Seminar on : Thermoelectric Cooling System
Presented By :Chetan M. Karale Guided By:Prof .K. G. Man
yar
Mauli College of Engineering and Technology ,Shegaon
SEMINAR TOPIC:
THERMOELECTRIC (TE)
COOLING SYSTEM
CONTENTS
• Introduction
• Literature review
• Basic principle
• Construction and Material
• Working
• Advantages
• Applications
• Conclusion
• References
INTRODUCTION
 A thermoelectric (TE) cooler , sometimes called a
thermoelectric module or peltier cooler , is a
semiconductor-based electronic component that
functions as a small heat pump.
 By applying low voltage DC power source to a TE
module, Heat will be moved through the module
from one side to other.
 One module face , therefore , will be cooled while
the opposite face simultaneously is heated.
LITERATURE REVIEW
Charles Peltier (1785-1845) He discovers peltier effect.
Thomas Johann 1821-1831 He discover Seeback effect
H.J Goldmid and R.W
Douglas
1954 He discover use of
semiconductor in
thermoelectric refrigeration.
L.Bell 2008 He recover waste heat with
thermoelectric system.
BASIC PRINCIPLES
 Peltier Effect- when a voltage or DC current is applied
to two dissimilar conductors, a circuit can be created that
allows for continuous heat transport between the
conductor’s junctions.
THERMOELECTRIC MATERIALS
 Copper are used to sandwich the
semiconductor.
 The most commonly used semiconductor for el
ectronics cooling applications is Bi2Te3 (b
ismuth and telluride).
 Ceramic substance.
CONSTRUCTION DIAGRAM
WORKING:
 In thermoelectric module two thin P and N doped bismuth-telluride
semiconductor material sandwiched between them.
 The N type material has an excess of electrons, while the P type
material has a deficit of electrons. One P and one N make up a couple.
 The electrons move from the P type material to the N type material and
jump to a higher energy state absorbing thermal energy (cold side).
 The electrons flow from the N type material to the P type material
electron dropping to a lower energy state and releasing energy as heat
to the heat sink (hot side).
THERMOELECTRIC PERFORMANCE
TE performance depends on the following factors:
 The temperature of the cold and hot sides.
 Thermal and electrical conductivities of the device’s ma
terials.
 Contact resistance between the TE device and heat so
urce/heat sink.
 Thermal resistance of the heat sink.
IMPROVING PERFORMANCE
 Method have been used to improve the
performance of TE coolers.
1. Multistage coolers.
MULTISTAGE MODULES
 Increasing the number of
stages increases the coefficient
of performance for a given cold
side temperature, as seen in the
figure on the right.
MULTISTAGE MODULES
 When the desired temperature differential between the cold
and hot side cannot be obtained with a single stage module,
or when the cold side temperature must be lower than a one
stage cooler will allow, a multistage module may need to be
applied.
 As the number of stages increases, the minimum cold side
temperature will decrease.
 Also, increasing the number of stages increases the
coefficient of performance for a given cold side
temperature.
ADVANTAGES
 No any compressor and refrigerant.
 Quick response of cooling.
 There is no contact of engine shaft to compressor.
 Less power consumption.
 Only use vehicle electric power with minimum voltage.
 Increases fuel economy by decreasing air conditioning loads.
 Cost-effective and efficient.
APPLICATIONS
 Military/Aerospace
Inertial Guidance Systems, Night Vision Equipment, Electronic Equipment Cooling, Cooled Personal
Garments, Portable Refrigerators.
 Consumer Products
Recreational Vehicle Refrigerators, Mobile Home Refrigerators, Portable Picnic Coolers, Wine and Beer K
eg Coolers.
 Laboratory and Scientific Equipment
Infrared Detectors, Integrated Circuit Coolers, Laboratory Cold Plates, Cold Chambers, Constant
Temperature Baths, Thermostat Calibrating Baths.
 Industrial Equpiments
C Computer Microprocessors, Microprocessors and PC's in Numerical Control and Robotics, Medical
Instruments, Hypothermia Blankets, Pharmaceutical Refrigerators .
CONCLUSION
Since Peltier cooling is not efficient comparatively and due to
its small size applications, it is not widely used. It found its
application only in electronics cooling etc. But, we have seen
that there is a huge scope of research in this field about
thermoelectric materials, its fabrication, heat sink design etc.
REFERENCE
1. H. Julian Goldsmid, Bismuth Telluride and Its Alloys as
Materials for Thermoelectric Generation, Materials 2014,
7, 2577-2592.
2. International Journal of Mechanical and Industrial
Technology ISSN 2348-7593 (Online) Vol. 4, Issue 1,
pp: (78-84), Month: April 2016 - September 2016,
Available at: www.researchpublish.com
THANK
YOU

Thermoelectic Cooling Module

  • 1.
    Seminar on :Thermoelectric Cooling System Presented By :Chetan M. Karale Guided By:Prof .K. G. Man yar Mauli College of Engineering and Technology ,Shegaon
  • 2.
  • 3.
    CONTENTS • Introduction • Literaturereview • Basic principle • Construction and Material • Working • Advantages • Applications • Conclusion • References
  • 4.
    INTRODUCTION  A thermoelectric(TE) cooler , sometimes called a thermoelectric module or peltier cooler , is a semiconductor-based electronic component that functions as a small heat pump.  By applying low voltage DC power source to a TE module, Heat will be moved through the module from one side to other.  One module face , therefore , will be cooled while the opposite face simultaneously is heated.
  • 5.
    LITERATURE REVIEW Charles Peltier(1785-1845) He discovers peltier effect. Thomas Johann 1821-1831 He discover Seeback effect H.J Goldmid and R.W Douglas 1954 He discover use of semiconductor in thermoelectric refrigeration. L.Bell 2008 He recover waste heat with thermoelectric system.
  • 6.
    BASIC PRINCIPLES  PeltierEffect- when a voltage or DC current is applied to two dissimilar conductors, a circuit can be created that allows for continuous heat transport between the conductor’s junctions.
  • 7.
    THERMOELECTRIC MATERIALS  Copperare used to sandwich the semiconductor.  The most commonly used semiconductor for el ectronics cooling applications is Bi2Te3 (b ismuth and telluride).  Ceramic substance.
  • 8.
  • 9.
    WORKING:  In thermoelectricmodule two thin P and N doped bismuth-telluride semiconductor material sandwiched between them.  The N type material has an excess of electrons, while the P type material has a deficit of electrons. One P and one N make up a couple.  The electrons move from the P type material to the N type material and jump to a higher energy state absorbing thermal energy (cold side).  The electrons flow from the N type material to the P type material electron dropping to a lower energy state and releasing energy as heat to the heat sink (hot side).
  • 10.
    THERMOELECTRIC PERFORMANCE TE performancedepends on the following factors:  The temperature of the cold and hot sides.  Thermal and electrical conductivities of the device’s ma terials.  Contact resistance between the TE device and heat so urce/heat sink.  Thermal resistance of the heat sink.
  • 11.
    IMPROVING PERFORMANCE  Methodhave been used to improve the performance of TE coolers. 1. Multistage coolers.
  • 12.
    MULTISTAGE MODULES  Increasingthe number of stages increases the coefficient of performance for a given cold side temperature, as seen in the figure on the right.
  • 13.
    MULTISTAGE MODULES  Whenthe desired temperature differential between the cold and hot side cannot be obtained with a single stage module, or when the cold side temperature must be lower than a one stage cooler will allow, a multistage module may need to be applied.  As the number of stages increases, the minimum cold side temperature will decrease.  Also, increasing the number of stages increases the coefficient of performance for a given cold side temperature.
  • 14.
    ADVANTAGES  No anycompressor and refrigerant.  Quick response of cooling.  There is no contact of engine shaft to compressor.  Less power consumption.  Only use vehicle electric power with minimum voltage.  Increases fuel economy by decreasing air conditioning loads.  Cost-effective and efficient.
  • 15.
    APPLICATIONS  Military/Aerospace Inertial GuidanceSystems, Night Vision Equipment, Electronic Equipment Cooling, Cooled Personal Garments, Portable Refrigerators.  Consumer Products Recreational Vehicle Refrigerators, Mobile Home Refrigerators, Portable Picnic Coolers, Wine and Beer K eg Coolers.  Laboratory and Scientific Equipment Infrared Detectors, Integrated Circuit Coolers, Laboratory Cold Plates, Cold Chambers, Constant Temperature Baths, Thermostat Calibrating Baths.  Industrial Equpiments C Computer Microprocessors, Microprocessors and PC's in Numerical Control and Robotics, Medical Instruments, Hypothermia Blankets, Pharmaceutical Refrigerators .
  • 16.
    CONCLUSION Since Peltier coolingis not efficient comparatively and due to its small size applications, it is not widely used. It found its application only in electronics cooling etc. But, we have seen that there is a huge scope of research in this field about thermoelectric materials, its fabrication, heat sink design etc.
  • 17.
    REFERENCE 1. H. JulianGoldsmid, Bismuth Telluride and Its Alloys as Materials for Thermoelectric Generation, Materials 2014, 7, 2577-2592. 2. International Journal of Mechanical and Industrial Technology ISSN 2348-7593 (Online) Vol. 4, Issue 1, pp: (78-84), Month: April 2016 - September 2016, Available at: www.researchpublish.com
  • 18.