Gas sensors on the verge of massive market adoption
Air quality is becoming a major concern, and therefore gas sensors are increasingly attracting interest. Gas sensing technologies are not new. Gas sensors embedded in gas detectors for defense and industrial safety applications form a highly regulated and mature market. But the growing awareness of the air quality challenge humankind faces is creating new applications and opportunities. These include gas sensors in consumer products like home devices, wearables and smartphones, or for buildings and cars, including indoor/in-cabin air quality monitoring.
Yole Développement’s Gas Sensor report estimates that the gas sensor market is currently growing, driven by Heating, Ventilation Air Conditioning (HVAC) and future consumer applications. It was worth $560M in 2014 and will reach almost $920M in 2021, at 7.3% CAGR. An upside market of almost $65M in 2021 is possible if gas sensors are widely adopted in consumers products.
There are numerous market drivers that will contribute to the growth:
• Driven by better energy management, the building market will experience 13.6% CAGR for a total market estimated at $237M in 2021.
• The medical industry is looking for very high sensitivity for asthma attack sensors or oxygen sensors for breath control.
• Consumer applications such as wearables and smartphones are driving the development of new gas sensors to reduce cost, power consumption and size with MEMS technologies.
• Driven by the desire for better outdoor air quality control, the environmental market will grow at almost 19% CAGR.
• The transport market is driven by oxygen sensors and future depollution applications.
The consumer market is very attractive as it can drive very large volumes depending on user case adoption, cost and technical maturity. The smartphone industry has revolutionized the sensor industry as mobile applications today aggregate ever more sensors. Gas sensors could be the next to be integrated in smart phones and/or wearables. As we believe that user cases are crucial for wide adoption of gas sensors in consumer products, we have built a list of potential applications and benchmarked them.
Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunit...Yole Developpement
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
A psychological survey in 1994 by Hatwell (Hatwell, Y. (1994). Traitéde psychologie expérimentale. Paris, P.U.F.) showed that 83% of our external world perception is through our vision.
Thus a high quality image is highly valued by the user –today Smartphone bill of materials is $10 for the camera module.
The next senses we use are Audio and Smell. Thus, we believe next innovation in MEMS & Sensors will be for microphones.
Gas sensors could be the next one to be valued for consumer applications.
Complete integration has been achieved at sensor level
Strong miniaturization race
Still some developments on power consumption, advanced packaging
Major developments at Software level to achieve sensor fusion
Accurate data acquisition
Precise tracking within the environment
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
An ever growing market
Imaging is highly valued
The imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die size
Interesting way for the MEMS industry to gain value:
More integration at environmental level seems a good opportunity
Pressure + Microphone
Add Particles & Gas detection (market pull)
High power consumption
•Limited access to sensors
•Players: Qualcomm, Samsung, Apple, etc…
•Application processors and MCU manufacturers try to override sensor hubs and access the fullfunctionality of the sensors. It requires allocated resources, may be not as optimized as a sensor hub provides
Deep access to the functionalities of the sensor
•Low power consumption
•Optimized performance
•They try to add value to their sensors by providing sensor hub, adding software and promoting use case,showing there al added-value offer by their sensors combined with their software.
A great competition to gather value at a higher level in the system, because value is in the software, not in the hardware.
More information on that report at http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Hybrid bonding methods for lower temperature 3 d integration 1SUSS MicroTec
* Overview of primary 3D bonding processes
* Mechanics of metal bonding options
* Mechanics for hybrid bond materials
* Process requirement comparisons
* Equipment requirements for hybrid bond processes
Gas Sensors, Detection of Particles, 3D Images…: What are the Next opportunit...Yole Developpement
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
A psychological survey in 1994 by Hatwell (Hatwell, Y. (1994). Traitéde psychologie expérimentale. Paris, P.U.F.) showed that 83% of our external world perception is through our vision.
Thus a high quality image is highly valued by the user –today Smartphone bill of materials is $10 for the camera module.
The next senses we use are Audio and Smell. Thus, we believe next innovation in MEMS & Sensors will be for microphones.
Gas sensors could be the next one to be valued for consumer applications.
Complete integration has been achieved at sensor level
Strong miniaturization race
Still some developments on power consumption, advanced packaging
Major developments at Software level to achieve sensor fusion
Accurate data acquisition
Precise tracking within the environment
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
An ever growing market
Imaging is highly valued
The imaging industry stopped the low cost/high integration model by increasing the pixel size and thus the die size
Interesting way for the MEMS industry to gain value:
More integration at environmental level seems a good opportunity
Pressure + Microphone
Add Particles & Gas detection (market pull)
High power consumption
•Limited access to sensors
•Players: Qualcomm, Samsung, Apple, etc…
•Application processors and MCU manufacturers try to override sensor hubs and access the fullfunctionality of the sensors. It requires allocated resources, may be not as optimized as a sensor hub provides
Deep access to the functionalities of the sensor
•Low power consumption
•Optimized performance
•They try to add value to their sensors by providing sensor hub, adding software and promoting use case,showing there al added-value offer by their sensors combined with their software.
A great competition to gather value at a higher level in the system, because value is in the software, not in the hardware.
More information on that report at http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Hybrid bonding methods for lower temperature 3 d integration 1SUSS MicroTec
* Overview of primary 3D bonding processes
* Mechanics of metal bonding options
* Mechanics for hybrid bond materials
* Process requirement comparisons
* Equipment requirements for hybrid bond processes
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
Gas and Particle Sensors 2018 - Technology, Industry, and Market Trends repor...Yole Developpement
Air quality is breathing life into the sensor market!
More information on : https://www.i-micronews.com/category-listing/product/gas-and-particle-sensors-2018.html
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
MEMS & Sensors challenges & opportunities for the next decade 2016 Presentati...Yole Developpement
MEMS & Sensors enable key functionalities…
Current battleground of the industry
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
Automotive is the historical MEMS high volume market
Transition started in 2003 towards consumer products…
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
irst product of AMS in their new gas sensor activity after the acquisition of AppliedSensor.
Still focused on industrial and building applications with low volume, the gas sensor begins to penetrate the consumer market. It is a change in the market and volume.
It is to enter this growing market that AMS bought AppliedSensor in July 2014. Winning strategy with the integration of the first sensor for the Consumer in a home monitor from Withings.
The AV-MLV-P2 is a volatile organic compounds gas sensor which can detect alcohols, aldehydes, ketones, organic acids, amines, aliphatic and aromatic hydrocarbons.
With a very small footprint, less than to 3mm², the die sensor of the AV-MLV-P2 is well adapted to consumer applications.
Coming from industry, the technologies of AMS/AplliedSensor are reliable, robust, accurate and mature. The die is based on a Metal Oxide sensitive layer made on a micro hotplate. This allows a low power consumption: 34mW in continuous operation.
The experience of AppliedSensor in specific nitride layers explains the very thin membrane. A platinum heater and an electrode structure complete the micro hotplate.
Yole AMS AV MLV P2 VOC MEMS Gas Sensor July 2015 Image1
The report provides all details on the structure of the component and the supply chain to produce this MEMS sensor. The report includes a detailed technology and cost analysis describing the innovations of AMS AplliedSensor.
MEMS Approach to Low Power Wearable Gas SensorsMichael Lim
This presentation gives an overview of candidates solid state MEMS structures for wearable monitoring systems. The basic transduction mechanisms and device structures are shown for 5 types: QCM, FBAR, SAW, Cantilever, and CMUT. Finally, the structures are compared for their application into these mobile systems.
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Power GaN 2019: Epitaxy, Devices, Applications and Technology Trends - Yole D...Yole Developpement
First design-win for GaN HEMTs in the high-volume smartphone fast charging market.
More information on: https://www.i-micronews.com/products/power-gan-2019-epitaxy-devices-applications-technology-trends/
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
Gas and Particle Sensors 2018 - Technology, Industry, and Market Trends repor...Yole Developpement
Air quality is breathing life into the sensor market!
More information on : https://www.i-micronews.com/category-listing/product/gas-and-particle-sensors-2018.html
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
MEMS & Sensors challenges & opportunities for the next decade 2016 Presentati...Yole Developpement
MEMS & Sensors enable key functionalities…
Current battleground of the industry
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
Automotive is the historical MEMS high volume market
Transition started in 2003 towards consumer products…
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
irst product of AMS in their new gas sensor activity after the acquisition of AppliedSensor.
Still focused on industrial and building applications with low volume, the gas sensor begins to penetrate the consumer market. It is a change in the market and volume.
It is to enter this growing market that AMS bought AppliedSensor in July 2014. Winning strategy with the integration of the first sensor for the Consumer in a home monitor from Withings.
The AV-MLV-P2 is a volatile organic compounds gas sensor which can detect alcohols, aldehydes, ketones, organic acids, amines, aliphatic and aromatic hydrocarbons.
With a very small footprint, less than to 3mm², the die sensor of the AV-MLV-P2 is well adapted to consumer applications.
Coming from industry, the technologies of AMS/AplliedSensor are reliable, robust, accurate and mature. The die is based on a Metal Oxide sensitive layer made on a micro hotplate. This allows a low power consumption: 34mW in continuous operation.
The experience of AppliedSensor in specific nitride layers explains the very thin membrane. A platinum heater and an electrode structure complete the micro hotplate.
Yole AMS AV MLV P2 VOC MEMS Gas Sensor July 2015 Image1
The report provides all details on the structure of the component and the supply chain to produce this MEMS sensor. The report includes a detailed technology and cost analysis describing the innovations of AMS AplliedSensor.
MEMS Approach to Low Power Wearable Gas SensorsMichael Lim
This presentation gives an overview of candidates solid state MEMS structures for wearable monitoring systems. The basic transduction mechanisms and device structures are shown for 5 types: QCM, FBAR, SAW, Cantilever, and CMUT. Finally, the structures are compared for their application into these mobile systems.
Sensors for Wearable Electronics & Mobile Healthcare 2015 Report by Yole Deve...Yole Developpement
Yole;report;market;technology;application;research;trend;player;analysis;free;data
MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Power Electronics
More information on that report at http://www.i-micronews.com/reports.html
Innovative MEMS technologies are spearheading the inkjet printing industry’s transformation.
From technology push to market pull, inkjet printing is entering a new era
Inkjet printing, which offers a flexible, cost-effective solution for printing personal documents, is still largely associated with home and small office printing. In parallel, large & wide format printing for CAD and graphic arts applications considers inkjet printing as its technology-of-choice for single prints and very small print runs. The democratization of digital applications in the early 2000s, spurred on by greater home internet usage and the appearance of digital cameras (which dramatically impacted the photo business), has influenced OEM printer manufacturers to develop high-quality, high-resolution printheads. MEMS technologies represent an attractive solution for creating a higher native density of nozzles-per-printheads at an acceptable manufacturing cost via mass production.
Office printing is one of the sectors that has recently benefited from MEMS printhead performance, competing with entry-level to mid-end laser printers. Moreover, the digital revolution is also gaining momentum in new sectors. For years, commercial and industrial applications have used analog printing solutions like flexography, offset printing, and screen-printing due to their high-volume production capacity and associated lower cost. However, these techniques are restrictive due to the use of a master, and not compatible with short runs < 4000m² printing surface. Today’s industrial and commercial applications require more diversity, as well as more instant service customization. Digital printing, specifically inkjet printing, is the solution to penetrating the three trillion square meters (m²) industrial market.
Point-of-Need Testing: Application of Microfluidic Technologies - 2016 Report...Yole Developpement
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies
PLENTY OF APPLICATIONS HAVE STARTED TO BENEFIT FROM MICROFLUIDICS FOR DECENTRALIZED TESTING, BUT HAVE NOT REALIZED THEIR FULL POTENTIAL – YET
Point-of-Care (PoC) testing is not a new concept - the first applications arose in the 1990s. Since then, microfluidic technologies have been increasingly used to solve technical problems and bring economic benefits to the healthcare industry. In the past few years, other applications have benefited from recent technological improvements: veterinary testing, environmental testing, agro-food and industrial testing are also part of the scope of the report. Decentralized testing brings significant operational benefits to various players across these applications.
Microfluidics is part of the diagnostics revolution, with an explosion in the number of products on the market. However, with many applications but few solutions existing today, these markets have not yet reached their full potential.
In the report, Yole Développement (Yole)’s analysts explain why the human healthcare market still looks much more attractive to technology developers. However, in the near future the greatest opportunities will be in all the other markets. The report also explores which barriers still need to be taken down for decentralized, or “point-of-need” (PoN), testing to flourish.
Microfluidics-based point-of-need testing will grow from a $2.6B market in 2015 to $10.3B in 2021, which is a 26% compound annual growth rate (CAGR). This value represents more than 500 million tests in 2021, but only 61 million will be outside human diagnostics. In the report, Yole’s analysts detail the evolution of each application in terms of microfluidic technology’s use.
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Sensors for Cellphones and Tablets - 2016 Report by Yole DeveloppementYole Developpement
In a global cellphone and tablet industry worth over $400B, sensors commanded US$12.2B in 2015, with 9.5% CAGR forecasted for 2015-2021.
The sensor market is still growing impressively, but needs to reinvent itself to avoid commoditization
While many are fearing a general slowdown due to smartphone market saturation, our forecast is rather optimistic concerning sensors. Driven by the expansion of the smartphone category over other phones and new applications, the sensor industry for cellphones and tablets is expected to grow at a 9.5% compound annual growth rate (CAGR) from 2015-2021. The market was worth US$12B in 2015, and will reach US$21B by 2021. The sensor offering has never been so diverse. The list includes: Accelerometers, gyroscopes, gyroscope for optical image stabilization (OIS), magnetometers, e-compasses, inertial measurement units (IMUs), including nine degree-of-freedom (9DOF) IMUs, microphones, pressure sensors, humidity and temperature (H&T), gas, ambient light sensors (ALS), proximity, red/green/blue (RGB) color sensors, heart rate monitors (HRMs), laser rangers, 3D cameras, CMOS image sensors (CISs), fingerprint and iris recognition. Makers of all such sensors need to stay at the cutting edge of innovation. In this report, we’ve analyzed and forecasted evolution of those sensors integrated in current smartphones, distributed in three different categories: the motion sensing hub, the environmental hub and the optical hub.
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
Sensors and Sensing Modules for Smart Homes and Buildings - 2017 Report by Yo...Yole Developpement
Smart homes and buildings: The “Trojan Horse” strategy
To achieve greener and more secure homes and buildings requires a shift in sensing from today’s basic functions such as turning light switches on or off to more advanced functions. Three main drivers are currently leading the smart buildings market:
Better energy control. With 40% of the world’s energy used for buildings, mostly for heating in residential and lighting in commercial, this is a very strong driver.
Increased security with detection of intrusion, fires and seismic activity.
Better comfort for occupants with sensor modules or hubs like those manufactured by Google/Nest, Fibaro, Smarthings, Canary, and Elgato Eve. They generally include 1-10 sensors, an energy source and a wireless module.
For more information, visit our website: https://www.i-micronews.com/reports.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Humidity Sensors from the main players analyzed and compared!
Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years.
In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost.
Single-chip and multi-chip devices are compared between suppliers and references evolution.
Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration.
The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.
Power SiC 2016: Materials, Devices, Modules, and Applications - 2016 Report b...Yole Developpement
More confident and more prepared, power SiC is progressing at a 2015 - 2021 CAGR of 19%!
SiC power is diffusing into multiple application segments
When the first SiC diode was launched in 2001, the industry questioned the future of the SiC power business: Will it grow? Is this a real business? 15 years later, in 2016, people don’t ask these questions anymore. The SiC power business is concrete and real, with a promising outlook. The SiC power market (diode and transistor included) is estimated to be more than $200M in 2015 and forecasted to be more than $550M in 2021, with a 2015 - 2021 CAGR of 19%. Not surprisingly, the power factor correction (PFC) power supply market is still the leading application, consuming a large volume of diodes.
Photovoltaics (PV) inverters are close behind. SiC diodes and MOSFETs are now used by various PV inverter manufacturers in their products. It has been confirmed that SiC implementation provides several performance benefits: increased efficiency, reduced size and weight. In addition, it allows to low cost at the system level in certain power range. Yole Développement has received increasingly positive feedback from the market, and we expect other manufacturers to follow in the footsteps of the early adopters, leading to a rapid expansion of the PV segment in the coming years.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Sensors for Biometry and Recognition - 2016 Report by Yole DeveloppementYole Developpement
In a global biometric hardware market worth over $4B, traditional fingerprint/palm sensors still monopolize 95% of the market, but face and iris sensors lie in wait.
Fingerprint technology impressively dominates the market - but changes are expected
Due to historical reasons, like the criminal fingerprint database established by the FBI with ink-based techniques, fingerprint sensing is the most common biometric technology currently used, by far. We estimate that the annual revenues generated by fingerprint-based solutions are currently $4.25B, representing 95% of the hardware market. Fingerprint sensing dominates technologies like iris, face, palm or voice recognition, because it meets almost all the requirements of a “perfect” biometric recognition technology. It is robust, stable and repeatable, time-invariant, difficult to spoof, has a distinctive meaning, is "unique" amongst a population, accessible, easy to use and acceptably non-intrusive. All other biometric technologies do not yet fulfill those requirements as specifically as fingerprint technology. Hardware revenues generated by the other biometric technologies are relatively low, estimated at $250M, mostly from iris and face recognition. This report identifies the players in the biometric hardware market, and provides technology, market and trend evolution insights. The fingerprint market has experienced an incredible volume increase in the consumer market with the adoption of the active capacitance detection on an increasing number of smartphones to answer the demand of online identification, mobile payment and unlocking applications. Diverse technologies, such as optical, thermal, and Piezoelectric Micromachined Ultrasonic Transducers (PMUT), are also trying to penetrate the consumer market, but are still very limited. The industrial and homeland/security markets are still widely using optical technology. Other biometric solutions like iris, face or voice recognition have been introduced but with a limited impact. Their performance hasn’t yet reached the requirements with regards to cost, reliability, false rejection rate and false acceptance rate to significantly penetrate either the consumer, industrial or homeland/security markets....
More information on that report: http://www.i-micronews.com/report/product/sensors-for-biometry-and-recognition.html
BioMEMS: Microsystems for Healthcare Applications 2016 Report by Yole Develop...Yole Developpement
With the barrier between consumer and healthcare blurring, an increasing number of healthcare applications are using MEMS components, resulting in impressive market growth!
MAJOR TRENDS WILL PROPEL THE BIOMEMS MARKET FOR THE NEXT FIVE YEARS
Faced with an aging “baby boomer” population, healthcare is more important than ever. In-vitro diagnostics, pharmaceutical research, patient monitoring, drug delivery, and implantable devices: all of these fields are growing and system integrators need new innovative technologies to rapidly improve performance, cost and size. Enter bioMEMS: micro components such as accelerometers, pressure sensors, flow sensors, and micropumps bring improved sensing and actuating functions for all of these healthcare fields. The applications are many and the market is quite segmented. Yole Développement’s BioMEMS report provides an overview of the diverse bioMEMS components and applications, along with who is using/ providing which component for which application. As a consequence of this “applications array”, the technical requirements are extremely diverse amongst similar component families.
BioMEMS have been used for years. Some are linked to solid, mature, slow-growing industries, while others are part of booming applications that are adding new fuel to the bioMEMS market – a market that will triple from $2.7B in 2015 to $7.6B in 2021! In Yole’s BioMEMS report, this dynamic growth is forecast in dollars and in units per component, taking into account the influence of all bioMEMS applications. For example, the report highlights the transition from reusable sensors to disposable ones in certain applications, thus driving huge growth in market volume.
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Ultrasound Sensing Technologies for Medical, Industrial and Consumer Applicat...Yole Developpement
New applications along with manufacturing capabilities and technological readiness are driving the takeoff of micro-machined ultrasonic transducers.
More information on that report at https://www.i-micronews.com/category-listing/product/ultrasound-sensing-technologies-for-medical-industrial-and-consumer-applications.html
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
Sample preparation automation through emerging microfluidic technologies 2015...Yole Developpement
Report’s key features
Overview of current bottlenecks in sample preparation
Specific focus on sample preparation for Next-Generation Sequencing (NGS), Single-Cell and Molecular Diagnostics, including point-of-care and trace analysis
Review of reference technologies vs. emerging microfluidic technologies
2015-2020 forecasts for microfluidics for sample preparation in Single-Cell and NGS markets
Market trend analysis
Supply chain analysis and main player map for each application
Business cases on NGS sample prep: microfluidic automation vs. reference solutions, ROI analysis
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers
MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.
To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…
Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.
More information on that report at http://www.i-micronews.com/reports.html
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
High-end Inertial Sensors for Defense, Aerospace, and Industrial Applications...Yole Developpement
Fueled by geopolitical risks rising defense investments, commercial aerospace and fast-growing applications, this new prosperous cycle of the high end inertial business will bring the market to new heights.
INCREASING GEOPOLITICAL RISKS, THE ENDING OIL CRISIS AND THE UPCOMING ROBOTIC ERA ARE FACTORS FUELING THE HIGH-END INERTIAL SYSTEM MARKET
Defense and commercial aerospace markets have always been the backbone of the high-end inertial system market, and that is still true today. The traditional markets, like defense, commercial aerospace and space applications, have returned to growth after a big slowdown from 2010 2015. For the last two years, the market has been evolving positively thanks to increasing geopolitical risks, and benefiting from the reinvigoration of the commercial aerospace business. And the end of the oil crisis in 2015, combined with increasing purchasing power coming from eastern regions, especially China, has definitely benefited this market. The space market is still evolving at its own pace, with the increasingly important robotic approach coming from players like SpaceX, Blue Origin enabling reusable rocket launchers, democratizing the space market.
In other words, the high-end inertial system market is recovering from a lean period that could bring it, in the long term, into a prosperous time with higher volumes. At long term, the market should be propelled by two major trends: the robotic approach and the growth of industrial applications. Yole Développement estimates that the high-end inertial system market has reached the $3B milestone in 2017. Defense makes up 36 % of this, with commercial aerospace comprising 33 %. Industrial, offshore and maritime applications account for the remaining 31 %. With a compound annual growth rate (CAGR) estimated to be 5% for the five next years, the high-end inertial system market is on a good track. The industry is now looking for emerging opportunities to sustain its growth, and this is what we highlight in this report.
More information on that report at http://www.i-micronews.com/reports.html
Smoke Detector Market PPT: Growth, Outlook, Demand, Keyplayer Analysis and Op...IMARC Group
The global smoke detector market size reached US$ 2.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 4.0 Billion by 2032, exhibiting a growth rate (CAGR) of 7.1% during 2024-2032.
More Info:- https://www.imarcgroup.com/smoke-detector-market
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
3. 3
REPORT OBJECTIVES
Get a clear understanding of the applications and related technologies:
• Identification and analysis of the applications:
• Determination of the range of applications
• Market segmentation
• Technical and economic requirements by segment
• Chemical species to be measured
• Key players at application and system levels
• Sensor market size and market forecast 2014-2021 in M$ and Munits
• Analyze and describe the technologies involved :
• Existing and future gas sensing technologies
• Major actors and R&D organizations on a world basis
• Technology roadmap for the different products and process
• Who is developing what ?
• Competing technologies and organization per application
• Sensor die market size and market forecast 2014-2021 in M$, Munits
• Main challenges (sensitivity, selectivity, packaging...)
Ecosystem
Market
Techno
4. 4
WHO SHOULD BE INTERESTED IN THIS REPORT?
o Gas sensors companies:
• To have a broad overview of all gas
sensors applications & markets
• To identify new markets
• To monitor and benchmark potential
competitors
o Financial & Strategic investors:
• To understand the potential for gas
sensors
• To get a list of gas sensors’ players and
their activities
o R&D players:
• To understand new technical challenges in
gas sensing
o Equipment & Material suppliers:
• To understand the technical evolution of
gas sensors
• To identify business opportunities and
prospects
o OEMs & Integrators:
• To evaluate benefits of using gas sensors
in your systems
5. 5
COMPANIES CITED IN THE REPORT
Aerocrine, Airsense Analytics,AlphaMOS,Alphasense,Amphenol,AMS,APIX,
AppliedSensor GmbH,Aryballe,Autochim, Bosch, Cambridge CMOS, CEA Leti, City
Technology, Crowcon, CubeSensors, Denso, Drager, E+E Elektronik , EcologicSense,
Edinburgh Sensors, eLichens, eNose, Figaro, Gas Sensing Solution, GE, Hanwei,
Honeywell, IT Dr Gambert GmbH, KAIST, KWJ, Membrapor, Micronas, Microsens,
MSA, nest, Netatmo, NGK – NTK, Nisha, NXP, OptoSense, Paragon AG, Qmicro,
Samsung, Schneider Electric, Senseair, Senseor, Sensic, Sensigent, SGX Sensortech Ltd,
Siemens, SPEC Sensors, Spectral Engines, Synkera,Techcomp Group,Telaire, Testo,
TSMC,Vaisala,Volvo,Winsen,Withings, X FAB … and many more
6. 6
TECHNOLOGIES OVERVIEW
The main principles - what is the signal output?
The big
detection
families
Technology Principle Output
Optical detection (FTIR, NDIR,
photoacoustic)
It is based on wavelength absorption of the gas:
NIR to MWIR sources are used for IR sensing /
UV source are used for photo acoustic.
A shift in wavelength is measures,
correlated to the target gas.
Calorimetric / Pellistor
It is based on burning target gases (it is mainly
for combustible gases).
A shift in temperature / resistance is
measured.
Electro chemical
It is based on a RedOx chemical reaction
between sensors electrodes.
An current intensity is measured.
Metal Oxide Semiconductor
It is mainly based on gas adsorption at the
sensor surface.
A resistance change is measured.
ChemFET
It is based on a change in mass / dielectric
properties of a specific layer.
A change in mass / dielectric constant is
measured.
Acoustic
It is based on the measure of travel time of
ultrasound at a given distance to calculate
propagation velocity of ultrasonic waves.
Concentration is linked to velocity.
Gas velocity is measured.
Chromatography Gas is electrically charged. Output is electrical current.
Chemiluminescence
Chemiluminescence (sometimes
"chemoluminescence") is the emission of light
(luminescence), as the result of a chemical
reaction.
Output is light.
7. 7
FUTUR CHALLENGES & ROADMAP
Current
developments
are focused
on the
following
trends.
Size & cost
reduction
Low
power
Increased
selectivity
Multi gases
detection
Wireless
comm
AMS AS-MLV-P2 / source S+C
Driven by new, large-volume
applications such as wearables, the
so-far established gas sensing
technologies undergo new technical
challenges such as size/cost
reduction, low power, increased
selectivity, multi gases detection and
wireless communication.
11. 11
GAS SENSORS MARKET SEGMENTATION
From technical and business requirements
towards homogenous market segment
Market segmentation, a useful tool to:
Address the right players with the right technology
Build an effective communication strategy
Identify new potential customers
13. 13
Biography & contact
THE AUTHORS
Dr. Eric Mounier, Senior Analyst
Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI R&D lab in Grenoble, France in
marketing dept. Since 1998 he is a cofounder of Yole Développement, a market research company based in France. At Yole Développement, Dr.
Eric Mounier is in charge of market analysis for MEMS & Sensors, visible and IR imagers (CIS, microbolometers), semiconductors, printed
electronics and photonics (e.g. Silicon photonics). He has contributed to more than 200 marketing & technological analysis and 70 reports. Eric is
also an expert at the OMNT ("Observatoire des Micro & Nanotechnologies") for Optics.
Contact: mounier@yole.fr
Benjamin Roussel, Medtech Activity Leader
He is leading the MedTech activity (microfluidic and medical technologies) at Yole Développement. He holds a pharmacy diploma from the
University Claude Bernard Lyon, complemented by a master degree in Technology and Innovation Management from EM Lyon Business School.
Contact: benjamin.roussel@yole.fr
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payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce,
redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES
18. 16
4 BUSINESS MODELS
o Consulting and Analysis
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
www.yole.fr
o Reports
• Market Technology reports
• Patent Investigation and patent infringement risk
analysis
• Teardowns Reverse Costing Analysis
• Cost SimulationTool
www.i-Micronews.com/reports
o Financial services
• MA (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast services
• Events
www.i-Micronews.com
19. 17
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
MA operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
22. 20
CONTACT INFORMATION
Follow us on
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination Customer Service
Email: khamassi@yole.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr
• General
• Email: info@yole.fr