Company catalogue

Talent is foundation
Technology is root
Shenzhen/Suzhou KaiZhiTong Micro-ElectronicTechnology
Co., Ltd
Innovation is resource
Creating world-class IC test solution top 1 brand!!
Focusing on socket for 16 years
2000-2016

Shenzhen /Suzhou KaiZhiTong Micro-
Electronic Technology Co.,Ltd is established
in 2000,which is high-tech enterprise that
integrating R&D、production and sale.
We specalize in researching and developing
kinds of IC test socketfixture burn-in
socketprogramming socket FPC and BTB
test module, At the same time ,we provide IC
test/burn-in solution and IC rework service.
In enterprise,professional technicians take up
40%,direct R&D staff take up 20%,among
most of staff are high-ranking engineer with
higher degree and rich experience.
After years of hard work,we gain aseries of
national invention patent and utility model
patent about test socketadapter for integrated
circuit.
Patent No：
ZL200610033402.7；ZL20071007233.4；
ZL200720118476.0；ZL201120515659.2；
ZL201420740006.8；
The enterprise always think highly of products
quality as life!!
For guranteeing quality of prduct,enterprise is
equipped with advanced production equipment
and inspection device;we have realised
standardized management of techenology and
developingproduction and assemblyquality and
inspectionageing testthe process of mass
production,in view of which,the products we
produce enjoy a higher repution in home and
abroad!!
We work hard to expand bussiness with
insisting on "Technology is root,innovoation is
soul,talent is foundation"as a rule and promise
we will provide perfect service with high-class
products and favorable price!!
The biggest manufacturer of IC
burn-in socket in China！！
Enterprise introduction

The grownth progress
Business constitution
2000 DEC Established KaiZhiTong electronic products sales department
2001 MAR Become qualified supplier of Vtouch Technology Enterprise Group
JUN Become qualified supplier of Foxconn group
2005 JUN Established KaiZhiTong Micro-Electronic Technology C.,Ltd
SEP Become Global strategic partner of Media Tek.In in September
2008 MAY Founded Suzhou factory in Suzhou Industrial Park
2009 SEP Founded Hong Kong Kaizhitong Micro-electronics Technology Co.,Ltd
2010 OCT Become qualified supplier of HUAWEI
2013 JUN Become Shenzhen high-tech enterprise
2015 JAN Become qualified supplier of Bwin/Longsys
APR Become qualified supplier of Intel
2016 MAR Founded agent of Russia
Company vision
Creating top-one brand on IC test solution!!
KZT
custom-made
IC test socket custom-made
IC test fixture
ANDK-Burn-in/
Progrmming socket
FPC/FFC/
Connector test fixture
BGA rework
/IC test service
BGA Burn-in
solution

Content:
1、Customized IC test socket----------------------------------------1
2、Customized IC test fixture----------------------------------------2
3、Standard solderseries of socket--------------------------------3
A-Gripper socket
B-socket + PCB adapterseries
C-Adapter +socket soldering structure
4、Standard IC test fixture-------------------------------------------7
A-eMMC/eMCP to SD/USB test fixture
B-SSDseries test fixture
C-Flash test solution
D-Sensor / touch IC solution
5、DDR/GDDR test solution-----------------------------------------11
A-DDR/GDDR socket+PCB adapter
B-DDR/GDDR FT test socket
C-DDR series Burn-in socket
D-DDR2/3/4 DIMM test fixture
6、ANDK—Burn-in/programming socket-------------------------15
A-BGA series Burn-in/programming socket
B-QFN series Burn-in/programming socket
C-QFP series Burn-in/programming socket
D-TSOP series Burn-in/programming socket
E-Sop series Burn-in/programming socket
F-Crystals eries Burn-in socket
G-Small IC probe series Burn-in/ Programming socket
H-SOP Burn-in clip on-line
I-Customized pin board
——Besides,we can customize kinds of burn-in and
programming socket,according to customer requirment
7、FPC/FFC/Connector test fixture--------------------------------35
8、BGA Rework/IC test service ------------------------------------36
9、IC Burn-in board solution----------------------------------------37
10、Socket sheet material-------------------------------------------38
11、Cooperative partner--------------------------------------------------39
Solemn promise:
——If socket has any quality problems,we will pay an indemnity for
double,stand in the world with good quality!!

——KZT has years of socket designing and producing experience,we provide
professional probe test socket according to customers’ request which applying
to IC R&D and testing.
1-Customized IC test socket
Double buckle
Product data:
1.applicable pitch :
0.25mm,0.3mm,0.4mm,0.5mm,0.65mm,0.8mm and so on
2.material:
FR4/ PPS/ PEI/ Torlon/ Peek/ Peek + Ceramic
3.applicable package:
BGA,QFP,QFN,WCSP and so on
4. structure:
Double buckle,clamshell with knob,clamshell,
open-top
5.contact type: probe(pogo pin)
Product features:
1.High precision positioning slot and the guide hole, ensure
the accuracy of testing
2.Choosing different probe according to the actual situation,to
do testing of BGA chips with balls or not
3.Humanized design,the probe can be replaced easily,and it’s
convenient to disassemble and maintain , greatly reducing
the cost
4.Imported probe,with high precision production equipment
and engineering materials,to make the socket more stable
for testing and longer life time
Clamshell with knob Clamshell
Structure diagram:
Probe contact diagram:
Manual test socket:
Automatic test socket:
For BGA test socket For eMMC test socket
Open-top
For modual test socketFor SOP test socket
1

——With years of experience of designing and producing test fixture,KZT fix the socket
onto customer’s existing product PCBA directly,no need layout,greatly reducing the
test cost,This kind of fixture can be widely used for the IC verification in the department
of ODE and semiconductor FAE.
2-Customized IC test fixture
1.According to customer's existing product PCBA, customized
individually,more close to the actual usage of the chips, no
need layout,delivery in shorter time,and greatly reducing the cost
2.Accumulated years of design experience, ensuring the IC
positioning precision,and at the same time, making the
disassembly and maintenance more convenient.
3.Probe can be replaced separately, reducing the cost
4.Scope of application:video card, mainboard, intelligent
communication and other digital product.
POP test fixture TV-Box IC test fixture GPU test fixture
Server board CPU test fixture GDDR5 test fixture eMMC test fixture
2
Product data:
1.Applicable pitch :
0.25mm,0.3mm,0.4mm,0.5mm,0.65mm,0.8mm and so on
2.Material:
FR4/ PPS/ PEI/ Torlon/ Peek/ Peek + Ceramic
3.Applicable package:
BGA,QFP,QFN,WCSP and so on
4. Structure:
Double buckle,clamshell with knob,clamshell,
open-top
5.Contact type: probe(POGOPIN)
Product features:
Structure diagram:

1.Application IC:DDR,eMMC,eMCP
2.Material:PEI,Beryllium copper
3.Contact type:soldering shrapnel
4.Operation temperature:-55℃~+175℃
1.Small,not interfere any surrounding
component,applicable to any shape
of PCBA
2.Convenient to use,soldering onto the
position of IC on the PCBA,press into
the socket,then can be tested
3.Contact shrapnel is short,reducing the
signal transmission distance of PCBA
and IC,equivalent to test on the original
PCBA.
4.Ball positioning,compatible with various
sizes of IC
Product diagram:
Model Pin Pitch
（mm）
Thickness
(mm)
DDR2/3/4 60/84/78/96 0.8 2
eMMC 153 0.5 1.4
eMCP 162/221 0.5 1.4
——Based on years of experience of designing and producing,KZT makes the test
socket of general IC components standardization,flexible and used universally,
greatly reduced the cost.
A-Gripper socket
Product specifications:
DDR gripper socket
3
3-Standard solderseries of socket
Product data:
Product features:
eMMC gripper socket
Contact detail：

LPDDR/eMMC/eMCP
test socket
1.Application of IC:
DDR,LPDDR,eMMC,eMCP,flash
2.socket material:torlon,PEI,alloy
3.Structure:double buckle,clamshell with knob,
clamshell
4.Contact type:soldering+probe
1.No need layout,use the PCBA customer
provided,test accurately
2.Just need four screws to fix and disassemble,
probe can be replaced,and maintain is so
convenient
3.The signal pins needed is around the edge of
adapter PCB,so as to analysis,test and verify
4.Frame guider can be replaced,applicable to
different size of IC
5.Socket can be combined into one fixture with
one socket,one with two socket,one with four
socket,test flexibly
6.Greatly reduced the time of production,at the
shortest of four hours.
DDR/GDDR
test socket
eMMC/eMCP
analysis socket
Flash test
socket
*Patented product, copying is not permitted!!
4
B-socket + PCB adapterseries
Structure diagram:
Product data:
Product features:

Model Pitch
（mm）
Structure Remark
DDR1-TSOP66 0.65
Open-top
SDRAM-TSOP54 0.8
TSOP48/56 0.5
DDR2/3 0.8
Clamshell
GDDR3/5 0.8
LPDDR-
134/168/178/216/2
20/221
0.5
Double
buckle
eMMC153/169 0.5
eMCP162/186 0.5
eMCP221 0.5
eMMC153/169
-Including
analysis PCB
0.5
eMCP162/186
-Including
analysis PCB
0.5
eMCP221
-Including
analysis PCB
0.5
BGA130
-Including
analysis PCB
0.65 clamshell
with knob
DDR2/3
-including
analysis PCB
0.8 Clamshell
5
Product specifications:
The data pin
will be pulled
out through
analysed
PCB,which is
convenient
for analysis

C-Adapter +socket soldering structure
1.Adapter soldering onto the PCBA,then insert the socket
onto the adapter
2.There are two types to be chosen,clamshell and double
buckle,very easy to operate
3.The plate of cover use the spinning type,down
smoothly,ensure the force well-distributed and no shifting
4.The special head of probe can pierce the oxide layer of
balls,contact reliably,but no hurt to the ball
5.High precision positioning slot and the guide hole, ensure
the accuracy of testing
6.Probe can be replaced,easier maintenance and lower cost
7.Pin to pin structure,no need to soldering into through
holes,lowered the cost and difficulty of manufacture,and
shortened the time of manufacture
8.Because of the structure,the socket can be moved,and one
socket can be used for testing the same pitch and array
with different function,reducing the cost greatly.
9.Adapter and socket can be separated,it’s easy to
solder,customers can do it themselves,no
need professionals to install
Adapter+socket
1.applicable pitch:≥0.7mm
2.Material:FR4,alloy
3.Package:BGA,QFN,etc.
4.Highest frequency:400MHz
5.Structure:double buckle,clamshell
Mother board socket
Adapter
Servies CPU socket
6
Product data:
Product features:

1
1.Applicable IC:eMMC,eMCP
2.Material:PEI,Alloy
3.Structure:clamshell,open top
4.Contact type:
Pogopin:probe can be replaced
contact sping:can both test chips
with balls or not
A-eMMC/eMCP to SD/USB test fixture
1. Support for hot-pluggable,can be
connected to computer by card reader.
2.Frame guider can be replaced,applicable
to different size of IC
3.Humanized design,fixed by srews,no need
to solder,and it’s convenient to assemble
and maintain
4.Use the floating structure,precise positioning.
easy to place and pick,greatly increased the
working efficiency.
eMMC529/153/eMCP162/221——4 in 1 to SD
Model Structur
e
Size Life time Remark
Contact
spring
Pogo
pin
eMCP162
Contact
spring
/Pogo pin
11.5x13,12x16
25000 100000
Customizing
limitation
fram
acoording to
different IC
Size
eMCP221 12x16
eMMC153 11.5x13,12x16,
12x18,14x18
eMMC529 15*15
eMMC100 12x18,14x18
Product specific:
4、Standard IC test fixture
Open-top
7
eMMC100/153/eMCP162/221——4 in 1 to USB
Clamshell Product data:
Product features:

B-SSDseries test fixture
1.With SMI solution,professional made PCBA,test
2.Clamshell structure,convenient and laborsaving,
quit suitable for manual operation
3.The frame guider can be disassembled easily,suitable
for different size of IC testing
4.unique U sharp contact shrapnel,can test IC with balls or not.
2246EN/2256K to
Dip48 1-to-2/4 fixture
Burn-in boasrd / USB3.0
to SATA board
2246EN/2256K to
BGA152/132 1-to-2/4 fixture
Contact detail
2246EN/2256K to
BGA316/272 1-to-2 fixture
2246EN test fixture 2256K test fixture
2246EN to Dip48 1-to-2 fixture
（256x16MB,128x16MB)
2256KtoDip48 1-to-2 fixture
（256x16MB)
2246EN to bga132/152 1-to-2 fixture
（256x16MB,128x16MB)
2256K to bga132/152 1-to-2 fixture
（256x16MB)
2246EN to Dip48 1-to-4 fixture
（128x16MB)
2256K to bga132/152 1-to-4 fixture
（256x16MB)
2246EN to bga272 1-to-2 fixture
（256x16MB）
2256K to bga3161-to-2 fixture
（256x16MB）
2246EN to bga316 1-to-2 fixture
（256x16MB）
2256K to bga272 1-to-2 fixture
（256x16MB）
2256K to Dip48 1-to-4 fixture
（128x16MB)
8
Product data:
Product specification:

C-Flash test solution
1、Apply to BGA63/100/17/137/152/169/225/SD card/TF19/TF24
2、Clamshell/Open-top structure,apply to different test requirement
Clamshell/Open-top to TSOP48 socket
10
1、Adopting solution of adapter cables to test board,link-up with probe between
products and test board,reducing loss
2、Testing kinds of flash in tray,such as UDP/Tsop48/BGA 152/132 ，high effective
UDP/Tsop48/BGA 152/132
Tray test fixture
1-to-32 1-to-88
Product features:
Product features:

D-Sensor / touch IC solution
1.manual or manual and automatic as a whole,precise
positioning,convenient operating
2.Use the Imported gold-plated probe and anti-static
material(torlon,PEI,PPS or PEEK)
3.Downward plate can adjust the force on IC automatically,
ensure the force evenly;probe can be used for testing chips
with residual balls or balls nonuniform
4.Mature design and precision machining,high-precision focusing,
clear shaped
5.The special design for clasp reducing the friction,extending service life
6.Customized all kinds of sensor fixture according to customers’ requirements
BTB test socket Backlight sensor IC
test fixture
Sensor auto-machine test socket
Touching
IC test socket
Camera moudle test
socket
Sensor IC test fixture
9
Product data:

Product exhibiton:
Patent product,counterfeit will be sued!!
A-DDR/GDDR socket+PCB adapter
5、DDR/GDDR test solution
GDDR3-136
test socket
DDR3
test socket
GDDR5-170
test socket
DDR/GDDR standard pogopin moudle
11
1.No need to lay-out , test accurated directly
use the product plate that customer provide
2.Easy to remove socket by releasing four screws ,
probe change and maintain is very simple and
convenience .
3.To test verify and analyse , analysis plate can
stretch out the pin to the pin board .
4.Frame Guides can interchange , apply to test
different sizes of IC
5.One breakout board can mount with one / two /
four sockets as customer requested which can
be tested flexibly .
6.Product delivery time is much shortened , shortest
delivery time is 4 hours
Product data:
Product features:
Contact detail:
DDR/GDDR
3.Structure:double buckle,clamshell with knob,
clamshell

BOTTOM VIEW
Part Number
Pitch
e
Pin
Count
IC
Array
AXB
OUTSIDE DIMENSIONS
C D E F G H I J
DDR2X8-60
(238)
0.8 60 8.0X6.4 27 17 6.4 6.4 4.0 3.2 5.6 4.8
DDR2X16-84
(238)
0.8 84 12.0X6.4 27 17 6.4 6.4 5.6 3.2 5.6 4.8
DDR3X8-78
(238)
0.8 78 9.6X6.4 27 17 6.4 6.4 4.8 3.2 5.6 4.8
DDR3X16-96
(238)
0.8 96 12.0X6.4 27 17 6.4 6.4 6.0 3.2 5.6 4.8
GDDR3-136
(238)
0.8 136 12.8X8.8 27 17 6.4 6.4 6.4 4.4 5.2 5.2
GDDR5-170
(238)
0.8 170 12.8X10.4 27 17 6.4 6.4 6.4 5.2 5.2 5.2
DDR-0.8(mm) Pitch
B-DDR/GDDR FT test socket
Material&Performance:
Ø Apply to Auto machine for test DDR/GDDR
Ø Adopting high accurate moudle,location is precise
Ø Probe can be interchanged,it is convinent for
maintenance reducing the cost of test
Production specification:
socket design dimension
12
Product features:
Ø socket Body: PEI
Ø Contacts:Beryllium Copper Alloy
Ø Contact Plating:Gold over Nickel
Ø Operation Force 25g/pin and the more PINs
the greater force.
Ø Contact Resistance:100 mΩ max.
Ø Dielectric:700V AC for 1 minute
Ø Insulation Resistance:1,000MΩ 500V DC
Ø Max Current Capacity : 2A
Ø Temperature Rating:-40℃~+155 ℃
Ø Life Span 20,000 Times(Mechanical)

C-DDR series Burn-in socket
Open-top socket design dimension:
Open-top structure
13
Model Pin Pitch
（mm）
Remark
DDR2/3/4 60/84/78/96 0.8 Test for IC with ball
GDDR3 136 0.8
Product features:
Material & Performance:
Ø socket Body: PEI
Ø Operation Force 15g/pin and the more PINs
the greater force.
Ø Contact Resistance:30mΩ max.at 10mA and 20mV MAX(启动).
Ø Life Span 15,000 Times(Mechanical)
ØOpen Top structure
Ø Adopting engineering material for socket body,strength is high,life span is long
Ø Adopting Imported BeCu material for socket contact
spring,thickening gold-plating surface,impedance is small,elasticity is good
ØThru hole design

1.High product versatility , can test different size of
memory chip by changing frame guide ( width ≤ 13MM
, Length ≤ 14MM )
2.Adopting manual clamshell roller-type structure , easy to
operate , reduce abrasion , compared with similar
products , our product has higher mechanical life
3.Adopting specified PCB of TaiWan well-known
manufacturer for memory chip test , gold finger and IC
solder pad gold plating is 5 times of general PCB , ensure
the test fixture has better breakover and abrasion
resistance , compared with similar products , our product
has better overclocking performance and mechanical life
4.Adopting specified PCB for locating hole memory chip test ,
probe board and PCB hole locating ensure the well-
positioned of probe and PCB , if there is damage ,
customer can change and maintain easily , avoid sending
back product to the original factory to maintain and
guarantee more precious time for customers
5.Adopting super short import double probe design , compared
with similar product , the distance between IC and PCB is
shorter which made the test more stable , frequency more
higher
6.Adopting magnet connect type , easy to change , high-
accurate probe IC frame guide , accurate location
D-DDR2/3/4 DIMM test fixture
DDR DIMM test fixture design dimension
*Metal part is guaranteed
for lifetime
14
Product data:
Product features:
DDR2/3/4(8/16 Bit)
3.Structure:Clamshell
4.Contact type:probe
Contact detail:

A-BGAseries Burn-in/Programming socket
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it can’t be recycle ;
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , ensure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost ;
——Base on our design and manufacturing experience of socket , KZT develop two
types contact lead structure BGA burn in socket , one is welding structure , adopt
traditional welding type to fix PCB ; another is no need of welding structure , adopt
innovative screws locking type to fix the PCB , customer can choose which one type
according to their need .
Welding structure :
Way:Fix by welding
Pin length：1.83mm
No need of welding structure:
Way:Fix by 4 screws
Pin length：0.25mm
6、ANDK—Burn-in/programming socket
15
Product features:

Open-top design dimension
Clamshell design dimension
Open-top Clamshell
Ø Open-top/Clamshell structure
Ø Accommodates pitch :4/0.5/0.65/0.8/1.0mm
Ø Compact size and low Actuation Force
Ø Field exchangeable package location plate
Ø “U”contact support any type of solder ball shape
（Ballno balldamaged ball,the drop of contact
surface is more than 0.2mm）
BGA Burn-in/programming socket
__ __
____
Contact detail
Welding structure No need of welding structure
16
Welding structure No need of welding structure
Product features:

BGA 0.4/0.5/0.65/0.8/1.0 Pitchseries Open-top/ Clamshell
17
Pitch e (mm) Pin Grid Max Package Size (mm) Type
0.4
6x6 3X3
Open-top/ Clamshell
16X16 7X7
23X23 10X10
0.5
5X5 3X3
10X10 6X6
13X13 7X7
19X29 10X15
0.65
5X5 4X4
11X11 8x8
14X14 10x10
14X22 10 X15
0.8
6X6 5X5
7X9 6X8
12X12 10X10
12X19 10X16
1.0
5X5 5X5
8X8 9X9
8X11 10X12
10X10 11X11
11X15 12X16
Ø socket Body: PEI
Ø Operation Force:2.0KG min, the more PINs
the greater force.
Ø Contact Resistance:50mΩ max
Ø Life Span 25,000 Times (Mechanical)

B-QFNseries
Burn-in/Programming socket
T (Through hole)
S (Surface mount)
Part NO
Ic encapsulation+PIN Count
G (The grounding)
N (Without grounding)
XXXXXX-X.XX-XX XX X X
Design NO.
TP（Open top）、CP（Clamshell）
Pitch 0.25MM 0.3MM 0.35MM 0.4MM
0.5MM 0.635MM 0.65MM 0.7MM
0.75MM 0.8MM 1.0MM 1.27MM
:
18
Open-top Clamshell
BGA Burn-in/programming socket
Contact detail
Product features:
Product specification: Material & Performance:
Ø socket Body: PEI
the greater force.
Ø Insulation Resistance:1,000MΩ500V DC
Ø Adopting engineering material for socket structure,
strength is high,lifetime is long
spring,thickening gold-plating surface,impedance is small,
elasticity is good
Ø For 0.4/0.5 mm pitch packages
Ø Thru hole design

QFNseries 0.4/0.5Pitch-Open-top/ Clamshell
Pitch
(mm)
Pad
Count
Pad
Matrix
Package
Size(mm)
Part Number Availa
-bility
0.4 12 odd 2X2 QFN12-0.4-TP/CP01G
16 even 3X3 QFN16-0.4-TP/CP01G
20 odd 3X3 QFN20-0.4-TP/CP01G
84 odd 10X10 QFN84-0.4-TP/CP01G
104 even 12X12 QFN104-0.4-TP/CP01G
108 odd 12X12 QFN108-0.4-TP/CP01G
25.00
23.00
31.85
90°
35.00
19
Open-top design dimension Clamshell design dimension

Pitch
(mm)
Pad
Count
Pad
Matrix
Package
Size(mm)
Part Number Availability
0.5 12 odd 2X2 QFN12-0.5-TP/CP01GT
16 even 3X3 QFN16-0.5-TP/CP01GT
20 odd 3X3 QFN20-0.5-TP/CP01GT
20
QFNseries 0.4/0.5Pitch-Open-top/ Clamshell

T (Through hole)
S (Surface mount)
Part NO
G (The grounding)
Design NO.
0.5MM 0.635MM 0.65MM 0.7MM
0.75MM 0.8MM 1.0MM 1.27MM
:
21
C-QFPseries
Open-top
Clamshell
QFP Burn-in/programming socket
Product features:
QFP Burn-in/programming socket
Ø Socket Body: PEI
the greater force.
Ø Accommodates pitch :4/0.5/0.8/1.0/1.27 mm
Ø Compact size and low Acctuation Force

H
G
E
E
D
B
A
C
E
F
Part Number
Pitch
(mm)
Pin
Count
Ic Body
AXB
(mm)
Ic
Tip-to-Tip
CXD(mm)
Parallel
Clame
E(mm)
Ic Height
F
(mm)
socket Dim.
GXH
(mm)
QFP64-0.4-TP01NT
0.4
64 7.0x7.0 9.0X9.0 8.3 1.4 24X24
QFP80-0.4-TP01NT 80 10.0X10.0 12.0X12.0 11.3 1.4 27X27
QFP100-0.4-TP01NT 100 12.0X12.0 14.0X14.0 13.3 1.4 29X29
QFP120-0.4-TP01NT 120 14.0X14.0 16.0X16.0 15.3 1.4 31X31
QFP128-0.4-TP01NT 128 14.0X14.0 16.0X16.0 15.3 1.4 31X31
QFP32-0.5-CP01N
0.5
32 5.0x5.0 7.0x7.0 6.3 1.4 32x37.5
QFP48-0.5-CP01N 48 7.0x7.0 9.0X9.0 8.3 1.4 32x37.5
QFP64-0.5-CP01N 64 10.0X10.0 12.0X12.0 11.3 1.4 32x37.5
QFP48-0.5-TP01N 48 7.0x7.0 9.0X9.0 8.3 1.4 24X24
QFP64-0.5-TP01N 64 10.0X10.0 12.0X12.0 11.3 1.4 27X27
QFP80-0.5-TP01N 80 12.0X12.0 14.0X14.0 13.3 1.4 29X29
QFP100-0.5-TP01N 100 14.0X14.0 16.0X16.0 15.3 1.4 31X31
QFP144-0.5-TP01N 144 20.0X20.0 22.0X22.0 21.3 1.4 37X37
QFP176-0.5-TP01G 176 24.0X24.0 26.0X26.0 24.3 1.5 36X36
QFP32-0.8-TP01NT
0.8
32 7.0x7.0 9.0X9.0 8.3 1.4 24X24
QFP44-0.8-TP01NT 44 10.5X10.5 12.0X12.0 11.2 1.4 28.4X28.4
QFP32-0.8-CP01NT 32 7.0x7.0 9.0X9.0 8.3 1.4 32x37.5
IC Package size
QFPseries 0.4/0.5/0.8/1.0/1.27 Pitch-Open-top/Clamshell
22
Open-top design
dimension
Clamshell design
dimension

ØOpen Top,Zero Insertion Force designed
for automatic loading
Ø Adopting double contact technology,contact
will be more steady
elasticity is good
ØFor 0.50/0.65/0.8 mm pitch packages
ØThru hole design
D-TSOPseries
T (Through hole)
S (Surface mount)
Part NO
G (The grounding)
Design NO.
0.5MM 0.635MM 0.65MM 0.7MM
0.75MM 0.8MM 1.0MM 1.27MM
:
23
Product features:
TSOP Burn-in socket
TSOP programming socket
Ø socket Body: PEI
the greater force.

TSOPseries 0.5/0.65/0.8 Pitch-Open-top
24
Part Number PITCH
(mm)
Pin
Count
Ic Body
AXB
(mm)
Parallel
Clame
C (mm)
Ic Tip
D
(mm)
socket Dim.
EXF
(mm)
socket
Height
G (mm)
Outside
Dimensions
H (mm)
TSOP32-0.5-TP01NT
0.5
32 8.4X18.4 19.2 20.0 14.8X30.1 15.6 3.3
TSOP40-0.5-TP01NT 40 10.2X18.4 19.2 20.0 16.8X30.1 15.6 3.3
TSOP48-0.5-TP01NT 48 12.2X18.4 19.2 20.0 20.0X28.0 15.6 3.3
TSOP48-0.5-TP02NT 48 14.0X18.4 19.2 20.0 20.0X28.0 15.6 3.3
TSOP48-0.5-TP03NT 48 12.2X18.4 19.2 20.0 17.6X40.0 13.6 3.0
TSOP48-0.5-TP04NT 48 12.2X18.4 19.2 20.0 17.6X40.0 13.6 3.0
TSOP48-0.5-TP05NT 48 12.2X18.4 19.2 20.0 17.6X40.0 13.6 3.0
TSOP48-0.5-TP07NT 48 12.2X18.4 19.2 20.0 20. 0X40 13.6 3.0
TSOP48-0.5-TP08NT 48 14.0X18.4 19.2 20.0 20. 0X40 13.6 3.0
TSOP48-0.5-TP09NT 48 12.2X18.4 19.2 20.0 20. 0X40 13.6 3.0
TSOP48-0.5-TP10NT 48 14.0X18.4 19.2 20.0 20. 0X40 13.6 3.0
IC Package dimension Open-top design dimension

25
Part Number PITCH
(mm)
Pin
Count
Ic Body
AXB
(mm)
Paral
lel
Clam
e
C
(mm)
Ic Tip
D
(mm)
socket Dim.
EXF
(mm)
socket
Height
G (mm)
Outside
Dimensions
H (mm)
TSOP32(48)-0.5-TP01NT
0.5
32 8.4X18.4 19.2 20.0 20.8X30.1 15.6 3.3
TSOP40(48)-0.5-TP01NT 40 10X18.4 19.2 20.0 20.8X30.1 15.6 3.3
TSOP40(48)-0.5-TP02NT 40 10.2X18.4 19.2 20.0 20.8X30.1 15.6 3.3
TSOP56-0.5-TP01NT 56 14.0X18.4 19.2 20.0 20.8X30.1 15.5 3.3
TSOP66-0.65-TP01NT 0.65 66 10.16X22.72 10.94 11.74 20.2X28 15.5 3.3
TSOP54-0.8-TP01NT 0.8 54 10.16X22.72 10.94 11.74 20.2X28 15.5 3.3
TSOPseries 0.5/0.65/0.8 Pitch-Open-top
IC Package dimension Open-top design dimension

E-TSOPseries Burn-in/
Programming socket
T (Through hole)
S (Surface mount)
Part NO
G (The grounding)
Design NO.
0.5MM 0.635MM 0.65MM 0.7MM
0.75MM 0.8MM 1.0MM 1.27MM
:
26
Product features:
SOP Burn-in socket
SOP programming socket
Ø socket Body: PEI
the greater force.
ØOpen Top,Zero Insertion Force designed
for automatic loading
Ø Adopting double contact technology,contact
will be more steady
elasticity is good
ØFor 0.50/0.65/1.27 mm pitch packages
ØThru hole design

SEC.J-J
Insertion
J
J
Part Number Pitch
(mm)
Pin
Count
socket Dim.
AXB
(mm)
socket
Height
C(mm)
Ic Body
DXE
(mm)
Ic Tip
F
(mm)
Parallel
Clame
G(mm)
Outside
Dimensions
I(mm)
SOP 38-0.5-TP02NT 0.5 38 17.5X21.5 16.6 4.4X9.7 6.4 5.2 2.5
SOP28-0.65-TP01NT
0.65
28 21.5X17.6 15.5 4.4X9.0 6.4 5.4 2.5
SOP24(28)-0.65-TP02NT 24 21.5X17.6 15.5 4.4X7.8 6.4 5.4 2.5
SOP20(28)-0.65-TP03NT 20 21.5X17.6 15.5 4.4X6.5 6.4 5.4 2.5
SO16(28)-0.65-TP04NT 16 21.5X17.6 15.5 4.4X5.2 6.4 5.4 2.5
SOP14(28)-0.65-TP05NT 14 21.5X17.6 15.5 4.4X4.54 6.4 5.4 2.5
SOP10(28)-0.65-TP06NT 10 21.5X17.6 15.5 4.4X3.24 6.4 5.4 2.5
SOP8(28)-0.65-TP07NT 8 2.15X17.6 15.5 4.4X2.6 6.4 5.4 2.5
SOP34-0.65-TP01NT 34 23X21 15.5 5.7X12.3 7.8 6.4 2.5
SOP30(34)-0.65-TP02NT 30 23X21 15.5 5.7X10.64 7.8 6.4 2.5
SOP28(34)-0.65-TP03NT 28 23X21 15.5 5.7X10.64 7.8 6.4 2.5
SOP24(34)-0.65-TP04NT 24 23X21 15.5 5.7X8.64 7.8 6.4 2.5
SOPseries 0.5/0.65/1.27Pitch-Open-top
27
IC Package dimensionOpen-top design dimension

Part Number
Pitch
(mm)
Pin
Count
(mm)
socket
Dim.
AXB
(mm)
socket
Height
C(mm)
Ic Body
DXE
(mm)
Ic Tip
F
(mm)
Parallel
Clame
G(mm)
Outside
Dimension
s
I(mm)
SOP16-1.27-TP01NT
1.27
16 20.0X18.0 15.5 3.9X10.9 6.0 5.0 2.5
SOP8(16)-1.27-TP02NT 8 20.0X18.0 15.5 3.9X5.8 6.0 5.0 2.5
SOP20-1.27-TP01NT 20 23.4X22 15.5 5.4X13.5 7.9 5.4 2.5
SOP8x2(20)-1.27-TP02NT 8X2 23.4X22 15.5 5.4X6.1 7.9 5.4 2.5
SOP14(20)-1.27-TP03NT 14 23.4X22 15.5 5.0X10.3 7.6 5.8 2.5
SOP8(20)-1.27-TP04NT 8 23.4X22 15.5 5.0X10.3 7.6 5.8 2.5
SOP28-1.27-TP01NT 28 25.4X27 15.5 7.5X18.54 10.4 9.2 2.5
SOP20(28)-1.27-TP02NT 20 25.4X27 15.5 7.5X13.45 10.4 9.2 2.5
SOP16(28)-1.27-TP03NT 16 25.4X27 15.5 7.5X10.9 10.4 9.2 2.5
MSOP Open-top design dimension
Part Number
Pitch
(mm)
Pin
Count
(mm)
socket
Dim.
AXB
(mm)
socket
Height
C(mm)
Ic
Body
DXE
(mm)
Ic
Tip
F
(mm)
Parallel
Clame
G(mm)
Outside
Dimension
s
I(mm)
MSOP10-0.5-TP01NT 0.5 10 10X19 13.5 3X3 4.9 3.7 3.2
MSOP8-0.65-TP02NT 0.65 8 10X19 13.5 3X3 4.9 3.7 3.2
28
SOPseries 0.5/0.65/1.27Pitch-Open-top

ØStructure:Open Top/ Clamshell
spring,thickening gold-plating surface,impedance is
small,elasticity is good
T (Through hole)
S (Surface mount)
Part NO
G (The grounding)
Design NO.
0.5MM 0.635MM 0.65MM 0.7MM
0.75MM 0.8MM 1.0MM 1.27MM
:
Open-top 1 design dimension
Open-top
29
Open-top 2Open-top 1
Product features:
Clamshell
Ø socket Body: PEI
the greater force.
Ø Life Span:
Open-top: 15,000 Times (Mechanical)
Clamshell:200,000 Times (Mechanical)
F-Crystalseries Burn-in socket

Pin
Count
PKG Size
(mm)
PKG
Thickness
socket Part Number Availability
2 5X3.2 1.25 CXP02-000-CP/TP51NT
5X3.2 1.42 CXP02-000-CP/TP52NT
4X2.5 1.15 CXP02-000-CP/TP41NT
3.2X2.5 0.9 CXP02-000-CP/TP31NT
3.2X2.5 1.15 CXP02-000-CP/TP32NT
2.5X2 0.5 CXP02-000-CP/TP21NT
1.65X1.25 0.53 CXP02-000-CP/TP11NT
3 4.1X1.5 0.93 CXP03-000-CP/TP41NT
4.9X1.8 0.8 CXP03-000-CP/TP42NT
4 5X3.2 1.4 CXP04-000-CP/TP51NT
2.05X1.65 0.85 CXP04-000-CP/TP21NT
2.05X1.65 0.94 CXP04-000-CP/TP22NT
2X1.6 0.7 CXP04-000-CP/TP23NT
1.7X1.3 0.54 CXP04-000-CP/TP11NT
1.7X1.3 0.61 CXP04-000-CP/TP12NT
1.3X1.1 0.49 CXP04-000-CP/TP13NT
1.3X1.1 0.6 CXP04-000-CP/TP14NT
30
Open-top 2 design dimension

Pin
Count
PKG Size
(mm)
PKG
Thickness
socket Part Number Availability
5 2.1X1.7 0.8 CXP05-000-CP/TP21NT
3.2X2.5 0.91 CXP05-000-CP/TP22NT
6 7X5 0.85 CXP06-000-CP/TP71NT
7X5 0.9 CXP06-000-CP/TP72NT
7X5 1.15 CXP06-000-CP/TP73NT
7X5 1.8 CXP06-000-CP/TP74NT
5.X3.2 0.85 CXP06-000-CP/TP51NT
5.X3.2 1.05 CXP06-000-CP/TP52NT
5.X3.2 1.1 CXP06-000-CP/TP53NT
5.X3.2 1.2 CXP06-000-CP/TP54NT
3.8X3.8 1.35 CXP06-000-CP/TP31NT
3.2X2.5 0.9 CXP06-000-CP/TP32NT
3.2X2.5 1 CXP06-000-CP/TP33NT
3.2X2.5 1.1 CXP06-000-CP/TP34NT
2.1X1.7 0.7 CXP06-000-CP/TP21NT
2.05X1.65 0.7 CXP06-000-CP/TP22NT
7 3.2X2.5 0.91 CXP07-000-CP/TP31NT
7X5 1.9 CXP07-000-CP/TP71NT
8 7X5 1.3 CXP08-000-CP/TP71NT
7X5 1.45 CXP08-000-CP/TP72NT
7X5 1.8 CXP08-000-CP/TP73NT
7.3X4.8 1.4 CXP08-000-CP/TP74NT
3.8X3.8 1.2 CXP08-000-CP/TP31NT
9 7X5 2 CXP09-000-CP/TP71NT
3.2X2.5 0.91 CXP09-000-CP/TP31NT
10 7X5 0.9 CXP10-000-CP/TP71NT
7X5 1.5 CXP10-000-CP/TP72NT
7X5 1.7 CXP10-000-CP/TP73NT
7X5 1.8 CXP10-000-CP/TP74NT
7X5 1.9 CXP10-000-CP/TP75NT
7X5 1.95 CXP10-000-CP/TP76NT
7X5.2 1.8 CXP10-000-CP/TP77NT
12 7X5 1.7 CXP12-000-CP/TP71NT
31

32
Contact detail
1、Adopting mould socket + probe structure,reducing cost
of design and making drastically and use fee
2、Acoording to test situation,choosing diffrent kinds of
probe to test ball /no ball IC
3、Deliver time is quick,the fastest 1 day
4、Imported probe and high accurate mould,the test is
more steady,life time is more longer
Clamshell Open-top
structure Package IC size（mm） Pitch
（mm）
socket
(WxLxH)mm
Open-top 1
BGA/QFN/DFN/SOT
1.5*1.5～10*12
≥0.3
26*30*17.5
Open-top 2 1.5*1.5～5*8 12*22*12.9
Clamshell 1.5*1.5～6*8 17*9.6*12
Open-top 2Open-top 1
G-Small IC packageseries Burn-in/
Programming socket
Product features:
Product data:
Open-top 1 design dimension Open-top 2 design dimension
1、Material: PEI
2、Applicable size:1.5x1.5～12x12mm
3、Structure:Open-top/Clamshell
4、Contact type: probe(POGOPIN)
5、Operation temperature:-55℃~+175℃

Ø Special design for SOP8/16-1.27 IC，it is convenient for
Burning in on-line，don‘t need to remove ic from PCBA,
Ø Adopting high accurate mould to make,clamp accurate,test
it very steady
Ø Coodinate burn-in line and burn-in board,it is so easy to link
burn-in machine
Lead
Count
Pitch
e ( mm)
Package Dimensions ( mm)
Width(E1) Lead Tip to Tip (E ) L ength(D)
Part Number
8 1.27 6.0-9.0 3.7-7.5 *** SOP8-1.27-01
16 1.27 6.0-9.0 3.7-7.5 *** SOP16-1.27-01
H-SOP Burn-in clip on-line
33
Product features:
Ø socket Body: PEI
the greater force.

4 Finger
6 Finger
Clip
Contact Finger
I-Customized pin board
34
Item ∅ A(mm) B(mm) C(mm) ∅ D(mm) Total
Length
(mm)
1 1.40 3.00 4.40 0.50 7.40
2 1.40 3.00 3.35 0.50 6.35
3 1.00 3.00 4.40 0.50 7.40
4 1.00 3.40 2.10 0.50 5.50
5 1.00 4.50 6.99 0.46 11.49
6 1.00 4.50 10.16 0.46 14.66
7 0.80 3.00 4.40 0.40 7.40
8 0.80 3.00 3.35 0.40 5.50
Ø socket Body: PEI
Ø Operation Force:050g/pin, the more PINs
the greater force.
Ø Operation temperature:-55℃~+175℃

7、FPC/FFC/Connector test fixture
ØIt is a connector test fixture for evaluation and
inspection of the circuits, modules or units that
have a connection tip by FPC/FFC unit for electrical
connection.
ØFunction test for video camera's camera unit, motor
unit, LCD modules etc.
Uses:
Clip body
Connector test module
FPC test module
1、The test module can be changed and
customized to apply to kinds of products,
the smallest pitch is 0.2mm
2、The test module is fixed position by dowl
and screws, which is convinent to apply to
other device
3、Structure of clip,accurate guaid slot,it is very
convinent to operate,test effciency is high
4、Material:PEI/Torlon
5、Max Current Capacity : 4 A
6、Life Span: 30 thousand Times (Mechanical)
Kinds of test contact spring
35
Pitch 0.2 0.25 0.3 0.35 0.4 0.5 0.8 1.0 1.25
Connector 6-
70pin
10-
100pin
16-
80pin
FPC/FFC 17-
101
pin
17-
79pin
6-
101pin
4-
33pin
3-
69pin
4-
17pin
3-
35pin
3-
26pin
Contact detail
Product features:

8、BGA Rework service
Related equipment:
1.Advanced BGA rework process and professional
technology are our advantage
2.ESD environment equipment and advanced produce
process are the ensurement of BGA rework quality
3.Professional equipment :
Large-scale BGA rework station / Microcomputer
reflow soldering / Oven large-scale ultrasonic
cleaning machine / Semi-automatic solder paste
printing machine etc domestic and foreign BGA rework
station
4.Serious and responsible is our consistent work style
5.We have our own factory , reputed and experienced ,
we definitely is your first choice
6.We have all kinds of different model reballing tool ,
no need to pay and build a mould , convenient and efficient
Advantage :
Solder ball Reball fixture Bake/Solder boxSteel mesh
1.Adopt import probe + PCB adapter structure , convenient
to maintain
2.Design with patent , PCB design layer reduce from traditional
several layers to two layers , greatly lower the difficulty of PCB
design and manufacture , meantime lower the signal disturb
3.Low manufacture cost , current cost is only one tenth of
traditional process
4.Supported with professional technology , adopt import probe ,
contact more stable , ensure test precise and reliable
5.Smallest test pin pitch = 0.2mm
6.Usage : integrated circuit Open-Short test analysis
7.Customized different pins display fixture according to customer’s
requested packaging
Product Feature :
IC Open Short
36

9、IC Burn-in board solution
——Provide burn in test solution one-stop service, according to customer request ,
design , customize burn in test socket , matching use with burn in PCBA and IC
burn in environmental box and burn in monitoring system ect whole set solution,
time saving , more efficient and reliable !!
37

10、socket sheet material
PEI：Polyetherimide (PEI) is an amorphous, amber-to-
transparent thermoplastic with characteristics similar to the
related plastic PEEK. Relative to PEEK, PEI is cheaper, but is
lower in impact strength and usable temperature.
PPS：Polyphenylene sulfide (PPS) is an organic polymer
consisting of aromatic rings linked with sulfides. Synthetic fiber
and textiles derived from this polymer are known to resist
chemical and thermal attack.
PAI：Polyamide-imides are either thermosetting or
thermoplastic, amorphous polymers that have exceptional
mechanical, thermal and chemical resistant properties.
Polyamide-imide polymers can be processed into a wide variety
of forms, from injection or compression molded parts and ingots,
to coatings, films, fibers and adhesives
PEEK+Ceramic：Polyether ether ketone (PEEK) is
a colourless organic thermoplastic polymer in the
polyaryletherketone (PAEK) family, used in engineering
applications.PEEK is a semicrystalline thermoplastic with
excellent mechanical and chemical resistance properties that
are retained to high temperatures.
——Sheet material is the important material of making socket , it has a key influence
to socket usability , and now most of the sheet material on the market has different
thickness , dimension oversized , in the use process it may face storage unchanged ,
complicated process and low usage rate problems , KZT had solved the problems by
adopting high-accuracy mould manufacture , molding in one , customize all kinds of
standard sheet material for socket , ensure product uniform specification and
meanwhile reduce wastage of material , had raised productivity by a big margin
Model Dimension
（mm）
Thickness
（mm）
Remark
PEI/PPS/PAI/PE
EK+Ceramic
250x250/
50x50
1.6/2.4/3/4.5/6 Can be
customized
PEI
PPS
PAI
38
Product features:

11、Cooperative partner
39

Shenzhen KaiZhiTong Micro-Electronic Technology Co., Ltd
Address：NO.14 building,Rentian south Road,Fuyong
Town,Baoan District,Shenzhen City,China
Tel：+86-755-27340793/29501178
Fax：+86-755-27340798
Suzhou KaiZhiTong Micro-Electronic Technology Co., Ltd
Address: No.2 builiding 3th floor,Kuachun Road,Weiting Town,
Suzhou industral area,Suzhou City,China
Tel：+86-512-62994351/62994352
Fax：+86-512-62994356
Website：www.KZT.CC / www.icsocket.net
Email：kaizhit@icsocket.net
Shenzhen
headquartes

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