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3D Stacked Architectures with
Interlayer Cooling - CMOSAIC
 Prof. John R. Thome, LTCM-EPFL, Project Coordinator	

             Prof. Yusuf Leblebici, LSM-EPFL	

          Prof. Dimos Poulikakos, LTNT-ETHZ	

            Prof. Wendelin Stark, FML-ETHZ	

          Prof. David Atienza Alonso, ESL-EPFL	

  Dr. Bruno Michel, IBM Zürich Research Laboratory
tegration & thermal management                        PhD student: Yassir Madhour	




                                                                      Vertical electrical intercon
                                                                        Through-Silicon-Via (TS




egration opportunities & threats                     How to remove heat from a chip stack: int
                                                                        cooling
al wire length reduction
ory-on-core stacking with vertical electrical        § Scales with number of dies whereas backsi
munication → massive core-to-cache bandwidth            cooling scales only with die area
 er wires & no repeaters → improved power            § Heat removal: refrigerant two-phase cooling
                                              3	

                                   4	

 ncy                                                 § Two-phase: no electrical insulation, minima
ats: heat flux accumulation, additional thermal         temperature gradients, automatic hot-spot h
r cooling with evaporated dielectric fluid.                 PhD st
 « eutectic » 3.5Ag-Sn, low melting temperature: 221°C.
  A&B                                                            Yas
 project status: package design optimization.                   Madh


                                                          B




Thomas
 chwiler,
Drechsler
Students: Michael Zervas, Yuksel Temiz	


r-level and CMOS compatible TSV process.          Daisy-chain interconnections pattern
                                                  on TSVs.
flat surface after TSV fabrication that allows.
lithographic steps.
SVs connected in a single daisy chain.
tance per TSV 0.7 Ohm.
Students: Yuksel Temiz, Michael Zervas	


                                            •  Wafer reconstitution and stencil litho
                                            •  Die-level etching and thin-film patter
                                            •  Die-level Cu electroplating.
Students: Yuksel Temiz (LSM), Sylwia Szczukiewicz (LTCM)	

 ont-side metal patterning.
 ont-side DRIE for inlet/outlet
penings.
ack-side DRIE for microchannels.
 licon-Pyrex Anodic Bonding




                                      Front-side
Ph.D.: Sylwia Szczukiewicz – Achievements to date	



                                                 CCD camera

                                                                                      DAQ sys



                                                               Micro-evaporator




                                                   IR camera



    Exploded view of the experimental setup	

           LTCM flow boiling test facility	

                                                                           4	

novel in-situ ‘pixel by pixel’ technique has been developed to calibrat
w infra-red images from IR camera running at 60fps.
D.: Sylwia Szczukiewicz – 2D visualisation of two-phase refrigerant fl
Multi-microchannel evaporator having 67 channels with the inlet orifices e=2 and 100x100µ
               cross-section areas, Tsat=31.96oC,	
  ΔTsub=5.63K,	
  q=30.69W/cm2	
  

                                                                      G=496.1kg/m2,s, 	

                                                                   slow motion (30fps)
                                                                 CCD recorded @2000
                                                                   IR recorded @60fps

                                                                For the test section
                                                                    the orifices with t
                                                                 expansion ratio e=2
                   Flow direction	

                                                                 flow tends to stabili
                                                                  the relatively high m
                                                                   fluxes and heat flu

                                                                     G=1643.02kg/m2s,
                                                                    slow motion (30fps)
D.: Gustavo Rabello dos Anjos	

                                                                           standard approach                Lagrangia

                                                             ace                             ace
                                                         surf                           surf




              Development:	

                     	

                                                              [1]	

omparison of surface representations;	

 bitrary Lagrangian-Eulerian Technique;	

        D(ρu)         1
                                                        + ∇p = 1/2 ∇ · [µ(∇u + ∇uT )] + ρg +
 t case: 2D microchannel and 3D                    Dt         N

 bubble.	

                                             [2]	

             ∇·u=0         mesh velocity                 gravity


D bubble motion - video	

                                         ∂u                               u=u
                                                                                                    ˆ           Lag
                                                                      + (u − u) · ∇u
                                                                             ˆ
                                                                   ∂t                               u=0
                                                                                                    ˆ           Eu
                  Goals:
                       	

                                                [3]	

                           	



 velop a 3D Arbitrary Lagrangian-                                                                         2D microc
erian Finite Element code;	

                                             velocity




 upled heat transfer and two-phase
w	

                                                                                                          3D rising
 dict flows in microscale complex                                                               3   	

ometries;	

                                             vity
D.: Gustavo Rabello dos Anjos	




 rising bubble:	


  : low velocity	

w: bubble rising,
 sertion, flipping and              to
eletion of grid points	


 rtion: top view	

 tion: bottom view
D.: Gustavo Rabello dos Anjos	




 rising bubble:	


  : high velocity	

w: bubble rising,
 sertion, flipping and              to
eletion of grid points	


 rtion: top view	

 tion: bottom view
perimental study: PhD student Adrian Renfer

e cavity of a   Increased pressure drop at        Instantaneous µ-Particle Image
chip stack            high flow rates                      Velocimetry




                                             Vortex shedding induced flow impingemen
tuations are amplified towards the outlet    micropin fins
                                                    à Higher pumping power

                                             Benefits of enhanced mixing
                                                    à  High heat transfer
                                                    à  Non-uniform micropin fin density fo
                                                       systematic hot spot cooling

 inlet           center           outlet     Planned: measure and evaluate
Pin-Fins Inline (PFI)      Microchannels (MC)    Parallel Pla
                                                                   Q                           Q                     Q
e performance of cooling structures                                                                    P
 design guidelines for 3D chip stacks                          D
                                                                   P
                                                                          H
                                                                                                   H




xperimental validation                                   Pressure drop and heat transfer coefficients

                                                                                  Parallel plates
               Transition




          I)                II)                                                     Pin-Fins




                                                                                                   Microchannels



ly underway:                                                           Transitional regime: vortex shedding
on the performance of:
in-fins density adjustment            Boundary layer
on-homogeneous heat fluxes             regeneration
D. Student: Michael Rossier	


                    Goals
                        	

 roduction of a highly hydrophobic surface to
educe the pressure drop in microchannel
with application for water cooling systems	


                   Approach	

                        	



 Creation of a nanostructure (silicon etching)	

 Surface functionalization of the created
                                                    Needle-like silicon etching
                                                                              	

 cture (fluorosiloxane)	




                                      3	

                            4
liquid cooling– Arvind Sridhar, EPFL-ESL
                                                        	

            •  FIRST-EVER compact modeling based thermal simulator for ICs with microchannel liquid coolin
            •  Available as an open source Software Thermal Library at http://esl.epfl.ch/3D-ICE                            	

            •  More than 35 (and counting!) research groups world-wide are using 3D-ICE	


 E 1.0	

 d on compact transient thermal modeling (CTTM)	

                                                      Rconv

 5x Faster! than commercial CFD tools even for
 l problems	


                     Coolant Flow	

                           3D-ICE 2.0	

                                       Rcond    Rconv          •  Advanced model for Enhanced Heat Transfer
                                                                  Geometries (e.g., Pin Fins)	

                                                               •      40x Faster! than conventional CTTM	

                                                                                                                 { X3D-ICE(tn+1)
 optimized as Neural Network based simulator for massively parallel
cs Processing Units (GPUs)	

arns from 3D-ICE test simulations	

                                                                                    Training	

n works as stand-alone simulator	

                                         { X(tn) }                                  Algorithm	



00x Faster! than conventional 3D-ICE model	

                              { U(tn+1) }    Neural Network	

    For more information on 3D-ICE please visit the poster 	

                             -based simulator	

                                                                                                                 { XNN(tn+1) }
MPSoCs – Mohamed M. Sabry, EPFL-ESL
                                          	


eve thermal balance in 3D MPSoC tiers	

hermal runaway situations (thermal violations)	

mal performance degradation	

mal energy consumption	

                           Scheduler	

          Power Manager (
                                                                            Flow-rate actua
 ed technique	

 gn-time run-time management strategy	

 sign-time Control knobs identification	

Electronic-based: 	

     Dynamic Voltage and Frequency Scaling	

Mechanical-based:	

                                                                   Transient Temperature R
      Dynamic Varying Flow rate	

                                           for Each Unit	

n-time thermal management	

Fuzzy-logic control	

     Rule-base look-up table control	

     Low complexity	

     Low computation overhead 	

evements	

Thermal violations 0%
PI: Prof. J.R. Thome
MOSAIC aims to make an important
bution to the development of the first 3D
mputer chip with a functionality per unit
 e that nearly parallels the functional density
          of a human brain.	


 §  A 3D computer chip with integrated	

         cooling system is expected to:	

                         	

           Overcome the limits of air cooling	

ompress ~1012 nanometer sized functional units	

                                                                 1000000
         (1 Tera) into one cubic centimeter 	

                           	

                                    100000




                                                    Wire Count
     § Yield 10-100 fold higher connectivity	

                   10000


                  Cut energy and CO2 	

                            1000

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cmosaic

  • 1. 3D Stacked Architectures with Interlayer Cooling - CMOSAIC Prof. John R. Thome, LTCM-EPFL, Project Coordinator Prof. Yusuf Leblebici, LSM-EPFL Prof. Dimos Poulikakos, LTNT-ETHZ Prof. Wendelin Stark, FML-ETHZ Prof. David Atienza Alonso, ESL-EPFL Dr. Bruno Michel, IBM Zürich Research Laboratory
  • 2.
  • 3. tegration & thermal management PhD student: Yassir Madhour Vertical electrical intercon Through-Silicon-Via (TS egration opportunities & threats How to remove heat from a chip stack: int cooling al wire length reduction ory-on-core stacking with vertical electrical § Scales with number of dies whereas backsi munication → massive core-to-cache bandwidth cooling scales only with die area er wires & no repeaters → improved power § Heat removal: refrigerant two-phase cooling 3 4 ncy § Two-phase: no electrical insulation, minima ats: heat flux accumulation, additional thermal temperature gradients, automatic hot-spot h
  • 4. r cooling with evaporated dielectric fluid. PhD st « eutectic » 3.5Ag-Sn, low melting temperature: 221°C. A&B Yas project status: package design optimization. Madh B Thomas chwiler, Drechsler
  • 5. Students: Michael Zervas, Yuksel Temiz r-level and CMOS compatible TSV process. Daisy-chain interconnections pattern on TSVs. flat surface after TSV fabrication that allows. lithographic steps. SVs connected in a single daisy chain. tance per TSV 0.7 Ohm.
  • 6. Students: Yuksel Temiz, Michael Zervas •  Wafer reconstitution and stencil litho •  Die-level etching and thin-film patter •  Die-level Cu electroplating.
  • 7. Students: Yuksel Temiz (LSM), Sylwia Szczukiewicz (LTCM) ont-side metal patterning. ont-side DRIE for inlet/outlet penings. ack-side DRIE for microchannels. licon-Pyrex Anodic Bonding Front-side
  • 8. Ph.D.: Sylwia Szczukiewicz – Achievements to date CCD camera DAQ sys Micro-evaporator IR camera Exploded view of the experimental setup LTCM flow boiling test facility 4 novel in-situ ‘pixel by pixel’ technique has been developed to calibrat w infra-red images from IR camera running at 60fps.
  • 9. D.: Sylwia Szczukiewicz – 2D visualisation of two-phase refrigerant fl Multi-microchannel evaporator having 67 channels with the inlet orifices e=2 and 100x100µ cross-section areas, Tsat=31.96oC,  ΔTsub=5.63K,  q=30.69W/cm2   G=496.1kg/m2,s, slow motion (30fps) CCD recorded @2000 IR recorded @60fps For the test section the orifices with t expansion ratio e=2 Flow direction flow tends to stabili the relatively high m fluxes and heat flu G=1643.02kg/m2s, slow motion (30fps)
  • 10. D.: Gustavo Rabello dos Anjos standard approach Lagrangia ace ace surf surf Development: [1] omparison of surface representations; bitrary Lagrangian-Eulerian Technique; D(ρu) 1 + ∇p = 1/2 ∇ · [µ(∇u + ∇uT )] + ρg + t case: 2D microchannel and 3D Dt N bubble. [2] ∇·u=0 mesh velocity gravity D bubble motion - video ∂u u=u ˆ Lag + (u − u) · ∇u ˆ ∂t u=0 ˆ Eu Goals: [3] velop a 3D Arbitrary Lagrangian- 2D microc erian Finite Element code; velocity upled heat transfer and two-phase w 3D rising dict flows in microscale complex 3 ometries; vity
  • 11. D.: Gustavo Rabello dos Anjos rising bubble: : low velocity w: bubble rising, sertion, flipping and to eletion of grid points rtion: top view tion: bottom view
  • 12. D.: Gustavo Rabello dos Anjos rising bubble: : high velocity w: bubble rising, sertion, flipping and to eletion of grid points rtion: top view tion: bottom view
  • 13. perimental study: PhD student Adrian Renfer e cavity of a Increased pressure drop at Instantaneous µ-Particle Image chip stack high flow rates Velocimetry Vortex shedding induced flow impingemen tuations are amplified towards the outlet micropin fins à Higher pumping power Benefits of enhanced mixing à  High heat transfer à  Non-uniform micropin fin density fo systematic hot spot cooling inlet center outlet Planned: measure and evaluate
  • 14. Pin-Fins Inline (PFI) Microchannels (MC) Parallel Pla Q Q Q e performance of cooling structures P design guidelines for 3D chip stacks D P H H xperimental validation Pressure drop and heat transfer coefficients Parallel plates Transition I) II) Pin-Fins Microchannels ly underway: Transitional regime: vortex shedding on the performance of: in-fins density adjustment Boundary layer on-homogeneous heat fluxes regeneration
  • 15. D. Student: Michael Rossier Goals roduction of a highly hydrophobic surface to educe the pressure drop in microchannel with application for water cooling systems Approach Creation of a nanostructure (silicon etching) Surface functionalization of the created Needle-like silicon etching cture (fluorosiloxane) 3 4
  • 16. liquid cooling– Arvind Sridhar, EPFL-ESL •  FIRST-EVER compact modeling based thermal simulator for ICs with microchannel liquid coolin •  Available as an open source Software Thermal Library at http://esl.epfl.ch/3D-ICE •  More than 35 (and counting!) research groups world-wide are using 3D-ICE E 1.0 d on compact transient thermal modeling (CTTM) Rconv 5x Faster! than commercial CFD tools even for l problems Coolant Flow 3D-ICE 2.0 Rcond Rconv •  Advanced model for Enhanced Heat Transfer Geometries (e.g., Pin Fins) •  40x Faster! than conventional CTTM { X3D-ICE(tn+1) optimized as Neural Network based simulator for massively parallel cs Processing Units (GPUs) arns from 3D-ICE test simulations Training n works as stand-alone simulator { X(tn) } Algorithm 00x Faster! than conventional 3D-ICE model { U(tn+1) } Neural Network For more information on 3D-ICE please visit the poster -based simulator { XNN(tn+1) }
  • 17. MPSoCs – Mohamed M. Sabry, EPFL-ESL eve thermal balance in 3D MPSoC tiers hermal runaway situations (thermal violations) mal performance degradation mal energy consumption Scheduler Power Manager ( Flow-rate actua ed technique gn-time run-time management strategy sign-time Control knobs identification Electronic-based: Dynamic Voltage and Frequency Scaling Mechanical-based: Transient Temperature R Dynamic Varying Flow rate for Each Unit n-time thermal management Fuzzy-logic control Rule-base look-up table control Low complexity Low computation overhead evements Thermal violations 0%
  • 18. PI: Prof. J.R. Thome
  • 19.
  • 20. MOSAIC aims to make an important bution to the development of the first 3D mputer chip with a functionality per unit e that nearly parallels the functional density of a human brain. §  A 3D computer chip with integrated cooling system is expected to:  Overcome the limits of air cooling ompress ~1012 nanometer sized functional units 1000000 (1 Tera) into one cubic centimeter 100000 Wire Count § Yield 10-100 fold higher connectivity 10000  Cut energy and CO2 1000