SlideShare a Scribd company logo
1 of 14
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
1
Device Modeling Report
Bee Technologies Inc.
COMPONENTS: MOSFET (Model Parameters)
PART NUMBER: TPCP8305
MANUFACTURER: TOSHIBA
REMARK: Body Diode (Model Parameters)
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
2
MOSFET MODEL
PSpice model
parameter
Model description
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
3
Transconductance Characteristics
Circuit Simulation result
Comparison table
-ID (A)
gfs (S)
%Error
Measurement Simulation
2 11.411 11.526 1.01
5 17.553 17.657 0.59
10 24.321 24.100 -0.91
20 32.350 32.430 0.25
24 33.851 34.691 2.48
VDS=-10V
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
4
V_VGS
0V -1.0V -2.0V -3.0V -4.0V
-I(Vsense)
0A
6A
12A
18A
24A
VGS
V1
-10V
0
U1
TPCP8305
Vsense
Vgs-Id Characteristics
Circuit Simulation result
Evaluation circuit
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
5
Comparison Graph
Circuit Simulation result
Comparison table
-ID (A)
-VGS (V)
%Error
Measurement Simulation
1 1.259 1.200 -4.69
2 1.323 1.301 -1.66
5 1.495 1.506 0.74
10 1.726 1.744 1.04
20 2.142 2.097 -2.10
24 2.328 2.215 -4.85
VDS=-10V
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
6
VGS
-4.5V
0
VDS
U1
TPCP8305
Vsense
V_VDS
0V -10mV -20mV -30mV -40mV -50mV -60mV
-I(Vsense)
0A
0.5A
1.0A
1.5A
2.0A
2.5A
3.0A
Rds(on) Characteristics
Circuit Simulation result
Evaluation circuit
Test condition: VGS=-4.5(V), ID=-3(A)
Parameter Unit Measurement Simulation %Error
RDS(on) mΩ 23.000 22.982 -0.08
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
7
V_VDS
0V -1.0V -2.0V -3.0V -4.0V -5.0V
-I(Vsense)
0A
4A
8A
12A
16A
20A
VGS
0
VDS
U1
TPCP8305
Vsense
Output Characteristics
Circuit Simulation result
Evaluation circuit
VGS=-1.4V
-1.5
-2.2
-2.5
-2
-1.9
-4.5
-1.8
-1.7
-1.6
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
8
Capacitance Characteristics
Simulation result
Comparison table
VSD (V)
Cbd (pF)
%Error
Measurement Simulation
0.1 130.000 129.550 -0.35
0.2 112.000 112.800 0.71
0.5 90.000 90.220 0.24
1 75.000 74.750 -0.33
2 62.000 61.400 -0.97
5 48.000 47.000 -2.08
10 38.000 38.295 0.78
20 30.000 31.175 3.92
Simulation
Measurement
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
9
Time*1mA
0 8n 16n 24n 32n 40n
V(W1:4)
0V
-2V
-4V
-6V
-8V
-10V
U1
TPCP8305
D1
dmod ID
6A
VDD
-16V
0
-
+
W1
ION = 0
IOFF = 1mA
W
IG
TD = 0
TF = 10n
PW = 10m
PER = 1
I1 = 0
I2 = -1m
TR = 10n
Gate Charge Characteristics
Circuit Simulation result
Evaluation circuit
Test condition: VDD=-16(V), VGS=-5(V), ID=-6(A)
Parameter Unit Measurement Simulation %Error
Qgs nC 4.500 4.503 0.07
Qgd nC 5.500 5.462 -0.69
Qg nC 22.000 19.858 -9.74
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
10
Time
1.8us 1.9us 2.0us 2.1us 2.2us 2.3us
V(U1:4) V(U1:5)/2
0V
-1.0V
-2.0V
-3.0V
-4.0V
-5.0V
-6.0V
-7.0V
-8.0V
L1
30nH
1 2
R1
4.7
V1TD = 2u
TF = 4n
PW = 5u
PER = 500u
V1 = 0
TR = 4n
V2 = -5 VDD
-10
0
RL
3.33
L2
50nH
12
U1
TPCP8305
Switching Time Characteristics
Circuit Simulation result
Evaluation circuit
Test condition: VDD=-10(V), VGS=-5(V), ID=-3(A), RG=4.7
Parameter Unit Measurement Simulation %Error
ton ns 27.500 27.455 -0.16
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
11
V_VDS
0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V 1.4V
-I(VDS)
100mA
1.0A
10A
100A
U1
TPCP8305VDS
0
Body Diode Forward Current Characteristics
Circuit Simulation result
Evaluation circuit
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
12
Comparison Graph
Simulation result
Comparison table
-IDR (A)
VDS (V)
%Error
Measurement Simulation
0.1 0.596 0.594 -0.34
0.2 0.618 0.619 0.16
0.5 0.657 0.657 0.05
1 0.694 0.695 0.14
2 0.747 0.745 -0.27
5 0.835 0.837 0.24
10 0.942 0.943 0.11
20 1.120 1.109 -0.98
25 1.190 1.182 -0.67
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
13
Time
1.92us 2.00us 2.08us 2.16us 2.24us 2.32us
I(R1)
-400mA
-300mA
-200mA
-100mA
-0mA
100mA
200mA
300mA
400mA
U1
TPCP8305
0
V1TD = 29.6ns
TF = 10ns
PW = 2us
PER = 200us
V1 = -9.5V
TR = 10ns
V2 = 10.65V
R1
50
Reverse Recovery Characteristics
Circuit Simulation result
Evaluation circuit
Comparison Measurement vs. Simulation
Parameter Unit Measurement Simulation %Error
trj ns 24.800 24.893 0.38
All Rights Reserved Copyright (C) Bee Technologies Inc. 2012
14
Reverse Recovery Characteristics Reference
Trj = 24.8(ns)
Trb = 65.6(ns)
Conditions: Ifwd = lrev = 0.2(A), Rl = 50
Relation between trj and trb
Example
Measurement

More Related Content

What's hot

SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 

What's hot (20)

SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPH4R606NH (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8059-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
 

Similar to SPICE MODEL of TPCP8305 (Standard+BDS Model) in SPICE PARK

SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 

Similar to SPICE MODEL of TPCP8305 (Standard+BDS Model) in SPICE PARK (15)

SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK65L60V (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCH2080KE (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SCT2080KE (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6N24TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K318T (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8P25DA (Standard+BDS Model) in SPICE PARK
 

More from Tsuyoshi Horigome

Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )Tsuyoshi Horigome
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )Tsuyoshi Horigome
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )Tsuyoshi Horigome
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )Tsuyoshi Horigome
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Tsuyoshi Horigome
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspiceTsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is ErrorTsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintTsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsTsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hiresTsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)Tsuyoshi Horigome
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモTsuyoshi Horigome
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?Tsuyoshi Horigome
 

More from Tsuyoshi Horigome (20)

Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?
 

Recently uploaded

Unlocking the Potential of the Cloud for IBM Power Systems
Unlocking the Potential of the Cloud for IBM Power SystemsUnlocking the Potential of the Cloud for IBM Power Systems
Unlocking the Potential of the Cloud for IBM Power SystemsPrecisely
 
Pigging Solutions in Pet Food Manufacturing
Pigging Solutions in Pet Food ManufacturingPigging Solutions in Pet Food Manufacturing
Pigging Solutions in Pet Food ManufacturingPigging Solutions
 
Install Stable Diffusion in windows machine
Install Stable Diffusion in windows machineInstall Stable Diffusion in windows machine
Install Stable Diffusion in windows machinePadma Pradeep
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsMemoori
 
Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationSlibray Presentation
 
Enhancing Worker Digital Experience: A Hands-on Workshop for Partners
Enhancing Worker Digital Experience: A Hands-on Workshop for PartnersEnhancing Worker Digital Experience: A Hands-on Workshop for Partners
Enhancing Worker Digital Experience: A Hands-on Workshop for PartnersThousandEyes
 
Maximizing Board Effectiveness 2024 Webinar.pptx
Maximizing Board Effectiveness 2024 Webinar.pptxMaximizing Board Effectiveness 2024 Webinar.pptx
Maximizing Board Effectiveness 2024 Webinar.pptxOnBoard
 
Human Factors of XR: Using Human Factors to Design XR Systems
Human Factors of XR: Using Human Factors to Design XR SystemsHuman Factors of XR: Using Human Factors to Design XR Systems
Human Factors of XR: Using Human Factors to Design XR SystemsMark Billinghurst
 
Artificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraArtificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraDeakin University
 
My Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationMy Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationRidwan Fadjar
 
SQL Database Design For Developers at php[tek] 2024
SQL Database Design For Developers at php[tek] 2024SQL Database Design For Developers at php[tek] 2024
SQL Database Design For Developers at php[tek] 2024Scott Keck-Warren
 
Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Mattias Andersson
 
Understanding the Laravel MVC Architecture
Understanding the Laravel MVC ArchitectureUnderstanding the Laravel MVC Architecture
Understanding the Laravel MVC ArchitecturePixlogix Infotech
 
Unblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesUnblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesSinan KOZAK
 
"Federated learning: out of reach no matter how close",Oleksandr Lapshyn
"Federated learning: out of reach no matter how close",Oleksandr Lapshyn"Federated learning: out of reach no matter how close",Oleksandr Lapshyn
"Federated learning: out of reach no matter how close",Oleksandr LapshynFwdays
 
Key Features Of Token Development (1).pptx
Key  Features Of Token  Development (1).pptxKey  Features Of Token  Development (1).pptx
Key Features Of Token Development (1).pptxLBM Solutions
 
Swan(sea) Song – personal research during my six years at Swansea ... and bey...
Swan(sea) Song – personal research during my six years at Swansea ... and bey...Swan(sea) Song – personal research during my six years at Swansea ... and bey...
Swan(sea) Song – personal research during my six years at Swansea ... and bey...Alan Dix
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Patryk Bandurski
 
Advanced Test Driven-Development @ php[tek] 2024
Advanced Test Driven-Development @ php[tek] 2024Advanced Test Driven-Development @ php[tek] 2024
Advanced Test Driven-Development @ php[tek] 2024Scott Keck-Warren
 

Recently uploaded (20)

Unlocking the Potential of the Cloud for IBM Power Systems
Unlocking the Potential of the Cloud for IBM Power SystemsUnlocking the Potential of the Cloud for IBM Power Systems
Unlocking the Potential of the Cloud for IBM Power Systems
 
Pigging Solutions in Pet Food Manufacturing
Pigging Solutions in Pet Food ManufacturingPigging Solutions in Pet Food Manufacturing
Pigging Solutions in Pet Food Manufacturing
 
Install Stable Diffusion in windows machine
Install Stable Diffusion in windows machineInstall Stable Diffusion in windows machine
Install Stable Diffusion in windows machine
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial Buildings
 
Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck Presentation
 
Enhancing Worker Digital Experience: A Hands-on Workshop for Partners
Enhancing Worker Digital Experience: A Hands-on Workshop for PartnersEnhancing Worker Digital Experience: A Hands-on Workshop for Partners
Enhancing Worker Digital Experience: A Hands-on Workshop for Partners
 
Maximizing Board Effectiveness 2024 Webinar.pptx
Maximizing Board Effectiveness 2024 Webinar.pptxMaximizing Board Effectiveness 2024 Webinar.pptx
Maximizing Board Effectiveness 2024 Webinar.pptx
 
Human Factors of XR: Using Human Factors to Design XR Systems
Human Factors of XR: Using Human Factors to Design XR SystemsHuman Factors of XR: Using Human Factors to Design XR Systems
Human Factors of XR: Using Human Factors to Design XR Systems
 
Artificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraArtificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning era
 
My Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationMy Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 Presentation
 
SQL Database Design For Developers at php[tek] 2024
SQL Database Design For Developers at php[tek] 2024SQL Database Design For Developers at php[tek] 2024
SQL Database Design For Developers at php[tek] 2024
 
Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?Are Multi-Cloud and Serverless Good or Bad?
Are Multi-Cloud and Serverless Good or Bad?
 
Understanding the Laravel MVC Architecture
Understanding the Laravel MVC ArchitectureUnderstanding the Laravel MVC Architecture
Understanding the Laravel MVC Architecture
 
Vulnerability_Management_GRC_by Sohang Sengupta.pptx
Vulnerability_Management_GRC_by Sohang Sengupta.pptxVulnerability_Management_GRC_by Sohang Sengupta.pptx
Vulnerability_Management_GRC_by Sohang Sengupta.pptx
 
Unblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesUnblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen Frames
 
"Federated learning: out of reach no matter how close",Oleksandr Lapshyn
"Federated learning: out of reach no matter how close",Oleksandr Lapshyn"Federated learning: out of reach no matter how close",Oleksandr Lapshyn
"Federated learning: out of reach no matter how close",Oleksandr Lapshyn
 
Key Features Of Token Development (1).pptx
Key  Features Of Token  Development (1).pptxKey  Features Of Token  Development (1).pptx
Key Features Of Token Development (1).pptx
 
Swan(sea) Song – personal research during my six years at Swansea ... and bey...
Swan(sea) Song – personal research during my six years at Swansea ... and bey...Swan(sea) Song – personal research during my six years at Swansea ... and bey...
Swan(sea) Song – personal research during my six years at Swansea ... and bey...
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
 
Advanced Test Driven-Development @ php[tek] 2024
Advanced Test Driven-Development @ php[tek] 2024Advanced Test Driven-Development @ php[tek] 2024
Advanced Test Driven-Development @ php[tek] 2024
 

SPICE MODEL of TPCP8305 (Standard+BDS Model) in SPICE PARK

  • 1. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 1 Device Modeling Report Bee Technologies Inc. COMPONENTS: MOSFET (Model Parameters) PART NUMBER: TPCP8305 MANUFACTURER: TOSHIBA REMARK: Body Diode (Model Parameters)
  • 2. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 2 MOSFET MODEL PSpice model parameter Model description LEVEL L Channel Length W Channel Width KP Transconductance RS Source Ohmic Resistance RD Ohmic Drain Resistance VTO Zero-bias Threshold Voltage RDS Drain-Source Shunt Resistance TOX Gate Oxide Thickness CGSO Zero-bias Gate-Source Capacitance CGDO Zero-bias Gate-Drain Capacitance CBD Zero-bias Bulk-Drain Junction Capacitance MJ Bulk Junction Grading Coefficient PB Bulk Junction Potential FC Bulk Junction Forward-bias Capacitance Coefficient RG Gate Ohmic Resistance IS Bulk Junction Saturation Current N Bulk Junction Emission Coefficient RB Bulk Series Resistance PHI Surface Inversion Potential GAMMA Body-effect Parameter DELTA Width effect on Threshold Voltage ETA Static Feedback on Threshold Voltage THETA Mobility Modulation KAPPA Saturation Field Factor VMAX Maximum Drift Velocity of Carriers XJ Metallurgical Junction Depth UO Surface Mobility
  • 3. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 3 Transconductance Characteristics Circuit Simulation result Comparison table -ID (A) gfs (S) %Error Measurement Simulation 2 11.411 11.526 1.01 5 17.553 17.657 0.59 10 24.321 24.100 -0.91 20 32.350 32.430 0.25 24 33.851 34.691 2.48 VDS=-10V
  • 4. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 4 V_VGS 0V -1.0V -2.0V -3.0V -4.0V -I(Vsense) 0A 6A 12A 18A 24A VGS V1 -10V 0 U1 TPCP8305 Vsense Vgs-Id Characteristics Circuit Simulation result Evaluation circuit
  • 5. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 5 Comparison Graph Circuit Simulation result Comparison table -ID (A) -VGS (V) %Error Measurement Simulation 1 1.259 1.200 -4.69 2 1.323 1.301 -1.66 5 1.495 1.506 0.74 10 1.726 1.744 1.04 20 2.142 2.097 -2.10 24 2.328 2.215 -4.85 VDS=-10V
  • 6. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 6 VGS -4.5V 0 VDS U1 TPCP8305 Vsense V_VDS 0V -10mV -20mV -30mV -40mV -50mV -60mV -I(Vsense) 0A 0.5A 1.0A 1.5A 2.0A 2.5A 3.0A Rds(on) Characteristics Circuit Simulation result Evaluation circuit Test condition: VGS=-4.5(V), ID=-3(A) Parameter Unit Measurement Simulation %Error RDS(on) mΩ 23.000 22.982 -0.08
  • 7. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 7 V_VDS 0V -1.0V -2.0V -3.0V -4.0V -5.0V -I(Vsense) 0A 4A 8A 12A 16A 20A VGS 0 VDS U1 TPCP8305 Vsense Output Characteristics Circuit Simulation result Evaluation circuit VGS=-1.4V -1.5 -2.2 -2.5 -2 -1.9 -4.5 -1.8 -1.7 -1.6
  • 8. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 8 Capacitance Characteristics Simulation result Comparison table VSD (V) Cbd (pF) %Error Measurement Simulation 0.1 130.000 129.550 -0.35 0.2 112.000 112.800 0.71 0.5 90.000 90.220 0.24 1 75.000 74.750 -0.33 2 62.000 61.400 -0.97 5 48.000 47.000 -2.08 10 38.000 38.295 0.78 20 30.000 31.175 3.92 Simulation Measurement
  • 9. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 9 Time*1mA 0 8n 16n 24n 32n 40n V(W1:4) 0V -2V -4V -6V -8V -10V U1 TPCP8305 D1 dmod ID 6A VDD -16V 0 - + W1 ION = 0 IOFF = 1mA W IG TD = 0 TF = 10n PW = 10m PER = 1 I1 = 0 I2 = -1m TR = 10n Gate Charge Characteristics Circuit Simulation result Evaluation circuit Test condition: VDD=-16(V), VGS=-5(V), ID=-6(A) Parameter Unit Measurement Simulation %Error Qgs nC 4.500 4.503 0.07 Qgd nC 5.500 5.462 -0.69 Qg nC 22.000 19.858 -9.74
  • 10. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 10 Time 1.8us 1.9us 2.0us 2.1us 2.2us 2.3us V(U1:4) V(U1:5)/2 0V -1.0V -2.0V -3.0V -4.0V -5.0V -6.0V -7.0V -8.0V L1 30nH 1 2 R1 4.7 V1TD = 2u TF = 4n PW = 5u PER = 500u V1 = 0 TR = 4n V2 = -5 VDD -10 0 RL 3.33 L2 50nH 12 U1 TPCP8305 Switching Time Characteristics Circuit Simulation result Evaluation circuit Test condition: VDD=-10(V), VGS=-5(V), ID=-3(A), RG=4.7 Parameter Unit Measurement Simulation %Error ton ns 27.500 27.455 -0.16
  • 11. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 11 V_VDS 0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V 1.4V -I(VDS) 100mA 1.0A 10A 100A U1 TPCP8305VDS 0 Body Diode Forward Current Characteristics Circuit Simulation result Evaluation circuit
  • 12. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 12 Comparison Graph Simulation result Comparison table -IDR (A) VDS (V) %Error Measurement Simulation 0.1 0.596 0.594 -0.34 0.2 0.618 0.619 0.16 0.5 0.657 0.657 0.05 1 0.694 0.695 0.14 2 0.747 0.745 -0.27 5 0.835 0.837 0.24 10 0.942 0.943 0.11 20 1.120 1.109 -0.98 25 1.190 1.182 -0.67
  • 13. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 13 Time 1.92us 2.00us 2.08us 2.16us 2.24us 2.32us I(R1) -400mA -300mA -200mA -100mA -0mA 100mA 200mA 300mA 400mA U1 TPCP8305 0 V1TD = 29.6ns TF = 10ns PW = 2us PER = 200us V1 = -9.5V TR = 10ns V2 = 10.65V R1 50 Reverse Recovery Characteristics Circuit Simulation result Evaluation circuit Comparison Measurement vs. Simulation Parameter Unit Measurement Simulation %Error trj ns 24.800 24.893 0.38
  • 14. All Rights Reserved Copyright (C) Bee Technologies Inc. 2012 14 Reverse Recovery Characteristics Reference Trj = 24.8(ns) Trb = 65.6(ns) Conditions: Ifwd = lrev = 0.2(A), Rl = 50 Relation between trj and trb Example Measurement