IMAGEM DESTAQUE
1
Traveo™ T2G Microcontrollers
For Industrial & Automotive Solutions
Marcelo Williams Silva
Global Product Marketing Director & Business Development for
Automotive and Industrial
Infineon offers a unique portfolio that links the real
and the digital world: “One-Stop-Shop” concept
Real-world
applications
Digitale
Welt
Battery-powered devices
Consumer IoT
5G
Power supplies
Drives
Industrial IoT
Connectivity
Automotive
Sense: sensors Compute: microcontrollers,
memories
Actuate: power semiconductors Connectivity: Wi-Fi, Bluetooth, USB
Coin cell-powered devices
Smart Home
Information and data
about the real world
Value addition and
optimized use of resources
Software
Ecosystem
Digital
world
2
2023-42-18 Copyright © Infineon Technologies AG 2023. All rights reserved.
3
Copyright © Infineon Technologies AG 2022. All rights reserved.
restricted
2023-04-20
Infineon’s top market position is built on system competence based on
an industry-leading product portfolio
› Total market grew by 27.4% y-y, reaching all-time-high of
$59.4bn; market growth clearly supported by content-per-car
growth
› Infineon #1 in power semiconductors due to high exposure in xEV
› Outstanding success of AURIX™ microcontroller family propelled
Infineon to #2 position in MCUs
› Undisputed #1 in automotive NOR Flash memory ICs
12.4%
11.6%
8.8%
8.3%
7.9%
Infineon
NXP
STMicro
Texas Instr.
Renesas
Automotive semiconductors (2022 total market: $59,425m; +27.4% y-y)
21.1%
13.2%
11.9%
8.8%
8.4%
Bosch
onsemi
Infineon
ADI
Melexis
Sensors
7.5%
8.8%
23.1%
23.7%
27.3%
Microchip
STMicro
NXP
Infineon
Renesas
MCUs Power semiconductors
5.5%
8.4%
11.2%
20.3%
31.9%
Rohm
onsemi
Texas Instr.
STMicro
Infineon
Source: TechInsights (formerly Strategy Analytics): Automotive Semiconductor Vendor Market Shares 2022. April 2023
4
Portfolio & Roadmap
Copyright © Infineon Technologies AG 2021. All rights reserved.
2021-02-08
8-bit/SoC
32-bit Arm® Cortex®-
M0/M0+
32-bit Arm® Cortex®-M3 32-bit Arm® Cortex®-M4 32-bit Arm® Cortex®-M7 32-bit TriCore™
IFX Microcontrollers portfolio & roadmap
Automotive
Industrial
Consumer
PSoC™ 6
PSoC™ 4 PSoC™ 5
PSoC™ 3
PSoC™ 1 FM0+™
FM3+™ FM4+™
XMC1000™
XMC4000™
XMC7000™
Auto PSoC™
Cortex M0+ ASIL-B
Up to 384kB Flash
CapSense / Magsense
MOTIX™
Cortex M0/M3 ASIL-B
Up to 256kB Flash
Motor Control SoC
TRAVEO T2G™
Dual Cortex M4 / M7 ASIL-B
Up to 16MB Flash
HSM, GPU (Cluster) and
Graphic capabilities
AURIX™ TC2x
Up to 3x Tricore ASIL-D
Up to 8MB Flash
HSM,ETH,Lockstep,CAN FD
AURIX™ TC3x
Up to 6x Tricore ASIL-D
Up to 16MB Flash
HSM,GETH,Lockstep,CAN FD
• CPU up to 48MHz and 64KB Flash
• Math co-processor
• CPU up to 144 MHz and 2MB Flash
• Dual Cortex®-M7 and M0+ up to
350 MHz and 8MB Flash
• CPU up to 40MHz and 128KB Flash
• Entry level USB
• CPU up to 144MHz and 1MB Flash
• Basic Motor Control
• CPU up to 200MHz and 2MB Flash
• High Performance Motor Control
• CPU up to 24Mhz and 32KB Flash
• CAPSENSE™ and application
specific mixed signal functionality
• CPU up to 67 MHz and 64 KB Flash
• High performance analog
• Programmable logic integration
• CPU up to 48MHz and 384KB Flash
• Industry leading CAPSENSE™ and
mixed signal functionality
• CPU up to 80MHz and 256KB Flash
• High-precision analog
• Programmable logic integration
• Dual Cortex®-M4 and M0+, up to 150
MHz and 2MB Flash
• Ultra-low-power with hardware based
security
PSoC Multitouch™
MCU integrated Touch Controller SoC
Touchscreen, Slider, Touchpad
Wet-finger tracking
PSoC Fingerprint™
MCU integrated Touch Controller SoC
Capacitive fingerprint solution
Support multi surface usage solution
Auto PSoC HV™
Cortex M0+ ASIL-B
Up to 384kB Flash
Up to 42V tolerant MCU
AURIX™ TC4x
Up to 6x Tricore ASIL-D
Up to 24MB Flash
PPU,CSRM,Lockstep,PCIe,RE
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
ADAS New E/E
Smart
Sensors
Body & Connectivity Chassis &
Safety
Powertrain &
xEV
Driver
Information
& HMI
AURIX™
TC3x
AURIX™, TRAVEO™ T2G & Auto PSoCTM Family – Successfully
Covering the Entire Range of Automotive Applications
AURIX™
TC4x
AUTO
PSoC™
AURIX™ TC3x
› Up to 6x Tricore™ 1.6 300MHz
› ISO26262 ASIL-D
› Up to 16MB Flash,
› HSM, GETH
› AEC-Q100 Grade 0 (Ta 150°C)
AURIX™ Next Gen
AUTO
PSoC™
AURIX™ TC4x
Next Generation MCU
Architecture
TRAVEO™ Next Gen
› Up to 6x Tricore™ 1.8 500MHz
› ISO26262 ASIL-D
› Up to 21MB Flash,
› PPU, CSRM, Routing engine
› AEC-Q100 Grade 0 (Ta 150°C)
TRAVEO™ T2G
› Arm® Cortex™ M4 / M7 based
› ISO26262 ASIL-B
› Low Power
› Up to 16MB flash, HSM
› GPU TVII-C (Cluster)
› AEC-Q100 Grade 1 (Ta 125°C)
AUTO PSoCTM
› Arm® Cortex™ M0+ & M23 lockstep based
Architecture
› ISO26262 ASIL-B , C &D
› Low Power
› CapSense®, MagSense™ & Multi-sense Converter
› AEC-Q100 Grade 1 (Ta 125°C)
Customer MCU decision flow Aurix™ vs. Traveo™ II and PSoC™
Safety
Requirement
ASILC/D/SIL-3
Yes
No
Customer
Need
AURIX
Traveo
Body
No
Yes
Yes
Internal Memory
requirements:
Performance
>2x350MHz
Flash >8MB
SRAM: >1.5MB
Ta>125°C
Need for low power
Scalability to the low
end at 0.5MB Flash
Traveo
Cluster
Need for Graphic
GPU, LP DDR IF
Yes
Internal Memory
requirements:
Flash <512KB
No
Auto
PSoC
Yes
No
7
2021-02-23 Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
TRAVEO™ T2G: Scalability and Low Power for Body and
Connectivity
Body
▪ Scalability performance, memores and packages for many body applications
▪ Low standby current with fast wakeup
▪ Security with FOTA and secure boot
▪ Functional safety up to ASIL-B
Connectivity
▪ Multi high-speed communication interfaces
▪ High performance with low standby current
▪ Functional safety up to ASIL-B
Body & Connectivity requirements …and our Automotive microcontroller offering
Connectivity
✓ Rich connectivity interfaces with 10/100/1000 Mbps Ethernet,
Flexray, CAN FD, LIN and CXPI
✓ DeepSleep accomplishes 50uA in CYT4B series with high
frequency at 350MHz of dual Cortex-M7.
✓ Meets ISO26262 ASIL B design
Body
✓ Scalability performance from a single Cortex-M4 right up to dual
Cortex-M7.
✓ Multiple variants for packages from 64-pins to 320-balls and
flash memories from 512kB to 16MB.
✓ DeepSleep accomplishes 35uA in CYT2B series
✓ Selectable Enhanced Secure Hardware Extension (eSHE) or
Hardware Security Module (HSM) with fast wakeup.
✓ Switchable single bank or dual bank mode in flash memory
✓ Meets ISO26262 ASIL B design
CYT4BF
2x 350MHz 8MB
CYT4BB
2x 250MHz 4MB
CYT3BB
1x 250MHz 4MB
Body control
module
PEPS/key/ID
TPMS sensor
(Valve/tier Mounted)
LED lighting and
AFS control unit
CYT2BL
1x/ 160MHz 4MB
CYT2B7
1x 160MHz 1MB
CYT2B6
1x 80MHz 512kB
CYT2B9
1x 160MHz 2MB
Seat control unit
CYT6BJ
4x 320MHz 16MB
Window/door
control unit
HVAC system
Immobilizer
DC/DC converter
Engine
start/stop button
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
TRAVEO™ T2G: Single Chip Solutions for Instrument Cluster and
HUD
Cluster
▪ Scalability from Dot-Matrix to Hybrid and Virtual clusters
▪ Digtal/analog video-in/out for high resoluton image and low cost display interface
▪ Mixing sounds for turn, hazard, back warning and other and stepper motor for needle control
▪ Multi communication interfaces with security
HUD / Video safety companion / eMirror
▪ Digtal/analog video in/out and laser driver for HUD including AR-HUD
▪ Image distortion on the window and critical image checking
▪ Video manipulation for HUD, safety companion and eMirror
▪ Safety support from graphics stream of 3D SoC
Instrument cluster & HUD requirements …and our Automotive microcontroller offering
Head-up display (HUD) / Video safety
companion / eMirror
✓ Display controller enable multiple variants display interfaces
✓ Laser dirver to cover AR-HUD based on MEMS Laser Beam
Scanner (LBS).
✓ Warping on-the-fly, warping library and calibration tool enable
distortion correction
✓ Safety signature unit and driver to find error image for ISO
26262 compliance
✓ Safety overlays, image supervision and intro animation to be
provided for ASIL-B as safety companion.
Cluster
✓ Single chip solution from LCD to 720p an entry level virtual
cluster with powerful 2.5D graphics engine and driver
✓ Line-based operation with on-the-fly for reduction of video RAM
✓ Display controller supports LVDS/RGB video-out and
RGB/MIPI-CSI2 video-in for multiple variants display interfaces
✓ Mixer, Sound Generator, I2S/TDM, PCM-PWN and Audio DAC
to provide minimize BOM cost.
✓ Selectable Enhanced Secure Hardware Extension (eSHE) or
Hardware Security Module (HSM) with fast secure boot.
CYT4DN
2x 320MHz 6M 2.5D GFX
CYT3DL
1x 240MHz 4M 2.5D GFX
CYT2CL
1x 160MHz 4M
HVAC system
Instrument cluster
Digital mirrors
Matrix LED headlights
T2G-G-AM-4M
2x 320MHz 4M 2.5D GFX
Laser driver
CYT4DN
2x 320MHz 6M 2.5D GFX
CYT3DL
1x 240MHz 4M 2.5D GFX
CYT4EN
2x 320MHz 6M 2.5D GFX
DDR
Head-up display (HUD)
CYT4EN
2x 320MHz 6M 2.5D GFX
DDR
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
TRAVEO™ T2G Body
CYT2B6
TVII-B-E-512K
CYT2B7
TVII-B-E-1M
CYT2B9
TVII-B-E-2M
CYT2BL
TVII-B-E-4M
TRAVEO™ T2G Body Entry
TRAVEO™ T2G Graphics
CYT2CL
TVII-C-E-4M
TRAVEO™ T2G
Cluster
CYT3DL
TVII-C-2D-
4M
CYT4DN
TVII-C-2D-
6M
CYT4EN
TVII-C-2D-
6M-DDR
TRAVEO™ T2G Graphics
Features
Performance
TRAVEO™ T2G Cluster and Graphics
✓ Up to 6MB Flash and 896KB RAM
✓ Up to dual M7 @350Mhz with 2.5D GFX
and 720p Graphics Support
✓ Video input and output
✓ JPEG Decoder
✓ HYPERBUS™
TRAVEO™ T2G Body Entry
✓ Up to 4MB Flash and 512KB
RAM
✓ M4 @(up to)160MHz
✓ 64 – 176 pins LQFP
TRAVEO™ T2G Features
› ARM® Cortex® Based
› Low Power
› CAN FD and
1Gb Ethernet
› Cortex® M0+ for HSM
› EVITA Full
› True FOTA
› ISO 26262 up to ASIL B
› Compliant up to AEC-
Q100 grade 1 (Ta
125°C)
› AUTOSAR-compliant
MCAL drivers available
TRAVEO™ T2G – Body Electronics and a Better User Experience
CYT3BB
CYT4BB
TVII-B-H-4M
CYT4BF
TVII-B-H-8M
TRAVEO™ T2G Body High
CYT6BJ
TVII-B-H-16M
TRAVEO™ T2G Body High
✓ Up to 16MB Flash and 2048KB
RAM
✓ Up to Quad M7 @320MHz
✓ 100 – LQFP to 320 – BGA
✓ eMMC interface
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
Full portfolio Scalability from Auto PSoCTM to TRAVEO™ T2G !
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Performance
TRAVEO™ T2G Body MCU Family Product Portfolio Extension
Availability
Status
Official
Production
Sampling
Development
Concept
1
Maximum operating frequency
2
Hardware security module, SHE-only mode
available
3
Clock eXtension peripheral interface
4
Package pin count
5
Single or dual core option
6
Time division multiplexing
7
Fine pitch ball grid array
8
Optional feature
9
Dual core option (TEQFP 176 only) QQYY
QQYY
Body/Gateway/Infotainment
TRAVEO™ T2G entry MCU TRAVEO™ T2G high MCU
Peripherals based on Infineon MXS40 platform
CYT3BB/CYT4BB
TVII-B-H-4M
2x Cortex®-M75, 250 MHz1,
ASIL-B, HSM,
4MB flash, 768KB RAM,
eMMC, ethernet, I2S/TDM6
100-176-pins4 TEQFP,
272-ball BGA7
CYT2B7
TVII-B-E-1M
Cortex®
-M4, 160 MHz1
,
ASIL-B, HSM2
,
1MB flash, 128KB RAM
64–176 pins4
LQFP
CYT2B9
TVII-B-E-2M
Cortex®
-M4, 160 MHz1
,
ASIL-B, HSM2
, CXPI3
2MB flash, 256KB RAM,
64–176 pins4
LQFP
CYT4BF
TVII-B-H-8M
2x Cortex®-M7, 350 MHz1,
ASIL-B, HSM,
8MB flash, 1024KB RAM,
eMMC, ethernet,
FlexRay8, I2S/TDM6
176-pins4 TEQFP,
272-ball BGA7,
320-ball BGA
CYT2B6
TVII-B-E-512K
Cortex®
-M4, 80 MHz1
,
ASIL-B, HSM2
,
512KB flash,
64KB RAM
64-100 pins4
LQFP
NOW NOW
NOW
CYT2BL
TVII-B-E-4M
Cortex®
-M4,160 MHz1
,
ASIL-B, HSM2
, CXPI3
4MB flash, 512KB RAM
64–176 pins4
LQFP
NOW
CYT6BJ
TVII-B-H-16M
4x Cortex®-M79, 320 MHz1,
ASIL-B, HSM,
16MB flash, 2048KB RAM,
eMMC, ethernet,
FlexRay8, I2S/TDM6
176-pins4 TEQFP,
272-ball BGA7,
320-ball BGA
Q124
NOW
NOW
Memory
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
TRAVEO™ T2G Body Scalable Portfolio
Family
CYT2B9
CYT2BL
CYT3BB
CYT4BB
CYT4BF
Flash
Memory
Size
4MB
4MB
4MB
16MB
LQFP/TEQFP BGA
64 80 100 144 272 320
Entry
High-End
Legend: RAM
768KB
Pin count
64KB
176
CYT2B6
CYT2B7
CYT6BJ*
512KB
2MB
1MB
8MB
128KB
256KB
512KB
1024KB
2048KB
* Qualified Samples in Q1 2024 and Production in Q1 2025
Applications
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
CYT2BL Series (TVII-B-E-4M)
CYT2BL000
Body control module (BCM), HVAC, Lighting, and Gateway
Applications
› 32-bit MCU core systems
– 160-MHz Arm® Cortex®-M4 Single core with FPU
– 4MB code flash, 128KB work flash, and 512KB SRAM and Cortex®-M0+ for crypto
› 2.7-V to 5.5-V supply voltages
› Interfaces
– Up to 8-ch CAN FD, up to 8-ch SCB, up to 12-ch LIN-UART, and up to 4-ch CXPI
› AD converter
– 3 SAR ADCs with up to 67 external channels (64 I/Os + 3 I/Os for motor control)
› Timers
– Up to 12 16-bit channels for Motor Control, 63 16-bit channels timer/counter/pulse-
width modulation (TCPWM), and 8-ch 32-bit TCPWM
– Up to 11 Event Generation timers
› Packages
– 64-pin LQFP, 80-pin LQFP, 100-pin LQFP, 144-pin LQFP, 176-pin LQFP
Datasheet: CYT2BL series
Collateral Availability
Peripheral
System control Core block
Regulators
PLL/FLL
RC Oscillators
LVD/BOD
Power mode
management
Real-time clock
WDT/CSV
Reset
Event generation
timer
Boot ROM
Code flash
SWD/JTAG/
Trace
PPU
Work flash
SRAM
Crypto
DMA
Cortex®-M0+
MPU eFuse
IRQ/NMI
8-ch SCB
SPI/I2C/UART
8-ch
CAN FD
GPIO
Smart I/O
16-bit TCPWM 12-ch LIN-UART
64-ch 12-bit ADC
3 SAR ADC
32-bit TCPWM
16-bit motor
TCPWM
4-ch CXPI
Controller
Cortex®-M4
(Single) FPU
Sampling: Now Production: Now
Features
TRAVEO™ T2G Body MCU Family
SUPER
SET
M4
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
CYT4BF Series (TVII-B-H-8M)
System control Core block
Peripheral
PLL/FLL
RC Oscillators
LVD/BOD
Power mode
management
Real-time clock
Regulators
WDT/CSV
Reset
Event generation
timer
Cortex®- M7
(Dual) FPU Boot ROM
Code flash
SWD/JTAG/
Trace
PPU
Work flash
SRAM
Crypto
DMA
Cortex®-M0+
MPU
D-Cache
I-Cache
IRQ/NMI
11-ch SCB
SPI/I2C/UART
10-ch
CAN FD
eMMC
eFuse
GPIO
Smart I/O
16-bit TCPWM 20-ch LIN-UART
96-ch 12-bit ADC
3 SAR ADC
32-bit TCPWM
SMIF
Ethernet
FlexRay
16-bit motor
TCPWM
I2S/TDM
CYT4BF000
Body Control Module (BCM), Gateway, and Infotainment
Applications
› 32-bit MCU core systems
– 350-MHz Arm® Cortex®-M7 Dual with single/double FPU, I/D-Cache
– 8MB code flash, 256KB work flash, 1024KB SRAM, and Cortex®-M0+ for crypto
› 2.7-V to 5.5-V supply voltages
› Interfaces
– Up to 10-ch CAN FD, up to 11-ch SCB, and 20-ch LIN-UART
– eMMC, SMIF (QSPI/HS-SPI), up to 2-ch 10/100/1000-Mbps Ethernet and FlexRay
– I2S/TDM with Tx 3ch and Rx 3ch
› AD converter
– 3 SAR ADCs with up to 99 external channels (96 I/Os + 3 I/Os for motor control)
› Timers
– Up to 15 16-bit channels for Motor Control, 87 16-bit channels timer/counter/pulse-
width modulation (TCPWM), and 16-ch 32-bit TCPWM
– Up to16 Event Generation timers
› High-speed I/O supported in BGA
– Operating voltage required: 2.7 V to 3.6 V
› Packages
– 176-pin TEQFP, 272-ball BGA, 320-ball BGA
Datasheet: CYT4BF series
Collateral
Sampling: Now Production: Now
Availability
Features
TRAVEO™ T2G Body MCU Family
SUPER
SET
M7
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
CYT6BJ Series (TVII-B-H-16M)
System control Core block
Peripheral
PLL/FLL
RC Oscillators
LVD/BOD
Power mode
management
Real-time clock
Regulators
WDT/CSV
Reset
Event generation
timer
Cortex®- M7
(Quad) FPU Boot ROM
Code flash
SWD/JTAG/
Trace
PPU
Work flash
SRAM
Crypto
DMA
Cortex®-M0+
MPU
D-Cache
I-Cache
IRQ/NMI
11-ch SCB
SPI/I2C/UART
10-ch
CAN FD
eMMC
eFuse
GPIO
Smart I/O
16-bit TCPWM 20-ch LIN-UART
96-ch 12-bit ADC
3 SAR ADC
32-bit TCPWM
SMIF
Ethernet
FlexRay
16-bit motor
TCPWM
I2S/TDM
CYT6BJ000
Body Control Module (BCM), Gateway, and Infotainment
Applications
› 32-bit MCU core systems
– 320-MHz Arm® Cortex®-M7 Quad core with single/double/quad FPU, I/D-Cache
– 16MB code flash, 512KB work flash, 2048KB SRAM, and Cortex®-M0+ for crypto
› 2.7-V to 5.5-V supply voltages
› Interfaces
– Up to 10-ch CAN FD, up to 11-ch SCB, and 20-ch LIN-UART
– eMMC, SMIF (QSPI/HS-SPI), up to 2-ch 10/100/1000-Mbit Ethernet and FlexRay
– I2S/TDM with Tx 3ch and Rx 3ch
› AD converter
– 3 SAR ADCs with up to 99 external channels (96 I/Os + 3 I/Os for motor control)
› Timers
– Up to 15 16-bit channels for Motor Control, 87 16-bit channels timer/counter/pulse-
width modulation (TCPWM), and 16-ch 32-bit TCPWM
– Up to16 Event Generation timers
› High-speed I/O supported in BGA
– Operating voltage required: 2.7 V to 3.6 V
› Packages
– 176-pin TEQFP, 272-ball BGA, 320-ball BGA
Datasheet MYICP (BODY) (NDA)
Collateral
Sampling: Q1 2024 Production: Q1 2025
Availability
Features
TRAVEO™ T2G Body MCU Family NEW
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
TRAVEO™ T2G Body MCU Marketing Part Number Decoder
CY T X X X X B X
Code Package type
AE TEQFP
AZ LQFP
BZ BGA
Q
Qualified
samples
A X
XX X
GS
0
CY T X X X X B X A E S Quality grade: ES – engineering samples
S = -40°C to +105°C
E = -40°C to +125°C
B
=
Body
2 = Single core M4
3 = Single core M7
4 = Dual core M7
6 = Quad core
TRAVEO™
T2G
CYPRESS™
Revision
Fab
location,
Q
=
UMC
T=Tape
&
Reel
Reserved
Density for cFlash/wFlash/RAM
6 512KB/64KB/64KB (CYT2B6)
7 1MB/96KB/128KB (CYT2B7)
9 2MB/128KB/256KB (CYT2B9)
B 4MB/256KB/768KB (CYT3BB/4BB)
L 4MB/128KB/512KB (CYT2BL)
F 8MB/256KB/1024KB (CYT4BF)
J 16MB/512KB/2048KB (CYT6BJ)
Package
3 64 pins
4 80 pins
5 100 pins
7 144 pins
8 176 pins
B 272 balls
C 320 balls
H 144 pins, 0.4 mm pitch
Hardware
option
Ethernet FlexRay eMMC
A off off off
B 1ch off off
C 1ch on off
D 1ch on on
E 1ch off on
F 2ch off off
G 2ch on off
H 2ch on on
J 2ch off on
B = eSHE*
C = HSM
* eSHE only supported with T2G Body
restricted
Traveo T2G™ = Technical Updates
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Low power
Scalability
Performance
Graphics
Audio
Connectivity
Security
Safety Updatability
4
5
6
1
2
3
2 5
Low power
› Energy-efficient
processing power
› Higher voltage supply
2.7 – 5.5V
Scalability
› Complete portfolio
› Memory density
› Package lineup
› Performance
Performance
› Single Arm® Cortex®-M4
› Dual Arm® Cortex®-M7
› Quad Arm® Cortex®-M7
› Up to 2700 DMIPS
Connectivity
› 8Mb CAN FD
› 1Gb ethernet
Security
› Hardware security module
› Evita full
› Arm® Cortex®-M0+ core
Safety
› ISO 26262 ASIL-B
Updatability
› True FOTA1 with RWW2
flash dual bank
› eMMC3
› QSPI/HS-SPI
Graphics / Audio
(T2G Cluster)
› 3x Performance of
TRAVEO™ T1G
Key Features (T2G Body)
8
7
6
1
2
3
4 5
TRAVEO™ T2G
family
1 FOTA: Firmware update over the air
2 RWW: Read while write
3 Embedded multi media card
Copyright © Infineon Technologies AG 2023. All rights reserved.
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2023-03-03
Traveo T2G = Power Mode Characteristics
› TRAVEO™ T2G supports six power modes
Active: CPU runs at full frequency with everything turned on
Sleep: CPU clock stops with memories and peripherals turned on
Low-power active: CPU runs at low (8 MHz) frequency with PLL, oscillators, and flash turned off
Low-power sleep: CPU clock stops with PLL, oscillators, and flash turned off, and system runs at low frequency (8 MHz)
DeepSleep: CPU, SRAM, and high-speed peripherals are in retention and a subset of functions operate
using a 32.768-kHz internal low-speed oscillator
Hibernate: Lowest power mode with no memory or logic retention
Active DeepSleep Hibernate
CPU On Sleep Off
Flash On Off Off
System RAM On Retention Off
Peripheral On Retention Off
Port On On/Freeze Freeze
Real time clock (RTC) On On (option) On (option)
Wake-up event — Interrupt/port input Reset
Power consumption CYT2BL 127 mA (Cortex-M4,160 MHz maximum)
35 µA (typical)
64KB SRAM (retained)
5 µA (typical)
Power consumption CYT4BF 287 mA (Dual Core Cortex-M7, 350 MHz max) 50 µA (typical)
64KB SRAM (retained)
8 µA (typical)
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Traveo T2G = DeepSleep mode
› Legacy
– CPU restarts when interrupt is asserted during low-power mode
› TRAVEO™ T2G
– Resume code execution when event is generated during DeepSleep mode
Power off Reset Run Shutdown Reset Run
Interrupt
Power
On
Enter Low Power mode
Power off Reset Run DeepSleep Run
Event
Power
on
Enter low power mode
The MCU supports event wakeup from
DeepSleep mode without reset. The density
for SRAM retained during DeepSleep mode is
software-configurable with every 32KB.
32KB
32KB
32KB
…
Necessary registers (e.g., configurations)
are retained in retention flip-flops, but
others (e.g., data) are powered off during
DeepSleep mode.
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
› Infineon provides the following support for enabling safe applications with TRAVEO™ T2G
› These documents help to achieve functional safety at the system level
› Requirements have been derived to detect potential failure modes and to achieve the hardware
architectural metrics for ASIL-B
Functional Safety with TRAVEO™ T2G
HW safety
manual
FMEDAs
for individual
TRAVEO™
T2G products
SW products
including safety
documentation
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Extra-vehicle/in-vehicle network
CAN-FD
Ethernet
Gateway HVAC system
Dual bank flash
for storing both
the updated
image and
rollback image
with read while
write operation
Autosar SecOC3
1 HTTPS: Hypertext transfer protocol secure
2 TLS: Transport layer security
3 SecOC: Secure onboard communication
External memory
interface for storing
update image
HSM for OTA client,
secure communication,
and authentication of
the updated image
Firmware Over-the-Air (FOTA) Update
HTTPS1/TLS2
Body control module
HSM for secure
communication
and flash loader
Secure high-speed
bulk data transfer
TRAVEO™ T2G HSM protects FOTA and assures authenticity
TRAVEO™
T2G family
TRAVEO™ T2G
family
TRAVEO™
T2G family
TRAVEO™ T2G
family
TRAVEO™
T2G family
TRAVEO™ T2G
family
FOTA Server In Vehicle
Update
Image
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Firmware over-the-air (FOTA) update with TRAVEO™ T2G
› True FOTA support means:
– Update of the software image in the background
– No interruption of service
– Not recognized by the user
– Roll-back in case of failure
› True FOTA requires:
– Dual-bank memory support
– Read-while-write memory, allowing execution of software
(read) while programming (write)
– HSM-level security
Cortex®-M4/M7
CPU
TRAVEO™ T2G
Crypto
Cortex®-M0+
RWW flash
Bank #2
RWW flash
Bank #1
Ethernet
CAN FD
restricted
TRAVEO™ T2G Applications & Examples
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
TRAVEO™ T2G Body Gateway/HVAC: CAN and LIN based e-drives
U-chip solution Fully integrated solution
E-drive type Motor System IC + Microcontroller MOTIX MCU/ e-Power
LIN based e-drive TLE9564QX + CYT2B6 (TVII-B-E-512)
TLE9893QKW62S (Grade 1 version) with external LIN
TLE9891QTA61 (64 pin version) with external LIN
CAN based e-drive TLE9563-3QX + CYT2B7 (TVII-B-E-1M) No e-power in 1MB Flash size available
A B
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
› Traveo II TVII-B-E-1M series
(CYT2B7 – 176 LQFP)
› TCPWM
– Operation in PWM mode
– Counter clock: 80/13 MHz
– PWM period: 39 µs
› 120-degree rotation control
using 3 HALL ICs
– U-phase
– V-phase
– W-phase
› 3 high signals output a PWM
TRAVEO™ T2G Body: Motor Control Application
28
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
TRAVEO™ T2G + Infineon Gen7L use case: HVAC
12,3“ 1920x720
Touch Display
Automotive
CYAT817L
CapSense
Buttons
Wakeup
Button
Glove Support Water Rejection
Gesture
Temperature
sensing
Voltage
sensing
TCPWM
I2C/SPI
I2C/SPI
OR
ADC
ADC
Day night sensor
(Advanced)
I2C
Day night sensor
(Entry)
ADC
OR
LED
backlight
LED
backlight
Backlight
Control IC
FPD/LVDS
Transceive
r
(up to 4)
Ethernet AVB
CAN FD LIN
PHY
Transceiv
er
TRAVEO™ II
TVII-C-2D-6M
TRAVEO™ II family
TRAVEO™ T2G
CYT4DN
TRAVEO™ II family
HYPERRAM™
TRAVEO™ II family
SEMPER™
NOR Flash
TRAVEO™ II family
Automotive
CYAT817L
29
TRAVEO™ T2G = IDE, Software & Ecosystem
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
ModusToolbox™ Eclipse IDE + FreeRTOS support available
LINK: https://www.infineon.com/cms/en/design-support/tools/sdk/modustoolbox-software/
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
Ecosystem Partners for Software Tools
Vendor SW tool Compiler Programmer Debugger
ETM trace
via SWD/JTAG1)
Trace via TPIU
(4 pins)
Debugger I/F
IAR IAR embedded
workbench
Yes I-jet No SWD/JTAG
IAR IAR embedded
workbench
Yes I-jet trace SWD/JTAG/TPIU
Lauterbach PowerView No2 µTrace SWD/JTAG/TPIU
Lauterbach PowerView No2 PowerDebug USB 3 + Cortex®-M debug cable combined with
CombiProbe
SWD/JTAG/TPIU
Lauterbach PowerView No2 PowerDebug Pro + Cortex®-M debug cable combined with
CombiProbe
SWD/JTAG/TPIU
Green Hills Software Multi Yes Green Hills Probe No SWD/JTAG
Green Hills Software Multi Yes Green Hills SuperTrace Probe SWD/JTAG/TPIU
iSYSTEM WinIDEA No2 iC5000 SWD/JTAG/TPIU
iSYSTEM WinIDEA No2 iC5700 SWD/JTAG/TPIU
Dts Insight microVIEW-PLUS Arm DS
MDK-ARM
adviceXross
NETIMPRES
adviceXross SWD/JTAG/TPIU
Tasking VX-toolset Yes Yes SWD/JTAG
Infineon ModusToolbox™ Yes Yes SWD/JTAG
1 Check with the tool vendor for the exact trace support feature and the latest status of handling of Traveo T2G MCUs
2 Vendor does not offer own compiler
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
› Software products
– AUTOSAR version 4.2.2 compliant (ASIL-B)
– MCAL1: MCU2, ADC3, ICU4, GPT5, PWM6, WDG7, OCU8, CAN9, LIN10, SPI11, FLS12, DIO13, and PORT
– STL (Self-test libraries): core test, flash test, and RAM test
– FEE (EEPROM emulation)
– Complex device drivers for I2C, UART, program flash
– Multi-Core extension for MCAL, offering ASR 4.4 type II multi-core support for selected modules
– Graphics software:
– Graphics driver, JPEG driver, safety signature driver, “ResourceGenerator.exe”
– TRAVEO™ T2G tool suite (warping calibrator), dynamic warping library
– SDL (sample driver library)
– AutoFlashUtility
› Software services/customization
– Infineon SW teams have leading expertise in the fields: AUTOSAR, graphics, functional safety, and security
– Customized SW modules available upon request
TRAVEO™ T2G Automotive Software Offering
1 MCAL: Microcontroller abstraction layer
2 MCU: MicroController
3 ADC: Analog digital converter
4 ICU: Input capture unit
5 GPT: General purpose timer
6 PWM: Pulse width modulation
7 WDG: Watchdog
8 OCU: Output capture unit
9 CAN: Controller area network
10 LIN: Local interconnected network
11 SPI: Serial peripheral interface
12 FLS: flash
13 DIO: Digital input/output
restricted
TRAVEO™ T2G Evaluation Kits
34
Copyright © Infineon Technologies AG 2021. All rights reserved.
restricted
2021-02-08
Infineon new Kits ecosystem – Key enabler for outstanding customer
experience!
New Lite Kits
35
Copyright © Infineon Technologies AG 2021. All rights reserved.
restricted
2021-02-08
Infineon new Kits ecosystem – Key enabler for outstanding customer
experience! New Lite Kit for Traveo – July 2023
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
TRAVEO™ T2G Kits Available !
Produced with HITEX, the following boards are now available to be purchased online
The CYTVII-B-E-BB is a generic base board that can be
connected to compatible Traveo™ II body-entry or body-
high evaluation boards so as to extend its functionality.
CYTVII-B-H-8M-320-CPU
CYTVII-B-E-BB
The CYTVII-B-H-8M-320-CPU evaluation board
is based on the Traveo™ II body high family of
devices.
CYTVII-B-E-176-SO
The CYTVII-B-E-176-SO evaluation board is based on
the Traveo™ II body entry family of devices.
CYTVII-B-E-1M-SK
The CYTVII-B-E-1M-SK is a low-cost easy to use
evaluation board based on the Traveo™ II body entry
family of devices.
CYTVII-B-H-176-SO
The CYTVII-B-H-176-SO, a 176-pin, socketed
evaluation board is based on the Traveo™ II body
high family, it helps develop and test functionalities
CYTVII-B-H-4M-176-CPU
The CYTVII-B-H-4M-176-CPU, a 176-pin
evaluation board is based on the Traveo™ II body
high family, it helps develop and test functionalities
CYTVII-B-E-100-SO
The CYTVII-B-E-100-SO, a 100-pin, socketed
evaluation board is based on the Traveo™ II body
entry family of devices.
Low
Cost
kit
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
TRAVEO™ Family
Long Term Technology Availability
32 Bit TRAVEO™ Family
◼ For Technology availability of TVII-B, C is ensured for a minimum of 15 years production starting from first product
qualification (series production)
◼ Extended product availability beyond silicon series production may be available based on after series supply concepts
Product Technology Wafer Fab Location 2014 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
TVI 55nm USJC Japan
TVI 40nm UMC Singapore
TVII-B-E 40nm UMC Singapore
TVII-B-H 40nm UMC Singapore
TVII-C 40nm UMC Singapore
Information presented reflects current planning status and is subject to potential future change.
Before any project decision always ensure that indicated dates reflect latest IFX planning status.
15 years
Qualification successfully completed/mass production
No new designs recommended
No prognosis from today`s perspective possible, depending on volume
Extension possible until specific commercial boundary conditions – pls contact your Infineon sales
Copyright © Infineon Technologies AG 2023. All rights reserved.
restricted
2023-03-03
myInfineon Collaboration Platform for TRAVEO™ T2G
Access to additional technical
documentation:
By registering in the myInfineon
collaboration platform (MyICP), you can
get access to add-on technical
documentation, trainings, tools, and much
more for all TRAVEO™ T2G devices.
How to get access:
If not already available, please create a myInfineon account on
www.infineon.com. Please contact traveo@infineon.com and
request access to TRAVEOTM T2G myICP.
Link to TRAVEOTM T2G MyICP:
https://myicp.infineon.com/sites/TRAVEODocumentation/Lists/d
efaultdoclib/Forms/AllItems.aspx
Supporting Information
https://www.infineon.com/cms/en/product/microcontroller/32-bit-traveo-ii-
automotive-microcontroller-based-on-arm/#!trainings
https://www.infineon.com/cms/en/product/microcontroller/32-bit-traveo-ii-
automotive-microcontroller-based-on-arm/
www.Infineon.com/makers
eLearning
Check out these Links for more Information!
For Further information
Marketing: Marcelo.Williams@Infineon.com
39
2020-09-23 Copyright © Infineon Technologies AG 2020. All rights reserved.
002-28416 *O

Webinar: Microcontroladores Infineon TRAVEO T2G

  • 1.
  • 3.
    1 Traveo™ T2G Microcontrollers ForIndustrial & Automotive Solutions Marcelo Williams Silva Global Product Marketing Director & Business Development for Automotive and Industrial
  • 4.
    Infineon offers aunique portfolio that links the real and the digital world: “One-Stop-Shop” concept Real-world applications Digitale Welt Battery-powered devices Consumer IoT 5G Power supplies Drives Industrial IoT Connectivity Automotive Sense: sensors Compute: microcontrollers, memories Actuate: power semiconductors Connectivity: Wi-Fi, Bluetooth, USB Coin cell-powered devices Smart Home Information and data about the real world Value addition and optimized use of resources Software Ecosystem Digital world 2 2023-42-18 Copyright © Infineon Technologies AG 2023. All rights reserved.
  • 5.
    3 Copyright © InfineonTechnologies AG 2022. All rights reserved. restricted 2023-04-20 Infineon’s top market position is built on system competence based on an industry-leading product portfolio › Total market grew by 27.4% y-y, reaching all-time-high of $59.4bn; market growth clearly supported by content-per-car growth › Infineon #1 in power semiconductors due to high exposure in xEV › Outstanding success of AURIX™ microcontroller family propelled Infineon to #2 position in MCUs › Undisputed #1 in automotive NOR Flash memory ICs 12.4% 11.6% 8.8% 8.3% 7.9% Infineon NXP STMicro Texas Instr. Renesas Automotive semiconductors (2022 total market: $59,425m; +27.4% y-y) 21.1% 13.2% 11.9% 8.8% 8.4% Bosch onsemi Infineon ADI Melexis Sensors 7.5% 8.8% 23.1% 23.7% 27.3% Microchip STMicro NXP Infineon Renesas MCUs Power semiconductors 5.5% 8.4% 11.2% 20.3% 31.9% Rohm onsemi Texas Instr. STMicro Infineon Source: TechInsights (formerly Strategy Analytics): Automotive Semiconductor Vendor Market Shares 2022. April 2023
  • 6.
  • 7.
    Copyright © InfineonTechnologies AG 2021. All rights reserved. 2021-02-08 8-bit/SoC 32-bit Arm® Cortex®- M0/M0+ 32-bit Arm® Cortex®-M3 32-bit Arm® Cortex®-M4 32-bit Arm® Cortex®-M7 32-bit TriCore™ IFX Microcontrollers portfolio & roadmap Automotive Industrial Consumer PSoC™ 6 PSoC™ 4 PSoC™ 5 PSoC™ 3 PSoC™ 1 FM0+™ FM3+™ FM4+™ XMC1000™ XMC4000™ XMC7000™ Auto PSoC™ Cortex M0+ ASIL-B Up to 384kB Flash CapSense / Magsense MOTIX™ Cortex M0/M3 ASIL-B Up to 256kB Flash Motor Control SoC TRAVEO T2G™ Dual Cortex M4 / M7 ASIL-B Up to 16MB Flash HSM, GPU (Cluster) and Graphic capabilities AURIX™ TC2x Up to 3x Tricore ASIL-D Up to 8MB Flash HSM,ETH,Lockstep,CAN FD AURIX™ TC3x Up to 6x Tricore ASIL-D Up to 16MB Flash HSM,GETH,Lockstep,CAN FD • CPU up to 48MHz and 64KB Flash • Math co-processor • CPU up to 144 MHz and 2MB Flash • Dual Cortex®-M7 and M0+ up to 350 MHz and 8MB Flash • CPU up to 40MHz and 128KB Flash • Entry level USB • CPU up to 144MHz and 1MB Flash • Basic Motor Control • CPU up to 200MHz and 2MB Flash • High Performance Motor Control • CPU up to 24Mhz and 32KB Flash • CAPSENSE™ and application specific mixed signal functionality • CPU up to 67 MHz and 64 KB Flash • High performance analog • Programmable logic integration • CPU up to 48MHz and 384KB Flash • Industry leading CAPSENSE™ and mixed signal functionality • CPU up to 80MHz and 256KB Flash • High-precision analog • Programmable logic integration • Dual Cortex®-M4 and M0+, up to 150 MHz and 2MB Flash • Ultra-low-power with hardware based security PSoC Multitouch™ MCU integrated Touch Controller SoC Touchscreen, Slider, Touchpad Wet-finger tracking PSoC Fingerprint™ MCU integrated Touch Controller SoC Capacitive fingerprint solution Support multi surface usage solution Auto PSoC HV™ Cortex M0+ ASIL-B Up to 384kB Flash Up to 42V tolerant MCU AURIX™ TC4x Up to 6x Tricore ASIL-D Up to 24MB Flash PPU,CSRM,Lockstep,PCIe,RE
  • 8.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 ADAS New E/E Smart Sensors Body & Connectivity Chassis & Safety Powertrain & xEV Driver Information & HMI AURIX™ TC3x AURIX™, TRAVEO™ T2G & Auto PSoCTM Family – Successfully Covering the Entire Range of Automotive Applications AURIX™ TC4x AUTO PSoC™ AURIX™ TC3x › Up to 6x Tricore™ 1.6 300MHz › ISO26262 ASIL-D › Up to 16MB Flash, › HSM, GETH › AEC-Q100 Grade 0 (Ta 150°C) AURIX™ Next Gen AUTO PSoC™ AURIX™ TC4x Next Generation MCU Architecture TRAVEO™ Next Gen › Up to 6x Tricore™ 1.8 500MHz › ISO26262 ASIL-D › Up to 21MB Flash, › PPU, CSRM, Routing engine › AEC-Q100 Grade 0 (Ta 150°C) TRAVEO™ T2G › Arm® Cortex™ M4 / M7 based › ISO26262 ASIL-B › Low Power › Up to 16MB flash, HSM › GPU TVII-C (Cluster) › AEC-Q100 Grade 1 (Ta 125°C) AUTO PSoCTM › Arm® Cortex™ M0+ & M23 lockstep based Architecture › ISO26262 ASIL-B , C &D › Low Power › CapSense®, MagSense™ & Multi-sense Converter › AEC-Q100 Grade 1 (Ta 125°C)
  • 9.
    Customer MCU decisionflow Aurix™ vs. Traveo™ II and PSoC™ Safety Requirement ASILC/D/SIL-3 Yes No Customer Need AURIX Traveo Body No Yes Yes Internal Memory requirements: Performance >2x350MHz Flash >8MB SRAM: >1.5MB Ta>125°C Need for low power Scalability to the low end at 0.5MB Flash Traveo Cluster Need for Graphic GPU, LP DDR IF Yes Internal Memory requirements: Flash <512KB No Auto PSoC Yes No 7 2021-02-23 Copyright © Infineon Technologies AG 2023. All rights reserved.
  • 10.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G: Scalability and Low Power for Body and Connectivity Body ▪ Scalability performance, memores and packages for many body applications ▪ Low standby current with fast wakeup ▪ Security with FOTA and secure boot ▪ Functional safety up to ASIL-B Connectivity ▪ Multi high-speed communication interfaces ▪ High performance with low standby current ▪ Functional safety up to ASIL-B Body & Connectivity requirements …and our Automotive microcontroller offering Connectivity ✓ Rich connectivity interfaces with 10/100/1000 Mbps Ethernet, Flexray, CAN FD, LIN and CXPI ✓ DeepSleep accomplishes 50uA in CYT4B series with high frequency at 350MHz of dual Cortex-M7. ✓ Meets ISO26262 ASIL B design Body ✓ Scalability performance from a single Cortex-M4 right up to dual Cortex-M7. ✓ Multiple variants for packages from 64-pins to 320-balls and flash memories from 512kB to 16MB. ✓ DeepSleep accomplishes 35uA in CYT2B series ✓ Selectable Enhanced Secure Hardware Extension (eSHE) or Hardware Security Module (HSM) with fast wakeup. ✓ Switchable single bank or dual bank mode in flash memory ✓ Meets ISO26262 ASIL B design CYT4BF 2x 350MHz 8MB CYT4BB 2x 250MHz 4MB CYT3BB 1x 250MHz 4MB Body control module PEPS/key/ID TPMS sensor (Valve/tier Mounted) LED lighting and AFS control unit CYT2BL 1x/ 160MHz 4MB CYT2B7 1x 160MHz 1MB CYT2B6 1x 80MHz 512kB CYT2B9 1x 160MHz 2MB Seat control unit CYT6BJ 4x 320MHz 16MB Window/door control unit HVAC system Immobilizer DC/DC converter Engine start/stop button
  • 11.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G: Single Chip Solutions for Instrument Cluster and HUD Cluster ▪ Scalability from Dot-Matrix to Hybrid and Virtual clusters ▪ Digtal/analog video-in/out for high resoluton image and low cost display interface ▪ Mixing sounds for turn, hazard, back warning and other and stepper motor for needle control ▪ Multi communication interfaces with security HUD / Video safety companion / eMirror ▪ Digtal/analog video in/out and laser driver for HUD including AR-HUD ▪ Image distortion on the window and critical image checking ▪ Video manipulation for HUD, safety companion and eMirror ▪ Safety support from graphics stream of 3D SoC Instrument cluster & HUD requirements …and our Automotive microcontroller offering Head-up display (HUD) / Video safety companion / eMirror ✓ Display controller enable multiple variants display interfaces ✓ Laser dirver to cover AR-HUD based on MEMS Laser Beam Scanner (LBS). ✓ Warping on-the-fly, warping library and calibration tool enable distortion correction ✓ Safety signature unit and driver to find error image for ISO 26262 compliance ✓ Safety overlays, image supervision and intro animation to be provided for ASIL-B as safety companion. Cluster ✓ Single chip solution from LCD to 720p an entry level virtual cluster with powerful 2.5D graphics engine and driver ✓ Line-based operation with on-the-fly for reduction of video RAM ✓ Display controller supports LVDS/RGB video-out and RGB/MIPI-CSI2 video-in for multiple variants display interfaces ✓ Mixer, Sound Generator, I2S/TDM, PCM-PWN and Audio DAC to provide minimize BOM cost. ✓ Selectable Enhanced Secure Hardware Extension (eSHE) or Hardware Security Module (HSM) with fast secure boot. CYT4DN 2x 320MHz 6M 2.5D GFX CYT3DL 1x 240MHz 4M 2.5D GFX CYT2CL 1x 160MHz 4M HVAC system Instrument cluster Digital mirrors Matrix LED headlights T2G-G-AM-4M 2x 320MHz 4M 2.5D GFX Laser driver CYT4DN 2x 320MHz 6M 2.5D GFX CYT3DL 1x 240MHz 4M 2.5D GFX CYT4EN 2x 320MHz 6M 2.5D GFX DDR Head-up display (HUD) CYT4EN 2x 320MHz 6M 2.5D GFX DDR
  • 12.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G Body CYT2B6 TVII-B-E-512K CYT2B7 TVII-B-E-1M CYT2B9 TVII-B-E-2M CYT2BL TVII-B-E-4M TRAVEO™ T2G Body Entry TRAVEO™ T2G Graphics CYT2CL TVII-C-E-4M TRAVEO™ T2G Cluster CYT3DL TVII-C-2D- 4M CYT4DN TVII-C-2D- 6M CYT4EN TVII-C-2D- 6M-DDR TRAVEO™ T2G Graphics Features Performance TRAVEO™ T2G Cluster and Graphics ✓ Up to 6MB Flash and 896KB RAM ✓ Up to dual M7 @350Mhz with 2.5D GFX and 720p Graphics Support ✓ Video input and output ✓ JPEG Decoder ✓ HYPERBUS™ TRAVEO™ T2G Body Entry ✓ Up to 4MB Flash and 512KB RAM ✓ M4 @(up to)160MHz ✓ 64 – 176 pins LQFP TRAVEO™ T2G Features › ARM® Cortex® Based › Low Power › CAN FD and 1Gb Ethernet › Cortex® M0+ for HSM › EVITA Full › True FOTA › ISO 26262 up to ASIL B › Compliant up to AEC- Q100 grade 1 (Ta 125°C) › AUTOSAR-compliant MCAL drivers available TRAVEO™ T2G – Body Electronics and a Better User Experience CYT3BB CYT4BB TVII-B-H-4M CYT4BF TVII-B-H-8M TRAVEO™ T2G Body High CYT6BJ TVII-B-H-16M TRAVEO™ T2G Body High ✓ Up to 16MB Flash and 2048KB RAM ✓ Up to Quad M7 @320MHz ✓ 100 – LQFP to 320 – BGA ✓ eMMC interface
  • 13.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Full portfolio Scalability from Auto PSoCTM to TRAVEO™ T2G !
  • 14.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Performance TRAVEO™ T2G Body MCU Family Product Portfolio Extension Availability Status Official Production Sampling Development Concept 1 Maximum operating frequency 2 Hardware security module, SHE-only mode available 3 Clock eXtension peripheral interface 4 Package pin count 5 Single or dual core option 6 Time division multiplexing 7 Fine pitch ball grid array 8 Optional feature 9 Dual core option (TEQFP 176 only) QQYY QQYY Body/Gateway/Infotainment TRAVEO™ T2G entry MCU TRAVEO™ T2G high MCU Peripherals based on Infineon MXS40 platform CYT3BB/CYT4BB TVII-B-H-4M 2x Cortex®-M75, 250 MHz1, ASIL-B, HSM, 4MB flash, 768KB RAM, eMMC, ethernet, I2S/TDM6 100-176-pins4 TEQFP, 272-ball BGA7 CYT2B7 TVII-B-E-1M Cortex® -M4, 160 MHz1 , ASIL-B, HSM2 , 1MB flash, 128KB RAM 64–176 pins4 LQFP CYT2B9 TVII-B-E-2M Cortex® -M4, 160 MHz1 , ASIL-B, HSM2 , CXPI3 2MB flash, 256KB RAM, 64–176 pins4 LQFP CYT4BF TVII-B-H-8M 2x Cortex®-M7, 350 MHz1, ASIL-B, HSM, 8MB flash, 1024KB RAM, eMMC, ethernet, FlexRay8, I2S/TDM6 176-pins4 TEQFP, 272-ball BGA7, 320-ball BGA CYT2B6 TVII-B-E-512K Cortex® -M4, 80 MHz1 , ASIL-B, HSM2 , 512KB flash, 64KB RAM 64-100 pins4 LQFP NOW NOW NOW CYT2BL TVII-B-E-4M Cortex® -M4,160 MHz1 , ASIL-B, HSM2 , CXPI3 4MB flash, 512KB RAM 64–176 pins4 LQFP NOW CYT6BJ TVII-B-H-16M 4x Cortex®-M79, 320 MHz1, ASIL-B, HSM, 16MB flash, 2048KB RAM, eMMC, ethernet, FlexRay8, I2S/TDM6 176-pins4 TEQFP, 272-ball BGA7, 320-ball BGA Q124 NOW NOW Memory
  • 15.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G Body Scalable Portfolio Family CYT2B9 CYT2BL CYT3BB CYT4BB CYT4BF Flash Memory Size 4MB 4MB 4MB 16MB LQFP/TEQFP BGA 64 80 100 144 272 320 Entry High-End Legend: RAM 768KB Pin count 64KB 176 CYT2B6 CYT2B7 CYT6BJ* 512KB 2MB 1MB 8MB 128KB 256KB 512KB 1024KB 2048KB * Qualified Samples in Q1 2024 and Production in Q1 2025 Applications
  • 16.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 CYT2BL Series (TVII-B-E-4M) CYT2BL000 Body control module (BCM), HVAC, Lighting, and Gateway Applications › 32-bit MCU core systems – 160-MHz Arm® Cortex®-M4 Single core with FPU – 4MB code flash, 128KB work flash, and 512KB SRAM and Cortex®-M0+ for crypto › 2.7-V to 5.5-V supply voltages › Interfaces – Up to 8-ch CAN FD, up to 8-ch SCB, up to 12-ch LIN-UART, and up to 4-ch CXPI › AD converter – 3 SAR ADCs with up to 67 external channels (64 I/Os + 3 I/Os for motor control) › Timers – Up to 12 16-bit channels for Motor Control, 63 16-bit channels timer/counter/pulse- width modulation (TCPWM), and 8-ch 32-bit TCPWM – Up to 11 Event Generation timers › Packages – 64-pin LQFP, 80-pin LQFP, 100-pin LQFP, 144-pin LQFP, 176-pin LQFP Datasheet: CYT2BL series Collateral Availability Peripheral System control Core block Regulators PLL/FLL RC Oscillators LVD/BOD Power mode management Real-time clock WDT/CSV Reset Event generation timer Boot ROM Code flash SWD/JTAG/ Trace PPU Work flash SRAM Crypto DMA Cortex®-M0+ MPU eFuse IRQ/NMI 8-ch SCB SPI/I2C/UART 8-ch CAN FD GPIO Smart I/O 16-bit TCPWM 12-ch LIN-UART 64-ch 12-bit ADC 3 SAR ADC 32-bit TCPWM 16-bit motor TCPWM 4-ch CXPI Controller Cortex®-M4 (Single) FPU Sampling: Now Production: Now Features TRAVEO™ T2G Body MCU Family SUPER SET M4
  • 17.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 CYT4BF Series (TVII-B-H-8M) System control Core block Peripheral PLL/FLL RC Oscillators LVD/BOD Power mode management Real-time clock Regulators WDT/CSV Reset Event generation timer Cortex®- M7 (Dual) FPU Boot ROM Code flash SWD/JTAG/ Trace PPU Work flash SRAM Crypto DMA Cortex®-M0+ MPU D-Cache I-Cache IRQ/NMI 11-ch SCB SPI/I2C/UART 10-ch CAN FD eMMC eFuse GPIO Smart I/O 16-bit TCPWM 20-ch LIN-UART 96-ch 12-bit ADC 3 SAR ADC 32-bit TCPWM SMIF Ethernet FlexRay 16-bit motor TCPWM I2S/TDM CYT4BF000 Body Control Module (BCM), Gateway, and Infotainment Applications › 32-bit MCU core systems – 350-MHz Arm® Cortex®-M7 Dual with single/double FPU, I/D-Cache – 8MB code flash, 256KB work flash, 1024KB SRAM, and Cortex®-M0+ for crypto › 2.7-V to 5.5-V supply voltages › Interfaces – Up to 10-ch CAN FD, up to 11-ch SCB, and 20-ch LIN-UART – eMMC, SMIF (QSPI/HS-SPI), up to 2-ch 10/100/1000-Mbps Ethernet and FlexRay – I2S/TDM with Tx 3ch and Rx 3ch › AD converter – 3 SAR ADCs with up to 99 external channels (96 I/Os + 3 I/Os for motor control) › Timers – Up to 15 16-bit channels for Motor Control, 87 16-bit channels timer/counter/pulse- width modulation (TCPWM), and 16-ch 32-bit TCPWM – Up to16 Event Generation timers › High-speed I/O supported in BGA – Operating voltage required: 2.7 V to 3.6 V › Packages – 176-pin TEQFP, 272-ball BGA, 320-ball BGA Datasheet: CYT4BF series Collateral Sampling: Now Production: Now Availability Features TRAVEO™ T2G Body MCU Family SUPER SET M7
  • 18.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 CYT6BJ Series (TVII-B-H-16M) System control Core block Peripheral PLL/FLL RC Oscillators LVD/BOD Power mode management Real-time clock Regulators WDT/CSV Reset Event generation timer Cortex®- M7 (Quad) FPU Boot ROM Code flash SWD/JTAG/ Trace PPU Work flash SRAM Crypto DMA Cortex®-M0+ MPU D-Cache I-Cache IRQ/NMI 11-ch SCB SPI/I2C/UART 10-ch CAN FD eMMC eFuse GPIO Smart I/O 16-bit TCPWM 20-ch LIN-UART 96-ch 12-bit ADC 3 SAR ADC 32-bit TCPWM SMIF Ethernet FlexRay 16-bit motor TCPWM I2S/TDM CYT6BJ000 Body Control Module (BCM), Gateway, and Infotainment Applications › 32-bit MCU core systems – 320-MHz Arm® Cortex®-M7 Quad core with single/double/quad FPU, I/D-Cache – 16MB code flash, 512KB work flash, 2048KB SRAM, and Cortex®-M0+ for crypto › 2.7-V to 5.5-V supply voltages › Interfaces – Up to 10-ch CAN FD, up to 11-ch SCB, and 20-ch LIN-UART – eMMC, SMIF (QSPI/HS-SPI), up to 2-ch 10/100/1000-Mbit Ethernet and FlexRay – I2S/TDM with Tx 3ch and Rx 3ch › AD converter – 3 SAR ADCs with up to 99 external channels (96 I/Os + 3 I/Os for motor control) › Timers – Up to 15 16-bit channels for Motor Control, 87 16-bit channels timer/counter/pulse- width modulation (TCPWM), and 16-ch 32-bit TCPWM – Up to16 Event Generation timers › High-speed I/O supported in BGA – Operating voltage required: 2.7 V to 3.6 V › Packages – 176-pin TEQFP, 272-ball BGA, 320-ball BGA Datasheet MYICP (BODY) (NDA) Collateral Sampling: Q1 2024 Production: Q1 2025 Availability Features TRAVEO™ T2G Body MCU Family NEW
  • 19.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G Body MCU Marketing Part Number Decoder CY T X X X X B X Code Package type AE TEQFP AZ LQFP BZ BGA Q Qualified samples A X XX X GS 0 CY T X X X X B X A E S Quality grade: ES – engineering samples S = -40°C to +105°C E = -40°C to +125°C B = Body 2 = Single core M4 3 = Single core M7 4 = Dual core M7 6 = Quad core TRAVEO™ T2G CYPRESS™ Revision Fab location, Q = UMC T=Tape & Reel Reserved Density for cFlash/wFlash/RAM 6 512KB/64KB/64KB (CYT2B6) 7 1MB/96KB/128KB (CYT2B7) 9 2MB/128KB/256KB (CYT2B9) B 4MB/256KB/768KB (CYT3BB/4BB) L 4MB/128KB/512KB (CYT2BL) F 8MB/256KB/1024KB (CYT4BF) J 16MB/512KB/2048KB (CYT6BJ) Package 3 64 pins 4 80 pins 5 100 pins 7 144 pins 8 176 pins B 272 balls C 320 balls H 144 pins, 0.4 mm pitch Hardware option Ethernet FlexRay eMMC A off off off B 1ch off off C 1ch on off D 1ch on on E 1ch off on F 2ch off off G 2ch on off H 2ch on on J 2ch off on B = eSHE* C = HSM * eSHE only supported with T2G Body
  • 20.
    restricted Traveo T2G™ =Technical Updates
  • 21.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Low power Scalability Performance Graphics Audio Connectivity Security Safety Updatability 4 5 6 1 2 3 2 5 Low power › Energy-efficient processing power › Higher voltage supply 2.7 – 5.5V Scalability › Complete portfolio › Memory density › Package lineup › Performance Performance › Single Arm® Cortex®-M4 › Dual Arm® Cortex®-M7 › Quad Arm® Cortex®-M7 › Up to 2700 DMIPS Connectivity › 8Mb CAN FD › 1Gb ethernet Security › Hardware security module › Evita full › Arm® Cortex®-M0+ core Safety › ISO 26262 ASIL-B Updatability › True FOTA1 with RWW2 flash dual bank › eMMC3 › QSPI/HS-SPI Graphics / Audio (T2G Cluster) › 3x Performance of TRAVEO™ T1G Key Features (T2G Body) 8 7 6 1 2 3 4 5 TRAVEO™ T2G family 1 FOTA: Firmware update over the air 2 RWW: Read while write 3 Embedded multi media card
  • 22.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Traveo T2G = Power Mode Characteristics › TRAVEO™ T2G supports six power modes Active: CPU runs at full frequency with everything turned on Sleep: CPU clock stops with memories and peripherals turned on Low-power active: CPU runs at low (8 MHz) frequency with PLL, oscillators, and flash turned off Low-power sleep: CPU clock stops with PLL, oscillators, and flash turned off, and system runs at low frequency (8 MHz) DeepSleep: CPU, SRAM, and high-speed peripherals are in retention and a subset of functions operate using a 32.768-kHz internal low-speed oscillator Hibernate: Lowest power mode with no memory or logic retention Active DeepSleep Hibernate CPU On Sleep Off Flash On Off Off System RAM On Retention Off Peripheral On Retention Off Port On On/Freeze Freeze Real time clock (RTC) On On (option) On (option) Wake-up event — Interrupt/port input Reset Power consumption CYT2BL 127 mA (Cortex-M4,160 MHz maximum) 35 µA (typical) 64KB SRAM (retained) 5 µA (typical) Power consumption CYT4BF 287 mA (Dual Core Cortex-M7, 350 MHz max) 50 µA (typical) 64KB SRAM (retained) 8 µA (typical)
  • 23.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Traveo T2G = DeepSleep mode › Legacy – CPU restarts when interrupt is asserted during low-power mode › TRAVEO™ T2G – Resume code execution when event is generated during DeepSleep mode Power off Reset Run Shutdown Reset Run Interrupt Power On Enter Low Power mode Power off Reset Run DeepSleep Run Event Power on Enter low power mode The MCU supports event wakeup from DeepSleep mode without reset. The density for SRAM retained during DeepSleep mode is software-configurable with every 32KB. 32KB 32KB 32KB … Necessary registers (e.g., configurations) are retained in retention flip-flops, but others (e.g., data) are powered off during DeepSleep mode.
  • 24.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 › Infineon provides the following support for enabling safe applications with TRAVEO™ T2G › These documents help to achieve functional safety at the system level › Requirements have been derived to detect potential failure modes and to achieve the hardware architectural metrics for ASIL-B Functional Safety with TRAVEO™ T2G HW safety manual FMEDAs for individual TRAVEO™ T2G products SW products including safety documentation
  • 25.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Extra-vehicle/in-vehicle network CAN-FD Ethernet Gateway HVAC system Dual bank flash for storing both the updated image and rollback image with read while write operation Autosar SecOC3 1 HTTPS: Hypertext transfer protocol secure 2 TLS: Transport layer security 3 SecOC: Secure onboard communication External memory interface for storing update image HSM for OTA client, secure communication, and authentication of the updated image Firmware Over-the-Air (FOTA) Update HTTPS1/TLS2 Body control module HSM for secure communication and flash loader Secure high-speed bulk data transfer TRAVEO™ T2G HSM protects FOTA and assures authenticity TRAVEO™ T2G family TRAVEO™ T2G family TRAVEO™ T2G family TRAVEO™ T2G family TRAVEO™ T2G family TRAVEO™ T2G family FOTA Server In Vehicle Update Image
  • 26.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Firmware over-the-air (FOTA) update with TRAVEO™ T2G › True FOTA support means: – Update of the software image in the background – No interruption of service – Not recognized by the user – Roll-back in case of failure › True FOTA requires: – Dual-bank memory support – Read-while-write memory, allowing execution of software (read) while programming (write) – HSM-level security Cortex®-M4/M7 CPU TRAVEO™ T2G Crypto Cortex®-M0+ RWW flash Bank #2 RWW flash Bank #1 Ethernet CAN FD
  • 27.
  • 28.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G Body Gateway/HVAC: CAN and LIN based e-drives U-chip solution Fully integrated solution E-drive type Motor System IC + Microcontroller MOTIX MCU/ e-Power LIN based e-drive TLE9564QX + CYT2B6 (TVII-B-E-512) TLE9893QKW62S (Grade 1 version) with external LIN TLE9891QTA61 (64 pin version) with external LIN CAN based e-drive TLE9563-3QX + CYT2B7 (TVII-B-E-1M) No e-power in 1MB Flash size available A B
  • 29.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 › Traveo II TVII-B-E-1M series (CYT2B7 – 176 LQFP) › TCPWM – Operation in PWM mode – Counter clock: 80/13 MHz – PWM period: 39 µs › 120-degree rotation control using 3 HALL ICs – U-phase – V-phase – W-phase › 3 high signals output a PWM TRAVEO™ T2G Body: Motor Control Application
  • 30.
    28 Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted TRAVEO™ T2G + Infineon Gen7L use case: HVAC 12,3“ 1920x720 Touch Display Automotive CYAT817L CapSense Buttons Wakeup Button Glove Support Water Rejection Gesture Temperature sensing Voltage sensing TCPWM I2C/SPI I2C/SPI OR ADC ADC Day night sensor (Advanced) I2C Day night sensor (Entry) ADC OR LED backlight LED backlight Backlight Control IC FPD/LVDS Transceive r (up to 4) Ethernet AVB CAN FD LIN PHY Transceiv er TRAVEO™ II TVII-C-2D-6M TRAVEO™ II family TRAVEO™ T2G CYT4DN TRAVEO™ II family HYPERRAM™ TRAVEO™ II family SEMPER™ NOR Flash TRAVEO™ II family Automotive CYAT817L
  • 31.
    29 TRAVEO™ T2G =IDE, Software & Ecosystem
  • 32.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 ModusToolbox™ Eclipse IDE + FreeRTOS support available LINK: https://www.infineon.com/cms/en/design-support/tools/sdk/modustoolbox-software/
  • 33.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 Ecosystem Partners for Software Tools Vendor SW tool Compiler Programmer Debugger ETM trace via SWD/JTAG1) Trace via TPIU (4 pins) Debugger I/F IAR IAR embedded workbench Yes I-jet No SWD/JTAG IAR IAR embedded workbench Yes I-jet trace SWD/JTAG/TPIU Lauterbach PowerView No2 µTrace SWD/JTAG/TPIU Lauterbach PowerView No2 PowerDebug USB 3 + Cortex®-M debug cable combined with CombiProbe SWD/JTAG/TPIU Lauterbach PowerView No2 PowerDebug Pro + Cortex®-M debug cable combined with CombiProbe SWD/JTAG/TPIU Green Hills Software Multi Yes Green Hills Probe No SWD/JTAG Green Hills Software Multi Yes Green Hills SuperTrace Probe SWD/JTAG/TPIU iSYSTEM WinIDEA No2 iC5000 SWD/JTAG/TPIU iSYSTEM WinIDEA No2 iC5700 SWD/JTAG/TPIU Dts Insight microVIEW-PLUS Arm DS MDK-ARM adviceXross NETIMPRES adviceXross SWD/JTAG/TPIU Tasking VX-toolset Yes Yes SWD/JTAG Infineon ModusToolbox™ Yes Yes SWD/JTAG 1 Check with the tool vendor for the exact trace support feature and the latest status of handling of Traveo T2G MCUs 2 Vendor does not offer own compiler
  • 34.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 › Software products – AUTOSAR version 4.2.2 compliant (ASIL-B) – MCAL1: MCU2, ADC3, ICU4, GPT5, PWM6, WDG7, OCU8, CAN9, LIN10, SPI11, FLS12, DIO13, and PORT – STL (Self-test libraries): core test, flash test, and RAM test – FEE (EEPROM emulation) – Complex device drivers for I2C, UART, program flash – Multi-Core extension for MCAL, offering ASR 4.4 type II multi-core support for selected modules – Graphics software: – Graphics driver, JPEG driver, safety signature driver, “ResourceGenerator.exe” – TRAVEO™ T2G tool suite (warping calibrator), dynamic warping library – SDL (sample driver library) – AutoFlashUtility › Software services/customization – Infineon SW teams have leading expertise in the fields: AUTOSAR, graphics, functional safety, and security – Customized SW modules available upon request TRAVEO™ T2G Automotive Software Offering 1 MCAL: Microcontroller abstraction layer 2 MCU: MicroController 3 ADC: Analog digital converter 4 ICU: Input capture unit 5 GPT: General purpose timer 6 PWM: Pulse width modulation 7 WDG: Watchdog 8 OCU: Output capture unit 9 CAN: Controller area network 10 LIN: Local interconnected network 11 SPI: Serial peripheral interface 12 FLS: flash 13 DIO: Digital input/output
  • 35.
  • 36.
    34 Copyright © InfineonTechnologies AG 2021. All rights reserved. restricted 2021-02-08 Infineon new Kits ecosystem – Key enabler for outstanding customer experience! New Lite Kits
  • 37.
    35 Copyright © InfineonTechnologies AG 2021. All rights reserved. restricted 2021-02-08 Infineon new Kits ecosystem – Key enabler for outstanding customer experience! New Lite Kit for Traveo – July 2023
  • 38.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ T2G Kits Available ! Produced with HITEX, the following boards are now available to be purchased online The CYTVII-B-E-BB is a generic base board that can be connected to compatible Traveo™ II body-entry or body- high evaluation boards so as to extend its functionality. CYTVII-B-H-8M-320-CPU CYTVII-B-E-BB The CYTVII-B-H-8M-320-CPU evaluation board is based on the Traveo™ II body high family of devices. CYTVII-B-E-176-SO The CYTVII-B-E-176-SO evaluation board is based on the Traveo™ II body entry family of devices. CYTVII-B-E-1M-SK The CYTVII-B-E-1M-SK is a low-cost easy to use evaluation board based on the Traveo™ II body entry family of devices. CYTVII-B-H-176-SO The CYTVII-B-H-176-SO, a 176-pin, socketed evaluation board is based on the Traveo™ II body high family, it helps develop and test functionalities CYTVII-B-H-4M-176-CPU The CYTVII-B-H-4M-176-CPU, a 176-pin evaluation board is based on the Traveo™ II body high family, it helps develop and test functionalities CYTVII-B-E-100-SO The CYTVII-B-E-100-SO, a 100-pin, socketed evaluation board is based on the Traveo™ II body entry family of devices. Low Cost kit
  • 39.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 TRAVEO™ Family Long Term Technology Availability 32 Bit TRAVEO™ Family ◼ For Technology availability of TVII-B, C is ensured for a minimum of 15 years production starting from first product qualification (series production) ◼ Extended product availability beyond silicon series production may be available based on after series supply concepts Product Technology Wafer Fab Location 2014 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 TVI 55nm USJC Japan TVI 40nm UMC Singapore TVII-B-E 40nm UMC Singapore TVII-B-H 40nm UMC Singapore TVII-C 40nm UMC Singapore Information presented reflects current planning status and is subject to potential future change. Before any project decision always ensure that indicated dates reflect latest IFX planning status. 15 years Qualification successfully completed/mass production No new designs recommended No prognosis from today`s perspective possible, depending on volume Extension possible until specific commercial boundary conditions – pls contact your Infineon sales
  • 40.
    Copyright © InfineonTechnologies AG 2023. All rights reserved. restricted 2023-03-03 myInfineon Collaboration Platform for TRAVEO™ T2G Access to additional technical documentation: By registering in the myInfineon collaboration platform (MyICP), you can get access to add-on technical documentation, trainings, tools, and much more for all TRAVEO™ T2G devices. How to get access: If not already available, please create a myInfineon account on www.infineon.com. Please contact traveo@infineon.com and request access to TRAVEOTM T2G myICP. Link to TRAVEOTM T2G MyICP: https://myicp.infineon.com/sites/TRAVEODocumentation/Lists/d efaultdoclib/Forms/AllItems.aspx
  • 41.
  • 42.