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Board Test Coverage and Electronic Product Testing

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Shiju Jacob
Shiju Jacob

This slide packs discuss about the electronic PCBA test coverage and product testing.

Technology
1 of 33
APRIL 2017 Electronic PCBAs and Products Testing
What We Will Discuss Today, Introduction & Test Coverage Test Development Strategies Different Type of Tests Functional Test Equipment Thales Industrial Test Strategy
And What We Won’t ! X Detailed Test Development Steps X Cost of Test Implementation/ROI X RF Tests X DFT Analysis X Reliability, HALT/HASS, Compliance Tests
Table of Contents ▌Introduction – Why Testing is Required ▌ Test Coverage - PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
▌ Production Variation, even very small Process Spec, M/C Parameters ▌ Internal Defect of PCB & Components ▌ Susceptibility & Tuning Requirement Comp Tolerance, Overall Performance of comps + PCB. Testing Required in Manufacturing? Why ? Manufacturing Outsourced ! Test Data is the confidence factor for customer !
Table of Contents ▌ Introduction – Why Testing Required ▌Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ DFT Analysis ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
Test Coverage AOI ICT FCTType of Test Fault Coverage Missed Coverage Overlapped Coverage ▌ Overall Fault Coverage Optimum Coverage ▌ Optimum Coverage Introducing new test method Fine-tuning of selected Test Methods
Test Covergae ▌ Fault Spectrum – Defect Universe Venn Diagram
Test Coverage - Effectiveness of Test ▌ Modeling Standards for Test Coverage PCOLA •Presence •Correctness •Orientation •Live •Alignment PPVS •Presence •Polarity •Value •Solder DMPSF •Design •Material •Placement •Solder •Function MPS •Material •Placement •Solder
Test Coverage ▌ Effectiveness of Test – Typical Case Study No Choices -Only at 1 Stage in Process Flow  AOI after Reflow catches more Defect. But better be before when Expensive Comps on board ! Effectiveness of one Test is indicated by another Test ! AOI – 35 % AXI – 92 % ICT – 25 %
Test Coverage - Product Level & Board Level ▌ Product Level Test Coverage aspect is different at product/sys level. Focus on - End to End Functionality - Latent Defects due to Reliability - Compliance ! • System Function • ESS • Reliability [Vibration, IP65] • Certification [CE, EMI/EMC] • AOI/AXI • ICT/FPT • Functional • Functional • AOI/AXI • ICT/FPT • AOI/AXI • ICT/FPT • BIT • Continuity • Functional Board Level Sub System Level System Level Product Level Coverage = Board Level Coverage + System Test Coverage !
Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌Test Strategies - Structural & Functional Tests ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
Test Strategy  Test Strategy Finalized Before Manufacturing Starts.  Test Strategy Influenced by  Component Package – small joints/reduced access  Product technology - Analog/ Dig/ RF  Product criticality – Industrial/Mission critical ?  Product complexity – H. Mix/L. Volume… Assembly Process – Pb Free There are many Dimensions to the Test Strategy Evaluation Matrix
▌ Right Test at Right Location – Later the Detection Tougher the Repair ! 90% of the defects are Structural, only 10% is electrical Traditional end of line testing (ICT+FCT) detects only electrical; at later stages of assembly ! Imaging Tests (AOI/AXI), ICT & Boundary Scan are more Effective to capture Structural Defects Test Strategy – Influencing Factors
Test Strategy – Influencing Factors ▌ Test at Right Cost Fault Spectrum is different for each product: Each line doesn’t require all Tests. AOI + AXI can capture most of the visual & structural defects. ICT can be made very simple of even eliminated. Programming also can be a Test ! Eliminate the Test overlap ! ▌ Test Throughput – Test Cycle Time ! ▌ Time to Debug ▌ Test Development Time
Test Strategy – Influencing Factors ▌ Complementary Test Coverage No single Test Technology can capture all defects Optimum test coverage achieved by combination of most effective Test Methods OVERALL Focus on Component Packages, Assembly Process, Test Cost … (multiple dimensions)
Test Strategy ▌ Re-look from Test Effectiveness
Test Allocation in Electronic Manufacturing - Typical
Different Test Systems - AOI ▌ AOI Visual check No electrical Test ▌ X Ray – Manual & AXI AXI – 3D X Ray Imaging – through X Ray No electrical Test
ICT - Most Effective Test Among Structural Tests ▌Test Fixture and Test SW development using CAD file. ▌Bed of nails connects to each node in the circuit. TestSW Complete PPVS Model
ICT ▌ ICT is most Effective test Strategy though very old ! No better Alternative ! ▌ Integration with Boundary scan increased the coverage with reduced no of net access ▌ Test Development cost justifies for high volume production
FPT ▌ No fixture - Highly sophisticated probe moves around and test the component on the test via. ▌ Relatively more test cycle time, better for lower volumes. ▌ Machine is programmed using CAD file ▌ Test Development fully in house ▌ Coverage can be lower than ICT in high mix PCBAs. Probe Movement can be obstructed by taller component on the boards
Boundary Scan a.k.a JTAG Nets in the circuit are accessed through JTAG port, no physical access required at test via Can Test only logic devices that are compatible with BSDL Compatible devices are connected in Daisy chain and interconnecting passives also included in the test. Test Strategy developed based by Joint Test Access Group (JTAG) Specified in IEEE 1149.1 Programming Language - BSDL
JTAG – Not Only Testing, Programming as well ! ▌ Powered Up Test ▌ In System Programming ▌ Boot loader loading and board bring up ▌ Integrated with ICT in modern systems to increase the overall test coverage
Functional Test ▌ Simple/Manual Functional Test Unit is powered up as in working configuration, Electrical signal applied in the input port, Output is connected and measured in standard instruments. Power Supply Data Capture Instrument Signal Source Instrument DUT I/P O/P FT is Power Up Test ! Functionality of the product is tested in the application point of view !
Functional Test ▌ Automated Functional Test Plug & Play Setup - Standard Bench-top Instruments - Interfacing through protocol [GPIB] - Test SW [Custom Developed on Licensed platform (NI Lab View)] - Test Fixture & Interfacing HW
Functional Test Setup Validation - Proto Batch Test & Test Report score card - Data Analysis & SPC
Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌Test Benches - FATE ▌ Test Challenges in Transfer Programs
Test Bench - FATE ▌ Functional ATE Completely Automated Test System
Test Bench - FATE
Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ Test Benches - FATE ▌Test Challenges in Transfer Programs
Test Challenges in Transfer Programs ▌ Old Designs – No coverage improvement possible. ▌ No DFT Tool and Test Coverage analysis in Manufacturing Interface Team – Dependency on Design House ▌ Functional Test - False Fail Tolerance Failure Obsolete Test Procedure - Tuning Requirements are not detailed. BOM and documents are not updated, Non documented test methods - Changes implemented at supplier is not added in the docs.
Only God We Trust, Everything Else We Test ! ▌Shiju JacobThank You !

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Board Test Coverage and Electronic Product Testing

  • 2. What We Will Discuss Today, Introduction & Test Coverage Test Development Strategies Different Type of Tests Functional Test Equipment Thales Industrial Test Strategy
  • 3. And What We Won’t ! X Detailed Test Development Steps X Cost of Test Implementation/ROI X RF Tests X DFT Analysis X Reliability, HALT/HASS, Compliance Tests
  • 4. Table of Contents ▌Introduction – Why Testing is Required ▌ Test Coverage - PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
  • 5. ▌ Production Variation, even very small Process Spec, M/C Parameters ▌ Internal Defect of PCB & Components ▌ Susceptibility & Tuning Requirement Comp Tolerance, Overall Performance of comps + PCB. Testing Required in Manufacturing? Why ? Manufacturing Outsourced ! Test Data is the confidence factor for customer !
  • 6. Table of Contents ▌ Introduction – Why Testing Required ▌Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ DFT Analysis ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
  • 7. Test Coverage AOI ICT FCTType of Test Fault Coverage Missed Coverage Overlapped Coverage ▌ Overall Fault Coverage Optimum Coverage ▌ Optimum Coverage Introducing new test method Fine-tuning of selected Test Methods
  • 8. Test Covergae ▌ Fault Spectrum – Defect Universe Venn Diagram
  • 9. Test Coverage - Effectiveness of Test ▌ Modeling Standards for Test Coverage PCOLA •Presence •Correctness •Orientation •Live •Alignment PPVS •Presence •Polarity •Value •Solder DMPSF •Design •Material •Placement •Solder •Function MPS •Material •Placement •Solder
  • 10. Test Coverage ▌ Effectiveness of Test – Typical Case Study No Choices -Only at 1 Stage in Process Flow  AOI after Reflow catches more Defect. But better be before when Expensive Comps on board ! Effectiveness of one Test is indicated by another Test ! AOI – 35 % AXI – 92 % ICT – 25 %
  • 11. Test Coverage - Product Level & Board Level ▌ Product Level Test Coverage aspect is different at product/sys level. Focus on - End to End Functionality - Latent Defects due to Reliability - Compliance ! • System Function • ESS • Reliability [Vibration, IP65] • Certification [CE, EMI/EMC] • AOI/AXI • ICT/FPT • Functional • Functional • AOI/AXI • ICT/FPT • AOI/AXI • ICT/FPT • BIT • Continuity • Functional Board Level Sub System Level System Level Product Level Coverage = Board Level Coverage + System Test Coverage !
  • 12. Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌Test Strategies - Structural & Functional Tests ▌ Test Benches - FATE ▌ Test Challenges in Transfer Programs
  • 13. Test Strategy  Test Strategy Finalized Before Manufacturing Starts.  Test Strategy Influenced by  Component Package – small joints/reduced access  Product technology - Analog/ Dig/ RF  Product criticality – Industrial/Mission critical ?  Product complexity – H. Mix/L. Volume… Assembly Process – Pb Free There are many Dimensions to the Test Strategy Evaluation Matrix
  • 14. ▌ Right Test at Right Location – Later the Detection Tougher the Repair ! 90% of the defects are Structural, only 10% is electrical Traditional end of line testing (ICT+FCT) detects only electrical; at later stages of assembly ! Imaging Tests (AOI/AXI), ICT & Boundary Scan are more Effective to capture Structural Defects Test Strategy – Influencing Factors
  • 15. Test Strategy – Influencing Factors ▌ Test at Right Cost Fault Spectrum is different for each product: Each line doesn’t require all Tests. AOI + AXI can capture most of the visual & structural defects. ICT can be made very simple of even eliminated. Programming also can be a Test ! Eliminate the Test overlap ! ▌ Test Throughput – Test Cycle Time ! ▌ Time to Debug ▌ Test Development Time
  • 16. Test Strategy – Influencing Factors ▌ Complementary Test Coverage No single Test Technology can capture all defects Optimum test coverage achieved by combination of most effective Test Methods OVERALL Focus on Component Packages, Assembly Process, Test Cost … (multiple dimensions)
  • 17. Test Strategy ▌ Re-look from Test Effectiveness
  • 18. Test Allocation in Electronic Manufacturing - Typical
  • 19. Different Test Systems - AOI ▌ AOI Visual check No electrical Test ▌ X Ray – Manual & AXI AXI – 3D X Ray Imaging – through X Ray No electrical Test
  • 20. ICT - Most Effective Test Among Structural Tests ▌Test Fixture and Test SW development using CAD file. ▌Bed of nails connects to each node in the circuit. TestSW Complete PPVS Model
  • 21. ICT ▌ ICT is most Effective test Strategy though very old ! No better Alternative ! ▌ Integration with Boundary scan increased the coverage with reduced no of net access ▌ Test Development cost justifies for high volume production
  • 22. FPT ▌ No fixture - Highly sophisticated probe moves around and test the component on the test via. ▌ Relatively more test cycle time, better for lower volumes. ▌ Machine is programmed using CAD file ▌ Test Development fully in house ▌ Coverage can be lower than ICT in high mix PCBAs. Probe Movement can be obstructed by taller component on the boards
  • 23. Boundary Scan a.k.a JTAG Nets in the circuit are accessed through JTAG port, no physical access required at test via Can Test only logic devices that are compatible with BSDL Compatible devices are connected in Daisy chain and interconnecting passives also included in the test. Test Strategy developed based by Joint Test Access Group (JTAG) Specified in IEEE 1149.1 Programming Language - BSDL
  • 24. JTAG – Not Only Testing, Programming as well ! ▌ Powered Up Test ▌ In System Programming ▌ Boot loader loading and board bring up ▌ Integrated with ICT in modern systems to increase the overall test coverage
  • 25. Functional Test ▌ Simple/Manual Functional Test Unit is powered up as in working configuration, Electrical signal applied in the input port, Output is connected and measured in standard instruments. Power Supply Data Capture Instrument Signal Source Instrument DUT I/P O/P FT is Power Up Test ! Functionality of the product is tested in the application point of view !
  • 26. Functional Test ▌ Automated Functional Test Plug & Play Setup - Standard Bench-top Instruments - Interfacing through protocol [GPIB] - Test SW [Custom Developed on Licensed platform (NI Lab View)] - Test Fixture & Interfacing HW
  • 27. Functional Test Setup Validation - Proto Batch Test & Test Report score card - Data Analysis & SPC
  • 28. Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌Test Benches - FATE ▌ Test Challenges in Transfer Programs
  • 29. Test Bench - FATE ▌ Functional ATE Completely Automated Test System
  • 30. Test Bench - FATE
  • 31. Table of Contents ▌ Introduction – Why Testing Required ▌ Test Coverage – PCBA & Product Level ▌ Different Test Strategies - Structural & Functional ▌ Test Benches - FATE ▌Test Challenges in Transfer Programs
  • 32. Test Challenges in Transfer Programs ▌ Old Designs – No coverage improvement possible. ▌ No DFT Tool and Test Coverage analysis in Manufacturing Interface Team – Dependency on Design House ▌ Functional Test - False Fail Tolerance Failure Obsolete Test Procedure - Tuning Requirements are not detailed. BOM and documents are not updated, Non documented test methods - Changes implemented at supplier is not added in the docs.
  • 33. Only God We Trust, Everything Else We Test ! ▌Shiju JacobThank You !