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SHORT CHANNEL EFFECTS
By:
Ashish A Bait
Sagar Paarcha
Nilesh Narkhede
Suraj More
OVERVIEW
• Pre-requisite
• What is Short Channel
• What are Short Channel Effects
• DIBL
• Surface scattering
• Hot electron effect
• Impact Ionisation
• Velocity saturation
PRE-REQUISITE
• Threshold voltage:- The minimum voltage
across gate and source which allows current
flow through the transistor.
• Sub-threshold current:- The current flowing
through the transistor before threshold
voltage is called sub-threshold current.
• Pinch-off voltage :- It is a voltage after which
there is no effect of increase in drain to
source voltage on the current flowing
through transistor.
WHAT IS SHORT CHANNEL
• Channel length ~= depletion width of source
and drain
SHORT CHANNEL EFFECTS
• Short channel MOS has good processing
speed, requires low operating potential and
increases transistor density on the chip.
• Although the performance degrades with
decrease in channel length.
• It faces some serious issues like DIBL, surface
scattering, velocity saturation, impact
ionisation, hot electron effect.
DRAIN INDUCEDBARRIER LOWERING(DIBL)
• Increase in drain voltage reduces the barrier
face by electrons or holes in the source
allowing them to go from source to drain
where gate voltage remain unchanged.
• Gate looses the control of flow of current
through MOS and become as good as
redundant.
DRAIN INDUCEDBARRIER LOWERING(DIBL)
DRAIN INDUCEDBARRIER LOWERING(DIBL)
Long Channel Short Channel
SURFACE SCATTERING
SURFACE SCATTERING
• In long channel Ex>>Ey,but in short channel
Ex is not negligible.
• Ex and Ey field makes electron to travel in zig-
zag path, reducing their mobility.
• As the channel length becomes shorter
electric field Ey increases causing surface
mobility to become field dependent.
HOT ELECTRON EFFECT
HOT ELECTRON EFFECT
• At high velocity carriers drifting near the drain
gains extra energy called hot carriers.
• These hot carriers tunnel through gate oxide
thus reducing the total current flow from
source to drain.
• Reduces the input impedance.
HOT ELECTRON EFFECT
• The technique is used in floating gate devices
to increase the threshold by trapping the
electrons in the floating gate
• To reduce hot electron effect:- drain is lightly
doped, resulting in less electric field created
for carriers.
IMPACT IONISATION
IMPACT IONISATION
• Electron travelling to the drain creates
electron-hole pair by impact ionisation.
• Secondary electrons are collected at drain
causing current to increase in saturation.
• Secondary holes are collected at substrate
causing to increase latch up.
VELOCITY SATURATION
VELOCITY SATURATION
• Up to certain point velocity is directly
proportional to electric field.
• But after the point velocity saturates and has
no effects of increase in electric field.

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Short channel effects

  • 1. SHORT CHANNEL EFFECTS By: Ashish A Bait Sagar Paarcha Nilesh Narkhede Suraj More
  • 2. OVERVIEW • Pre-requisite • What is Short Channel • What are Short Channel Effects • DIBL • Surface scattering • Hot electron effect • Impact Ionisation • Velocity saturation
  • 3. PRE-REQUISITE • Threshold voltage:- The minimum voltage across gate and source which allows current flow through the transistor. • Sub-threshold current:- The current flowing through the transistor before threshold voltage is called sub-threshold current. • Pinch-off voltage :- It is a voltage after which there is no effect of increase in drain to source voltage on the current flowing through transistor.
  • 4. WHAT IS SHORT CHANNEL • Channel length ~= depletion width of source and drain
  • 5. SHORT CHANNEL EFFECTS • Short channel MOS has good processing speed, requires low operating potential and increases transistor density on the chip. • Although the performance degrades with decrease in channel length. • It faces some serious issues like DIBL, surface scattering, velocity saturation, impact ionisation, hot electron effect.
  • 6. DRAIN INDUCEDBARRIER LOWERING(DIBL) • Increase in drain voltage reduces the barrier face by electrons or holes in the source allowing them to go from source to drain where gate voltage remain unchanged. • Gate looses the control of flow of current through MOS and become as good as redundant.
  • 10. SURFACE SCATTERING • In long channel Ex>>Ey,but in short channel Ex is not negligible. • Ex and Ey field makes electron to travel in zig- zag path, reducing their mobility. • As the channel length becomes shorter electric field Ey increases causing surface mobility to become field dependent.
  • 12. HOT ELECTRON EFFECT • At high velocity carriers drifting near the drain gains extra energy called hot carriers. • These hot carriers tunnel through gate oxide thus reducing the total current flow from source to drain. • Reduces the input impedance.
  • 13. HOT ELECTRON EFFECT • The technique is used in floating gate devices to increase the threshold by trapping the electrons in the floating gate • To reduce hot electron effect:- drain is lightly doped, resulting in less electric field created for carriers.
  • 15. IMPACT IONISATION • Electron travelling to the drain creates electron-hole pair by impact ionisation. • Secondary electrons are collected at drain causing current to increase in saturation. • Secondary holes are collected at substrate causing to increase latch up.
  • 17. VELOCITY SATURATION • Up to certain point velocity is directly proportional to electric field. • But after the point velocity saturates and has no effects of increase in electric field.