JEDEC LPDDR4 Compliance and Validation Testing. Learn about electrical and protocol testing and validation. DDR Memory is in almost all computing devices today.
HBM stands for high bandwidth memory and is a type of memory interface used in 3D-stacked DRAM (dynamic random access memory) in GPUs, as well as the server, machine-learning DSP , high-performance computing and networking and client space.
HBM stands for high bandwidth memory and is a type of memory interface used in 3D-stacked DRAM (dynamic random access memory) in GPUs, as well as the server, machine-learning DSP , high-performance computing and networking and client space.
UVM RAL is an object-oriented model for registers inside the design. To access these design registers, UVM RAL provides ready-made base classes and APIs
I2C is a serial protocol for two-wire interface to connect low-speed devices like microcontrollers, EEPROMs, A/D and D/A converters, I/O interfaces and other similar peripherals in embedded systems. It was invented by Philips and now it is used by almost all major IC manufacturers. Each I2C slave device needs an address – they must still be obtained from NXP (formerly Philips semiconductors).
Serial Peripheral Interface (SPI) is an interface bus commonly used to send data between microcontrollers and small peripherals such as shift registers, sensors, and SD cards.
Double Data Rate Synchronous Dynamic Random-Access Memory, officially abbreviated as DDR SDRAM, is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM, and soon will be superseded by DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work in DDR1-equipped motherboards, and vice versa.
Compared to single data rate (SDR) SDRAM, the DDR SDRAM interface makes higher transfer rates possible by more strict control of the timing of the electrical data and clock signals. Implementations often have to use schemes such as phase-locked loops and self-calibration to reach the required timing accuracy.[4][5] The interface uses double pumping (transferring data on both the rising and falling edges of the clock signal) to double data bus bandwidth without a corresponding increase in clock frequency. One advantage of keeping the clock frequency down is that it reduces the signal integrity requirements on the circuit board connecting the memory to the controller. The name "double data rate" refers to the fact that a DDR SDRAM with a certain clock frequency achieves nearly twice the bandwidth of a SDR SDRAM running at the same clock frequency, due to this double pumping.
AXI is an on-chip, point to point communication protocol. It is used as a high-performance bus in various IP or SoC Systems. It is used for connecting high-performance processors with memory.
I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multi-master, multi-slave, single-ended, serial computer bus invented by Philips Semiconductor (now NXP Semiconductors). It is typically used for attaching lower-speed peripheral ICs to processors and microcontrollers. Alternatively I²C is spelled I2C (pronounced I-two-C) or IIC (pronounced I-I-C).
Since October 10, 2006, no licensing fees are required to implement the I²C protocol. However, fees are still required to obtain I²C slave addresses allocated by NXP.[1]
Several competitors, such as Siemens AG (later Infineon Technologies AG, now Intel mobile communications), NEC, Texas Instruments, STMicroelectronics (formerly SGS-Thomson), Motorola (later Freescale), and Intersil, have introduced compatible I²C products to the market since the mid-1990s.
SMBus, defined by Intel in 1995, is a subset of I²C that defines the protocols more strictly. One purpose of SMBus is to promote robustness and interoperability. Accordingly, modern I²C systems incorporate policies and rules from SMBus, sometimes supporting both I²C and SMBus, requiring only minimal reconfiguration.
The Serial Peripheral Interface (SPI) bus is a synchronous serial communication interface specification used for short distance communication, primarily in embedded systems. The interface was developed by Motorola and has become a de facto standard. Typical applications include sensors, Secure Digital cards, and liquid crystal displays.
SPI devices communicate in full duplex mode using a master-slave architecture with a single master. The master device originates the frame for reading and writing. Multiple slave devices are supported through selection with individual slave select (SS) lines.
Sometimes SPI is called a four-wire serial bus, contrasting with three-, two-, and one-wire serial buses. The SPI may be accurately described as a synchronous serial interface,[1] but it is different from the Synchronous Serial Interface (SSI) protocol, which is also a four-wire synchronous serial communication protocol, but employs differential signaling and provides only a single simplex communication channel.
Webinar: Practical DDR Testing for Compliance, Validation and Debugteledynelecroy
Join Teledyne LeCroy for this free webinar as we first cover the basics of a DDR interface with a focus on physical-layer test challenges and solutions to common problems. We will then outline the general procedures and considerations for compliance, debug and validation test scenarios. Finally, case studies will illustrate how to apply sophisticated test tools to solve real-life problems.
UVM RAL is an object-oriented model for registers inside the design. To access these design registers, UVM RAL provides ready-made base classes and APIs
I2C is a serial protocol for two-wire interface to connect low-speed devices like microcontrollers, EEPROMs, A/D and D/A converters, I/O interfaces and other similar peripherals in embedded systems. It was invented by Philips and now it is used by almost all major IC manufacturers. Each I2C slave device needs an address – they must still be obtained from NXP (formerly Philips semiconductors).
Serial Peripheral Interface (SPI) is an interface bus commonly used to send data between microcontrollers and small peripherals such as shift registers, sensors, and SD cards.
Double Data Rate Synchronous Dynamic Random-Access Memory, officially abbreviated as DDR SDRAM, is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM, and soon will be superseded by DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work in DDR1-equipped motherboards, and vice versa.
Compared to single data rate (SDR) SDRAM, the DDR SDRAM interface makes higher transfer rates possible by more strict control of the timing of the electrical data and clock signals. Implementations often have to use schemes such as phase-locked loops and self-calibration to reach the required timing accuracy.[4][5] The interface uses double pumping (transferring data on both the rising and falling edges of the clock signal) to double data bus bandwidth without a corresponding increase in clock frequency. One advantage of keeping the clock frequency down is that it reduces the signal integrity requirements on the circuit board connecting the memory to the controller. The name "double data rate" refers to the fact that a DDR SDRAM with a certain clock frequency achieves nearly twice the bandwidth of a SDR SDRAM running at the same clock frequency, due to this double pumping.
AXI is an on-chip, point to point communication protocol. It is used as a high-performance bus in various IP or SoC Systems. It is used for connecting high-performance processors with memory.
I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multi-master, multi-slave, single-ended, serial computer bus invented by Philips Semiconductor (now NXP Semiconductors). It is typically used for attaching lower-speed peripheral ICs to processors and microcontrollers. Alternatively I²C is spelled I2C (pronounced I-two-C) or IIC (pronounced I-I-C).
Since October 10, 2006, no licensing fees are required to implement the I²C protocol. However, fees are still required to obtain I²C slave addresses allocated by NXP.[1]
Several competitors, such as Siemens AG (later Infineon Technologies AG, now Intel mobile communications), NEC, Texas Instruments, STMicroelectronics (formerly SGS-Thomson), Motorola (later Freescale), and Intersil, have introduced compatible I²C products to the market since the mid-1990s.
SMBus, defined by Intel in 1995, is a subset of I²C that defines the protocols more strictly. One purpose of SMBus is to promote robustness and interoperability. Accordingly, modern I²C systems incorporate policies and rules from SMBus, sometimes supporting both I²C and SMBus, requiring only minimal reconfiguration.
The Serial Peripheral Interface (SPI) bus is a synchronous serial communication interface specification used for short distance communication, primarily in embedded systems. The interface was developed by Motorola and has become a de facto standard. Typical applications include sensors, Secure Digital cards, and liquid crystal displays.
SPI devices communicate in full duplex mode using a master-slave architecture with a single master. The master device originates the frame for reading and writing. Multiple slave devices are supported through selection with individual slave select (SS) lines.
Sometimes SPI is called a four-wire serial bus, contrasting with three-, two-, and one-wire serial buses. The SPI may be accurately described as a synchronous serial interface,[1] but it is different from the Synchronous Serial Interface (SSI) protocol, which is also a four-wire synchronous serial communication protocol, but employs differential signaling and provides only a single simplex communication channel.
Webinar: Practical DDR Testing for Compliance, Validation and Debugteledynelecroy
Join Teledyne LeCroy for this free webinar as we first cover the basics of a DDR interface with a focus on physical-layer test challenges and solutions to common problems. We will then outline the general procedures and considerations for compliance, debug and validation test scenarios. Finally, case studies will illustrate how to apply sophisticated test tools to solve real-life problems.
High Speed Data Connectivity: More Than Hardware (Design Conference 2013)Analog Devices, Inc.
In wireless communications and data acquisition systems, there is more to consider when designing and implementing a complete solution beyond simply physically connecting a high speed analog module to an FPGA platform. Available hardware description language (HDL) components and software are critical to establish an interface, which is necessary for practical system integration. This session starts with a top-level overview of various physical interfaces that are typically used and provides an in-depth focus on high speed serial JESD204B. Prototype HDL used for these types of boards is covered, along with the specific board components and how they are used to interface to high speed ADCs and DACs. Linux device drivers for the HDL components as well as for the ADI components are presented. This includes a short introduction into the Industrial I/O (IIO) framework, the benefits it offers, and how it can be used in end designs.
IDT DDR4 RCD register and DB data buffer enable RDIMM and LRDIMM to faster speeds and deeper memories. This video helps you understand the DDR4 feature enhancements of IDT's DDR4 RCD and DB compared to earlier DDR3 technology. An introduction into some available LeCroy testing and debug tools completes the video. Presented by Douglas Malech, Product Marketing Manager at IDT and Mike Micheletti, Product Manager at Teledyne LeCroy. To learn more about IDT's leading portfolio of memory interface products, visit www.idt.com/go/MIP.
In wireless communications and data acquisition systems, there is more to consider when designing and implementing a complete solution beyond simply physically connecting a high speed analog module to an FPGA platform. Available hardware description language (HDL) components and software are critical to establishing an interface, which is necessary for practical system integration. This session starts with a top-level overview of various physical interfaces that are typically used and provides an in-depth focus on high speed serial JESD204B. Prototype HDL used for these types of boards is covered, along with the specific board components and how they are used to interface to high speed ADCs and DACs. Linux device drivers for the HDL components, as well as for the ADI components, are presented. This includes a short introduction into the Industrial I/O (IIO) framework, the benefits it offers, and how it can be used in end designs.
MIPI DevCon 2016: MIPI I3C High Data Rate ModesMIPI Alliance
The MIPI I3C standardized sensor interface provides a number of significant advantages over existing digital sensor interfaces. One of the most advanced features is the ability to operate in I3C high data rate modes, HDR-DDR, HDR-TSP and HDR-TSL, which provides the best performance in both speed and power. Alex Passi of Cadence Design Systems presents I3C interface basics and focuses on various verification aspects of I3C HDR modes through an advanced verification methodology based on coverage driven verification and real-life scenarios.
Various Open Source Cryptographic Libraries are being used these days to implement the
general purpose cryptographic functions and to provide a secure communication channel over
the internet. These libraries, that implement SSL/TLS, have been targeted by various side
channel attacks in the past that result in leakage of sensitive information flowing over the
network. Side channel attacks rely on inadvertent leakage of information from devices
through observable attributes of online communication. Some of the common side channel
attacks discovered so far rely on packet arrival and departure times (Timing Attacks), power
usage and packet sizes. Our research explores novel side channel attack that relies on CPU
architecture and instruction sets. In this research, we explored such side channel vectors
against popular SSL/TLS implementations which were previously believed to be patched
against padding oracle attacks, like the POODLE attack. We were able to successfully extract
the plaintext bits in the information exchanged using the APIs of two popular SSL/TLS
libraries.
digital signal processing
Computer Architectures for signal processing
Harvard Architecture, Pipelining, Multiplier
Accumulator, Special Instructions for DSP, extended
Parallelism,General Purpose DSP Processors,
Implementation of DSP Algorithms for var
ious operations,Special purpose DSP
Hardware,Hardware Digital filters and FFT processors,
Case study and overview of TMS320
series processor, ADSP 21XX processor
2. LPDDR4 Specification
• The JEDEC LPDDR4
Specification is a DRAM
specification
• There is no specification
for the memory controller
– Which is what you need to
test!
• There is no LPDDR4
Compliance Specification
Don’t Worry! Help is
on the way!
3. What to test on your LPDDR4 design?
• That the LPDDR4 DRAM is being
treated properly
– Electrical
• Signal Integrity on all signals
• Receiver Eye size
• BER – Bit Error Rate
– Protocol
• Protocol Checks
• Power up /power down states
• Performance
4. LPDDR4 Command/Address Rx
Mask
• Do you know the
difference
between the
‘Mask’ and the
Data Valid Eye?
Mask: The area (voltage and time)
where no signal may encroach in order
for the DRAM to successfully capture
Rx Data Valid Eye: Is the voltage/time
opening measured at the receiver
6. 6
Measuring System
Compliance
6
Vcent (one for all
DQs, one for all CAs)
Mask center time
calculated separately for
each signal
About 1E6 bits
accumulated by
scope at DRAM pin
Dual-dirac eye extra-
polation to (TBD) BER
(approx. 1E-9 to 1E-16)
Extrapolated eye must
not touch the mask
7. LPDDR4 Bus Level Signal Integrity
Insight
• A quick way to get bus level signal integrity
insight is to use a logic analyzer
– With high speed ‘scanning’ capabilities
• All signals can be observed and compared
to each other
• Signals with problems can be identified
quickly
– An oscilloscope then used on the problem
signals
8. 8
Signal Integrity Insight: Cross Talk
on ADDRESS
January 2014
Eye Scan Insight:
Crosstalk on ADDR 8
and ADDR9
Symptom: Random
intermittent data
corruption on DDR4
system
Next Steps:
•Check routing for crosstalk threats.
(missing ground planes, traces too
close to each other or to noise
source….)
Slide Courtesy of
9. 9
Signal Integrity Insight:
LPDDR4 DQS
Clean DQS strobes on BGA interposer for both Read/Write
3 Gb/s Read
strobe (DQS0)
probed single
ended.
3 Gb/s Write
strobe (DQS0)
probed single
ended.
Slide Courtesy of
10. 10
Signal Integrity Insight: DDR4 3500
Mb/s Read Scans
Next Steps:
• Take trace to inspect ODT operation
• Cross trigger scope to check for ISI
Eye Scan Insight:
•Potential ODT setting issue.
Threshold of first bit in burst has
less swing than remainder of
burst.
•Could also be ISI
(inter-symbol interference)
• Overdriving DDR4 DRAM
to 1.4V could cause
damage.
Slide Courtesy of
11. 11
Signal Integrity Insight:
Incorrect Signal Transition
Eye Scan
Insight
Symptom: Data Corruption on
DDR4 system
Next Steps:
• SW work around:
– Do not use BG1 = 1
– Limits address space
• Long term: HW fix required
DDR4 Bank Group 1
Transitioning incorrectly
Slide Courtesy of
12. Looking for Protocol Violations
• What is a Protocol violation?
– The specification has rules about:
• How close in time transactions can be to each
other
– Example:Time between an ACTIVATE and a Read or
Write can be no closer than tRCD
• How far apart transactions can be from each
other
– Example:Time between two REFRESH commands
cannot be greater than 9*tREFImax
• The ordering of transactions
– Example: A Read or Write command must be preceded
with an ACTIVATE command to the selected ROW
13. 13
Example: Protocol Violation
Average Refresh Rate
When the Refresh rate falls below the 100% bar
(indicating too few Refresh):
• Red dots indicate the locations
• Too few Refresh = risk of data corruption
14. Example: Protocol Violation
Write to close to a PREA
Last cycle of a 4
cycle Write
Command
Time between equals
WL+BL/2+tWR+1
8 +32/2+ 15 + 1
= 40 clocks
Measurement is 38
clocks: VIOLATION
PREA closes the
bank. If this
happens too
quickly then the
data may not be
written properly
15. Example: Protocol Violation tRCD
ACTIVATE to close to a Read
tRCDmin = MAX(tRCD{nCK}, ROUNDUP((tRCD{ns}/tCK{ns})-0.025))
24 clocks
4 ((18ns/.625ns)-0.025)
29
3200MT/s
18. Probing LPDDR4
using a BGA interposer with individual probe points
Riser
DRAM BGA
Interposer
DRAM
Motherboard
Probe Point
DRAM BGA Interposer
Grounds
Signals
Photos Courtesy of
25. LPDDR4 on a SODIMM
• Some applications
looking at this
– No ECC
• Will use the same
form factor as
DDR4 SODIMM
• Slot interposer
can be used for
probing
27. Summary for Success
• Put a robust validation and
compliance plan in place for your
product
• One that verifies the electrical and
the protocol operation
• Plan your probing ahead of time so
you can achieve success easily!
28. Contact Information
Barbara Aichinger
Vice President
FuturePlus Systems Corporation
15 Constitution Drive
Bedford NH 03110 USA
Barb.Aichinger@FuturePlus.com
USA 603-472-5905
www.FuturePlus.com
www.DDRDetective.com
Represented in China by Full Wise Technology
www.FullWiseTech.com