This document summarizes AMD's strategy to drive down costs and footprint for high-performance x86 embedded systems. It introduces two new complete platforms that improve performance while maintaining low power usage. AMD is committed to supporting embedded customers with long-term design support and driving capabilities forward through integration of new CPU cores and graphics.

1. Helping Drive Down Power, Footprint and Costs for High-Performance x86 Embedded SystemsBuddy Broeker, Director, AMD Embedded SolutionsAMD Confidential | Embargoed until 12:01 a.m. Monday, April 26, 2010

2. Why AMD Embedded Solutions?X86 DeliversDirect Connect Architecture DeliversEnterprise-class performance

3. 64-bit capability

4. Full functionality

5. High-performance graphics support

6. High-performance memory with low latency

7. High I/O throughput

8. RAS features, including ECC

9. Low power, strong performance-per-watt

10. Well-established software & tools and ecosystem

11. Broad knowledge base among developers

12. Support for multiple operating systems

13. Efficient design & development cycles

14. Fast time-to-marketAMD Continues to Advance x86 for Embedded SystemsThe AMD Geode™processorAddition of graphics and chipset optionsfor comprehensive embedded solution High-performanceAMD Geode™ NX based on AMD-K7™ architectureBall Grid Array (BGA) packaging introduced to meet customer demand Introduction of AMD64 technology into embedded markets with AMD Opteron™ processorToday: 2 new complete-solution platformsAddition of AMD Turion™ and AMD Sempron™ processorsAMD has increased performance and features, driven down power, area, and price barriers for x86 in embedded20032005200720042006200820092010

15. Today’s New Complete PlatformsImproves performance and choice, maintains low powerASB2 with BGA PackageHigh-Performance AM3PCI Express® 2.0

16. DDR3

17. HT3

18. 25W

19. Dual-Core

20. 2.2GHz

21. DDR3

22. HyperTransport™ 3 (HT3) technology

23. 65W

24. Quad-Core

25. 2.2GHz

26. DDR3

27. HT3

28. DirectX® 10.1

29. Full 1080p resolution

30. Drive up to 4 displays

31. HDMI

32. UVD support

33. 8W, 12W, 15W

34. Single- or Dual-Core options

35. 1.0 – 1.5 GHz

36. DDR3

37. HT1 or HT3

38. 25W, 45W

39. Dual-Core

40. 2.0 – 2.8GHz

41. DDR2 or DDR3

42. HT3ASB2/785E BGA Platform Architecture14x USB 2.02x USB 1.1 Integrated Ethernet MACFully Integrated Solution HDCP + AudioHyperTransport™ 3 TechnologyDual DVI/HDMI orDisplayPortDisplay CacheTwo IndependentDisplay Controllers2x8 or 1x16Gen 2LVDS6 x1VGAGen 26X SATA 6GB/s2 x1AudioSB850M

43. Shrink the Design, Not the Performance Direct ConnectArchitectureScalabilityEnterprise-class FeaturesPackagingMulti-core design

44. Low memory latency

45. DDR3 memory

46. High-performance I/O with HyperTransport™ 3.0 technology

47. Consistent 64-bit capability

48. BGA and lidless options

49. Low-z-height for small, compact form factors

50. Small area footprint

51. Reliability

52. Low cost

53. Fanless operation

54. ECC

55. Virtualization

56. Multiple power management/ reduction features

57. Enhanced Virus Protection¹

58. No compromise on application performance

59. Socket-compatibility for easy design upgrade

60. Easy migration path to higher performance

61. Chipset & graphics compatibility

62. Clear roadmap progression¹As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.

63. Ideal ApplicationsThin-clientsMedical ImagingPoint-of-sale (POS) &Kiosk SystemsIndustrial ControlsRuggedized, Field, & Military SystemsTelecommunications& NetworkingDigital SignageSmall/Home Office to Enterprise StorageGaming MachinesSingle Board Computing (SBC)

64. Moving Embedded x86 ForwardIntegration of a new CPU core & the latest in graphics

65. Improved overall platform performance with lower power compared to previous generation AMD platforms

66. More form factor options with reduced footprint

67. The technical features that matter, with an outstanding user experience wStrong Commitment Long-term design supportIndustry-standard longevity – planned 5+ years

68. AMD has more than 30 years experience in embedded devicesEnterprise-class, high-performance platforms with embedded-specific features and powerNo compromises on the system designTrue innovation in x86 CPUs and graphicsDriving the capabilities of embedded systems forwardForward-Looking StatementThis presentation contains forward-looking statements concerning AMD and technology partner product offerings which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," “strategy,” “roadmaps,” "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. With respect to AMD, risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting AMD's business will prevent attainment of AMD's current plans; customers stop buying AMD’s products or materially reduce their operations or demand for its products; AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; standards promulgated by open standards will be adopted at rates slower than currently projected, demand for computers and, in turn, demand for AMD’s products will be lower than currently expected; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and AMD will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the fiscal year ended December 26, 2009. Trademark Attribution AMD, the AMD Arrow logo, AMD Athlon, AMD-K7, AMD Opteron, AMD Phenom,, AMD Sempron, AMD Turion, Geode, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, Windows Vista, and DirectX are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. Other names are for informational purposes only and may be the trademarks of their respective owners. ©2010 Advanced Micro Devices, Inc. All rights reserved.