ISI is the industry leader as the world’s largest volume IC manufacturer of adapter products, designing approximately 150 new adapters each year to help customers through semiconductor shortages, outages, FPGA EOL, FPGA PDN, etc. We can supply the adapter only, as well as provide a complete turn-key assembly by purchasing all the required components, solder the components to the top of the adapter, and test the completed assembly. ISI specializes in designing and manufacturing customized module interconnect technologies. We have multiple methods that allow the replacement module to be assembled to the motherboard with the same manufacturing process as the original IC.

1. IC ADAPTERS & INTERPOSERS
SOLUTIONS FOR
COMPONENT SHORTAGES
& IC OBSOLESCENCE
website: https://isipkg.com/ | phone: 1.805.482.2870 | email: isisales@molex.com

2. Interconnect Systems Confidential Information
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IC FOOTPRINT CONVERSION ADAPTERS
REPLACE UNAVAILABLE OR OBSOLETE ICs, AVOID COSTLY PCB RE-SPINS
An IC Adapter is a small PCB assembly with:
• A circuit design and components to emulate the original IC
• Interconnect/IO that matches the original IC
• A footprint compatible with your original IC and attachable
using standard SMT assembly process
Also Known As:
• Interposers
• Footprint conversion adapters
• Modules
• Daughter cards
• Mezzanine cards
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WHY USE AN IC ADAPTER?
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Production-Worthy Solution for IC Obsolescence or Shortages:
• Avoid the cost and engineering resources of redesigning a motherboard
• Avoid expensive last-time buy purchases
• Avoid risky gray-market purchases
• Minimize product requalification and test requirements
Fan-Out Adapters
• Fan-out fine pitch components to a larger pitch to avoid increasing motherboard
layer count
• Eliminate micro-vias and blind/buried vias
• Ease SMT attachment process
TSOP to SOJ
BGA Fanout Adapter
Multi IC to QFP

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TYPES OF ADAPTERS
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BGA
ADAPTERS
LEADFRAME
ADAPTERS
PGA/DIP/SIP
ADAPTERS

5. Interconnect Systems Confidential Information
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FOOTPRINT CONVERSION ADAPTERS
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Adapter Design Examples
In many cases, more than one component is necessary to replace the original IC. For example, many adapters require bypass capacitors
and/or voltage regulators. ISI offers many innovative solutions to allow multiple components to fit into the available x,y and z space.
Example A
The new device(s) will fit into the same area as the original chip. Adapter has new device(s)
on top side, and I/O to the motherboard on the bottom side.
Example B
The new device and components will not fit into the same area as the original chip. I/O to
the motherboard is lengthened to allow placement of devices on both sides of the adapter.
Example C
Adapter must extend above surrounding components to accommodate all components.
I/O to the motherboard is lengthened and components can be placed on both sides
Example A
Example B
Example C
Motherboard
New Device(s)
Clearance
Motherboard
New Device(s)
New Device(s)
Motherboard
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OVERVIEW OF ADAPTER DESIGN PROCESS
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1. Customer provides project information
 Mechanical drawings of ICs and target footprint
 Net list or schematic
 Routing requirements; matched/maximum signal lengths, differential pair,
controlled impedance, ground planes, etc.
 Mechanical envelope or X, Y, Z dimensional requirements
 Any specific reliability requirements (environmental, mechanical, etc.)
 Quantities required for prototypes, qualification and production
2. ISI provides quotation for NRE, prototypes and production
3. Customer orders NRE & prototypes
4. ISI designs module/adapter and submits design to customer for approval
5. Customer approves design
6. ISI builds prototypes
7. Customer verifies functionality and in some cases reliability of module/adapter
solution and places order for production requirements
8. ISI builds solution to production schedule

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INTERPOSER MANUFACTURING PROCESS
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Interposer assembly is typically done in multi-up panels
• Panel assembly provides for more efficient and consistent assembly of the various
components to the PCB
• Interposers can attach to motherboards through various methods
• Leadframes
• Pin grid arrays
• Ball grid arrays
3 x 5 Interposer Panel
PGA
SOIC / SOJ
DIP
QFP / PLCC MicroPGA

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INTERPOSER MANUFACTURING PROCESS
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Step 1: SMT Bottom Side
Individual QFP
FlexFrame
Screen Solder
MPM - SPM
Placement
Fuji CP-732 & QP-351
Reflow
Heller 1800, 1809
Step 2: SMT Top Side
Populate interconnect
Populate QFPs

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INTERPOSER MANUFACTURING PROCESS
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Step 3: Singulate
Inspection
 Visual to IPC A-610 Class III
 Mechanical / Dimensional to
Drawing (including leads)
 X-Ray of non-visible solder
joints (as required)
 Inspection templates (as
required)
 Automated Optical/Laser
equipment for lead flatness,
coplanarity & true position as
required
Testing (as required)
 Functional
 Boundary Scan / JTAG
 DC Parametric
 Test patterns
Packaging / Labeling
 JEDEC Tray
 Tape & Reel
 Custom

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WHY CHOOSE ISI FOR IC ADAPTERS & INTERPOSERS?
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 ISI has 30+ years experience designing and manufacturing various interposer designs
 ISI’s U.S.- based design team and high-volume manufacturing facility allow for rapid prototyping
and a fast ramp to production
 ISI has developed and manufactures our own unique interconnect to accommodate multiple IC
footprints (FlexFrame, BGA, PGA, etc.)
 ISI Adapters are designed for high-volume, automated SMT manufacturing lines using standard
SMT processes
 ISI Adapters have been tested and qualified for use in some of the most demanding applications,
including military and commercial aircraft, automotive, ruggedized embedded computing systems
 ISI’s in-house design and manufacturing capabilities provide customers a one-stop shop solution
to address their IC shortages or other electronic assembly needs

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BGA REBALLING, HARVESTING, & RECLAIMING
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When adapters or interposers are not a viable option, our reballing capabilities can provide for an
effective method to extend the useful lifecycle of components that are available to you today.
• Balling LGA Devices: LGA devices can be converted to BGA devices
by attaching solder balls. ISI offers various leaded and lead-free
solder ball material compositions.
• BGA, LGA Reclaiming Service: ISI can remove specific components
from assemblies and convert those components to original or
modified package specifications by attaching solder balls.
• Lead-free to Leaded Conversion: If devices are RoHS, ISI can remove
leaded balls and replace with solder balls of a different composition.
• Surface Refinishing: If components (QFP, QFN, connectors) need
surface finish conversion, ISI can process the components to the
desired finish.
• Testing and Inspection: ISI can also offer specific testing of
components as required by customer specifications.

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BGA Interposers
BGA REBALLING & RoHS SOLUTIONS
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Many modern ICs are only
available in RoHS/Lead-
Free BGA packages.
However, leaded solder
joints are required to
ensure reliability for many
demanding applications.
ISI offers solutions to meet
customer’s configuration
requirements.
BGA Reballing
Separate Pb and Pb-free solder joints
RoHS
Lead-Free
Eutectic
Tin/Lead

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WHY CHOOSE ISI FOR REBALLING?
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 ISI has been audited and qualified as a production reballing
supplier to leading Tier 1 defense contractors
 We certify that our reballed parts meet the most stringent
industry criteria
 We reball over 100,000+ BGAs each year
 Any pitch, any package, any alloy
 Quick-Turn Delivery: 3-5 day expedited turn time available

14. THANK YOU
Contact us:
https://isipkg.com/
isisales@molex.com
1.805.482.2870
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