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Gandhimathi .M
I-Block no-72,MMDA Colony,
Arumbakkam,Chennai-600106
Mobile: 9942499090 E- mail: gmelixir06@gmail.com
Professional Summary
 Having more than 5 years of industry experience.
 Expertise in Layout Designing for APPLICATION & LOAD board circuits
 Extensive knowledge on BOM Creation and Management, Board design for EMI/EMC and PCB
design
 Expertise on the designing tools:
o Allegro PCB Editor 15.2,15.7,16.0,16.3,16.5
o ECAM-CAM-350 7.5.1
o PADS LAYOUT 2005, 2007
o Design Entry CIS 15.2,15.7,16.0
Educational Qualification
 BE(Bachelors of Engineering in Electrical and Electronics Engineering) from IRTT College,
affiliated to Anna University, Chennai, India with an aggregate of 75 % during the period 2002 –
2006.
Work History & Experience
 Working as cad consultant in Mobi veil technologies pvt ltd from july 2015 to till date.
 Worked as Freelancer form 2010 to June 2015.
 Worked as PCB Designer in Nimbeon Intertechnologies from 2006 to 2010.
Key Proficiencies
 Component creation- Schematic development-Net list
 Create Technical Guidelines different circuits and simulation
 Evaluate the customer requirements and recommend the best parts to be used to improve
manufacturing and design in a cost effective manner
 Assist the team in troubleshooting client applications and pitch in whenever necessary
 Created team forums media to help communicate and share information, learnings and methods
with cross-functional team members to achieve organizational goals.
 Ensure project meets schedule, deliverables meets standards and adhere client policies
Core Competencies
 Study of reference platform, Defining specifications, Circuit design, Datasheet study, Component
selection, Discussion with component vendors, Schematic entry,
 PCB design, layout and packaging of high-speed, high-density, RF, BGA and mixed signal design
technologies Rigid
 Board Design for EMI/EMC compliance in the 1 to 6.4 GHz range.
 Best Practices IPC Standards and Conventions
 Footprint selection
 BOM Creation and Management.
 Component creation using datasheets and IPC standards
 Import the net list and do a quick place of components.
 Apply routing constraints and complete the routing using manual as well as auto route if necessary.
 Create plane layers on high speed boards for power and ground and split then if required.
 Run reports and ensure no DRC errors.
 Gerber file generation and view them using Ecam.
 Perform complete quality check considers the customer requirement, IPC standards and the internal
quality procedures.
 Ensure compliance with company policies and procedures
Recent Project Experience
1. Gigabit Passive Optical Network (GPON)
This board is developed for Kawasaki Microelectronics America, Inc. (K-micro), this is 8-layer
card. This board contain SerDes transceiver, PHY, SoC, FPGA, DDR2, FLASH, SRAM, SDRAM,
optical, RJ45 circuit interface. Power, SiLab and Legrity modules are used. This card output data
rate is 6Gbps.Ethernet signal speed is 1000Mbps for RGMII and GMII signals. DDR2 clock speed
is 233MHz and Data speed is 466 MHz.
DDR2 have 16 bit data and 14 bit address lines and it is routed with T topology. Address and
control signal are routed in one layer and data and strobe lines were routed in other layer to
minimize the slew rate delay on its group of signal and improve signal integrity. Proper reference
planes are provided underneath the signal.
No of layer : 8
No of nodes : 3968
No of components : 1700(120 types)
2. World Space Mobile satellite Radio
This board is designed for DELPHI. It has the following cards:
 Mother Board – Main MMI Card
 Car Dock
 Home Dock
S/R (Satellite Radio) receiver is capable of receiving both satellite and terrestrial signals.
Terrestrial re-transmission of the received satellite signal provides scope for Mobile radio receiver.
This receiver is a single receiver which will be used for a Home dock, On Dash and In Dash
configuration. This is mainly for automotive application. The receiver is designed based on the
Black Fin 561 dual core DSP Processor and ATMEGA64 is used as Front panel controller.
The placement of the components and the routing guidelines are followed as per the chip layout
guideline for Analog and digital circuitry. Topology of the ground planes between Analog, digital
and the ground earth were provide as per the design recommendation. Care has taken on the input
and amplification layout area, which may easily couple with noise since it is very low frequency
and voltage.
No of layer : 8
No of nodes : 1500
No of components : 500(45 types)
3. Alcatel Mini – CPE Switch
This card contains PROCESSOR, CONTROLLER, M4/32/32 CPLD, FPGA, DDR2, FLASH, and
SRAM circuitry. To avoid EMI, EMC and isolation problem we were given special attention to the
placement and characteristics of signal routing, placement of components, Visas, traces Pads and
connectors/ cable. It is sixteen layers card. Power and ground planes are used for high capacitance
and low inductance between power planes and return path for signals. Decoupling capacitors are
placed very closer to major components to prevent from sudden power disturbance. High-speed
data transmission components are placed very closer to controller for eliminates time delay in
transmission of data.
No of layer : 16
No of nodes : 5300
No of components : 1850(130 types)
Personal Information
Father’s Name : Mr. R. Muthusamy
Date of Birth : 02-05-1985
Nationality : Indian
Languages Known : English and Tamil
Communication Address : I-Block No-72,
Muthumariamman kovil st,
MMDA Colony,Chennai-600106
Declaration
I hereby declare that the information furnished above is true to the best of my knowledge.
(M. GANDHIMATHI)

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PCB Designer Resume - Gandhimathi M

  • 1. Gandhimathi .M I-Block no-72,MMDA Colony, Arumbakkam,Chennai-600106 Mobile: 9942499090 E- mail: gmelixir06@gmail.com Professional Summary  Having more than 5 years of industry experience.  Expertise in Layout Designing for APPLICATION & LOAD board circuits  Extensive knowledge on BOM Creation and Management, Board design for EMI/EMC and PCB design  Expertise on the designing tools: o Allegro PCB Editor 15.2,15.7,16.0,16.3,16.5 o ECAM-CAM-350 7.5.1 o PADS LAYOUT 2005, 2007 o Design Entry CIS 15.2,15.7,16.0 Educational Qualification  BE(Bachelors of Engineering in Electrical and Electronics Engineering) from IRTT College, affiliated to Anna University, Chennai, India with an aggregate of 75 % during the period 2002 – 2006. Work History & Experience  Working as cad consultant in Mobi veil technologies pvt ltd from july 2015 to till date.  Worked as Freelancer form 2010 to June 2015.  Worked as PCB Designer in Nimbeon Intertechnologies from 2006 to 2010. Key Proficiencies  Component creation- Schematic development-Net list  Create Technical Guidelines different circuits and simulation  Evaluate the customer requirements and recommend the best parts to be used to improve manufacturing and design in a cost effective manner  Assist the team in troubleshooting client applications and pitch in whenever necessary  Created team forums media to help communicate and share information, learnings and methods with cross-functional team members to achieve organizational goals.  Ensure project meets schedule, deliverables meets standards and adhere client policies Core Competencies  Study of reference platform, Defining specifications, Circuit design, Datasheet study, Component selection, Discussion with component vendors, Schematic entry,  PCB design, layout and packaging of high-speed, high-density, RF, BGA and mixed signal design technologies Rigid
  • 2.  Board Design for EMI/EMC compliance in the 1 to 6.4 GHz range.  Best Practices IPC Standards and Conventions  Footprint selection  BOM Creation and Management.  Component creation using datasheets and IPC standards  Import the net list and do a quick place of components.  Apply routing constraints and complete the routing using manual as well as auto route if necessary.  Create plane layers on high speed boards for power and ground and split then if required.  Run reports and ensure no DRC errors.  Gerber file generation and view them using Ecam.  Perform complete quality check considers the customer requirement, IPC standards and the internal quality procedures.  Ensure compliance with company policies and procedures Recent Project Experience 1. Gigabit Passive Optical Network (GPON) This board is developed for Kawasaki Microelectronics America, Inc. (K-micro), this is 8-layer card. This board contain SerDes transceiver, PHY, SoC, FPGA, DDR2, FLASH, SRAM, SDRAM, optical, RJ45 circuit interface. Power, SiLab and Legrity modules are used. This card output data rate is 6Gbps.Ethernet signal speed is 1000Mbps for RGMII and GMII signals. DDR2 clock speed is 233MHz and Data speed is 466 MHz. DDR2 have 16 bit data and 14 bit address lines and it is routed with T topology. Address and control signal are routed in one layer and data and strobe lines were routed in other layer to minimize the slew rate delay on its group of signal and improve signal integrity. Proper reference planes are provided underneath the signal. No of layer : 8 No of nodes : 3968 No of components : 1700(120 types) 2. World Space Mobile satellite Radio This board is designed for DELPHI. It has the following cards:  Mother Board – Main MMI Card  Car Dock  Home Dock S/R (Satellite Radio) receiver is capable of receiving both satellite and terrestrial signals. Terrestrial re-transmission of the received satellite signal provides scope for Mobile radio receiver. This receiver is a single receiver which will be used for a Home dock, On Dash and In Dash configuration. This is mainly for automotive application. The receiver is designed based on the Black Fin 561 dual core DSP Processor and ATMEGA64 is used as Front panel controller. The placement of the components and the routing guidelines are followed as per the chip layout guideline for Analog and digital circuitry. Topology of the ground planes between Analog, digital
  • 3. and the ground earth were provide as per the design recommendation. Care has taken on the input and amplification layout area, which may easily couple with noise since it is very low frequency and voltage. No of layer : 8 No of nodes : 1500 No of components : 500(45 types) 3. Alcatel Mini – CPE Switch This card contains PROCESSOR, CONTROLLER, M4/32/32 CPLD, FPGA, DDR2, FLASH, and SRAM circuitry. To avoid EMI, EMC and isolation problem we were given special attention to the placement and characteristics of signal routing, placement of components, Visas, traces Pads and connectors/ cable. It is sixteen layers card. Power and ground planes are used for high capacitance and low inductance between power planes and return path for signals. Decoupling capacitors are placed very closer to major components to prevent from sudden power disturbance. High-speed data transmission components are placed very closer to controller for eliminates time delay in transmission of data. No of layer : 16 No of nodes : 5300 No of components : 1850(130 types) Personal Information Father’s Name : Mr. R. Muthusamy Date of Birth : 02-05-1985 Nationality : Indian Languages Known : English and Tamil Communication Address : I-Block No-72, Muthumariamman kovil st, MMDA Colony,Chennai-600106 Declaration I hereby declare that the information furnished above is true to the best of my knowledge. (M. GANDHIMATHI)