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Hot Chips: AMD Next Gen 7nm Ryzen 4000 APU

The document summarizes AMD's next-generation 7nm Ryzen 4000 APU "Renoir". Key points include: - It features "Zen 2" CPU cores with up to 8 cores and 16 threads, and an integrated 7nm "Vega" GPU with up to 8 compute units. - Performance is improved with up to 25% higher single-thread and 200% higher multi-thread CPU performance compared to previous generations. The GPU provides up to 27% higher performance. - Power efficiency is increased with up to 20% lower power consumption while delivering higher performance. - It offers improved memory bandwidth with support for DDR4-3200 and LPDDR4x-42

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1 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020
2 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 “Zen2”- with 15% higher IPC 2x Performance/Watt 2x Transistor Density 59% higher perf per CU SEE ENDNOTES EPYC-09, RM3-250, RM3-01, RM3-123, RM3-130
3 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 CPU Single Thread CPU Multi Thread GPU Performance Power MORE SINGLE THREAD FORMANCE Delivered 8 high performance Cores in mobile form-factor Scaled Graphics performance density by 3.25x. Per CU performance by 59% Improved memory bandwidth efficiency Upgraded audio- visual experience Increased package performance density MORE MULTITHREAD PERFORMANCE Up to 25% REDUCED SOC POWER SEE ENDNOTES RM3-06, RM3-123, RM3-250, RM3-129 Up to 200% Up to 20% MORE GFX PERFORMANCE Up to 27% AMD Ryzen™ 7 4800U AMD Ryzen™ 7 3700U
4 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 “ZEN 2” CPU (8 CORE | 16 THREAD) CPU 2 CPU 0 USBC ---------- USB 3.1 ----------- USB 2.0 Display Controller 2nd Gen AMD 7nm Vega (8 COMPUTE UNITS) Infinity Fabric Platform Security Processor 4MB L3 Cache Multimedia Engines PCIe GPP Video Codec 2nd Gen Audio ACP 3rd Gen NVMe ---------- SATA X64DDR4/LPDDR4x System Management Unit CPU 1 CPU 3 PCIe Discrete GFX CU CU CU CU CU CU CU CU X64DDR4/LPDDR4x 1MB L2 Cache Sensor Fusion Hub AMD 7nm “VEGA” GPU AMD “ZEN 2” x86 CPU CORES HIGH BANDWIDTH SOC FABRIC (DDR4 3200 MT/s and LPDDR4x 4266 MT/s) FULL SYSTEM CONNECTIVITY UPGRADED DISPLAY ENGINE INTEGRATED SENSOR FUSION HUB ACCELERATED MULTIMEDIA EXPERIENCE CPU 6 CPU 4 4MB L3 Cache CPU 5 CPU 7 NVMe ---------- SATA Fusion Controller Hub
5 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 Technology TSMC 7nm – 13-layer metal Transistor count 9.8B Die Size 156mm2 vs previous “Picasso” APU SEE ENDNOTES RN-1 transistorsnearly 2x smaller die25% BGA: 25 x 35 x 1.38mm
6 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES EPYC-09 CCX1: 4C8T, 4M L3 CCX2: 4C8T, 4M L3
7 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-06, RM3-123 • +30% IPC and design – Improved branch prediction accuracy – Higher op cache hit rate – New integer scheduler algorithms – Clock and data gating improvements – Low-power design methodology • +70% 7nm Density and Power Efficiency CPU Single Thread CPU Multi Thread MORE SINGLE THREAD FORMANCE MORE MULTITHREAD PERFORMANCE Up to 25% Up to 200% • +15% IPC • +10% Fmax “Renoir” “Picasso”
8 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SINGLE-THREAD Cinebench R20 2411 3306 MULTI-THREAD Ryzen™ 7 4800UCore™ i7-10710U SINGLE-THREAD MULTI-THREAD SINGLE-THREAD MULTI-THREAD 479 Ryzen™ 9 4900HCore™ i9-10980HK Ryzen™ 7 4700GCore™ i7-10700 473 479 505 3422 4243 4462 4785 498 508 SEE ENDNOTES RM3-216, RM3-217, RZG2-68
9 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 126 129 226 229 90 92 69 73 90 62 121 68 104 121 DOTA2 League of Legend Rocket League CS:GO Far Cry 5 ME: SoW Civ VI Deus Ex:MD (DX12) Hitman Total War: WH2-Battle F1 2019 AoS (GPU, Vulkan) Rise of the Tomb Raider Strange Brigade (Vulkan) 60FPS SEE ENDNOTES RM3H-21. RESULTS MAY VARY. FPS 1080P HIGH SETTINGSRyzen 9 4900HS + RTX 2060 MaxQ – 35W Up To Up To
10 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-250. • 2x wide Data Fabric interface for power efficient data transfer • Graphics low power state transition optimization • 25% higher peak graphics clock • 77% higher peak memory bandwidth • Up to 59% higher Time Spy performance per Compute Unit • 1.79 TFLOPS (FP32) peak throughput • Same 15W power envelope as previous generation Efficiency Arbiter Infinity Fabric Efficiency Arbiter L2 (1MB) CUL1 CUL1 CUL1 CUL1 CUL1 CUL1 CUL1 Command Processor RenderBackendPlus(RB+) RenderBackendPlus(RB+) Geometry Engine Shader Engine 2x Data Interface xBAR CUL1
11 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 -61% area 14nm ”Vega” 11CU Performance Density “Picasso” “Renoir” 7nm ”Vega” 8CU GPU Performance Up to 27% MORE GFX PERFORMANCE Up to 225% MORE PERFORMANCE DENSITY SEE ENDNOTES RM3-250, RN-2
12 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Two Memory Controllers • Each controller can support 1x64 for DDR4 or 2x32 using virtual channels for LPDDR4x • 4x32 LPDDR4x-4266 (68.3 GB/s peak) OR • 2x64 DDR4-3200 (51.2 GB/s peak) LPDDR4x x32 LPDDR4x x32 UMC0 32 32 LPDDR4x LPDDR4x x32 LPDDR4x x32 UMC1 32 32 LPDDR4x DDR4 x64 UMC0 64 DDR4 DDR4 x64 UMC1 64 DDR4
13 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • 7nm Technology • Optimized Fabric Performance States • Dynamic Power optimization in the fabric switches • Double bus width from graphics engine to fabric to improve pj/bit • DDR4-3200 and LPDDR4x-4266 Infinity Fabric I/O and System Hub Display Engine Memory Controllers “VEGA” 7nm GRAPHICS Graphic s Pipeline L2 Cache Render Engines Comput e Engine “ZEN2” CORE COMPLEX “Zen2” Core “Zen2” Core “Zen2” Core “Zen2” Core L3 Cache “ZEN2” CORE COMPLEX “Zen2” Core “Zen2” Core “Zen2” Core “Zen2” Core L3 Cache Multimedia Engines SEE ENDNOTES RM3-255, RN-3
14 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 541 1623 SEE ENDNOTES RM3-218, RZG2-69. Time Spy 957 1227 Core™ i7- 1065G7 Ryzen™ 7 4800U Core™ i7-10700 Ryzen™ 7 4700G
15 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Single Power State Exposed in ACPI • All hardware power state control done with OS input • Three States Exposed in ACPI • Minimum duration per state included for OS to optimally select the Cstate depth • Reduced hysteresis between states by using OS guidance CC1 CC6 CPUoff VDDoff OS Cstate Entry CC1 OS Cstate1 Entry CC1 CC6 CC1 CC6 CPUoff VDDoff OS Cstate2 Entry OS Cstate3 Entry From “Picasso” to “Renoir” we moved to latest ACPI Power state definition (6.3) Increasing Duration IncreasingDepth IncreasingDepth
16 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-129, RM3-249, RM3-251. • Double the save and restore bus width to reduce entry and exit latency • Removed CPU-Off hysteresis by Intelligent Core Power State selection • Power management firmware optimizations • 7nm Technology enables reduced minimum voltage • Aggressive L3 clock and power-gating • IO Power Reduction – Reduced IO digital power supply – Reduced analog power supply for embedded display and PCIE PHYs – Power optimized SoC Clocking circuits Core0Core-1Core0 DRAM System Management Controller
17 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-254. 0.0 1.0 2.0 3.0 4.0 CoreFrequency(GHz) 0.0 1.0 2.0 3.0 4.0 CoreFrequency(GHz) PICASSO CPU FREQUENCY RENOIR CPU FREQUENCY Picasso Renoir Memory Self Refresh residency 3.6 % 18.5 % CPUOFF residency 4.5% 31.2 % GFXOFF residency 61.7 % 71.7% VDDOFF residency 1.7% 28.2% During Application Execution (PCMark® 10 APP START BENCHMARK)
18 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 System BIOS STT Limits DPTC Config Sensor 2 Embedded Controller (EC) OEM Skin Temp Limit External Diodes °C Sensor 1 AMD Infinity Fabric Calculate Skin Temp Manage SoC Power Dynamic Power & Thermal Control Advanced Platform Management Link • Evaluates external thermal sensors in the CPU/GPU boost decision • Diodes placed in chassis hotspots • Thermal readings passed to Infinity Fabric via Embedded Controller (EC) • Also works with dGPU in AMD SmartShift system configurations
19 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3H-17. • Boost durations can be extended for the user by up to 4X by considering chassis temp • Surface temp of the notebook can be managed with a closed loop • V2 STT simplifies OEM EC designs by pulling chassis thermal calculations into the SoC • Works alongside AMD STAPM technology: – STAPM enables “high boost” by budgeting CPU power vs. a sustained limit – STT enables “long boost” by budgeting chassis thermals vs. a programmed limit Time ChassisTemp Sustained Power Limit Power Boost Power Limit STAPM Boost STT Boost
20 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Saves system power by allowing the CPU to idle for longer periods when playing audio or video on enabled Windows applications • 20% power savings with LPAP enabled • Designed to support popular wake words (e.g. Cortana, Alexa) • Integrated (up to 6) PDM mic interfaces • Full Audio Stack to enable pre-processing and spotting keyword • Acoustic Echo Cancellation (AEC)
21 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 *REQUIRES WINDOWS 10 USB-C with DP Alt-mode supports concurrent USB 3.2 , high bandwidth display and power charging when docked Supports DisplayPort v1.4 – 8.1G HBR3 and Display Stream Compression (DSC) “Renoir” USB-C based MST dock can support USB 3.2 and multiple monitors simultaneously*
22 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 8b/10b Youtube MPEG-4 8b Twitch HEVC 8b/10b NEXT GEN 1080p480 4K120 1080p240 4K60 1080p240 4K60 1080p240 4K60 1080p240 4K60 SEE ENDNOTES GD-81, RM3-253. • New HDR/WCG encode (HEVC) • 31% encoder speedup
23 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 AIDA Windows Memory Manager Privileged Guest AMD KMD Integrated GPU VA to PA Manager GFX Display Video Codec IOMMU Hypervisor HAL DRAM Host Translation Cache/ rIOMMU PTE Management Frame Buffer System Memory Frame Buffer System Memory Up to 75% reduction “Picasso” “Renoir”• Microsoft Hyper-V or Host translation support for integrated devices (GPU, Multimedia Accelerators, Display) • Based on AMD IO Virtualization Technology • Helps enable Microsoft PlayReady with reduced UMA dedicated memory frame buffer
24 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTE RVM-108 For more information and substantiation please visit www.amd.com/25x20 • In 2014, AMD set a bold goal to accelerate the energy efficiency of our mobile processors by 25x from 2014- 2020 • 3rd Gen Ryzen 7 (4800H) achieved a 31.7x improvement as a result of achieving: • 5x more performance • 84% less energy use • The gains exceed historical energy efficiency improvements by 2x 2 0 1 7
25 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 First 8-core Processors for Ultrathin Laptops “Zen 2” Core with 15% higher IPC “Vega” 7nm Graphics Engine with up to 59% more performance per CU Infinity Fabric and Memory subsystem optimized for energy efficiency SEE ENDNOTES RM3-01, EPYC-09, RM3-250.
26 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 We would like to thank our talented AMD design teams across Austin, Bangalore, Boston, Fort Collins, Hyderabad, Markham, Santa Clara, and Shanghai.
27 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • GD-81: HEVC (H.265), H.264, and VP9 acceleration are subject to and not operable without inclusion/installation of compatible HEVC players. GD-81 • EPYC-09: AMD “Matisse” CPU-based system scored an estimated 15% higher SPECint®_base2006 than previous generation AMD “Summit Ridge” based systems. Estimate based on internal testing of internal “Matisse” vs. “Summit Ridge” platforms with single threaded SPEC CPU® 2006 Speed, compiled with Open64 4.2.5.1. SPEC, SPEC CPU and SPECint are registered trademarks of the Standard Performance Evaluation Corporation. For more information about SPEC, see www.spec.org. NOTE: When compared to Industry Trend Line on charts, the industry trend line is based on specint06 single thread run, fixed frequency (3.4 GHZ), 8M L3, open64 compiler, with performance score over the last 8 years, starting with the Intel Sandybridge in 2011. • RM3-01: As of January 2020, the Ryzen 4000 series mobile processor is the "Most advanced laptop processor," defined as superior 7nm process technology in a smaller node, 15W and 45W typical TDP. • RM3-06: Testing by AMD Performance Labs as of 11/22/2019 utilizing the Ryzen 7 4800U vs. 2nd Gen Ryzen 7 3700U in Cinebench R20 Benchmark. Results may vary. • RM3-123: Testing by AMD Performance Labs as of 11/22/2019 utilizing the Ryzen 7 4800U vs. 2nd Gen Ryzen 7 3700U in Cinebench R20 Benchmark. Results may vary. • RM3-125: Ultrathin laptop processors defined as 15W typical TDP. As of December 20, 2019, demonstrated by Ryzen 4000 U-series mobile processor having up to 8 cores, while comparable competitive product (Intel 10th generation mobile processors) offer up to 6 cores. • RM3-129: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 7 4800U reference system and an AMD Ryzen™ 7 3700U reference system in Mobilemark 2014. Results may vary. • RM3-130: Based on AMD engineering estimates, January 2020. • RM3-249: Based on AMD performance labs internal analysis in February 2020, measuring the latency of power state entry/exit for “Renoir” processor architecture compared to previous generation “Picasso” architecture. • RM3-250: Testing by AMD performance labs in February 2020, utilizing a Ryzen™ 7 4800 in an AMD reference system and a previous generation Ryzen™ 7 3700U in an AMD reference system and tested in 3DMark Time Spy. Results may vary. 3DMark is a registered trademark of Futuremark. • RM3-251: Based on internal analysis by AMD performance labs in February 2020. Results may vary. • RM3-252: Testing by AMD performance labs utilizing the Lenovo Yoga S750 configured with the Ryzen™ 4500U measuring total system power with low power audio playback (LPAP) enabled and disabled.
28 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • RM3-253: Based on internal analysis by AMD performance labs, February 2020. • RM3-255: Based on internal analysis by AMD performance labs, February 2020. Results may vary. • RM3H-17: Test data generated by AMD Performance Labs as of January 04, 2020. Testing conducted by running multiple sequential runs of 3DMark® 11 with AMD STAPM technology enabled VS. multiple sequential runs of 3DMark® 11 with AMD STT v2 technology enabled. Boost duration evaluated by comparing the performance results over time between the two boost technologies. Results may vary. RM3H-17 • RM3H-21: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor at 1080P with high settings in DOTA2, LOL, Rocket League, CS:GO, Far Cry 5, ME: SoW, Civ VI, Deus Ex:MD, Hitman, Total War: WH2-Battle, F1 2018, AoS, Rise of the Tomb Raider, and Strange Brigade. Results may vary. • RM3H-22: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor and the MSI P75 Creator 9SF laptop with Core i9-9880H processor in Cinebench nT, HandBrake, Blender® CPU (BMW), LAME, and PCMark® 10 DCC. Results may vary. PCMark is a registered trademark of Futuremark Corporation. • RM3H-23: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor and the MSI P75 Creator 9SF laptop with Core i9-9880H processor in Cinebench nT, HandBrake, Blender® CPU (BMW), LAME, and PCMark® 10 DCC. Results may vary. • RM3-216: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in Cinebench R20 1T. Results may vary. • RM3-217: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in Cinebench R20 nT. Results may vary. • RM3-218: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in 3DMark® Time Spy. Results may vary. 3DMark is a registered trademark of Futuremark Corporation. • RM3-254: Testing by AMD performance labs measuring the average APU power consumption of the Ryzen 4800U compared to the Ryzen 7 3700U PRO while running PCMark® 10 Applications test.
29 AMD NEXT GENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • RVM-108: Testing by AMD Performance Labs as of 4/15/2020. Processors tested: AMD FX-7600P, AMD FX-8800P, AMD FX-9830P, AMD Ryzen 7 2700U, AMD Ryzen 7 2800H, AMD Ryzen 7 3750H, and AMD Ryzen 7 4800H. 25x20 program tracked against Energy Star Rev 6.1 8/12/2014 and 3DMark® 2011 P-Score and Cinebench R15 nT. Results may vary with drivers and BIOSes. The normalized performance increase is 5x higher from AMD’s 2014 notebook processor to the 2020 design. This equates to one- fifth the average compute time for a given task. Annual processor electricity use (kwh), based on ENERGY STAR typical use energy consumption (TEC), in 2020 equals 84% less than the 2014 amount. AMD achieved a 31.7x increase in typical use energy efficiency from 2014-2020, or ~2x compared to what would be the historical rate of increase (doubling every 1.57 years) during the same timeframe of 14.1x. • RN-1: Based on AMD Internal evaluation comparing die size and transistor count of Renoir SoC Die in 7nm to Raven-Picasso SoC Die in GF14/12 • RN-2: Based on AMD internal analysis. Compared Vega 14nm (11 CU, Picasso) area to Vega 7nm (8 CU, Renoir) area. Performance density is evaluated by calculating a ratio of Performance per unit area. • RN-3: Based on AMD internal analysis Feb 2020. Compared max speed for Picasso mobile notebook to Renoir mobile • RZG2-68: Based on testing by AMD Labs on 6.9.2020 using Cinebench R20 1T and nT benchmarks. Performance may vary. • RZG2-69: Based on testing by AMD Labs in June 2020, using the 3DMark Timespy benchmark. Results may vary. 3DMark is a registered trademark of Futuremark Corporation.
Hot Chips: AMD Next Gen 7nm Ryzen 4000 APU

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Hot Chips: AMD Next Gen 7nm Ryzen 4000 APU

  • 1.
    1 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020
  • 2.
    2 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 “Zen2”- with 15% higher IPC 2x Performance/Watt 2x Transistor Density 59% higher perf per CU SEE ENDNOTES EPYC-09, RM3-250, RM3-01, RM3-123, RM3-130
  • 3.
    3 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 CPU Single Thread CPU Multi Thread GPU Performance Power MORE SINGLE THREAD FORMANCE Delivered 8 high performance Cores in mobile form-factor Scaled Graphics performance density by 3.25x. Per CU performance by 59% Improved memory bandwidth efficiency Upgraded audio- visual experience Increased package performance density MORE MULTITHREAD PERFORMANCE Up to 25% REDUCED SOC POWER SEE ENDNOTES RM3-06, RM3-123, RM3-250, RM3-129 Up to 200% Up to 20% MORE GFX PERFORMANCE Up to 27% AMD Ryzen™ 7 4800U AMD Ryzen™ 7 3700U
  • 4.
    4 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 “ZEN 2” CPU (8 CORE | 16 THREAD) CPU 2 CPU 0 USBC ---------- USB 3.1 ----------- USB 2.0 Display Controller 2nd Gen AMD 7nm Vega (8 COMPUTE UNITS) Infinity Fabric Platform Security Processor 4MB L3 Cache Multimedia Engines PCIe GPP Video Codec 2nd Gen Audio ACP 3rd Gen NVMe ---------- SATA X64DDR4/LPDDR4x System Management Unit CPU 1 CPU 3 PCIe Discrete GFX CU CU CU CU CU CU CU CU X64DDR4/LPDDR4x 1MB L2 Cache Sensor Fusion Hub AMD 7nm “VEGA” GPU AMD “ZEN 2” x86 CPU CORES HIGH BANDWIDTH SOC FABRIC (DDR4 3200 MT/s and LPDDR4x 4266 MT/s) FULL SYSTEM CONNECTIVITY UPGRADED DISPLAY ENGINE INTEGRATED SENSOR FUSION HUB ACCELERATED MULTIMEDIA EXPERIENCE CPU 6 CPU 4 4MB L3 Cache CPU 5 CPU 7 NVMe ---------- SATA Fusion Controller Hub
  • 5.
    5 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 Technology TSMC 7nm – 13-layer metal Transistor count 9.8B Die Size 156mm2 vs previous “Picasso” APU SEE ENDNOTES RN-1 transistorsnearly 2x smaller die25% BGA: 25 x 35 x 1.38mm
  • 6.
    6 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES EPYC-09 CCX1: 4C8T, 4M L3 CCX2: 4C8T, 4M L3
  • 7.
    7 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-06, RM3-123 • +30% IPC and design – Improved branch prediction accuracy – Higher op cache hit rate – New integer scheduler algorithms – Clock and data gating improvements – Low-power design methodology • +70% 7nm Density and Power Efficiency CPU Single Thread CPU Multi Thread MORE SINGLE THREAD FORMANCE MORE MULTITHREAD PERFORMANCE Up to 25% Up to 200% • +15% IPC • +10% Fmax “Renoir” “Picasso”
  • 8.
    8 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SINGLE-THREAD Cinebench R20 2411 3306 MULTI-THREAD Ryzen™ 7 4800UCore™ i7-10710U SINGLE-THREAD MULTI-THREAD SINGLE-THREAD MULTI-THREAD 479 Ryzen™ 9 4900HCore™ i9-10980HK Ryzen™ 7 4700GCore™ i7-10700 473 479 505 3422 4243 4462 4785 498 508 SEE ENDNOTES RM3-216, RM3-217, RZG2-68
  • 9.
    9 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 126 129 226 229 90 92 69 73 90 62 121 68 104 121 DOTA2 League of Legend Rocket League CS:GO Far Cry 5 ME: SoW Civ VI Deus Ex:MD (DX12) Hitman Total War: WH2-Battle F1 2019 AoS (GPU, Vulkan) Rise of the Tomb Raider Strange Brigade (Vulkan) 60FPS SEE ENDNOTES RM3H-21. RESULTS MAY VARY. FPS 1080P HIGH SETTINGSRyzen 9 4900HS + RTX 2060 MaxQ – 35W Up To Up To
  • 10.
    10 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-250. • 2x wide Data Fabric interface for power efficient data transfer • Graphics low power state transition optimization • 25% higher peak graphics clock • 77% higher peak memory bandwidth • Up to 59% higher Time Spy performance per Compute Unit • 1.79 TFLOPS (FP32) peak throughput • Same 15W power envelope as previous generation Efficiency Arbiter Infinity Fabric Efficiency Arbiter L2 (1MB) CUL1 CUL1 CUL1 CUL1 CUL1 CUL1 CUL1 Command Processor RenderBackendPlus(RB+) RenderBackendPlus(RB+) Geometry Engine Shader Engine 2x Data Interface xBAR CUL1
  • 11.
    11 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 -61% area 14nm ”Vega” 11CU Performance Density “Picasso” “Renoir” 7nm ”Vega” 8CU GPU Performance Up to 27% MORE GFX PERFORMANCE Up to 225% MORE PERFORMANCE DENSITY SEE ENDNOTES RM3-250, RN-2
  • 12.
    12 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Two Memory Controllers • Each controller can support 1x64 for DDR4 or 2x32 using virtual channels for LPDDR4x • 4x32 LPDDR4x-4266 (68.3 GB/s peak) OR • 2x64 DDR4-3200 (51.2 GB/s peak) LPDDR4x x32 LPDDR4x x32 UMC0 32 32 LPDDR4x LPDDR4x x32 LPDDR4x x32 UMC1 32 32 LPDDR4x DDR4 x64 UMC0 64 DDR4 DDR4 x64 UMC1 64 DDR4
  • 13.
    13 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • 7nm Technology • Optimized Fabric Performance States • Dynamic Power optimization in the fabric switches • Double bus width from graphics engine to fabric to improve pj/bit • DDR4-3200 and LPDDR4x-4266 Infinity Fabric I/O and System Hub Display Engine Memory Controllers “VEGA” 7nm GRAPHICS Graphic s Pipeline L2 Cache Render Engines Comput e Engine “ZEN2” CORE COMPLEX “Zen2” Core “Zen2” Core “Zen2” Core “Zen2” Core L3 Cache “ZEN2” CORE COMPLEX “Zen2” Core “Zen2” Core “Zen2” Core “Zen2” Core L3 Cache Multimedia Engines SEE ENDNOTES RM3-255, RN-3
  • 14.
    14 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 541 1623 SEE ENDNOTES RM3-218, RZG2-69. Time Spy 957 1227 Core™ i7- 1065G7 Ryzen™ 7 4800U Core™ i7-10700 Ryzen™ 7 4700G
  • 15.
    15 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Single Power State Exposed in ACPI • All hardware power state control done with OS input • Three States Exposed in ACPI • Minimum duration per state included for OS to optimally select the Cstate depth • Reduced hysteresis between states by using OS guidance CC1 CC6 CPUoff VDDoff OS Cstate Entry CC1 OS Cstate1 Entry CC1 CC6 CC1 CC6 CPUoff VDDoff OS Cstate2 Entry OS Cstate3 Entry From “Picasso” to “Renoir” we moved to latest ACPI Power state definition (6.3) Increasing Duration IncreasingDepth IncreasingDepth
  • 16.
    16 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-129, RM3-249, RM3-251. • Double the save and restore bus width to reduce entry and exit latency • Removed CPU-Off hysteresis by Intelligent Core Power State selection • Power management firmware optimizations • 7nm Technology enables reduced minimum voltage • Aggressive L3 clock and power-gating • IO Power Reduction – Reduced IO digital power supply – Reduced analog power supply for embedded display and PCIE PHYs – Power optimized SoC Clocking circuits Core0Core-1Core0 DRAM System Management Controller
  • 17.
    17 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3-254. 0.0 1.0 2.0 3.0 4.0 CoreFrequency(GHz) 0.0 1.0 2.0 3.0 4.0 CoreFrequency(GHz) PICASSO CPU FREQUENCY RENOIR CPU FREQUENCY Picasso Renoir Memory Self Refresh residency 3.6 % 18.5 % CPUOFF residency 4.5% 31.2 % GFXOFF residency 61.7 % 71.7% VDDOFF residency 1.7% 28.2% During Application Execution (PCMark® 10 APP START BENCHMARK)
  • 18.
    18 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 System BIOS STT Limits DPTC Config Sensor 2 Embedded Controller (EC) OEM Skin Temp Limit External Diodes °C Sensor 1 AMD Infinity Fabric Calculate Skin Temp Manage SoC Power Dynamic Power & Thermal Control Advanced Platform Management Link • Evaluates external thermal sensors in the CPU/GPU boost decision • Diodes placed in chassis hotspots • Thermal readings passed to Infinity Fabric via Embedded Controller (EC) • Also works with dGPU in AMD SmartShift system configurations
  • 19.
    19 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTES RM3H-17. • Boost durations can be extended for the user by up to 4X by considering chassis temp • Surface temp of the notebook can be managed with a closed loop • V2 STT simplifies OEM EC designs by pulling chassis thermal calculations into the SoC • Works alongside AMD STAPM technology: – STAPM enables “high boost” by budgeting CPU power vs. a sustained limit – STT enables “long boost” by budgeting chassis thermals vs. a programmed limit Time ChassisTemp Sustained Power Limit Power Boost Power Limit STAPM Boost STT Boost
  • 20.
    20 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • Saves system power by allowing the CPU to idle for longer periods when playing audio or video on enabled Windows applications • 20% power savings with LPAP enabled • Designed to support popular wake words (e.g. Cortana, Alexa) • Integrated (up to 6) PDM mic interfaces • Full Audio Stack to enable pre-processing and spotting keyword • Acoustic Echo Cancellation (AEC)
  • 21.
    21 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 *REQUIRES WINDOWS 10 USB-C with DP Alt-mode supports concurrent USB 3.2 , high bandwidth display and power charging when docked Supports DisplayPort v1.4 – 8.1G HBR3 and Display Stream Compression (DSC) “Renoir” USB-C based MST dock can support USB 3.2 and multiple monitors simultaneously*
  • 22.
    22 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 8b/10b Youtube MPEG-4 8b Twitch HEVC 8b/10b NEXT GEN 1080p480 4K120 1080p240 4K60 1080p240 4K60 1080p240 4K60 1080p240 4K60 SEE ENDNOTES GD-81, RM3-253. • New HDR/WCG encode (HEVC) • 31% encoder speedup
  • 23.
    23 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 AIDA Windows Memory Manager Privileged Guest AMD KMD Integrated GPU VA to PA Manager GFX Display Video Codec IOMMU Hypervisor HAL DRAM Host Translation Cache/ rIOMMU PTE Management Frame Buffer System Memory Frame Buffer System Memory Up to 75% reduction “Picasso” “Renoir”• Microsoft Hyper-V or Host translation support for integrated devices (GPU, Multimedia Accelerators, Display) • Based on AMD IO Virtualization Technology • Helps enable Microsoft PlayReady with reduced UMA dedicated memory frame buffer
  • 24.
    24 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 SEE ENDNOTE RVM-108 For more information and substantiation please visit www.amd.com/25x20 • In 2014, AMD set a bold goal to accelerate the energy efficiency of our mobile processors by 25x from 2014- 2020 • 3rd Gen Ryzen 7 (4800H) achieved a 31.7x improvement as a result of achieving: • 5x more performance • 84% less energy use • The gains exceed historical energy efficiency improvements by 2x 2 0 1 7
  • 25.
    25 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 First 8-core Processors for Ultrathin Laptops “Zen 2” Core with 15% higher IPC “Vega” 7nm Graphics Engine with up to 59% more performance per CU Infinity Fabric and Memory subsystem optimized for energy efficiency SEE ENDNOTES RM3-01, EPYC-09, RM3-250.
  • 26.
    26 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 We would like to thank our talented AMD design teams across Austin, Bangalore, Boston, Fort Collins, Hyderabad, Markham, Santa Clara, and Shanghai.
  • 27.
    27 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • GD-81: HEVC (H.265), H.264, and VP9 acceleration are subject to and not operable without inclusion/installation of compatible HEVC players. GD-81 • EPYC-09: AMD “Matisse” CPU-based system scored an estimated 15% higher SPECint®_base2006 than previous generation AMD “Summit Ridge” based systems. Estimate based on internal testing of internal “Matisse” vs. “Summit Ridge” platforms with single threaded SPEC CPU® 2006 Speed, compiled with Open64 4.2.5.1. SPEC, SPEC CPU and SPECint are registered trademarks of the Standard Performance Evaluation Corporation. For more information about SPEC, see www.spec.org. NOTE: When compared to Industry Trend Line on charts, the industry trend line is based on specint06 single thread run, fixed frequency (3.4 GHZ), 8M L3, open64 compiler, with performance score over the last 8 years, starting with the Intel Sandybridge in 2011. • RM3-01: As of January 2020, the Ryzen 4000 series mobile processor is the "Most advanced laptop processor," defined as superior 7nm process technology in a smaller node, 15W and 45W typical TDP. • RM3-06: Testing by AMD Performance Labs as of 11/22/2019 utilizing the Ryzen 7 4800U vs. 2nd Gen Ryzen 7 3700U in Cinebench R20 Benchmark. Results may vary. • RM3-123: Testing by AMD Performance Labs as of 11/22/2019 utilizing the Ryzen 7 4800U vs. 2nd Gen Ryzen 7 3700U in Cinebench R20 Benchmark. Results may vary. • RM3-125: Ultrathin laptop processors defined as 15W typical TDP. As of December 20, 2019, demonstrated by Ryzen 4000 U-series mobile processor having up to 8 cores, while comparable competitive product (Intel 10th generation mobile processors) offer up to 6 cores. • RM3-129: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 7 4800U reference system and an AMD Ryzen™ 7 3700U reference system in Mobilemark 2014. Results may vary. • RM3-130: Based on AMD engineering estimates, January 2020. • RM3-249: Based on AMD performance labs internal analysis in February 2020, measuring the latency of power state entry/exit for “Renoir” processor architecture compared to previous generation “Picasso” architecture. • RM3-250: Testing by AMD performance labs in February 2020, utilizing a Ryzen™ 7 4800 in an AMD reference system and a previous generation Ryzen™ 7 3700U in an AMD reference system and tested in 3DMark Time Spy. Results may vary. 3DMark is a registered trademark of Futuremark. • RM3-251: Based on internal analysis by AMD performance labs in February 2020. Results may vary. • RM3-252: Testing by AMD performance labs utilizing the Lenovo Yoga S750 configured with the Ryzen™ 4500U measuring total system power with low power audio playback (LPAP) enabled and disabled.
  • 28.
    28 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • RM3-253: Based on internal analysis by AMD performance labs, February 2020. • RM3-255: Based on internal analysis by AMD performance labs, February 2020. Results may vary. • RM3H-17: Test data generated by AMD Performance Labs as of January 04, 2020. Testing conducted by running multiple sequential runs of 3DMark® 11 with AMD STAPM technology enabled VS. multiple sequential runs of 3DMark® 11 with AMD STT v2 technology enabled. Boost duration evaluated by comparing the performance results over time between the two boost technologies. Results may vary. RM3H-17 • RM3H-21: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor at 1080P with high settings in DOTA2, LOL, Rocket League, CS:GO, Far Cry 5, ME: SoW, Civ VI, Deus Ex:MD, Hitman, Total War: WH2-Battle, F1 2018, AoS, Rise of the Tomb Raider, and Strange Brigade. Results may vary. • RM3H-22: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor and the MSI P75 Creator 9SF laptop with Core i9-9880H processor in Cinebench nT, HandBrake, Blender® CPU (BMW), LAME, and PCMark® 10 DCC. Results may vary. PCMark is a registered trademark of Futuremark Corporation. • RM3H-23: Testing by AMD Performance Labs as of 12/09/2019 utilizing an ASUS ROG G14 (GA401IV) laptop with AMD Ryzen™ 9 4900HS processor and the MSI P75 Creator 9SF laptop with Core i9-9880H processor in Cinebench nT, HandBrake, Blender® CPU (BMW), LAME, and PCMark® 10 DCC. Results may vary. • RM3-216: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in Cinebench R20 1T. Results may vary. • RM3-217: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in Cinebench R20 nT. Results may vary. • RM3-218: Testing by AMD Performance Labs as of 12/09/2019 utilizing an AMD Ryzen™ 4800U reference system and a Dell XPS 7390 system with Intel® Core i7-10710U processor in 3DMark® Time Spy. Results may vary. 3DMark is a registered trademark of Futuremark Corporation. • RM3-254: Testing by AMD performance labs measuring the average APU power consumption of the Ryzen 4800U compared to the Ryzen 7 3700U PRO while running PCMark® 10 Applications test.
  • 29.
    29 AMD NEXTGENERATION 7NM RYZEN™ 4000 APU “RENOIR” | AUG 2020 • RVM-108: Testing by AMD Performance Labs as of 4/15/2020. Processors tested: AMD FX-7600P, AMD FX-8800P, AMD FX-9830P, AMD Ryzen 7 2700U, AMD Ryzen 7 2800H, AMD Ryzen 7 3750H, and AMD Ryzen 7 4800H. 25x20 program tracked against Energy Star Rev 6.1 8/12/2014 and 3DMark® 2011 P-Score and Cinebench R15 nT. Results may vary with drivers and BIOSes. The normalized performance increase is 5x higher from AMD’s 2014 notebook processor to the 2020 design. This equates to one- fifth the average compute time for a given task. Annual processor electricity use (kwh), based on ENERGY STAR typical use energy consumption (TEC), in 2020 equals 84% less than the 2014 amount. AMD achieved a 31.7x increase in typical use energy efficiency from 2014-2020, or ~2x compared to what would be the historical rate of increase (doubling every 1.57 years) during the same timeframe of 14.1x. • RN-1: Based on AMD Internal evaluation comparing die size and transistor count of Renoir SoC Die in 7nm to Raven-Picasso SoC Die in GF14/12 • RN-2: Based on AMD internal analysis. Compared Vega 14nm (11 CU, Picasso) area to Vega 7nm (8 CU, Renoir) area. Performance density is evaluated by calculating a ratio of Performance per unit area. • RN-3: Based on AMD internal analysis Feb 2020. Compared max speed for Picasso mobile notebook to Renoir mobile • RZG2-68: Based on testing by AMD Labs on 6.9.2020 using Cinebench R20 1T and nT benchmarks. Performance may vary. • RZG2-69: Based on testing by AMD Labs in June 2020, using the 3DMark Timespy benchmark. Results may vary. 3DMark is a registered trademark of Futuremark Corporation.