptable heat rise, copper thickness, hole-size, and if capable of support vias.
Flexible heaters are just that…heaters designed to be flexible enough to accommodate tight areas and intricate geometries that need heating properties. These highly-customized heaters are engineered specifically to meet your specific requirements. They’re thin, bendable, and can be designed using the most complex shapes, geometries, and curves to fit almost any type of application.
Rigid-flex circuit technology and construction methods allow for a wide variety of advanced design options that can further expand the extent of design integration possible. Common rigid-flex circuit design typically consists of 4 to 8 layer rigid sections with 2 flex layers.
Options including higher flex layer counts, blind /buried vias, ZIF connections, flex area components, attachment PSAs, asymmetrical constructions and multiple rigid area thicknesses provide many opportunities to achieve higher levels of packaging density.
In this webinar we introduce and discuss the benefits and application of advanced rigid-flex circuit board constructions.
For more information on our flex and rigid-flex PCB solutions visit http://www.epectec.com/flex/
Epec Engineered Technologies manufactures custom cables for specific applications based upon customer design and print requirements. We can assist with cable and connector selection, layout and manufacturing techniques, and computer aided design (CAD).
Next Generation of implantable Polyurethanes UBMCanon
Outline
• Polyurethane Background
• Implantable Polyurethanes: historic challenges
• Case Study: Polyurethane in cardiac leads
• Next Generation of Implantable Polyurethanes
• Future of novel Polyurethanes in long-term implants
Selecting a Printed Circuit Board Surface FnishCheryl Tulkoff
The selection of the surface finish on your Printed Circuit Boards (PCBs) could be the most important material decision made for the electronic assembly.
The surface finish influences the process yield, the amount of rework, field failure rate, the ability to test, the scrap rate, and of course the cost.
One can be lead astray by selecting the lowest cost surface finish only to find that the eventual total cost is much higher.
The selection of a surface finish should be done with a holistic approach that considers all important aspects of the assembly.
This paper discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions, and significant cost savings.
One of the challenges facing OEMs and CMs in building assemblies with miniature components is the stencil printing process. Many of today’s designs incorporate a mix of miniature and much larger components. Manufacturing engineers are faced with the dilemma of choosing a thinner stencil foil to ensure solder paste release for the miniature components or a thicker foil to ensure sufficient solder volume for the larger components.
Extreme Materials: Robust Performance from Cable to Connector – White Paper S...NorthwireCable
Aggregating decades of interconnectivity knowledge, Northwire, Inc. (NWI) along with its partner The LEMO Group, has released Part IV of their “Extreme Environments, Complex Requirements” white paper series, titled “Extreme Materials: Robust Performance from Cable to Connector.”
Testing the Socket - The Benefits of Verifying Socket Functionalitymarmic65
Being able to easily and efficiently measure the pin
CRES has led to improvements in the
understanding of pin reliability, appropriate
cleaning intervals and the effectiveness of cleaning.
Inaugural lecture for Tomasz Liskiewicz, Professor of Tribology and Surface Engineering, Manchester Metropolitan University, Faculty of Science and Engineering
Magnetic FLux Control in Induction Systems - Fluxtrol Heat Processing Paper Fluxtrol Inc.
By Dr. Valentin Nemkov - Fluxtrol Inc.
Magnetic flux controllers are widely used in induction heating systems for concentration, shielding or redistribution of
the magnetic field which generates power in the part to be heated. Controllers, made of Soft Magnetic Composites
(SMC), provide accurate heat pattern control, improve parameters of inductors and performance of the entire installation.
In melting systems, especially in the case of vacuum furnaces, cold crucible and other specialty furnaces, the magnetic
control can provide large energy savings, magnetic field shielding, shorter melting cycles and optimized field distribution
for enhancement of the metallurgical processes. Due to the diversity of applications, service conditions of controllers
are very different including very severe cases. Mechanical, magnetic, electrical, thermal and other properties must be
considered in design and application of SMC. This article describes properties and performance of SMC typically used
in induction heating technology. Several presented case stories are based on more than 20 years of R&D and practical
experience of scientists and practitioners at Fluxtrol, Inc. Presented material may be interesting not only for induction
heating community but also for all people using AC magnetic fields in technological processes.
ProCoat Industrial Corrosion Protection. Rebuilding and refurbishing. Steel, Power, Cement, Marine, waste water Treatment, Paper, Process, Soda Ash, FGD Systems, Tank, Electricity, corrosion, Erosion, Cavitation, pitting, Acid protections, chemical protection, Transmission and many more industries.
Next Generation of implantable Polyurethanes UBMCanon
Outline
• Polyurethane Background
• Implantable Polyurethanes: historic challenges
• Case Study: Polyurethane in cardiac leads
• Next Generation of Implantable Polyurethanes
• Future of novel Polyurethanes in long-term implants
Selecting a Printed Circuit Board Surface FnishCheryl Tulkoff
The selection of the surface finish on your Printed Circuit Boards (PCBs) could be the most important material decision made for the electronic assembly.
The surface finish influences the process yield, the amount of rework, field failure rate, the ability to test, the scrap rate, and of course the cost.
One can be lead astray by selecting the lowest cost surface finish only to find that the eventual total cost is much higher.
The selection of a surface finish should be done with a holistic approach that considers all important aspects of the assembly.
This paper discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions, and significant cost savings.
One of the challenges facing OEMs and CMs in building assemblies with miniature components is the stencil printing process. Many of today’s designs incorporate a mix of miniature and much larger components. Manufacturing engineers are faced with the dilemma of choosing a thinner stencil foil to ensure solder paste release for the miniature components or a thicker foil to ensure sufficient solder volume for the larger components.
Extreme Materials: Robust Performance from Cable to Connector – White Paper S...NorthwireCable
Aggregating decades of interconnectivity knowledge, Northwire, Inc. (NWI) along with its partner The LEMO Group, has released Part IV of their “Extreme Environments, Complex Requirements” white paper series, titled “Extreme Materials: Robust Performance from Cable to Connector.”
Testing the Socket - The Benefits of Verifying Socket Functionalitymarmic65
Being able to easily and efficiently measure the pin
CRES has led to improvements in the
understanding of pin reliability, appropriate
cleaning intervals and the effectiveness of cleaning.
Inaugural lecture for Tomasz Liskiewicz, Professor of Tribology and Surface Engineering, Manchester Metropolitan University, Faculty of Science and Engineering
Magnetic FLux Control in Induction Systems - Fluxtrol Heat Processing Paper Fluxtrol Inc.
By Dr. Valentin Nemkov - Fluxtrol Inc.
Magnetic flux controllers are widely used in induction heating systems for concentration, shielding or redistribution of
the magnetic field which generates power in the part to be heated. Controllers, made of Soft Magnetic Composites
(SMC), provide accurate heat pattern control, improve parameters of inductors and performance of the entire installation.
In melting systems, especially in the case of vacuum furnaces, cold crucible and other specialty furnaces, the magnetic
control can provide large energy savings, magnetic field shielding, shorter melting cycles and optimized field distribution
for enhancement of the metallurgical processes. Due to the diversity of applications, service conditions of controllers
are very different including very severe cases. Mechanical, magnetic, electrical, thermal and other properties must be
considered in design and application of SMC. This article describes properties and performance of SMC typically used
in induction heating technology. Several presented case stories are based on more than 20 years of R&D and practical
experience of scientists and practitioners at Fluxtrol, Inc. Presented material may be interesting not only for induction
heating community but also for all people using AC magnetic fields in technological processes.
ProCoat Industrial Corrosion Protection. Rebuilding and refurbishing. Steel, Power, Cement, Marine, waste water Treatment, Paper, Process, Soda Ash, FGD Systems, Tank, Electricity, corrosion, Erosion, Cavitation, pitting, Acid protections, chemical protection, Transmission and many more industries.
Experimental Study on Surface Roughness by Using Abrasive ParticlesIJERA Editor
New advancement of technology and never satisfying demands of the civilization are putting huge pressure on the natural fuel resources and these resources are at a constant threat to its sustainability. Surface finish has a vital influence on functional properties such as wear resistance and power loss due to friction on most of the engineering components. Voltage, mesh number, revolutions per minute (rpm) of electromagnet, and percentage weight of abrasives has been identified as important process parameters affecting surface roughness. The experiments were planned using response surface methodology and percentage change in surface roughness (ΔRa) was considered as response. Analysis of experimental data showed that percentage change in surface roughness (ΔRa) was highly influenced by mesh number followed by percentage weight of abrasives, rpm of electromagnet, and voltage. The process has been investigated extensively in the finishing of cylindrical surfaces. The surface finish was found to improve significantly with an increase in the grain size, relative size of abrasive particles vis-à-vis the iron particles, feed rate and current. Super finishing is a micro-finishing process that produces a controlled and smooth surface condition on work pieces. It is not primarily a sizing operation, its major purpose is to produce a surface on a work piece capable of sustaining uneven distribution of a load by improving the geometrical accuracy. The wear life of the parts micro finished to maximum smoothness is extended considerably. According to the design of experimentation, mathematical model for Lapping operation on advance ceramic material is proposed. In order to get minimum values of the surface roughness, optimization of the mathematical model is done and optimal operation of the examined factors is going to be determined. The obtained res
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Bottom termination components (BTCs) are everywhere.
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Improvement of Surface Roughness of Nickel Alloy Specimen by Removing Recast ...IJMER
Abstract: In this investigation, experimental work and computational work are combined to obtain improvement in the surface roughness of nickel alloy specimen, the machining is carried out by means of CNC wire electric discharge machining (WEDM). Brass wire is used as the tool electrode and nickel alloy (Inconel600) is used as the work piece material. The machining parameters such as Pulse-On time (Ton), Pulse-Off time (Toff), Peak Current (Ip), and Bed speed are considered as input parameters for this project. Surface roughness and Recast layer are considered the output parameters. The experiments
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experiments. Once the recast layer thickness is obtained Chemical Etching and abrasive blasting is performed in order to remove the recast layer and again the surface roughness is measured by using stylus type roughness tester. Finally from the obtained results it was found that there was significant improvement in the Surface roughness of the nickel alloy material. In addition using regression analysis this work is stimulated by computational method and the results are obtained
RMD24 | Debunking the non-endemic revenue myth Marvin Vacquier Droop | First ...BBPMedia1
Marvin neemt je in deze presentatie mee in de voordelen van non-endemic advertising op retail media netwerken. Hij brengt ook de uitdagingen in beeld die de markt op dit moment heeft op het gebied van retail media voor niet-leveranciers.
Retail media wordt gezien als het nieuwe advertising-medium en ook mediabureaus richten massaal retail media-afdelingen op. Merken die niet in de betreffende winkel liggen staan ook nog niet in de rij om op de retail media netwerken te adverteren. Marvin belicht de uitdagingen die er zijn om echt aansluiting te vinden op die markt van non-endemic advertising.
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2. Eric F. Schulte
Focal Plane Engineering
Consultant
Indium Bump
Bonding
Hybrid Focal
Plane Layout Mission Statement:
FPA packaging Capitalize on 30+ years of R&D experience to save my
and Stress Control
Contact clients time and money by providing rapid, cost-effective,
Metallization knowledgeable solutions to engineering challenges in:
Compound
- Design
Semiconductor
Plasma Etching - Materials
Detector - Process
Processing
Resume and - Yield, throughput, and cost
Specific Process - Reliability
Experience
Patents, of infrared, visible, and UV focal plane detectors, hybrid
Publications, and assemblies, MEMS, and 3-D stacked structures.
Awards
Contact Eric: See last page
3. Indium Bump Bonding Is
THE Lead-Free, High-density
Interconnect Solution.
High-yield in-house indium bump bonding capability
requires integrated proficiency in the following process areas:
- Under-bump metallization deposition – CTE matched, diffusion barrier, ohmic contact, metallurigically compatible.
- Bump photolithography process – Thick photoresist for efficient clean liftoff, dimensional uniformity.
- Indium deposition – Parameters optimized for minimum grain growth, confined directionality, lateral uniformity; in-situ
pre-deposition surface clean.
- Indium liftoff capability – special techniques to minimize damage to bumps, contain indium, eliminate cross-
contamination.
- Pre-hybridization oxidation removal – to ensure bump-to-bump adhesion, minimize force and slip.
- Hybridization process – Appropriate selection of bonding equipment and options, vacuum tooling design, bonding
parameters (thermo-compression vs. reflow, temperature profiles, compression profiles, scrubbing, slip prevention)
- Post-hybrid measurement – gap, parallelism, alignment, mechanical integrity, electrical integrity.
Correct choices for all of the above capabilities are essential to first-pass success
Contact Eric: See last page
4. Hybrid Focal Plane Layout
Design considerations for successful FPA
layout:
- Minimum die length and width for handling and stability during
bonding.
- Die flatness requirements.
- Detector & ROIC die thickness tradeoffs.
- ROIC bulk wafer resistivity and backside surface finish for IR transparency (for post-bond metrics)
- ROIC and detector backside surface finish requirements for vacuum hold on bonder tooling.
- Detector size vs. RIOC size
- Saw lane dimensions, border widths, saw lane fiducials.
- Circumferential guard devices and ground plane.
- Single-sided or double-sided indium bump configuration.
- Indium bump dimensions, shape, spacing, and bump count for optimal yield, minimum bond force, maximum mechanical
integrity.
- Under-bump metallization choices for optimal adhesion, conductivity, CTE matching, and diffusion resistance.
- Hybridization fiducial design and location for optimal precision of alignment, parallelism, post-hybrid metrics.
Correct choices for all of the above parameters are essential to first-pass success
Contact Eric: See last page
5. FPA packaging and Stress Control
Focal plane die flatness is essential for high performance, high
yield, and reliability.
- Not only must the materials stack be balanced in theory, but one must also take into account the
process sequence and thermal excursions during processing to achieve a flat final product.
Additionally, if the stack contains fragile layers (i.e. compound semiconductors) one must consider
transient stresses during processing to avoid residual damage to those delicate components.
- Thin film stress is the #1 contributor to FPA failure during production, testing, and in the field.
o Incorrect choices of metallization, insulators, and substrate material can lead to bowing/warpage
of the focal plane with subsequent failures in hybrid interconnect, semiconductor device
responsivity, or loss of focus.
- Adhesive failures are the #2 contributor to FPA failure. These failures are usually due to incorrect
choice of adhesive and/or incorrect adhesive curing and/or inadequate surface preparation.
o Some bondlines call for very rigid adhesives to withstand high stress, others require flexible
adhesives to avoid thermal mismatch bowing. The trick is in knowing which to use in a particular
situation.
o Adhesive cure cycles are critical to proper performance of the bondline. The manufacturer’s
recommended cure cycle is not necessarily the best choice in unique situations/unusual materials
combinations.
o Removal of organics, adsorbed water, and silicones is essential to reliable bondlines. Numerous
wet and dry processes are available to give an ideal surface, depending on the materials involved
and the process history.
Correct choices for all of the above parameters are essential to first-pass success
Contact Eric: See last page
6. Contact Metallization
“Simple” metal contacts are ANYTHING BUT simple!
Considerations include:
- Selection of the proper metal(s) to achieve the optimum balance of:
o Ohmic contact.
o Thermal expansion match to substrate.
o Series resistance.
o Barrier to diffusion.
o Metallurgical compatibility with underlying and overlying materials (reliability).
- Selection of proper deposition technique (evaporation, sputtering, reactive sputtering) to control:
o Static (as-deposited) stress.
o Dynamic stress due to thermal expansion issues.
o Step coverage (or not).
o Damage to underlying semiconductor material due to deposition energetics.
- Pre-deposition surface preparation to achieve:
o Good adhesion.
o Barrier-free ohmic contact.
- Selection of patterning technique
o Liftoff vs. etchback patterning.
o Photoresist selection: positive vs. negative tone, viscosity.
o Photoresist spin and bake parameters.
o Photoresist sidewall profile for optimal liftoff.
o Critical dimension monitoring and control.
Correct choices for all of the above parameters are essential to first-pass success
Contact Eric: See last page
7. Compound Semiconductor Plasma Etching
Eric Schulte was the first to develop reactive ion etching (RIE) of HgCdTe for infrared detectors, and the first to successfully
fabricate spec. HgCdTe focal plane arrays using the technique.
He received the prestigious IRIS (InfraRed Industry Symposium ) “Best Paper Award” in 1993 for his pioneering work in the
field.
Key to the success of this development was finding the correct etch chemistry and plasma parameters which
could produce a high etch rate with controllable sidewall angle, good surface morphology, and minimal
damage to the remaining HgCdTe material. This process is now routinely used in the HgCdTe IR detector
industry where high aspect ratio etching is required.
Contact Eric: See last page
8. Device Processing
Through the years, Eric has led development projects in virtually every aspect of HgCdTe, InSb, and Si
device processing including:
- Starting wafer specification, measurement, and cleanup.
- Photolithography: resists, spin, spray, bake, exposure, development, profile control, liftoff, strip.
- Metal deposition: Thermal evap, e-beam evap, sputtering, reactive sputtering; adhesion, stress,
conductivity.
- Insulator deposition: Thermal evap, e-beam evap, sputtering, reactive sputtering, CVD; adhesion,
stress, dielectric strength.
- Dry etching: Semiconductors, metals, insulators, plasma surface prep., resist compatibility, damage
control and mitigation.
- Wet etching and surface preparation: Static, agitated, manual spray, automated spray, spin, surfactants,
rinsing.
- Implant and diffusion: species, profiles, characterization, stability, effect on performance.
- Annealing: open-tube and closed-tube, vacuum, vapor, inter-diffusion.
- Yield improvement: Test data analysis, physical analysis, correlation of performance defects to physical
defects to processing parameters, techniques, contamination, particulates, handling, etc.
- Cost and thruput improvement: Creative application of equipment and processing techniques to
simplify and integrate processes, reduce touch labor, reduce queue dwell, improve process flow.
- Reliability: failure analysis, performance degradation tracking, thermal cycling, vibration testing, bond
strength measurement, accelerated shelf life testing, stress analysis and mitigation.
Contact Eric: See last page
9. RESUME OF
ERIC F. SCHULTE
FOCAL PLANE ENGINEERING CONSULTANT
Permanent residence: Santa Barbara, Ca.
Contact Eric: See last page
EDUCATION
BSEE, Michigan Technological University, 1970
MSEngSci, University of Texas at Dallas, 1982
2004-Present (as a part-time consultant)
- U.S. Army Night Vision Laboratories – Project to develop small-pitch indium bump deposition and hybridization techniques for high-density
focal plane arrays. (Ongoing)
- Lockheed-Martin Santa Barbara FocalPlane – Advanced process development in hybridization, array fabrication, backend processing,
and packaging. (Ongoing)
- Teledyne Imaging Systems – 2-color HgCdTe detector processing, yield, and performance, with concentration on contact metallization,
stress control, passivation, dry etch, and hybridization. (Ongoing)
- Judson Technologies – Technical assistance in all aspects of large IR focal plane production: detector processing, hybridization,
packaging (Ongoing)
- NASA GSFC Microshutter Project – Indium bump bonding capability setup, thin film stress management, MEMS process development,
array handling and packaging design. (Completed in 2006)
1985-2004 (retired) - Raytheon Vision Systems, Goleta, Ca. Senior Principal Engineer, 2nd Gen Array Production Dept., responsible for
conception, development, and implementation of novel processing techniques and equipment for the manufacture of infrared detectors.
Numerous key developments in device design, semiconductor processing, equipment design, hybridization, process monitoring and control,
failure analysis, and product reliability have resulted in 9 US patents, as well as company and industry awards.
10. 1982-85 - Texas Instruments, Central Research Labs, Dallas Tx. Member Technical Staff, IR Focal Plane Project. Developed
advanced processing techniques for the fabrication of IR focal plane arrays. Also responsible for the design, mask generation, process
development, fab. supervision, and internal delivery of a family of novel vertically integrated IR focal plane devices. 3 U.S. patents in this
period.
1979-82 - Texas Instruments, Central Research Labs, Dallas Tx. Member Technical Staff, Solar Energy Project. Conceived and
implemented laser processing steps in fabrication of photovoltaic solar arrays, including laser-induced diffusion, laser redistribution of
dopants, laser patterning of metallization, and laser metallurgy of fuel cell electrode surfaces for electro-chemical activation. 2 U.S. patents
in this period.
1977-79 - Texas Instruments, Consumer Products Group, Dallas Tx. Special Project Engineer. Successfully designed and produced a
magneto-resistive sensor component for use in a consumer product application. Also interfaced with 3-M Corp. on proprietary magnetic
materials. 1 U.S. patent in this period.
1976-77 - Texas Instruments, Government Equipment Group, Dallas, Tx. Maintainability Engineer. Successfully performed all
maintainability engineering support for man-portable infrared imaging systems. Efforts included design support, maintenance procedure
definition, and support equipment definition.
1972-75 - U.S. Navy - Missile Radar Officer, USS Oklahoma City, Western Pacific. Direct supervisor and administrator for 45 radar
technicians and computer technicians. Responsible for maintenance and operation of shipboard tracking and guidance radars, and
associated computer system. Vietnam Veteran.
1970-72 - U.S. Naval Air Engineering Center, Philadelphia, Pa. Ground Support Equipment Engineer. Evaluated contractor-proposed
ground support equipment for Navy and Marine Corps aircraft. Interfaced directly with contractors and military end-users to evaluate
electronic function, ease of operation, validity of operation manuals, and cost of support equipment.
TECHNICAL PAPERS:
Authored or co-authored eleven technical papers, including a pioneering paper in plasma etching of II-VI compounds which received quot;Best
Paperquot; award for the 1993 Infra-Red Industry Symposium.
PATENTS:
Holder of fifteen US patents, three international patents, mainly in the fields of semiconductor processing and novel semiconductor devices.
Received 1993 Hughes Aircraft Aerospace Sector patent award for a novel multi-band IR detector which has created a new multi-million $
market for infrared detectors.
AFFILIATIONS:
Institute of Electrical and Electronic Engineers
Materials Research Society
American Vacuum Society
Surface Mount Technology Association
PERSONAL:
Age 60, excellent health.
11. Very happily married
One son (age 28)
Hobbies: automobiles, world travel, digital photography, skiing, golf, guitar, philosophy, language.
Have traveled extensively in Europe and the Far East; speak “survival” German, French, Spanish, and Japanese.
SPECIFIC TECHNICAL EXPERIENCE BASE
IN THIN-FILM PROCESSING (33 year period)
INDIUM BUMP HYBRIDIZATION:
- Indium bump photolithography
- Indium evaporation and liftoff
- Pre-hybridization indium surface preparation
- Flip-chip hybridization (with specialization in Suss/SET flip-chip bonders)
- FPA mounting and packaging
SPUTTER DEPOSITION:
- R.F. & D.C. sputter deposition of metals & insulators.
- Magnetron-enhanced sputtering.
- Reactive sputtering to form metal oxides and nitrides.
- Indirect sputtering by ion beam impact and transfer.
- Stress control, thermal expansion coefficient control.
- Diffusion barrier metallization.
VACUUM EVAPORATION:
- Automatic controller implementation.
- Thermal evaporation by boat, basket, wire sources.
- E-beam evaporation of metals and insulators.
ION BEAM MILLING:
- Accelerated argon ion etching.
- Chlorine/Argon reactive ion beam etching of SiO2
- Photoresist compatibility.
PLASMA DEPOSITION:
- Parallel plate deposition of SiO2, Si3N4, SiOxNy.
- quot;Downstreamquot; magnetron-excited plasma dep. of SiO2, Si3N4.
PHOTOLITHOGRAPHY:
- Positive and negative resists.
- Contact and projection aligners.
12. - Multi-layer techniques.
- Plasma resist deposition and development.
- Excimer laser projection exposure.
PLASMA ETCHING:
- ECR/RIE of II-VI materials.
- ECR/RIE of Si, SiO2, Si3N4, and metals with CF4/O2 and SF6.
- Deep RIE of Silicon using the Bosch process.
CLUSTER TOOLING:
- Specified and purchased two multi-chamber cluster tools for in-situ etch and deposition of semiconductor thin films.
OTHER SKILLS:
- Excellent mechanical aptitude.
- Strong capabilities in processing equipment selection and set-up.
- Computer-versatile.
- Innovative problem-solver.
- Functionally versed in solid state physics, chemistry, and materials science.
- User familiarity with SEM, STEM, Auger, XPS, SIMS, ESCA.
Contact Eric: See last page
13. Patents
Issued U.S. Patents:
5,880,510 Graded layer passivation of group II-VI infrared photodetectors
5,646,426 Contact metal diffusion barrier for semiconductor devices
5,401,986 Bake-stable HgCdTe photodetector with II-VI passivation layer
5,296,384 Bake-stable HgCdTe photodetector and method for fabricating same
5,113,076 Two terminal multi-band infrared radiation detector
4,970,567 Method and apparatus for detecting infrared radiation
4,956,304 Buried junction infrared photodetector process
4,865,245 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
4,783,594 Reticular detector array
4,729,003 Configuration of a metal insulator semiconductor with a processor based gate
4,616,403 Configuration of a metal insulator semiconductor with a processor based gate
4,447,291 Method for via formation in HgCdTe
4,413,020 Device fabrication incorporating liquid assisted laser patterning of metallization
4,388,517 Sublimation patterning process
4,369,498 Photoluminescent powered calculator
Also, three international patents and several new U.S. patents pending.
Contact Eric: See last page
14. Contact Eric
Please note: Due to my affiliation with the U.S. Infrared Focal Plane Industry, I am
prohibited by United States ITAR (International Traffic in Arms Regulations) from
consulting for non-U.S. governments and institutions on technology directly related to
past and current Focal Plane design and manufacturing processes.
This limitation does NOT apply to MEMS, hybrid assembly, 3-D integration projects,
future Focal Plane Technology, or other technology areas.
Phone: 805-637-5723, 805-965-5022
FAX: 805-965-5022
Email: EricFSchulte@yahoo.com
Location: Santa Barbara, CA, USA