Application for 3D surface mapping with high image resolution and measurement. Targeting product having high surface flatness or needed high precision measurement for 3D surface.
THERMOGRAPHY AND EDDY CURRENT TESTING (ET)laxtwinsme
Thermography- Principles, Contact and non contact inspection methods, Techniques for applying liquid crystals, Advantages and limitation - infrared radiation and infrared detectors, Instrumentations and methods, applications. Eddy Current Testing-Generation of eddy currents, Properties of eddy currents, Eddy current sensing elements, Probes, Instrumentation, Types of arrangement, Applications, advantages, Limitations, Interpretation/Evaluation
Introduction.
Superconductivity.
Meissner effect.
Flux Quantization.
Types of Superconductors.
London Equations.
BCS Theory.
London Penetration Depth
Applications of Super conductors.
This article discusses the principle of interferometry. The definition of the term along with its applications are stated in this article. Five most common type of interferometers viz. Michelson Interferometer, Mach-Zahnder Interferometer, Fabry Perot Interferometer, Sagnac Interferometer and Fiber Interferometer are discussed in detial in this article.
THERMOGRAPHY AND EDDY CURRENT TESTING (ET)laxtwinsme
Thermography- Principles, Contact and non contact inspection methods, Techniques for applying liquid crystals, Advantages and limitation - infrared radiation and infrared detectors, Instrumentations and methods, applications. Eddy Current Testing-Generation of eddy currents, Properties of eddy currents, Eddy current sensing elements, Probes, Instrumentation, Types of arrangement, Applications, advantages, Limitations, Interpretation/Evaluation
Introduction.
Superconductivity.
Meissner effect.
Flux Quantization.
Types of Superconductors.
London Equations.
BCS Theory.
London Penetration Depth
Applications of Super conductors.
This article discusses the principle of interferometry. The definition of the term along with its applications are stated in this article. Five most common type of interferometers viz. Michelson Interferometer, Mach-Zahnder Interferometer, Fabry Perot Interferometer, Sagnac Interferometer and Fiber Interferometer are discussed in detial in this article.
A presentation on Molecular Beam Epitaxy made by Deepak Rajput. It was presented as a course requirement at the University of Tennessee Space Institute in Fall 2008.
Plenary lecture of the XIII SBPMat (Brazilian MRS) meeting, given on September 30th 2014 by Karl Leo, professor of optoelectronics at Dresden University of Technology (Germany) and director of the Solar and Photovoltaic Engineering Research Center at KAUST (Saudi Arabia).
A presentation on Molecular Beam Epitaxy made by Deepak Rajput. It was presented as a course requirement at the University of Tennessee Space Institute in Fall 2008.
Plenary lecture of the XIII SBPMat (Brazilian MRS) meeting, given on September 30th 2014 by Karl Leo, professor of optoelectronics at Dresden University of Technology (Germany) and director of the Solar and Photovoltaic Engineering Research Center at KAUST (Saudi Arabia).
Introduction to applying X-Ray imaging techniques to industrial machine vision applications. This presentation was given at the "Vision Show" in 2009 in Phoenix, AZ. It provides as overview of possible sensors to convert X-Rays into photons for imaging.
Se-2000 for modular design provides modularity and high measurement performance in a compact table footprint. This cost effective tool includes automatic sample positioning suitable for R&D laboratories and production quality monitoring.
3D Surface characterisation - Atomic Force and Scanning Electron Microscopy...Daniel Thomas
A scanning electron microscope produces images of a sample by scanning it with a focused beam of electrons.
These electrons interact with atoms in the sample, producing various signals that can be detected and that contain information about the samples surface topography and composition.
A Tungsten filament cathode is used in a thermionic electron gun because it has a high melting point and low vapour pressure, thereby allowing it to be heated for electron emission.
Improvement of Surface Roughness of Nickel Alloy Specimen by Removing Recast ...IJMER
Abstract: In this investigation, experimental work and computational work are combined to obtain improvement in the surface roughness of nickel alloy specimen, the machining is carried out by means of CNC wire electric discharge machining (WEDM). Brass wire is used as the tool electrode and nickel alloy (Inconel600) is used as the work piece material. The machining parameters such as Pulse-On time (Ton), Pulse-Off time (Toff), Peak Current (Ip), and Bed speed are considered as input parameters for this project. Surface roughness and Recast layer are considered the output parameters. The experiments
with the pre-planned set of input parameters are designed based on Taguchi’s orthogonal array. The surface roughness is measured using stylus type roughness tester and the thickness of the Recast layer is measured using Scanning Electron Microscope (SEM). The results obtained from the experiments are fed to the Minitab software and optimum input parameters for the desired output parameters are identified. The software uses the concept of analysis of variance (ANOVA) and indicates the nature of effect of input parameters on the output parameters and confirmation is done by validation
experiments. Once the recast layer thickness is obtained Chemical Etching and abrasive blasting is performed in order to remove the recast layer and again the surface roughness is measured by using stylus type roughness tester. Finally from the obtained results it was found that there was significant improvement in the Surface roughness of the nickel alloy material. In addition using regression analysis this work is stimulated by computational method and the results are obtained
3D Scanners and their Economic FeasibilityJeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to analyze how the economic feasibility of 3D scanners is becoming better through improvements in lasers, camera ICs, and processor ICs. 3D scanning is both a complement to 3D printing and a technology with its own unique applications. 3D printing of complex objects can be done from a CAD database or from a 3D scan where a 3D scan can be done with laser or other sources of white light such as LEDs.
3D scanning can also be done for other purposes. For example, scientists and engineers are using 3D scanners to survey archeological, construction, crime scene, and engineering sites, to document maintenance and repair of engineered systems, and to customize medical and dental products for humans. Improvements in lasers, LEDs, camera chips, ICs, and other components continue to improve the economic feasibility of 3D scanning. Longer wavelength lasers increase the scanning range, better camera chips improve the scanning resolution, and better lasers, camera chips, and processor ICs reduce the scanning time. For example, third generation scanners from Argon, one leading supplier, have 100 times higher resolution and one tenth the scan times of Argon’s first generation system.
For costs, lasers make up the largest percentage followed by camera and processor ICs. For example, lasers make up 80% of the hardware cost for one high-end system with a current cost of $1346 and a price of about $3000. As laser costs fall and as volumes enable smaller margins, the price of such systems will fall.
For the same reasons, low-end systems continue to emerge. These include Microsoft’s Kinect and an app for the iPhone. Microsoft’s Kinect was $150 while the app was only $4.99, both in early 2013. As such low-end systems proliferate, and high-end systems continue to get cheaper, 3D scanning will find new applications.
2. Theory background
• Interferometer uses the superposition principle to combine waves in a
way to extract information from the wave fronts.
• The position of the zero order interference fringe is independent of
wavelength
• A broadband “white light” source is used to illuminate the test and
reference surfaces
2
reference surfaces
• The reference beam is reflected by the reference mirror, while the
measurement beam is reflected or scattered from the test surface.
• Reconstruction of the surface based on the fringes snapped by the
camera
3. Intensity = A + B cos(φ) φ ∽ z 3D topographic
image of the
object surface
Light
Plane
Mirau microscope objective
3
Convergent
lens
Plane
reference
mirror
Reference
surface
z
Object surface
Interferences
4. • Step-height and roughness measurement
• White light interferometric profilometer
• Variable field of view due to revolver objectives
• High speed: full image recorded within seconds
Semilab Optical Profilometer
4
• High speed: full image recorded within seconds
• Sub-micron lateral resolution
• Sub-nm height resolution
• CCD color camera
• Low sensitivity to vibrations
• Non-destructive
5. WLI
Camera resolution: 1024x1024 (2048 x 1088)
Pixel Size (on the sensor): 5.5µmx5.5µm
Acquisition speed: 500 fps (340 fps)
Measurement time (without motion): <1 sec
Depth resolution : < 0.1 nm
Repeatability: σ=0.3 - 6 nm depend on sample
Specification:
www.semilab.com
Repeatability: σ=0.3 - 6 nm depend on sample
Multiple heads configuration available
Color Camera option
9/21/2015 5
Objective (3D) 50x 20x 10x
Maximum FOV (µm) 284x150 568x300 1136x600
Best optical resolution
(Rayleigh definition) (µm)
0.5 0.7 0.9
Field of views:
29. • Semilab is capable to deliver state of art 3d surface profiling metrology using white
light interferometry
• Best resolution available : high resolution camera can deliver data up to 2 Megapixels,
in less than 3s aquisition time
Conclusions
www.semilab.com
in less than 3s aquisition time
• Semilab wli technology proved to work for various industrial applications in the flat
panel, solar cell and semiconductor area
• Excellent repeatability is proven to be in the range of few nm-s
29