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TECHNICAL DATA SHEET
VD Chemicals
VD-2001G
Solder Paste, Low Residue, No-Clean
DESCRIPTION
2001G No-Clean is a low residue solder paste designed for surface mount and other electronic assembly applications.
After reflow, a noncorrosive, non-conductive and highly insulated residue remains. The chemistry in this formulation
yields RMA type activity without
compromising reliability.
APPLICATION
STENCIL PRINTING / PARTICLE SIZE
> 31 mil pitch : Use -200+325 mesh
< 30 mil pitch : Use -325+500 mesh
< 20 mil pitch : Use -400+635 mesh
ALLOY
Sn63/Pb37, Sn62/Pb36/Ag2, etc.
(Meet J-STD-006 Specification)
METAL CONTENT
Stencil Printing : 90 %
Screen Printing : 88 %
RECOMMENDED PRINTING PARAMETERS
SQUEEGEE BLADE
80 to 90 durometer, Polyurethane or Stainless Steel
SQUEEGEE SPEED
1.0 to 8.0 in/sec (25 to 200 mm/sec) typical, other speed
possible.
STENCIL MATERIAL
Brass, Stainless Steel, Polyester, etc.
REFLOW PROFILE
Reflow Profile is determined by the melting
temperature of the solder and the heat
resistance of components. 2001 can be
processed in most reflow media, (i.e. IR, Vapor
phase, Forced convention, etc.).
Ramp rate of 2.5-3.0oC per second is desirable,
since most components are rated for 4.0oC per sec.
PHYSICAL / CHEMICAL CHARACTERISTICS
Color & Appearance Metallic Grey
Water Extract Resistivity > 100,00 ohm-cm
Copper Mirror Test (Flux Extract) Pass
Silver Chromate Paper (Flux Extract) Pass
Slump Test Pass
Electromigration, Bellcore1 Pass
Surface Insulation resistance in Ohms2 >1.0 x 108
VISCOSITY
Malcom3 150 - 250 kcps, 90% metal (-325+500 mesh)
Brookfield4 700 - 1400 kcps, 90% metal (-325+500 mesh)
TACKINESS5
Tack Time 24 hours (90%
metal)
SHIPPING & STORAGE
Refrigeration is the recommended storage
condition for solder paste to maintain its optimum
overall performance.
Recommended storage temperature (2 - 10) oC
SHELF-LIFE
Unopened container (6 Months from
DOM)
1. Bellcore GR-78-CORE
2. Per J-STD-004 Class 3
3. Malcom PCU-203-Series, 10 RPM, 25oC
4. Brookfield RVTD, TF spindle, 5 RPM,
25oC
5. Press, JIS Method

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TDS VD2001G solder paste

  • 1. TECHNICAL DATA SHEET VD Chemicals VD-2001G Solder Paste, Low Residue, No-Clean DESCRIPTION 2001G No-Clean is a low residue solder paste designed for surface mount and other electronic assembly applications. After reflow, a noncorrosive, non-conductive and highly insulated residue remains. The chemistry in this formulation yields RMA type activity without compromising reliability. APPLICATION STENCIL PRINTING / PARTICLE SIZE > 31 mil pitch : Use -200+325 mesh < 30 mil pitch : Use -325+500 mesh < 20 mil pitch : Use -400+635 mesh ALLOY Sn63/Pb37, Sn62/Pb36/Ag2, etc. (Meet J-STD-006 Specification) METAL CONTENT Stencil Printing : 90 % Screen Printing : 88 % RECOMMENDED PRINTING PARAMETERS SQUEEGEE BLADE 80 to 90 durometer, Polyurethane or Stainless Steel SQUEEGEE SPEED 1.0 to 8.0 in/sec (25 to 200 mm/sec) typical, other speed possible. STENCIL MATERIAL Brass, Stainless Steel, Polyester, etc. REFLOW PROFILE Reflow Profile is determined by the melting temperature of the solder and the heat resistance of components. 2001 can be processed in most reflow media, (i.e. IR, Vapor phase, Forced convention, etc.). Ramp rate of 2.5-3.0oC per second is desirable, since most components are rated for 4.0oC per sec. PHYSICAL / CHEMICAL CHARACTERISTICS Color & Appearance Metallic Grey Water Extract Resistivity > 100,00 ohm-cm Copper Mirror Test (Flux Extract) Pass Silver Chromate Paper (Flux Extract) Pass Slump Test Pass Electromigration, Bellcore1 Pass Surface Insulation resistance in Ohms2 >1.0 x 108 VISCOSITY Malcom3 150 - 250 kcps, 90% metal (-325+500 mesh) Brookfield4 700 - 1400 kcps, 90% metal (-325+500 mesh) TACKINESS5 Tack Time 24 hours (90% metal) SHIPPING & STORAGE Refrigeration is the recommended storage condition for solder paste to maintain its optimum overall performance. Recommended storage temperature (2 - 10) oC SHELF-LIFE Unopened container (6 Months from DOM) 1. Bellcore GR-78-CORE 2. Per J-STD-004 Class 3 3. Malcom PCU-203-Series, 10 RPM, 25oC 4. Brookfield RVTD, TF spindle, 5 RPM, 25oC 5. Press, JIS Method