AMD Embedded Roadmap

EMBEDDED ROADMAP UNVEIL
ARUN IYENGAR, CORPORATE VP & GM, EMBEDDED, AMD
SEPTEMBER 09, 2013

2 | AMD EMBEDDED SOLUTIONS | SEPTEMBER 09, 2013 | CONFIDENTIAL
CAUTIONARY STATEMENT
THIS DECK CONTAINS FORWARD-LOOKING STATEMENTS CONCERNING AMD, ITS EMBEDDED PRODUCT ROADMAP AND STRATEGY AND THE TIMING, FEATURES AND
FUNCTIONALITY OF AMD’S FUTURE PRODUCTS, WHICH ARE MADE PURSUANT TO THE SAFE HARBOR PROVISIONS OF THE PRIVATE SECURITIES LITIGATION REFORM ACT
OF 1995. FORWARD-LOOKING STATEMENTS ARE COMMONLY IDENTIFIED BY WORDS SUCH AS "BELIEVES, "EXPECTS," "MAY," "WILL," "SHOULD," "SEEKS," "INTENDS,"
"PRO FORMA," "ESTIMATES," "ANTICIPATES," "PLANS," "PROJECTS," AND OTHER TERMS WITH SIMILAR MEANING. INVESTORS ARE CAUTIONED THAT THE FORWARD-
LOOKING STATEMENTS IN THIS RELEASE ARE BASED ON CURRENT BELIEFS, ASSUMPTIONS AND EXPECTATIONS, SPEAK ONLY AS OF THE DATE OF THIS RELEASE AND
INVOLVE RISKS AND UNCERTAINTIES THAT COULD CAUSE ACTUAL RESULTS TO DIFFER MATERIALLY FROM CURRENT EXPECTATIONS. RISKS INCLUDE THE POSSIBILITY
THAT INTEL CORP.'S PRICING, MARKETING AND REBATING PROGRAMS, PRODUCT BUNDLING, STANDARD SETTING, NEW PRODUCT INTRODUCTIONS OR OTHER
ACTIVITIES MAY NEGATIVELY IMPACT THE COMPANY’S PLANS, THAT THE COMPANY WILL REQUIRE ADDITIONAL FUNDING AND MAY BE UNABLE TO RAISE SUFFICIENT
CAPITAL ON FAVORABLE TERMS, OR AT ALL; THAT CUSTOMERS STOP BUYING THE COMPANY’S PRODUCTS OR MATERIALLY REDUCE THEIR OPERATIONS OR DEMAND
FOR THE COMPANY’S PRODUCTS; THAT THE COMPANY MAY BE UNABLE TO DEVELOP, LAUNCH AND RAMP NEW PRODUCTS AND TECHNOLOGIES IN THE VOLUMES THAT
ARE REQUIRED BY THE MARKET AT MATURE YIELDS ON A TIMELY BASIS; THAT THE COMPANY’S THIRD PARTY FOUNDRY SUPPLIERS WILL BE UNABLE TO TRANSITION THE
COMPANY’S PRODUCTS TO ADVANCED MANUFACTURING PROCESS TECHNOLOGIES IN A TIMELY AND EFFECTIVE WAY OR TO MANUFACTURE THE COMPANY’S
PRODUCTS ON A TIMELY BASIS IN SUFFICIENT QUANTITIES AND USING COMPETITIVE PROCESS TECHNOLOGIES; THAT THE COMPANY WILL BE UNABLE TO OBTAIN
SUFFICIENT MANUFACTURING CAPACITY OR COMPONENTS TO MEET DEMAND FOR ITS PRODUCTS OR WILL NOT FULLY UTILIZE ITS PROJECTED MANUFACTURING
CAPACITY NEEDS AT GLOBALFOUNDRIES (GF) MICROPROCESSOR MANUFACTURING FACILITIES; THAT THE COMPANY’S REQUIREMENTS FOR WAFERS WILL BE LESS THAN
THE FIXED NUMBER OF WAFERS THAT IT AGREED TO PURCHASE FROM GF OR GF ENCOUNTERS PROBLEMS THAT SIGNIFICANTLY REDUCE THE NUMBER OF FUNCTIONAL
DIE IT RECEIVES FROM EACH WAFER; THAT THE COMPANY IS UNABLE TO SUCCESSFULLY IMPLEMENT ITS LONG-TERM BUSINESS STRATEGY; THAT THE COMPANY
INACCURATELY ESTIMATES THE QUANTITY OR TYPE OF PRODUCTS THAT ITS CUSTOMERS WILL WANT IN THE FUTURE OR WILL ULTIMATELY END UP PURCHASING,
RESULTING IN EXCESS OR OBSOLETE INVENTORY; THAT THE COMPANY IS UNABLE TO MANAGE THE RISKS RELATED TO THE USE OF ITS THIRD-PARTY DISTRIBUTORS AND
ADD-IN-BOARD (AIB) PARTNERS OR OFFER THE APPROPRIATE INCENTIVES TO FOCUS THEM ON THE SALE OF THE COMPANY’S PRODUCTS; THAT THE COMPANY MAY BE
UNABLE TO MAINTAIN THE LEVEL OF INVESTMENT IN RESEARCH AND DEVELOPMENT THAT IS REQUIRED TO REMAIN COMPETITIVE; THAT THERE MAY BE UNEXPECTED
VARIATIONS IN MARKET GROWTH AND DEMAND FOR THE COMPANY’S PRODUCTS AND TECHNOLOGIES IN LIGHT OF THE PRODUCT MIX THAT IT MAY HAVE AVAILABLE
AT ANY PARTICULAR TIME; THAT GLOBAL BUSINESS AND ECONOMIC CONDITIONS, INCLUDING PC MARKET CONDITIONS, WILL NOT IMPROVE OR WILL WORSEN; THAT
DEMAND FOR COMPUTERS WILL BE LOWER THAN CURRENTLY EXPECTED; AND THE EFFECT OF POLITICAL OR ECONOMIC INSTABILITY, DOMESTICALLY OR
INTERNATIONALLY, ON THE COMPANY’S SALES OR SUPPLY CHAIN. INVESTORS ARE URGED TO REVIEW IN DETAIL THE RISKS AND UNCERTAINTIES IN THE COMPANY'S
SECURITIES AND EXCHANGE COMMISSION FILINGS, INCLUDING BUT NOT LIMITED TO THE QUARTERLY REPORT ON FORM 10-Q FOR THE QUARTER ENDED JUNE 29,
2013.

AGENDA
THE EMBEDDED MARKET
FOCUS AREAS
PRODUCT ROADMAP

RESET &
RESTRUCTURE
Q3’12 - Q1’13
ACCELERATE &
EXECUTE PLAN
2013
TRANSFORM
TO WIN
2014 & BEYOND
 ~$450M OPEX target in Q3
2013
 Reduce headcount by ~14%
 Manage cash and Inventory
 Execute 2013 roadmap
 Deliver 2013 financial
commitments
 Return to profitability at
the net income level based
on mid-point of Q3’13
revenue guidance
 Achieve positive free cash
flow in 2H 2013
 Build leadership IP:
– Low power
– Server: x86 & ARM
– Graphics
 Transition 40-50% of our
business to high growth
adjacent markets
– Ultra low power client
– Embedded
– Semi-custom
– Professional graphics
– Dense server
AMD EMBEDDED SOLUTIONS
THREE STEPS TO TRANSFORMATION

0
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Traditional embedded systems* Intelligent systems* Personal computers Servers Cellular phones(M)
Source: IDC Press Release, Intelligent Systems Transforming the Embedded Industry and Driving the Value
Among M2M and the Internet of Everything, May 2013
THE INTERNET OF THINGS, SURROUND COMPUTING AND NEXT GENERATION EMBEDDED
SYSTEMS WILL BE A STRONG DRIVER FOR THE NEXT LEG OF SUBSTANTIAL GROWTH IN THE
COMPUTING INDUSTRY
THE EMBEDDED MARKET

THE EMBEDDED MARKET
VDC Research - Strategic Insights 2012: Embedded Processing Technologies
*Excludes mobile phones
4.0%
5.0%
6.0%
7.0%
8.0%
9.0%
10.0%
11.0%
12.0%
13.0%
14.0%
15.0%
0.0% 4.0% 8.0% 12.0% 16.0%
CAGR
% of Embedded Market
CPU GROWTH IN EMBEDDED APPLICATIONS BY 2016
Communications
& NetworkingIndustrial
Tablets
Consumer
Electronics
Industrial Control
& Automation
Gaming
Retail
Automation
Storage
Gateway
Equipment
Thin
Clients
Military/Aerospace/Defense
Energy/Power
Automotive
Office/Business Automation
Digital Surveillance/Security
Infotainment
Transportation Digital Signage
Medical

FOCUS AREAS
INDUSTRIAL CONTROLS
& AUTOMATION
GAMING MACHINES
THIN CLIENT
DIGITAL SIGNAGE
COMMUNICATIONS
INFRASTRUCTURE
THEN NOW

x86
44%
ARM
36%
MIPS
7%
Power
6%
Other
7%
2013 TAM $11.3B
x86
45%
ARM
37%
MIPS
6%
Power
6%
Other
6%
2016 TAM $15.5B
FOCUS AREAS
VDC Research - Strategic Insights 2012: Embedded Processing Technologies
X86 & ARM ACCOUNT FOR 82% OF $15.5B TAM BY 2016

PRODUCTS & TECHNOLOGY
A FIRST LOOK
 GCN “Adelaar” Discrete GPU
 x86 “Steppe Eagle” APU SOC
 x86 “Bald Eagle” APU/CPU
 ARM “Hierofalcon” CPU SOC

2013 2014
High-performance
Low-power
Discrete graphics
AMD Embedded R-Series APU/CPU
2/4 “Piledriver” cores
AMD Radeon™ HD 7000 Series GPU
17W-35W TDP
32nm
AMD Embedded G-Series APU SOC
2/4 “Jaguar” cores
6W-25W TDP
28nm
AMD Radeon™ E6460 / E6760 GPU
512MB
1GB GDDR5
“Adelaar” GPU
Graphics Core Next architecture
2GB GDDR5
72GB/s Memory Throughput
40nm 28nm
“Bald Eagle” APU/CPU
2/4 “Steamroller” cores
17W-35W TDP
“Steppe Eagle” APU SOC
2/4 enhanced “Jaguar” cores
5W-25W TDP
28nm
28nm
“Hierofalcon” CPU SOC
4/8 ARM Cortex-A57 cores
10 Gigabit Ethernet
15W-30W TDP
28nm

A FIRST LOOK: “ADELAAR”
 Discrete GCN-based GPU
 2GBs integrated memory
 Pre-qualified
 MCM, MXM or PCIe® Add-on Board
FIRST EMBEDDED
DISCRETE GPU BASED
ON GCN

A FIRST LOOK: “STEPPE EAGLE”
 Low-power x86 APU SOC
 Enhanced “Jaguar” CPU core
 CPU & GPU frequency boosts
 Superior performance/watt
EXCEPTIONAL
PERFORMANCE/WATT
AT LOWER TDP

A FIRST LOOK: “BALD EAGLE”
 High-performance X86 APU & CPU
 New “Steamroller” CPU cores
 Enhanced GCN based GPU
 New power management features
 Error-correcting code (ECC) memory
HSA ENHANCEMENTS FOR NEXT-
GENERATION EMBEDDED
HETEROGENEOUS COMPUTE

A FIRST LOOK: “HIEROFALCON”
 High-performance 64-bit ARM CPU SOC
 Up to 8 ARM Cortex™-A57 CPUs
 10Gb KR Ethernet
 PCI-Express Gen 3
 Enhanced security with ARM TrustZone™
FIRST ARM SOLUTION
FROM AMD FOR
EMBEDDED MARKETS

Charlene Marini
VP of Marketing, Embedded Segments, ARM

AMD. ONLY COMPANY TO OFFER 64-BIT X86
& ARM FOR EMBEDDED APPLICATIONS.
INDUSTRY-LEADING IP
UNMATCHED GRAPHICS
ULTIMATE SCALABILITY
COMPLETE ECOSYSTEM

NOVEMBER 11-13, 2013 | SAN JOSE CONVENTION CENTER
Register Today! Learn More At: http://developer.amd.com/apu
LEARN from industry experts
presenting more than 100 technical
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COLLABORATE with hundreds of
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opportunities for relationship-building
and career-advancements abound.

DISCLAIMER & ATTRIBUTION
The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.
The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap
changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software
changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD
reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of
such revisions or changes.
AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY
INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.
AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE
LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION
CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
ATTRIBUTION
© 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon and PCIe and combinations thereof are trademarks of
Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. Other names are for informational purposes only and may be trademarks of
their respective owners.
DISCLAIMER
*Intelligent systems normally include personal computers, servers, and the smartphone segment of cellular phones. Traditional embedded systems normally
include the non-smartphone cellular phones.

AMD Embedded Roadmap

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