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1-Introduction to COMSOL Multiphysics.pptx
- 1. Introduction to COMSOL Multiphysics PREPAREDBY MECHANICAL ENGINEER: LOUBNA KHALED 1 ENG. LOUBNA KHALED
- 2. Definition COMSOL Multiphysics isa finite element analysis, solver and simulation software/ FEA software package for various physics and engineering applications, especially coupled phenomena, or Multiphysics. 2 ENG. LOUBNA KHALED
- 3. A Brief Historyof Modeling Software A computer model refers to the algorithms and equations used to capture the behavior of the system being modeled. However, a computer simulation refers to the actual running of the program which contains these equations or algorithms. 3 ENG. LOUBNA KHALED
- 4. The General IdeaBehind Numerical Modeling • User builds a model with significant variables • User builds a model mesh • COMSOL solves the model numerically at every mesh intersection • Intersections are connected to provide “continuous” data 4 ENG. LOUBNA KHALED
- 5. How is TheModel Solved at Every Intersection? Several methods exist - one example is the Finite Element Method: 5 ENG. LOUBNA KHALED
- 6. Mathematical Model •Algebraic equation •OrdinaryDifferential Equations (ODE) •Partial Differential Equations (PDE) •Differential-Integral Equations 6 ENG. LOUBNA KHALED
- 7. Mathematical Model –Example 7 ENG. LOUBNA KHALED
- 8. Characteristics of COMSOLMultiphysics •Include and couple all relevant effects • Solve fully coupled or physics at a time • Easy to learn • Easy to use • Highly adaptable 8 ENG. LOUBNA KHALED
- 9. COMSOL Multiphysics Modules Electrical AC/DCModule RF Module Wave optics Module Plasma Module Semiconductor Module Mechanical Heat Transfer Module Structural Mechanics Module Geomechanics Module Fatigue Module Acoustics Module Fluid Chemical CFD Module Mixer Module Microfluids Module Pipe Flow Module Molecular Flow Module Chemical Reaction Engineering Module Batteries and Fuel Cells Module Electrodeposition Module Corrosion Module Electrochemistry Module CFD Module Mixer Module Microfluids Module Pipe Flow Module 9 ENG. LOUBNA KHALED
- 10. Study Types –Examples 10 Stationary Analysis Eigenfrequency Analysis Mode Analysis Time Domain Analysis Frequency Domain Analysis ENG. LOUBNA KHALED
- 11. Simulate Almost Everything!! 11 ENG.LOUBNA KHALED
- 12. Examples – Structuralanalysis of a Wrench Structural mechanics Stresses and strains in a wrench 12 ENG. LOUBNA KHALED
- 13. Examples – ElectricalHeating in a Busbar Busbar - an electrical conductor, maintained at a specific voltage and capable at a specific voltage and capable of carrying a high current, usually used to make a common connection between several circuits Joule heating Structural stresses and strains Cooling by an air stream 13 ENG. LOUBNA KHALED
- 14. Examples – Coolingand Solidification of Metal Continuous casting, where liquid metal solidifies in a cooled mold. It simplifies by assuming constant metal velocity, neglecting flow field computation, and ignoring volume change at solidification. The phase transition is modeled using apparent heat capacity. 14 ENG. LOUBNA KHALED
- 15. Example – LightBulb – Heat and Flow Natural Convection Flow with Heat All Three Forms of Heat Transfer •Conduction • Through solid glass domain • On metal socket •Convection • Flow inside bulb • Convection Coefficient Outside •Radiation • Surface-to-Surface • Surface-to-Ambient 15 ENG. LOUBNA KHALED
- 16. Example – LaserHeating of A Silicon Wafer A silicon wafer is heated up by a laser that moves radially in and out over time while the wafer itself rotates on its stage. Modeling the incident heat flux from the laser as a spatially distributed heat source on the surface, the transient thermal response of the wafer is obtained. The peak, average, and minimum temperatures during the heating process are computed, as well as the temperature variations across the wafer. 16 ENG. LOUBNA KHALED
- 17. Grading •Attendance •Weekly Assignments (followingsteps mentioned in Comsol4for engineers) •Final Project: Simulation Report 17 ENG. LOUBNA KHALED
- 18.