The AMD Embedded G-Series Platform is the world's first APU for embedded systems, incorporating an x86 "Bobcat" CPU and a DirectX 11-capable GPU on a single chip. It offers improved performance over previous embedded solutions while significantly reducing power, size, and cost. Initial customer response has been strong, with many traditional embedded companies adopting the new platform for their next-generation products.

1. THE AMD EMBEDDED G-SERIES
PLATFORM
The World’s First APU for Embedded Systems
Embargo until 12:01 a.m. EST 1/19/2011
1 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

2. Strong Commitment to x86 Embedded Systems
Ball Grid Array (BGA)
packaging introduced
Addition of graphics and to meet customer
chipset options for demand
comprehensive The AMD
Introduction of AMD64 embedded solution
technology into Embedded G-
The AMD embedded markets with Series
Geode™ AMD Opteron™ Platform
processor processor
2003 2004 2005 2006 2007 2008 2009 2010 2011
AMD increases performance and features, while driving down
power, area, and price barriers for x86 in embedded
2 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

3. The Embedded Market is Key in AMD’s Strategy
Market is huge and growing
10%+ per year growth in the CPU market for embedded applications¹
The x86 CPU SAM² is more than 3B/year in 2010 alone²
>350% growth for AMD’s 64-bit embedded CPU/chipset business in just 3
years³
This market wants innovative, complete platforms
Systems are more compute intensive with high-performance graphics
requirements
¹ As predicted by VDC research 2009 Global Embedded Market Analysis
² “Served Available Market”; as estimated by VDC research 2009 Global Embedded Market Analysis
³ Based on AMD internal data 2007-2010
3 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

4. The Next Step Forward for AMD in Embedded: AMD G-Series Platform
We live in an always-on environment
that requires high performance.
There is an ongoing push for
decreased power, smaller size, higher
capability systems at lower prices.
There is a strong visual element and
Today, AMD is delivering the world’s first and
growing need for quality graphics in
only APU for embedded systems,
many embedded markets incorporating the new, very low power x86
“Bobcat” core with a world-class DirectX® 11-
capable GPU on a single piece of silicon.
4 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

5. Traditional Vertical Markets
Thin-clients Medical Imaging
Point-of-sale (POS)
Gaming Machines
& Kiosk Systems
Digital Signage Single Board Computing (SBC)
Small/Home Office to Enterprise
Industrial Controls
Storage
Ruggedized, Field, Telecommunications
& Military Systems & Networking
5 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

6. The Future of Embedded Systems is Here
More compelling designs in
traditional markets
Incredible user experiences in
smaller form factors
Enabling brand new markets and
products in a world of connected
devices
3.5” Single Board Computer
6 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

7. The AMD Fusion Family of Accelerated Processing Units
APU External
Multi-Core CPUs GPU sub-systems
CPU Serial Data Processing GPU
Parallel Data Video Display
General General
Program Program Processing
Task Task
Graphics ATI Stream
• General-purpose,
Designed for: programmable scalar and Designed for:
vector processor cores, form
General purpose tasks Specialized tasks
heterogeneous capability (e.g. graphics, video)
Most common
applications • High-speed bus Most visual applications
Data processing serially architecture Data processing in
• Shared, low-latency parallel
memory model
• All on the same die
7 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

8. The AMD Embedded G-Series Platform: APU + Fusion Controller Hub
APU
• 2 x86 CPU Cores (40nm “Bobcat” core – 1 MB L2, 64-bit
FPU)
• C6 and power gating
• Array of SIMD Engines
– DX11 graphics performance
– Industry leading 3D and graphics processing
• 3rd Generation Unified Video Decoder
– H.264, VC1, DixX/Xvid format
• Two dedicated digital display interfaces
– Configurable externally as HDMI, DVI, and/or Display Port
– Also supports a single link LVDS for internal panels
• Integrated VGA DDR3 800-1066, 2 DIMMs, 64 bit channel
• BGA package
AMD Fusion Controller Hub for display and I/O
• 4x1 PCIe®
• “Hudson” Fusion Controller Hub
8 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

9. Developer Support
Reference designs, development boards, and schematics
Support for differentiated embedded products at every phase
Design
Development
Go-to-market
Commitment to an open ecosystem for embedded developers
9 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

10. Current Customer Systems
10 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

11. Select AMD Embedded G-Series Platform Customer and Partners
11 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

12. The AMD Embedded G-Series Platform In Summary
AMD’s strong commitment to embedded is in a separate
league
•The world’s first and only APU for embedded systems
•Cutting-edge AMD Fusion technology
•Immediately available for embedded
•Driving down power consumption and board area
•Leveraging open and industry standards
•Improving time to market
The premier solution for a new generation of
differentiated, small form factor embedded systems
that consume less power, yet deliver improved
performance and features, including an outstanding
visual experience
12 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

13. BACKUP
13 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

14. Features that “Shrink the Design, Not the Performance”
Packaging Direct Connect Enterprise-class Scalability
Architecture Features
BGA and lidless options Multi-core leadership ECC
Socket-compatibility
for easy design
Virtualization upgrade
Low-z-height for small, Low memory latency
compact form factors
Multiple power
DDR3 memory management/ reduction Easy migration path to
Small area footprint features higher performance
High-performance I/O with
Reliability HyperTransport™ 3.0 Chipset & graphics
Enhanced virus protection
technology compatibility
Low cost
No compromise on Clear roadmap
Consistent 64-bit capability application performance progression
Fanless operation
14 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

15. With the AMD Embedded G-Series Platform: Further Shrink the Design, Improve the Experience
Reduced Board Integrated Graphics Rich Display and I/O Low Idle
Space Performance Support Power
World-class integrated AMD
Radeon™ graphics core with
Up to 6 digital display Optimized display refresh
DirectX® 11 support
Brings together CPU and ports connect one minimizes DRAM activity
GPU into a single, smaller Low Latency, high-bandwidth HDMI™, multiple DP, or during idle states, does
package memory access enables high DVI displays and docks not require external I/O or
performance graphics chipset activity
DirectCompute 11
Easy migration path to
Smooth playback of Blu-ray titles
PCIe® general purpose higher performance
ports provide low-latency,
Enables small form factors Up to 1080p video playback high bandwidth I/O direct UVD 3.0 offloads video
with high levels of SoC supported (18W processors and
to memory to support decode dramatically
integration above only)
demanding peripherals reducing CPU loading
Up to 2560x1600 display during video playback
resolution
15 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

16. New Low-Power "Bobcat" x86 Core
Advanced Micro-architecture
 Dual x86 Decode
 Advanced Branch Predictor ICACHE
 Out-of-Order Instruction Execution “Bobcat” L2
– Full OOO Instruction Execution Low-Power Fetch
– Full OOO Load/Store Engine
Core
 High Performance Floating Point
 AMD64 64-bit ISA Decode BU
 SSE1,2,3, SSSE3 ISA, SSE4A
 Secure Advanced Virtualization
 32KB L1s, 512KB L2
Low Power Design
Integer Address FP
 Power Optimized Execution Scheduler Scheduler Scheduler
 Micro-architecture that minimizes data movement
and unnecessary reads
 Clock Gating, Power Gating I I Load Store A M
 System Low Power States Pipe Pipe Pipe Pipe Pipe Pipe
 Sub 1W capable
Small Core DCACHE
 Mainstream performance in less
than half of the silicon area of previous solutions
 40nm / 10 metal layer process
16 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

17. Better Footprint than Intel Atom Solutions
To scale
2.7W-4.7W = 11.7W-22.7W
AMD Embedded G-Series Platform 9,18W
Controller
FT1 APU Hub = 890mm2
361mm2 529mm2
413 balls 605 balls
= 1018 balls
2.7-3.9W 1.55W = 4.25W-5.45W
Intel Atom E6xx Series
Intel Intel
EG20T
FCBGA559 Atom 600
Controller = 1013mm2
Series Hub
484mm2 529mm2 = 1052 balls
Source: http://download.intel.com/embedded/processors/prodbrief/324100.pdf
676 balls 376 balls
2.5-4.3W = 8W-17.3W
Intel Atom 400 and 500 Series 5.5-13W
Intel Intel
FCBGA559 Atom ICH9 I/O = 1445mm2
400-500 Controller
Source: http://ark.intel.com/Product.aspx?id=29823&code=82801HM and 484mm2 = 1235 balls
http://download.intel.com/embedded/processors/prodbrief/323288.pdf 559 balls
961mm2
676 balls
17 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

18. Better Footprint : AMD Embedded G-Series Platform vs. Intel Core i5-520M
To scale
AMD Embedded G-Series Platform
9,18W 2.7W-4.7W = 11.7W-22.7W
FT1 APU
Controller
= 890mm2
Hub
361mm2
413 balls 529mm2
= 1018 balls
605 balls
Intel Core i5-520M 35W =38.5W
3.5W
Intel
Intel Core i5-
QM57 = 1627mm2
BGA1288 Controller
520M
Hub
= 2359 balls
675mm2
1071 balls
952mm2
1288 balls 82% larger footprint with more
than 2X balls to route
Source: http://ark.intel.com/Product.aspx?id=47341 and http://ark.intel.com/chipset.aspx?familyID=43185
18 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

19. DISCLAIMER
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19 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11