Acceleration Factor using norris landzberg equation
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The document discusses using the Norris-Landzberg equation to calculate acceleration factors for accelerated life testing of components. It explains that the Norris-Landzberg equation uses parameters like temperature cycling frequency, maximum temperature, temperature range, and activation energy to determine how stresses in accelerated testing relate to stresses in normal usage conditions. It recommends using the equation to calculate acceleration factors for different lifetimes of a controller, which would allow reducing the number of thermal cycles needed in durability testing from what simple models require.
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Ultrasonic phased array technology provides an effective way to inspect composite wind turbine blades for flaws during manufacturing. Phased array probes use multiple piezoelectric elements that can be electronically controlled to generate beams for scanning blades. This allows for high resolution inspection and detection of flaws like porosity, disbonds, delaminations, and wrinkles. Automated scanning systems can inspect large areas quickly, generating C-scan images to analyze bond quality and adhesive thickness. Ultrasonic phased array offers productivity advantages over conventional UT for the critical task of ensuring blade integrity.
Aramco inspection handbook
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GaN RF Market: Applications, Players, Technology and Substrates 2020
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
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API 570 Piping and Pipeline Inspectors Preparatory Course
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Introdution to POF reliability methods
Physics of Failure (also known as Reliability Physics) is a science-based approach for achieving Reliability by Design. The approach is based on research to identify and understand the processes that initiate and propagate mechanisms that ultimately results in failure. This knowledge when used in Computer Aided Engineering (CAE) durability simulations and reliability assessment can evaluate if a new design, under actual operating is susceptible to the root causes of failure such as fatigue, fracture, wear, and corrosion during the intended service life of the product.
The objective is to identify and eliminate potential failure mechanisms in order to prevent operational failures through stress-strength analysis to produce a robust design and aid in the selection of capable manufacturing practices. This is accomplished by modeling the material strength and architecture of the components and technologies a product is based upon to evaluating their ability to endure the life-cycle usage and environmental stress conditions the product is expected to encounter over its service life in the field or during durability or reliability qualification tests.
The ability to identify and quantify the specific hazard risks timeline of specifics failure risks in a new product while it is still on the drawing board (or CAD screen) enables a product team to design reliability into a product by revising the design to eliminate or mitigate failure risks. This capability results in a form of Virtual Validation and Virtual Reliability Growth during the a product’s design phase that can be implemented faster and at lower costs than the traditional Design-Build-Test-Fixed approach to Reliability Growth during a product’s development and test phase.
This webinar compares classical reliability concepts and relates them to the PoF approach as applied to Electrical/Electronic (E/E) System and technologies. This webinar is intended for E/E Product Engineers, Validation/Test Engineers, Quality, Reliability and Product Assurance Personnel, CAE Modeling Analysts, R&D Staff and their supervisor.
Reliability Growth Testing (RGT) Plan
RGT is a planned test-analyze-and-fix (TAAF) process in which End Unit is tested under actual, simulated, or accelerated environments to disclose design deficiencies and defects. It is intended to provide a basis for early incorporation of corrective actions and for verification of their effectiveness, thus promoting reliability growth. RGT is intended to correct failures that reduce operational effectiveness and failures that increase maintenance and logistics support costs.
ESS and HASS: Concerns with the Practices and Standards
The purpose of "stress" screening such as environmental stress screening (ESS) or highly accelerated stress screening (HASS) is to precipitate failures in weak or defective populations using some load (stress) condition(s) without reducing the required useful life of the product
Use of Failure Mechanisms enhance FMEA and FMECA
This document summarizes a paper that proposes a new methodology called Failure Modes, Mechanisms and Effects Analysis (FMMEA) to enhance traditional Failure Modes and Effects Analysis (FMEA). The standard FMEA process does not identify failure mechanisms or models, limiting its usefulness. FMMEA identifies high priority failure mechanisms and models to help control operational stresses and test product reliability. It was applied to an electronic circuit board assembly in an automotive underhood environment. The full paper discusses the limitations of FMEA and how identifying failure mechanisms can help with virtual qualification, root cause analysis, accelerated testing, and remaining life assessment.
Thermal cycling screen development
Thermal cycling screens involve cycling hardware between high and low temperatures to induce failures. Method A for developing a thermal cycling profile uses a thermal survey to tailor cycle characteristics, equipment conditions, and number of cycles to the specific hardware. An ideal thermal survey involves computer modeling, constructing a test facility replica, instrumenting hardware, and performing experimental trials to establish screening parameters that achieve desired hardware temperature histories. Key parameters include temperature extremes and rates of change, dwell times at extremes, and whether hardware is powered during screening.
DFR a case study using a physics of failure
Design for reliability (DFR) is an industry-wide practice and a philosophy of considering reliability in an early stage of product design and development, to achieve a highly-reliable product while with sustainable cost. Physical of Failure (PoF) is recognized as a key approach of implementing DFR in a product design and development process. The author will present a case study to illustrate predicting and identifying product failure early in the design phase with the help of a quantitative PoF model based analysis tool.
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ESS and HASS: Concerns with the Practices and Standards
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Similar to Acceleration Factor using norris landzberg equation
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1. The document describes an experiment to test the validity of the Nernst equation by measuring the voltage of electrochemical cells containing varying concentrations of zinc or magnesium ions.
2. Results show cell voltage decreases with decreasing log of the concentration of zinc ions, following the linear relationship predicted by the Nernst equation.
3. A magnesium-copper cell is also constructed, producing enough voltage to power a small LED, demonstrating a spontaneous redox reaction and energy conversion.
International Journal of Engineering Research and Development (IJERD)
We would send hard copy of Journal by speed post to the address of correspondence author after online publication of paper.
We will dispatched hard copy to the author within 7 days of date of publication
03C -Chapter 3 - Sec 3.6.ppt
1) An electronic chip attached to an air-cooled heat sink with 11 fins is analyzed to determine the maximum power the chip can dissipate without exceeding 85°C.
2) The thermal resistance network is analyzed using the fin equation and equations for thermal resistance of each component.
3) The maximum allowable power is found to be 31.8W based on the geometry, material properties, and convection coefficients given.
4) Without the heat sink, the maximum power would be much lower at only 2.60W due to the higher thermal resistance of natural convection alone. The heat sink significantly increases the chip's cooling ability.
Nernst Equation 3.ppt
Bfhdjskdjdjdkdodjfjdksjfjekskfjeosjfjeosfjeodidjeifjeidjdodofjdjdoeifjrieowidjeiwjsjfjeiwosiwiwisjsjdxjxjcjdjdkkddodododi😆didkfkdieock
IA on effectiveness of different types of catalysts MnO2 vs Fe(NO3)3 on the r...
IA on effectiveness of different types of catalysts MnO2 vs Fe(NO3)3 on the rate of decomposition of H2O2 measured using a pressure sensor.
Characterization of Single crystal KNN Ceramics (K0.5Na0.5NbO3)
This document describes the characterization of potassium sodium niobate (KNN) single crystals grown via a slow-cooling technique. Key points:
1) KNN single crystals up to 4x4x8 mm in size were grown and showed an orthorhombic perovskite structure.
2) Dielectric measurements found phase transitions from rhombohedral to orthorhombic at -100°C, orthorhombic to tetragonal at 214°C, and tetragonal to cubic at 433°C.
3) Piezoelectric coefficient d33 peaked at 130°C with a maximum value of 220 pC/N, decreasing above 210°C
11.a new mechanism of sodium zirconate formation
This document presents a new mechanism for forming sodium zirconate (Na2ZrO3) through the thermal decomposition of sodium acetate (CH3COONa) and zirconium(IV) acetylacetonate (Zr(C5H7O2)4). Thermogravimetric analysis showed the reaction occurs in three significant weight losses. Fourier transform infrared spectroscopy identified gases like CO2 and CO released during the reaction. X-ray diffraction confirmed the product was sodium zirconate. A kinetic study determined the activation energy, pre-exponential factor, and reaction order for each weight loss region using the Arrhenius equation. The proposed mechanism involves three reactions corresponding to the decomposition
ECNG 3015 Power System Protection
The document discusses power system protection. It defines the objectives of power system protection as detecting and isolating faults instantaneously while minimizing the number of circuits isolated and restoring the system quickly. It also discusses criteria for proper protection systems, including reliability, selectivity, speed of operation, and discrimination. Detection methods like current transformers and potential transformers are explained. Common protection relays like electromagnetic attraction, balance beam, and electromagnetic induction types are also summarized.
6th ed solution manual---fundamentals-of-heat-and-mass-transfer
This document contains 10 problems related to heat transfer by conduction. Each problem provides known information such as materials, dimensions, temperatures, and heat transfer rates. The problems then ask the reader to find unknown values like heat fluxes, surface temperatures, or thicknesses using Fourier's Law of heat conduction and assumptions of one-dimensional and steady-state heat transfer. The problems cover a variety of applications including insulation, walls, windows, refrigeration, and cooking.
IA on effect of zinc concentration on voltage using nernst equation
This document describes an experiment to investigate the effect of varying the concentration of ZnSO4 and CuSO4 on the electromotive force (emf) and current of a Zn/Cu voltaic cell. Zinc and copper electrodes are placed in wells containing solutions of varying molarities of ZnSO4 and CuSO4, and the emf and current are measured. Theoretical calculations of cell potential are performed using Nernst equation for different concentrations. A graph of the logarithm of concentration ratio versus measured cell potential shows good agreement between theoretical and experimental values, with around 12% error.
Heat exchanger
This document discusses heat exchangers and includes the following key points:
- It describes different types of heat exchangers including concentric-tube, cross-flow, shell-and-tube, and compact heat exchangers.
- It discusses the overall heat transfer coefficient and factors that influence it such as convection, conduction, fins, and fouling.
- It introduces the log mean temperature difference (LMTD) method for calculating heat transfer in heat exchangers and how LMTD is evaluated for different flow configurations.
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CH EN 3453 Heat Transfer 2014 Fall Utah Homework HW 05 Solutions
Chemical Engineering CH EN 3453 Heat Transfer
from University of Utah, 2014 Fall
Homework HW 05 Solutions
0210varo
The document summarizes the interaction between a vibration exciter and the structure under test. It discusses how the exciter's armature mass can affect vibration test measurements if not properly accounted for. A theoretical model is presented that models the exciter armature as a 2 degree-of-freedom system coupled to the structure. Equations are provided that relate the exciter's electrical properties to the mechanical motion based on principles of electromagnetism and circuit theory. The effects of the exciter's operating mode and nonlinear dynamics are also addressed.
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This document provides an overview of fundamentals of refrigeration. It begins with definitions and applications of refrigeration systems. It then discusses the reversed Carnot cycle and presents the temperature-entropy and pressure-enthalpy diagrams for the refrigeration cycle. The key components of a vapor-compression refrigeration system are described along with diagrams illustrating the thermodynamic processes. Mathematical analysis equations for determining refrigeration effect, mass of refrigerant, theoretical piston displacement, and theoretical power required are provided. Examples are also given to demonstrate calculations of performance metrics like COP for refrigeration and heat pump applications.
Heat transfer(HT) lab manual
This lab manual document provides instructions for experiments on heat transfer in a Mechanical Engineering department. The first experiment listed is on heat transfer from a pin-fin apparatus. The objective is to calculate the heat transfer coefficient for natural and forced convection from a fin. The experiment involves measuring temperatures along a brass fin heated at one end while air passes over it naturally or in a duct. The second experiment listed is on heat transfer through a composite wall, and involves determining the total thermal resistance and conductivity of a wall made of different slab materials sandwiching a heater.
Reaction Kinetics
The document discusses reaction kinetics and methods for determining reaction rates. It defines reaction rate and explains how to express reaction rates using concentration changes over time. It also discusses calculating reaction rates from experimental data and determining the rate laws and orders of reactions. Integrated rate laws that relate concentration to time for first-order reactions are also covered, including calculating rate constants and half-lives. The Arrhenius equation, which relates reaction rate to temperature, is introduced.
Master Thesis Total Oxidation Over Cu Based Catalysts
The evolution in the oxidation state of Cu and Ce in a benchmark catalyst is studied
under different conditions: temperature programmed reduction with propane and hydrogen,
and isothermal reduction with propane and hydrogen.
Analytical methods used involve operando X-ray absorption spectroscopy (XAS) in
transmission mode at the Cu K edge and Ce LIII edge, as well as online mass spectrometry
(MS) at the outlet of the reactor.
Krkk tugas
1) The document discusses the thermal decomposition reaction of hydrogen iodide (HI). Experimental data on the rate constant (k) of the reaction at different temperatures is provided.
2) The complete rate equation for the reaction is derived. The Arrhenius equation is used to determine the activation energy (E) and pre-exponential factor (ko) by plotting the logarithm of k against the inverse of temperature.
3) The final rate equation determined is:
-rHI = 4.06 x 1016 e-22,727/T CHI2 (mol/cm3.s)
Chem140alecture3.ppt
The document discusses the effective mass approximation in quantum mechanics. It begins by defining the effective mass as inversely proportional to the curvature of energy bands. Having a effective mass allows electrons in crystals to be treated similarly to classical particles, with the crystal forces and quantum properties accounted for in the mass. The effective mass can be a tensor and depends on the crystal direction. It then discusses measuring the effective mass using cyclotron resonance and how it varies by crystallographic direction. In general, the effective mass incorporates the quantum mechanical behavior of electrons in crystals to allow a classical particle treatment.
Ch.17
1) Sound is a small pressure wave that travels through a medium and requires a medium, unlike light which can travel through a vacuum.
2) The speed of sound in a medium depends on the properties of that medium and changes as those properties change, such as temperature.
3) The speed of sound is highest in gases with a high kR value, such as helium, and increases with increasing temperature in all gases.
Similar to Acceleration Factor using norris landzberg equation (20)
International Journal of Engineering Research and Development (IJERD)
International Journal of Engineering Research and Development (IJERD)
IA on effectiveness of different types of catalysts MnO2 vs Fe(NO3)3 on the r...
IA on effectiveness of different types of catalysts MnO2 vs Fe(NO3)3 on the r...
Characterization of Single crystal KNN Ceramics (K0.5Na0.5NbO3)
Characterization of Single crystal KNN Ceramics (K0.5Na0.5NbO3)
6th ed solution manual---fundamentals-of-heat-and-mass-transfer
6th ed solution manual---fundamentals-of-heat-and-mass-transfer
IA on effect of zinc concentration on voltage using nernst equation
IA on effect of zinc concentration on voltage using nernst equation
CH EN 3453 Heat Transfer 2014 Fall Utah Homework HW 05 Solutions
CH EN 3453 Heat Transfer 2014 Fall Utah Homework HW 05 Solutions
Master Thesis Total Oxidation Over Cu Based Catalysts
Master Thesis Total Oxidation Over Cu Based Catalysts
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IEEE 1633 Recommended Practice on Software Reliability
Software reliability engineering has existed for over 50 years, fundamental prerequisite for virtually all modern systems. Diverse set of stakeholders requires pragmatic guidance and tools to apply software reliability models to assess real software or firmware projects during each stage of the software development lifecycle. Reliability engineers may lack software development experience. Software engineers may be unfamiliar with methods to predict software reliability. Both may have challenges acquiring data needed for the analyses.
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Statistical Confidence Level
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Outgoing Reliability Assurance of 'End-Units'
The document discusses environmental stress screening (ESS) processes used to test electronic products and remove latent defects. It notes that while ESS is commonly used, failure rate analysis is not always performed to evaluate screening effectiveness. The document recommends analyzing failure rate distributions over time using the Chance Defective Exponential model to determine optimal ESS screening times and ensure high outgoing quality. Adaptive ESS processes that adjust screening parameters based on results can further reduce defects.
Transient Suppressors
Transients can cause slow degradation, erratic operation, or catastrophic failure in electrical parts, insulation dielectrics, and electrical contacts used in switches and relays. The possible occurrence of transients must be considered in the overall electronic design. Required circuit performance and reliability must be assured both during and after the transient
Reliability Prediction Procedure for Mechanical Components
This document presents methodology to be used to predict mechanical component reliability using the Stress/Strength Interference Method. This method assumes that the material properties are time independent because of their slow change, and the components are not subjected to wear related failure modes
Software Reliability
Software Reliability models have been in existence since the early 1970, over 200 have been developed. Some of the older models have been discarded based upon more recent information about the assumptions, and newer ones have replaced them.
Virtual Qualification
Virtual qualification is the first stage of the overall qualification process. It is the application of Physics of Failure (PoF) based reliability assessment to determine if a proposed product can survive its anticipated life cycle
Availability
Availability is a performance criterion for repairable systems that accounts for both the reliability and maintainability properties of a component or system. It is defined as the probability that the system is operating properly when it is requested for use
Testability
Testability refers to the design parameter which makes it relatively easy to identify and isolate faults in the system. Testability can be considered to be a subset of maintainability, because fault detection and isolation are important drivers in the maintainability of a system
Accelerated Stress Testing
This handbook is written to show how greater control can be gained over total product reliability by the utilization of Accelerated Stress Testing techniques (AST)
Early Life Failure Rate Calculation Procedure for Semiconductor Components
Early Life Failure Rate Calculation Procedure for Semiconductor ComponentsHilaire (Ananda) Perera P.Eng.
This standard defines methods for calculating the early life failure rate of a product, using accelerated
testing, whose failure rate is constant or decreasing over time. For technologies where there is adequate
field failure data, alternative methods may be used to establish the early life failure rate.
The purpose of this standard is to define a procedure for performing measurement and calculation of early
life failure rates. Projections can be used to compare reliability performance with objectives, provide line
feedback, support service cost estimates, and set product test and screen strategies to ensure that the
Early life Failure Rate meets customers' requirements.
Basic Design Considerations for Surface Mount Technology
Surface mount technology (SMT) secures electronic components to printed circuit boards through soldering the leads directly to the surface rather than passing them through holes. This places more stress on the solder connections and can lead to higher failure rates compared to through-hole technology. SMT offers advantages like being able to mount components on both sides of boards and in closer proximity. However, special design considerations are needed like matching the coefficient of thermal expansion of components and boards and ensuring the soldering surfaces can withstand the temperatures of the soldering process without damage.
Design For Reliability
The document discusses various techniques for designing products for reliability, including derating components, accelerated life testing, and reliability estimation methods. It describes how reliability modeling should guide the design process from the beginning to design out potential failure mechanisms. The goal is to develop longer-lived products through an iterative approach of testing, analyzing failures, and redesigning to improve reliability. Key aspects of a reliability-focused design process include understanding failure mechanisms, developing reliability databases, and using super-accelerated life testing techniques.
Rating & uprating handbook
This book provides a methodology for engineers to determine if electronic parts can meet performance requirements when used outside of the manufacturer's specified ratings. It aims to give a well-defined, risk-informed process for uprating parts. The book covers determining application environment specifications, avoiding risks of using parts outside ratings, applying an uprating methodology, and mitigating legal risks. It is intended for engineers selecting, qualifying, and managing electronic parts across the supply chain, from product manufacturers to part suppliers.
Vibration before thermal cycling in ESS
Environmental stress screening (ESS) is a process that applies environmental stresses like vibration to products to induce latent defects. This helps improve quality and reliability. Vibration and temperature cycling are effective forms of ESS to stimulate flaws like loose connections or cracks. ESS is intended to find flaws, not simulate actual use, so failures during the process are encouraged and their causes must be identified and addressed. Random and quasi-random vibration are commonly used for ESS to induce a variety of motions that can cause failures through mechanisms like loose parts or solder joints. Thermal cycling and vibration work best together in ESS to find defects that one stress alone may not reveal.
Mechanical component reliability
This document provides methodology for designing reliability into mechanical components. It discusses testing wear-related parts for 2 times their expected cycle life to ensure no failures occur during operational use. It also describes using a probabilistic design method called stress/strength interference to design non-wear parts subjected to reversing loads, selecting a safety margin probability number based on the mean and standard deviation of material strength and stress functions. All components should be designed to have a reliability better than a target for the total operational use time.
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The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
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みなさんこんにちはこれ何文字まで入るの？40文字以下不可とか本当に意味わからないけどこれ限界文字数書いてないからマジでやばい文字数いけるんじゃないの？えこ...
ここ3000字までしか入らないけどタイトルの方がたくさん文字入ると思います。
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みなさんこんにちはこれ何文字まで入るの？40文字以下不可とか本当に意味わからないけどこれ限界文字数書いてないからマジでやばい文字数いけるんじゃないの？えこ...
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- 1. Acceleration Factor Calculation Using Norris-Landzberg Equation Using Accelerated Life Testing the specified Thermal Cycles can be reduced. Accelerated Tests are performed using stresses beyond normal life cycle or usage conditions. Accelerated tests are performed primarily to (a) identify or conform marginal design or manufacturing areas or (b) estimate product life. Prior to initiating accelerated testing, weak links should be investigated and potential failure modes eliminated Reference Qualification Test Plan for the Controller, the specified Durability Thermal Cycles for the “Flight Lifetime” are 6242 and Durability Thermal Cycles for the “ Maintenance Lifetime” are 6970 The most widely used model is the modified Coffin-Manson (Norris-Landzberg) Equation. This can be used to determine a Acceleration Factor for the thermal test condition and product environment. It uses: (1) an Arrhenius Term; (2) Temperature Cycling Frequency; (3) Maximum Temperature reached in a Cycle; (4) Temperature Range during a Cycle. The modified Coffin-Manson (Norris-Landzberg) Equation and a worked example using arbitrarily chosen values is shown in Page 2 Recommendation Use appropriate Parameter (f1; f2; ∆T1; ∆T2; m; n; T1; T2; Ea ) Values for the modified Coffin-Manson (Norris-Landzberg) Equation to suit the Controller Design and Durability Test Requirements. Calculate Acceleration Factors for the Flight Lifetime and Maintenance Life Time and determine the Durability Flight & Maintenance Cycles Benefit Durability Thermal Cycles determined using the modified Coffin-Manson (Norris- Landzberg) Equation will be lower than using Coffin-Manson Equation, hence reduction in Test Time and a Cost Saving Hilaire Ananda Perera http://www.linkedin.com/in/hilaireperera Long Term Quality Assurance
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