Wire bonding is used to electrically interconnect integrated circuits to packages so they can be handled, tested, and used in electronic products. There are two main types of wire bonding: ball bonding and wedge bonding. Ball bonding uses a capillary tool to form a ball bond on the chip and substrate, while wedge bonding uses a wedge tool. Wire bonding allows for high-speed, economical connections and is the most common interconnection method. It enables signals and power to be distributed from the packaged IC to the rest of the system while also providing mechanical support and environmental protection.
Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as in material science research.
it is a low temperature process that includes the acceleration of ions of a particular element towards a target, altering the chemical and physical properties of the target.
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
PresenWide Bandgap Semiconductor Materials for Improved Performance Microwave...Realsim, Fanavaran Sharif
Wide bandgap semiconductors such as SiC (Silicon Carbide), GaN
(Gallium Nitride) and related heterostructures are characterised by
a much higher breakdown voltage and therefore they may allow fabrication of devices with an order of magnitude improved RF output power compared to traditional solid state devices.
Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as in material science research.
it is a low temperature process that includes the acceleration of ions of a particular element towards a target, altering the chemical and physical properties of the target.
Semiconductors are materials that have electrical conductivity between conductors such as most metals and nonconductors or insulators like ceramics. How much electricity a semiconductor can conduct depends on the material and its mixture content.
Semiconductors can be insulators at low temperatures and conductors at high temperatures. As they are used in the fabrication of electronic devices, semiconductors play an important role in our lives.
1.Silicon Manufacturing
a) Czochralski method.
b) Wafer Manufacturing
c) Crystal structure
2.Photolithography
a) Photoresists
b) Photomask and Reticles
c) Patterning
PresenWide Bandgap Semiconductor Materials for Improved Performance Microwave...Realsim, Fanavaran Sharif
Wide bandgap semiconductors such as SiC (Silicon Carbide), GaN
(Gallium Nitride) and related heterostructures are characterised by
a much higher breakdown voltage and therefore they may allow fabrication of devices with an order of magnitude improved RF output power compared to traditional solid state devices.
EDC Unit-5 Introduction to Integrated Circuits (ICs) | RGPV De BunkersRGPV De Bunkers
The PDF document "Fundamentals of Integrated Circuits" provides a comprehensive overview of the subject "Electronic Devices & Circuits" for Semester 3 in the Bachelor of Engineering program in Computer Science at Rajiv Gandhi Proudyogiki Vishwavidyalaya Bhopal. Designed to cater to both students and electronics enthusiasts, this document delves into the core concepts of Integrated Circuits (ICs), their fabrication process, and general IC technology.
The first unit, "Introduction to Integrated Circuits (ICs)," sets the foundation by introducing the revolutionary technology of ICs. It explores the integration of multiple active and passive components onto a single semiconductor chip. Emphasizing the advantages of ICs, the document highlights their role in miniaturizing electronic devices, cost-effectiveness in mass production, enhanced reliability, power efficiency, and high-performance capabilities. However, it also discusses the limitations, such as complex design processes and difficulty in repair and maintenance.
The second unit, "Classification of Integrated Circuits," categorizes ICs based on complexity, application, and technology. From Small-Scale Integration (SSI) to Very-Large-Scale Integration (VLSI), it covers the wide spectrum of IC complexities. The distinction between analog ICs, digital ICs, and mixed-signal ICs is explored in terms of their distinct applications. Moreover, the choice between bipolar ICs and CMOS ICs is elaborated upon, explaining the trade-offs between performance and power consumption.
In the third unit, "Production Process of Monolithic ICs," the document delves into the intricate fabrication steps required to create monolithic ICs. From selecting the semiconductor wafer material to heat treatment and testing, each stage of the process is explained in detail. The photolithographic process, an essential part of IC fabrication, is thoroughly covered, encompassing photoresist coating, mask alignment, exposure, developing, and subsequent etching or ion implantation.
The unit further explores unipolar ICs, focusing on N-channel and P-channel Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). It explains how these transistors are used as essential components in digital and analog integrated circuits.
The final topic, "IC Symbols," introduces standardized graphical representations commonly used in circuit diagrams to depict various types of integrated circuits and their functions. Understanding these symbols is fundamental for interpreting and designing electronic circuits accurately.
This comprehensive PDF document serves as an invaluable resource for students and electronics enthusiasts seeking to grasp the fundamentals of Integrated Circuits and Electronic Devices & Circuits. With a detailed explanation of each topic and sub-topic, along with real-world applications, it equips readers with the knowledge required to pursue advanced studies and excel in the dynamic field of electronics.
The Presentation describes about the Transmission media and in detail about coaxial cable,Twisted pair, Fiber optics, Power lines and their comparisons
Transmission Media, Guided and unguided transmission mediaadnanqayum
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Review of the Security Challenges of Fiber Optics Technologies in Network Con...inventionjournals
The increasing number of people who transfer data from one place to another daily demands that the telecom industries develop a sophisticated strategy to guaranty quality data transferred without compromise or interception. Some of these industries in a bid to meet up with this demand employ any means of data transfer possible to them. Internet connectivity requires physical transfer of data from one place to another. This can be achieved either through wire or wirelessly. Connection through wire could be by UTP, Coaxial or Fiber Optics. Experience showed that wired is more advantageous when considering bandwidth utilization, performance, reliability, resiliency and security, many people are toeing this way and fiber optics their major choice. Fiber optics can be bundled as cable and used for data transmission through which light propagates with little attenuation, which makes it advantageous for long distance communication. The massive choice of fiber optics of recent has increase the security challenges bedevilling it, as it is now the prime target of network attackers. This has increased its vulnerability. Fiber optic is experiencing some security issues like splicing, clamping, cutting and tapping in developing countries like Nigeria. The paper tries to evaluate the security challenges bedevilling the optic fiber
Review of the Security Challenges of Fiber Optics Technologies in Network Con...inventionjournals
The increasing number of people who transfer data from one place to another daily demands that the telecom industries develop a sophisticated strategy to guaranty quality data transferred without compromise or interception. Some of these industries in a bid to meet up with this demand employ any means of data transfer possible to them. Internet connectivity requires physical transfer of data from one place to another. This can be achieved either through wire or wirelessly. Connection through wire could be by UTP, Coaxial or Fiber Optics. Experience showed that wired is more advantageous when considering bandwidth utilization, performance, reliability, resiliency and security, many people are toeing this way and fiber optics their major choice. Fiber optics can be bundled as cable and used for data transmission through which light propagates with little attenuation, which makes it advantageous for long distance communication. The massive choice of fiber optics of recent has increase the security challenges bedevilling it, as it is now the prime target of network attackers. This has increased its vulnerability. Fiber optic is experiencing some security issues like splicing, clamping, cutting and tapping in developing countries like Nigeria. The paper tries to evaluate the security challenges bedevilling the optic fiber
The ever-increasing use of high-frequency switching devices in industrial automation can result in high-frequency currents circulating in an equipotential bonding network that was not designed for this purpose. The absence of a proven low-impedance bonding network can result in these currents taking alternative and often undesirable routes. Occasionally these will be the shields of industrial network cables such as PROFIBUS and PROFINET that in turn can lead to intermittent communications problems. This presentation will discuss the issues in more detail and will explain the relevance of the recently released PI guidelines “Functional Bonding and Shielding for PROFIBUS and PROFINET”.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
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All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
From Daily Decisions to Bottom Line: Connecting Product Work to Revenue by VP...
Wire bonding
1. WIRE BONDING
Group 2: Tống Văn Khoa
Cao Văn Phước
Trần Phúc Thành
2. Why Wire Bonding?
Enable an IC to be electrically interconnected
to the package, and to allow that IC to be
handled, tested and “burnt-in”
Such “qualified” IC used in electronic
product.
Interconnected to other ICs, passives, flat
panel displays, keyboards, sensors,
connectors, antennas, switches, etc.
PRIMARY purpose – enable ICs to be
interconnected with rest of the system.
Primary functions of IC assembly:
(1) To provide signal and power distribution of
the packaged IC to the system. Another way to bonding: Tape
automated bonding (TAB)
(2) To provide mechanical support to fragile IC Flip chip
(3) To provide environmental protection of the
IC
3. Introduction
Used in interconnecting the Die to various substrates
… The most popular interconnection method
Wire bonding is a SOLID phase welding process where the
two metallic materials, a thin wire and the metallization on
Pad surface are brought into intimate contact under a
combination of heat, pressure, and/or ultrasonic energy…..
4. Types of Wire Bonding
Wire bonding is made using two types of tools:
A Wedge- Called Wedge bonding
B: Capillary- Called ball bonding
Very inexpensive- A penny per pin
6. Ball Bonding
Process Steps
Capillary loaded with Au wire
EFO wand generates a spark to melt the Au wire at the
tip
Apply pressure and ultrasonic energy, heat to form ball
bond at bond pad on chip side
Bonding on substrate pad
Loop formation
Package bond pad formation by stitch bonding
Wire break-off to finish process
12. Process Steps
Wedge tool loaded
with wire
Apply pressure and
ultrasonic energy to
form wedge
Bonding on substrate
pad
Loop formation
Package bond pad
formation
Wire break-off to
finish process
13.
14. Features of Wire Bonding Method
High speed( Bonding time 40ms: 2-4 wires/ sec)
Economical
Strong bond
Larger Bonding pad (0,2mm gold wire: 0,5*0,5 mm
pad)
Ultrasonic can be used
15. (Dis)advantages
The advantages of wirebonding:
Highly flexible chip-to-package interconnection process
Low defect rates or high yield interconnection processing
Easily programmed
High reliability interconnection structure
Very large industry infrastructure supporting the technology
Rapid advances in equipment, tools, and material technology
The disadvantages of wirebonding:
Slower interconnection rates due to point-to-point processing
of each wirebond
Long chip-to-package interconnection lengths, degrading
electrical performance
Larger footprint required for chip to package interconnection
16. Summary
Function of Wire Bonding
Types of Wire Bonding
Ball Bonding
Wedge Bonding
Advantages and Disadvantages