RBL paper _Design_of_MIGFET_based_junctionless_transistorHema N
1) The document describes the design and analysis of a junctionless transistor using TCAD simulation tools. A MIGFET-based junctionless transistor structure with two independent gates is modeled.
2) ID-VG characteristics are obtained by varying one gate voltage while keeping the other fixed. The mixer output of the MIGFET junctionless transistor is also analyzed and found to have higher but distorted amplitude compared to a conventional MIGFET.
3) In conclusion, the MIGFET junctionless transistor structure is not suitable for mixer applications due to distortion in the output, though it has higher amplitude. The junctionless transistor design and simulation is performed using Sentaurus TCAD tools.
The document discusses basic concepts in VLSI design including:
- The history and progression of integrated circuit generations from SSI to VLSI to ULSI.
- The basic operation and types (enhancement vs depletion, NMOS vs PMOS) of MOS transistors.
- Fabrication processes for CMOS, including masks, diffusion, deposition of oxide and polysilicon layers.
- Threshold voltage and factors that determine it such as oxide thickness and charges at interfaces.
small geometry effect and working of solar cellShivank Rastogi
The document discusses MOSFET theory and operation, including:
- MOSFET device structure and types (depletion and enhancement mode).
- Regions of operation depending on gate-source and drain-source voltages.
- Effects that occur at small device geometries including short channel effects like drain-induced barrier lowering, velocity saturation, and hot carriers.
- Operation and efficiency of solar cells made from semiconductor materials, and how efficiency depends on the material bandgap. Design improvements like PERL cells are also discussed.
Effects of Scaling on MOS Device Performanceiosrjce
This paper presents effects on MOS transistor performance due to scaling of its dimensions. Scaling
theory deals with the change in the device characteristics with the decrease in the dimensions of a MOS
transistor. MOS transistors are continuously scaled down due to the desire for high density and high
functionality VLSI chips. The driving forces behind these developments are increasing the demand for portable
systems requiring high throughput and high integration capacity. Effects of scaling on the performance
characteristics of a MOS device are analyzed in this paper
Design of Near-Threshold CMOS Logic GatesVLSICS Design
Numerous efforts have made to balance the tradeoff between power consumption, area and speed of a design. While studying the design at the two extreme ends of the design spectrum, namely the ultra-low power with acceptable performance at one end and high performance with power within limit at the other has not made. One solution to achieve the ultra-low power consumption is to operate the design in subthreshold region. The use of sub-threshold circuit designing in fast and energy efficient circuits is always needed in electronics industry especially in DSP, image processing and arithmetic units in microprocessors, where the low power is the primary concern and the delay can be tolerated. We design a simple CMOS inverter in weak inversion region (sub-threshold) and compare the power consumption with strong inversion region using Cadence 0.18µm Technology.
ULTRA HIGH SPEED FACTORIAL DESIGN IN SUB-NANOMETER TECHNOLOGYcscpconf
This work proposes a high speed and low power factorial design in 22nm technology and also it counts the effect of sub nano-meter constraints on this circuit. A comparative study for this
design has been done for 90nm, 45nm and 22nm technology. The rise in circuit complexity and speed is accompanied by the scaling of MOSFET’s. The transistor saturation current Idsat is an important parameter because the transistor current determines the time needed to charge and discharge the capacitive loads on chip, and thus impacts the product speed more than any other transistor parameter. The efficient implementation of a factorial number is carried out by using
a decremented and multipliers which has been lucidly discussed in this paper. Normally in a factorial module a number is calculated as the iterative multiplication of the given number to
the decremented value of the given number. A Parallel adder based decremented has been proposed for calculating the factorial of any number that also includes 0 and 1. The
performances are calculated by using the existing 90-nm CMOS technology and scaling down the existing technology to 45-nm and 22-nm.
This document discusses MOSFETs and CMOS technology scaling. It begins with an introduction to electronics and transistors before discussing MOSFET structure and operation. The MOSFET I-V characteristics and effects like body effect and channel length modulation are covered. The use of SPICE models to simulate MOSFET behavior is also summarized. The document then addresses challenges with scaling CMOS technology to smaller nodes and how approaches like high-k dielectrics and FinFETs helped overcome these challenges. FinFET structure and advantages over planar MOSFETs are briefly outlined.
This document summarizes research on gate leakage reduction techniques for deep submicron integrated circuits. It discusses how gate leakage has become a significant source of power dissipation as devices are scaled down, due to increased subthreshold leakage, gate oxide tunneling, and reverse bias junction leakage. The document then describes complementary pass transistor logic (CPL) and differential cascade voltage switch logic (DCVSL) as logic families that aim to reduce static power by using fewer transistors and eliminating inverters.
RBL paper _Design_of_MIGFET_based_junctionless_transistorHema N
1) The document describes the design and analysis of a junctionless transistor using TCAD simulation tools. A MIGFET-based junctionless transistor structure with two independent gates is modeled.
2) ID-VG characteristics are obtained by varying one gate voltage while keeping the other fixed. The mixer output of the MIGFET junctionless transistor is also analyzed and found to have higher but distorted amplitude compared to a conventional MIGFET.
3) In conclusion, the MIGFET junctionless transistor structure is not suitable for mixer applications due to distortion in the output, though it has higher amplitude. The junctionless transistor design and simulation is performed using Sentaurus TCAD tools.
The document discusses basic concepts in VLSI design including:
- The history and progression of integrated circuit generations from SSI to VLSI to ULSI.
- The basic operation and types (enhancement vs depletion, NMOS vs PMOS) of MOS transistors.
- Fabrication processes for CMOS, including masks, diffusion, deposition of oxide and polysilicon layers.
- Threshold voltage and factors that determine it such as oxide thickness and charges at interfaces.
small geometry effect and working of solar cellShivank Rastogi
The document discusses MOSFET theory and operation, including:
- MOSFET device structure and types (depletion and enhancement mode).
- Regions of operation depending on gate-source and drain-source voltages.
- Effects that occur at small device geometries including short channel effects like drain-induced barrier lowering, velocity saturation, and hot carriers.
- Operation and efficiency of solar cells made from semiconductor materials, and how efficiency depends on the material bandgap. Design improvements like PERL cells are also discussed.
Effects of Scaling on MOS Device Performanceiosrjce
This paper presents effects on MOS transistor performance due to scaling of its dimensions. Scaling
theory deals with the change in the device characteristics with the decrease in the dimensions of a MOS
transistor. MOS transistors are continuously scaled down due to the desire for high density and high
functionality VLSI chips. The driving forces behind these developments are increasing the demand for portable
systems requiring high throughput and high integration capacity. Effects of scaling on the performance
characteristics of a MOS device are analyzed in this paper
Design of Near-Threshold CMOS Logic GatesVLSICS Design
Numerous efforts have made to balance the tradeoff between power consumption, area and speed of a design. While studying the design at the two extreme ends of the design spectrum, namely the ultra-low power with acceptable performance at one end and high performance with power within limit at the other has not made. One solution to achieve the ultra-low power consumption is to operate the design in subthreshold region. The use of sub-threshold circuit designing in fast and energy efficient circuits is always needed in electronics industry especially in DSP, image processing and arithmetic units in microprocessors, where the low power is the primary concern and the delay can be tolerated. We design a simple CMOS inverter in weak inversion region (sub-threshold) and compare the power consumption with strong inversion region using Cadence 0.18µm Technology.
ULTRA HIGH SPEED FACTORIAL DESIGN IN SUB-NANOMETER TECHNOLOGYcscpconf
This work proposes a high speed and low power factorial design in 22nm technology and also it counts the effect of sub nano-meter constraints on this circuit. A comparative study for this
design has been done for 90nm, 45nm and 22nm technology. The rise in circuit complexity and speed is accompanied by the scaling of MOSFET’s. The transistor saturation current Idsat is an important parameter because the transistor current determines the time needed to charge and discharge the capacitive loads on chip, and thus impacts the product speed more than any other transistor parameter. The efficient implementation of a factorial number is carried out by using
a decremented and multipliers which has been lucidly discussed in this paper. Normally in a factorial module a number is calculated as the iterative multiplication of the given number to
the decremented value of the given number. A Parallel adder based decremented has been proposed for calculating the factorial of any number that also includes 0 and 1. The
performances are calculated by using the existing 90-nm CMOS technology and scaling down the existing technology to 45-nm and 22-nm.
This document discusses MOSFETs and CMOS technology scaling. It begins with an introduction to electronics and transistors before discussing MOSFET structure and operation. The MOSFET I-V characteristics and effects like body effect and channel length modulation are covered. The use of SPICE models to simulate MOSFET behavior is also summarized. The document then addresses challenges with scaling CMOS technology to smaller nodes and how approaches like high-k dielectrics and FinFETs helped overcome these challenges. FinFET structure and advantages over planar MOSFETs are briefly outlined.
This document summarizes research on gate leakage reduction techniques for deep submicron integrated circuits. It discusses how gate leakage has become a significant source of power dissipation as devices are scaled down, due to increased subthreshold leakage, gate oxide tunneling, and reverse bias junction leakage. The document then describes complementary pass transistor logic (CPL) and differential cascade voltage switch logic (DCVSL) as logic families that aim to reduce static power by using fewer transistors and eliminating inverters.
The document discusses short channel effects in MOSFETs. As MOSFET channel lengths decrease according to Moore's Law, adverse effects emerge. Short channel effects arise when the channel length becomes comparable to the depletion layer width. This causes (1) drain-induced barrier lowering and punch through, where the drain depletion region extends to the source, (2) surface scattering from electrons accelerated toward surfaces, (3) velocity saturation reducing transconductance, (4) impact ionization generating electron-hole pairs, and (5) hot electrons that can become trapped or increase threshold voltage. New technologies such as 3D-gate FETs and CNT-FETs can help reduce these short channel effects.
The document compares double gate MOSFETs to single gate MOSFETs. Double gate MOSFETs reduce leakage current and delay compared to single gate by controlling the silicon channel more efficiently with two gates. This improves short channel effects and leads to higher currents. Double gate MOSFETs are suitable for low power and high performance applications due to their reduced leakage current and improved device characteristics like reduced short channel effects and improved current driving capability.
Structural and Electrical Analysis of Various MOSFET DesignsIJERA Editor
Invention of Transistor is the foundation of electronics industry. Metal Oxide Semiconductor Field Effect Transistor (MOSFET) has been the key to the development of nano electronics technology. This paper offers a brief review of some of the most popular MOSFET structure designs. The scaling down of planar bulk MOSFET proposed by the Moore’s Law has been saturated due to short channel effects and DIBL. Due to this alternative approaches has been considered to overcome the problems at lower node technology. SOI and FinFET technologies are promising candidates in this area.
This presentation is for beginners of electronics. This will give you a brief about all the important basic building blocks of electronics and hence will be helpful in creating a good foundation.
1. The document discusses the basic concepts of diodes and MOS transistors, including their structures, operations, and issues related to submicron MOS transistors. It covers topics such as p-type and n-type semiconductors, the PN junction, biasing of diodes, ideal and real diode equations, MOS transistor structure and operation, and effects in submicron transistors like channel length modulation and velocity saturation.
2. Design abstraction levels are introduced to efficiently design complex ICs through successive simplification and representation of circuits from the system level down to the transistor and layout levels.
3. MOS transistor models like the switch model and SPICE models are presented to simulate and analyze
VLSI power estimation is vital component of the modern electronic designs. Rapid changes in the advanced electronic infrastructure may causes the power to become paramount important in the VLSI designs.
This document discusses JFETs and MOSFETs. It describes the construction and working of JFETs and MOSFETs. It defines pinch-off voltage and discusses the advantages of FETs over BJTs. There are two types of JFETs - n-channel and p-channel. The document explains the operating principle of an n-channel JFET and shows the symbol. It describes how to plot the output characteristics or drain characteristics of a JFET by varying the drain-source and gate-source voltages and measuring the drain current. It notes that drain current reaches a constant value at pinch-off voltage.
This document discusses power bipolar transistors and power MOSFETs. It describes the vertical structure of power bipolar transistors which allows for higher current handling. Power transistors have lower current gain but larger safe operating areas bounded by maximum current, voltage and power limits to prevent damage. Power MOSFETs provide advantages over bipolar transistors like no second breakdown and stable performance over temperature. They have lower on-resistance and can switch large currents with small control currents. DMOS and VMOS structures are described for power MOSFETs.
SOC, SOPC, MPSOC, ASIC are new VLSI approaches. Therefore power estimation and precise power calculation is vital to better understanding of Electronic world
SHORT-CHANNEL EFFECTS
A MOSFET is considered to be short when the channel length ‘L’ is the same order of magnitude as the depletion-layer widths (xdD, xdS). The potential distribution in the channel now depends upon both, transverse field Ex, due to gate bias and also on the longitudinal field Ey, due to drain bias When the Gate channel length <<1 m, short channel effect becomes important .
This leads to many
undesirable effects in MOSFET.
The short-channel effects are attributed to two physical phenomena:
A) The limitation imposed on electron drift characteristics in the channel,
B) The modification of the threshold voltage due to the shortening channel length.
In particular five different short-channel effects can be distinguished:
1. Drain-induced barrier lowering and “Punch through”
2. Surface scattering
3. Velocity saturation
4. Impact ionization
5. Hot electrons
The document outlines the lecture slides for a course on VLSI Design. It covers topics such as introduction to IC technology including various processes like oxidation, lithography, diffusion, and doping. It also discusses MOSFET basics like different types of MOS transistors, their symbols, characteristics and modes of operation. The summary provides an overview of the key concepts covered in the VLSI Design lecture.
The document provides an introduction to electronic components, including their classification and examples of active components. It describes key active components like diodes, transistors, operational amplifiers (op-amps), and timers (IC-555) in detail. For diodes, it covers the light emitting diode (LED) and its working principle. For transistors, it explains NPN, PNP, JFET, and MOSFET types as well as their construction and working. It provides details on op-amp characteristics, applications, and uses in instrumentation amplifiers. It also describes the 555 timer and its uses in generating waveforms and applications like monostable multivibrators.
The document discusses MOSFET transistors. It describes their basic structure as having a gate, source and drain, with the gate separated from the semiconductor material by an insulating oxide layer. MOSFETs can be either n-channel or p-channel and either enhancement or depletion mode. Their operation depends on the voltage applied to the gate, which controls the flow of current between the source and drain. MOSFETs are widely used in applications like microprocessors and memories due to their low cost, small size and low power consumption. The CMOS inverter circuit is also discussed, which uses complementary n-channel and p-channel MOSFETs.
Microelectronic technology
This report briefly discusses the need for Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), their structure and principle of operation. Then it details the fabrication and characterization of the MOSFETs fabricated at the microelectronic lab at University of Malaya
shows the simulation and analysis of a MOSFET device using the MOSFet tool. Several powerful analytic features of this tool are demonstrated, including the following:
calculation of Id-Vg curves
potential contour plots along the device at equilibrium and at the final applied bias
electron density contour plots along the device at equilibrium and at the final applied bias
spatial doping profile along the device
1D spatial potential profile along the device
This document summarizes the double-gate MOSFET transistor. It begins by describing the basic operation of a single-gate MOSFET and then discusses the scaling limitations of bulk MOSFETs, such as decreasing carrier mobility and threshold voltage rolloff as channel length decreases. It introduces the double-gate MOSFET as a way to better control the channel and reduce short-channel effects. Key features of the double-gate MOSFET include two gates that control the ultra-thin body channel and allow direct scaling to small channel lengths of 20nm or less. Fabricating double-gate MOSFETs using a silicon-on-insulator approach provides benefits like low leakage currents. The double gates provide improved performance
This document outlines the syllabus for a VLSI design course. The syllabus covers five units: (1) CMOS technology, including history, characteristics, and enhancements; (2) circuit characterization and simulation; (3) combinational and sequential circuit design; (4) CMOS testing; and (5) specification using Verilog HDL. The first unit provides an introduction to CMOS technology, discussing MOS transistors, CMOS processes like p-well and n-well, and layout design rules. Subsequent units cover circuit analysis, common circuit elements, testing approaches, and hardware description languages. References include textbooks on VLSI design, digital circuits, and Verilog HDL.
The document provides an overview of the history and scaling of transistors and integrated circuits. It discusses how vacuum tubes were replaced by transistors, with the first transistor invented in 1947 and the first integrated circuit in 1958. It describes how continuous scaling and improvements in silicon manufacturing have led to billions of transistors being integrated onto a single chip today. The document then discusses different transistor technologies, including MOSFETs, and how scaling to smaller sizes introduced challenges like short channel effects that new transistor designs like FinFETs help address.
Prediction of Electrical Energy Efficiency Using Information on Consumer's Ac...PriyankaKilaniya
Energy efficiency has been important since the latter part of the last century. The main object of this survey is to determine the energy efficiency knowledge among consumers. Two separate districts in Bangladesh are selected to conduct the survey on households and showrooms about the energy and seller also. The survey uses the data to find some regression equations from which it is easy to predict energy efficiency knowledge. The data is analyzed and calculated based on five important criteria. The initial target was to find some factors that help predict a person's energy efficiency knowledge. From the survey, it is found that the energy efficiency awareness among the people of our country is very low. Relationships between household energy use behaviors are estimated using a unique dataset of about 40 households and 20 showrooms in Bangladesh's Chapainawabganj and Bagerhat districts. Knowledge of energy consumption and energy efficiency technology options is found to be associated with household use of energy conservation practices. Household characteristics also influence household energy use behavior. Younger household cohorts are more likely to adopt energy-efficient technologies and energy conservation practices and place primary importance on energy saving for environmental reasons. Education also influences attitudes toward energy conservation in Bangladesh. Low-education households indicate they primarily save electricity for the environment while high-education households indicate they are motivated by environmental concerns.
ELS: 2.4.1 POWER ELECTRONICS Course objectives: This course will enable stude...Kuvempu University
Introduction - Applications of Power Electronics, Power Semiconductor Devices, Control Characteristics of Power Devices, types of Power Electronic Circuits. Power Transistors: Power BJTs: Steady state characteristics. Power MOSFETs: device operation, switching characteristics, IGBTs: device operation, output and transfer characteristics.
Thyristors - Introduction, Principle of Operation of SCR, Static Anode- Cathode Characteristics of SCR, Two transistor model of SCR, Gate Characteristics of SCR, Turn-ON Methods, Turn-OFF Mechanism, Turn-OFF Methods: Natural and Forced Commutation – Class A and Class B types, Gate Trigger Circuit: Resistance Firing Circuit, Resistance capacitance firing circuit.
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The document discusses short channel effects in MOSFETs. As MOSFET channel lengths decrease according to Moore's Law, adverse effects emerge. Short channel effects arise when the channel length becomes comparable to the depletion layer width. This causes (1) drain-induced barrier lowering and punch through, where the drain depletion region extends to the source, (2) surface scattering from electrons accelerated toward surfaces, (3) velocity saturation reducing transconductance, (4) impact ionization generating electron-hole pairs, and (5) hot electrons that can become trapped or increase threshold voltage. New technologies such as 3D-gate FETs and CNT-FETs can help reduce these short channel effects.
The document compares double gate MOSFETs to single gate MOSFETs. Double gate MOSFETs reduce leakage current and delay compared to single gate by controlling the silicon channel more efficiently with two gates. This improves short channel effects and leads to higher currents. Double gate MOSFETs are suitable for low power and high performance applications due to their reduced leakage current and improved device characteristics like reduced short channel effects and improved current driving capability.
Structural and Electrical Analysis of Various MOSFET DesignsIJERA Editor
Invention of Transistor is the foundation of electronics industry. Metal Oxide Semiconductor Field Effect Transistor (MOSFET) has been the key to the development of nano electronics technology. This paper offers a brief review of some of the most popular MOSFET structure designs. The scaling down of planar bulk MOSFET proposed by the Moore’s Law has been saturated due to short channel effects and DIBL. Due to this alternative approaches has been considered to overcome the problems at lower node technology. SOI and FinFET technologies are promising candidates in this area.
This presentation is for beginners of electronics. This will give you a brief about all the important basic building blocks of electronics and hence will be helpful in creating a good foundation.
1. The document discusses the basic concepts of diodes and MOS transistors, including their structures, operations, and issues related to submicron MOS transistors. It covers topics such as p-type and n-type semiconductors, the PN junction, biasing of diodes, ideal and real diode equations, MOS transistor structure and operation, and effects in submicron transistors like channel length modulation and velocity saturation.
2. Design abstraction levels are introduced to efficiently design complex ICs through successive simplification and representation of circuits from the system level down to the transistor and layout levels.
3. MOS transistor models like the switch model and SPICE models are presented to simulate and analyze
VLSI power estimation is vital component of the modern electronic designs. Rapid changes in the advanced electronic infrastructure may causes the power to become paramount important in the VLSI designs.
This document discusses JFETs and MOSFETs. It describes the construction and working of JFETs and MOSFETs. It defines pinch-off voltage and discusses the advantages of FETs over BJTs. There are two types of JFETs - n-channel and p-channel. The document explains the operating principle of an n-channel JFET and shows the symbol. It describes how to plot the output characteristics or drain characteristics of a JFET by varying the drain-source and gate-source voltages and measuring the drain current. It notes that drain current reaches a constant value at pinch-off voltage.
This document discusses power bipolar transistors and power MOSFETs. It describes the vertical structure of power bipolar transistors which allows for higher current handling. Power transistors have lower current gain but larger safe operating areas bounded by maximum current, voltage and power limits to prevent damage. Power MOSFETs provide advantages over bipolar transistors like no second breakdown and stable performance over temperature. They have lower on-resistance and can switch large currents with small control currents. DMOS and VMOS structures are described for power MOSFETs.
SOC, SOPC, MPSOC, ASIC are new VLSI approaches. Therefore power estimation and precise power calculation is vital to better understanding of Electronic world
SHORT-CHANNEL EFFECTS
A MOSFET is considered to be short when the channel length ‘L’ is the same order of magnitude as the depletion-layer widths (xdD, xdS). The potential distribution in the channel now depends upon both, transverse field Ex, due to gate bias and also on the longitudinal field Ey, due to drain bias When the Gate channel length <<1 m, short channel effect becomes important .
This leads to many
undesirable effects in MOSFET.
The short-channel effects are attributed to two physical phenomena:
A) The limitation imposed on electron drift characteristics in the channel,
B) The modification of the threshold voltage due to the shortening channel length.
In particular five different short-channel effects can be distinguished:
1. Drain-induced barrier lowering and “Punch through”
2. Surface scattering
3. Velocity saturation
4. Impact ionization
5. Hot electrons
The document outlines the lecture slides for a course on VLSI Design. It covers topics such as introduction to IC technology including various processes like oxidation, lithography, diffusion, and doping. It also discusses MOSFET basics like different types of MOS transistors, their symbols, characteristics and modes of operation. The summary provides an overview of the key concepts covered in the VLSI Design lecture.
The document provides an introduction to electronic components, including their classification and examples of active components. It describes key active components like diodes, transistors, operational amplifiers (op-amps), and timers (IC-555) in detail. For diodes, it covers the light emitting diode (LED) and its working principle. For transistors, it explains NPN, PNP, JFET, and MOSFET types as well as their construction and working. It provides details on op-amp characteristics, applications, and uses in instrumentation amplifiers. It also describes the 555 timer and its uses in generating waveforms and applications like monostable multivibrators.
The document discusses MOSFET transistors. It describes their basic structure as having a gate, source and drain, with the gate separated from the semiconductor material by an insulating oxide layer. MOSFETs can be either n-channel or p-channel and either enhancement or depletion mode. Their operation depends on the voltage applied to the gate, which controls the flow of current between the source and drain. MOSFETs are widely used in applications like microprocessors and memories due to their low cost, small size and low power consumption. The CMOS inverter circuit is also discussed, which uses complementary n-channel and p-channel MOSFETs.
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This report briefly discusses the need for Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), their structure and principle of operation. Then it details the fabrication and characterization of the MOSFETs fabricated at the microelectronic lab at University of Malaya
shows the simulation and analysis of a MOSFET device using the MOSFet tool. Several powerful analytic features of this tool are demonstrated, including the following:
calculation of Id-Vg curves
potential contour plots along the device at equilibrium and at the final applied bias
electron density contour plots along the device at equilibrium and at the final applied bias
spatial doping profile along the device
1D spatial potential profile along the device
This document summarizes the double-gate MOSFET transistor. It begins by describing the basic operation of a single-gate MOSFET and then discusses the scaling limitations of bulk MOSFETs, such as decreasing carrier mobility and threshold voltage rolloff as channel length decreases. It introduces the double-gate MOSFET as a way to better control the channel and reduce short-channel effects. Key features of the double-gate MOSFET include two gates that control the ultra-thin body channel and allow direct scaling to small channel lengths of 20nm or less. Fabricating double-gate MOSFETs using a silicon-on-insulator approach provides benefits like low leakage currents. The double gates provide improved performance
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Supermarket Management System Project Report.pdfKamal Acharya
Supermarket management is a stand-alone J2EE using Eclipse Juno program.
This project contains all the necessary required information about maintaining
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The core idea of this project to minimize the paper work and centralize the
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2. MODULE V
MOSFET scaling – need for scaling, constant voltage scaling and constant field
scaling, Sub threshold conduction in MOS. Short channel effects- Channel length
modulation, Drain Induced Barrier Lowering, Velocity Saturation, Threshold Voltage
Variations and Hot Carrier Effects. Non-Planar MOSFETs: Fin FET –Structure,
operation and advantages
3. MOSFET scaling – need for scaling
• Design of high density chip in MOS VLSI technology requires that packing density should
increase, accordingly size of the IC must decrease.
• The reduction of the size, i.e., the dimensions of MOSFETs, is commonly referred to as
scaling.
• Scaling of MOS transistors is concerned with systematic reduction of overall dimensions
of the devices.
• The proportional scaling of all devices in a circuit would certainly result in a reduction of
the total silicon area occupied by the circuit, thereby increasing the overall functional
density of the chip.
• There are two basic types of size-reduction strategies:
✓ Full scaling (Constant-field scaling)
✓Constant voltage scaling
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
4. CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
5. Motivation for Scaling
• More transistors --> Higher performance
• Less delay time --> Higher frequency
• Less VDD --> Lower power consumption
Nanoelectronics:An overview by Dr.Santhanu Mahapatra
6. Full Scaling (Constant-Field Scaling)
• Preserve the magnitude of internal electric fields in the MOSFET, while the
dimensions are scaled down by a factor of S.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
7. Influenceof scaling
• The gate oxide capacitance per unit area, on the other hand, is changed
• Aspect ratio WIL will remain unchanged under scaling.
• Trans conductance parameter kn will be scaled by a factor of S.
• Linear-mode drain current of the scaled MOSFET
• Saturation-mode drain current is reduced by the scaling factor.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
8. • Power dissipation of the transistor will be reduced by the factor s2 .
• Gate oxide capacitance scaled down by a factor of s.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
9. Constant-Voltage Scaling
• The power supply voltage and all terminal voltages be scaled down proportionally with
the device dimensions.
• Constant-voltage scaling is usually preferred over full scaling- Peripheral and interface
circuitry may require certain voltage levels for all input and output voltages, which in
turn would necessitate multiple power supply voltages and complicated level shifter
arrangements.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
10. Influence of constant voltage scaling
• All dimensions of the MOSFET are reduced by a factor of S.
• Power supply voltage and the terminal voltages remain unchanged.
• Doping densities must be increased by a factor of s2.
• Gate oxide capacitance per unit area Cox is increased by a factor of S, which means
that the trans conductance parameter is increased by S.
• Linear mode drain current of the scaled MOSFET
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
11. CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
12. • Saturation current of the device
• Power dissipation of the MOSFET increases by a factor of S.
• Power density (power dissipation per unit area) is found to increase by a factor of S3 .
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
14. Long-channel devices
o Width and length long enough so that edge effects from
the four sides can be neglected
o Channel length L must be much greater than the sum of
the drain and source depletion widths
Short channel devices
o Width and length short enough such that the edge
effects can not be neglected
o Devices with width and length short enough such that the
edge effects can not be neglected
14
https://people.rit.edu/lffeee/mosfet_s.pdf
15. Sub threshold conduction in MOS
• As per drain current expression ID=0 when VG=VT.
• There is some drain conduction below threshold- subthreshold conduction.
• This current is due to weak inversion in the channel between flat band and threshold (for
band bending between zero and 2φF), which leads to a diffusion current from source to
drain.
Where
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
16. • ID depends exponentially on gate bias, VG.
• VD has little influence on ID once VD exceeds a few kT > q.
• The slope of ID-VGS curve is known as the subthreshold
slope, S.
• It has typical values of 70 mV/decade at room
temperature
• A change in the input VG of 70 mV will change the output
ID by an order of magnitude.
• Smaller the value of S, the better the transistor is as a
switch.
• A small value of S means a small change in the input bias
can modulate the output current considerably.
• S is a measure of the efficacy of the gate potential in
• modulating ID.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
17. Short Channel Effects
• A MOS transistor is called a short-channel device if its channel length is on the
same order of magnitude as the depletion region thicknesses of the source and
drain junctions.
• If the effective channel length Leff is approximately equal to the source and drain
junction depth x.
• Effects
(i) Limitations imposed on electron drift characteristics in the channel
(ii) Modification of the threshold voltage due to the shortening channel length.
CMOS Digital Integrated Circuits, Analysis AndDesign,sung-mo Kang, Yusuf Leblebigi,second Dition
18. Velocity Saturation
• As the effective channel length is decreases, lateral electric field EY along the channel
increases
• At low field: Electron drift velocity Vd in the channel is proportional to the electric field
• At high field: Drift velocity tends to saturate
• As E = 105 V/cm and higher, the electron drift velocity saturates to value of about vd(sat)=
107cm/s.
• Carrier velocity saturation actually reduces the saturation-mode current
• The current is no longer a quadratic function of the gate-to-source voltage VGS, and it is
virtually independent of the channel length
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
19. Mobility Degradation
• In short-channel MOS transistors, the carrier velocity in the channel is also a
function of the normal (vertical) electric-field component Ex.
• Vertical field influences the scattering of carriers (collisions suffered by the
carriers) in the surface region, the surface mobility is reduced with respect to the
bulk mobility
• It is given by the relation
• µno is the low-field surface electron mobility and ϴ is an empirical factor.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
20. Threshold Voltage Variations
• In short-channel MOS transistors, n+ drain and source diffusion regions in the p-
type substrate induce a significant amount of depletion charge.
• Long-channel threshold voltage expression overestimates the depletion charge
supported by the gate voltage.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
21. • The drain depletion region is larger than the source depletion region because the
positive drain-to-source voltage reverse-biases the drain-substrate junction.
• Significant portion of the total depletion region charge under the gate is actually due
to the source and drain junction depletion, rather than the bulk depletion induced by
the gate voltage.
• The threshold voltage expression must be modified to account for this reduction.
• ∆VT0 is the threshold voltage shift (reduction) due to the short-channel effect.
• The reduction term actually represents the amount of charge differential between a
rectangular depletion region and a trapezoidal depletion region.
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
22. • Let ∆ LS and ∆ LD represent the lateral extent of the depletion regions associated
with the source junction and the drain junction
• Let xds and xdD represent the depth of the pn-j unction depletion regions
associated with the source and the drain
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
23. • From figure
• On solving for ∆LD
• Similarly
• The amount of threshold voltage reduction AV70 due to short-channel effects
CMOS Digital Integrated Circuits, Analysis And Design,sung-mo Kang, Yusuf Leblebigi,second Dition
24. • As the channel lengths are reduced, the shared charge becomes a larger fraction
of the total, and this results in a VT roll-off as a function of L.
• Narrow width effect, where the VT goes up as the channel width Z is reduced for
very narrow devices.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
25. Drain Induced Barrier lowering
• Unintended electrostatic interactions between the source and the drain is known
as Drain- Induced Barrier Lowering (DIBL).
• It may occur if
• Small channel length MOSFETs are not scaled properly
• Source/drain junctions are too deep or the channel doping is too low
• This leads to punch- through leakage or breakdown between the source and the
drain, and loss of gate control.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
26. • As the drain bias is increased, the conduction band
edge in the drain is pulled down.
• The drain- channel depletion width expands.
• For a long channel MOSFET, the drain bias does
not affect the source- to- channel potential barrier,
which corresponds to the built- in potential of the
source-channel p- n junction.
• Hence, unless the gate bias is increased to lower
this potential barrier, there is little drain current.
• For a short channel MOSFET, as the drain bias is
raised and the conduction band edge in the drain
is pulled down.
• The source- channel potential barrier is lowered
due to DIBL.
• There can be significant drain leakage current, with
the gate being unable to shut it off.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
27. • Solutions
• The source/drain junctions must be made sufficiently shallow (i.e., scaled properly)
as the channel lengths are reduced, to prevent DIBL.
• Secondly, the channel doping must be made sufficiently high to prevent the drain
from being able to control the source junction.
• Anti- punch- through implant in the channel
• Instead of implant throughout the channel a localized implant is done only near the
source/drains. These are known as halo or pocket implants.
• The higher doping reduces the source/drain depletion widths and prevents their
interaction.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
28. Channel length modulation
➢ Assumption : Drain current is constant in
saturation region
➢ As Vds increases pinch off region extends along
the channel away from drain
➢ Effective channel length decreases
➢ Id = µ Cox (W/L) (Vgs-Vth)2
➢ Transistor current increases as Leff decreases
28
Analog VLSI: Circuits and Principles By Shih-Chii Liu
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31. • For short channel MOSFETs, DIBL is related to the electrical modulation of the
channel length in the pinch- off region, L.
• Since the drain current is inversely proportional to the electrical channel length
• The fractional change in the channel length is proportional to the drain bias
where λ is the channel length modulation parameter
• Drain current is modified as
Channel length modulation
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
32. Hot Electron Effects
• If we simply reduced the dimensions of the device and kept the power supply
voltages the same, the internal electric fields in the device would increase.
• For ideal scaling, power supply voltages should also be reduced to keep the internal
electric fields reasonably constant.
• In practice, power supply voltages are not scaled hand- in- hand with the device
dimensions, partly because of other system- related constraints.
• The longitudinal electric fields in the pinch- off region, and the transverse electric
fields across the gate oxide, increase with MOSFET scaling.
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
34. • When an electron travels from the source to the drain
along the channel, it gains kinetic energy, and becomes a
“hot” electron.
• As it gains more kinetic energy, it moves higher up in the
conduction band.
• A few of the electrons can become energetic enough to
surmount the potential barrier between the Si channel
and the gate oxide .
• Some of these injected hot electrons can go through the
gate oxide and be collected as gate current, thereby
reducing the input impedance.
• Some of these electrons can be trapped in the gate oxide
as fixed oxide charges. This increases the flat band
voltage, and therefore the VT.
• Energetic hot carriers can rupture Si– H bonds that exist
at the Si-SiO2 interface, creating fast interface states that
degrade MOSFET parameters.
• Solution: Lightly doped drain structure
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
35. • As the electrons travel toward the drain and become
hot, they can create secondary EHPs by impact
ionization.
• The secondary electrons are collected at the drain, and
cause the drain current in saturation to increase with
drain bias at high voltages, thereby leading to a
decrease of the output impedance.
• The secondary holes are collected at the substrate as
substrate current.
• This current can create circuit problems such as noise or
latch up in CMOS circuits
Solid StateElectronic Devices,seventh edition, Ben G. Streetman •Sanjay Kumar Banerjee
36. Ultra –Thin- Body MOSFET (Planar)
❑ Control over short channel effects
❑ Layered Silicon-Insulator-Silicon in place of
conventional Silicon
❑ Lower junction leakage
❑ Better electrostatic control reduce S-D leakage
❑ For high density , high performance , low
power applications
36
40. FinFET(Non planar MOSFET)
• Also called tri-gate transistor.
• FinFETs can be implemented either on bulk
silicon or SOI wafer.
• This FinFET structure consists of thin (vertical)
fin of silicon body on a substrate.
• The gate is wrapped around the channel
providing excellent control from three sides of
the channel.
• This structure is called the FinFET because its Si
body resembles the back fin of a fish.
Former TSMC CTO and Berkeley professor Chenming Hu and his team presented the concept of
FinFET in 1999
A Review Paper on CMOS, SOI and FinFET Technology By Pavan H Vora, Ronak Lad (Einfochips Pvt. Ltd.)
Fig:FinFET Structure
42. • In bulk-MOS (planner MOS), the channel is horizontal.
• In FinFET channel, it is vertical.
• For FinFET, the height of the channel (Fin) determines the
width of the device.
• The perfect width of the channel is given by
Width of Channel = 2 X Fin Height + Fin Width
• The drive current of the FinFET can be increased by
increasing the width of the channel i.e. by increasing the
height of the Fin.
• We can also increase the device drive current by
constructing parallel multiple fins connected together.
Fig: Multi fin FET Structure
A Review Paper on CMOS, SOI and FinFET Technology By Pavan H Vora, Ronak Lad (Einfochips Pvt. Ltd.)
43. • FinFET Working: The mode of operation of a FinFET does not differ from a traditional field
effect transistor. There is one source and one drain contact as well as a gate to control the
current flow.
• In conventional MOS, a doping is inserted into the channel, reducing the various SCEs and
ensuring high Vth.
• While in FinFET, the gate structure is wrapped around the channel and the body is thin,
providing better SCEs, so channel doping becomes optional.
• It implies that FinFET suffers less from dopant-induced variations.
• Low channel doping also ensures better mobility of the carriers inside the channel. Hence,
higher performance.
A Review Paper on CMOS, SOI and FinFET Technology By Pavan H Vora, Ronak Lad (Einfochips Pvt. Ltd.)
44. Types of FinFET
Bulk FinFETs: Design at 14 nm Node and Key Characteristics Jong-Ho Lee 44
45. Bulk V/S SOI FinFET
Bulk FinFET SOI FinFET
Deep etching needed simpler fabrication
Need isolation no isolation problem
Cheaper Expensive
45
46. Advantages:
✓FinFET has higher drive current.
✓Strain technology can be used to increase carrier mobility.
✓Improved transistor sub threshold swing due to greatly improved gate control.
✓Improved channel mobility due to reduced transverse electric field,
✓Reduced parasitic capacitancesfrom the absence of depletion capacitances,
leading to improved speed,
✓Reduced power consumption
✓Much Lower off-state current comparedto bulk counterpart.
Disadvantages:
o Width quantization
o Parasitic resistance is the main adverse factor which prevents FinFETs’ application,
which leads to lower speed and high noise.
o Complex manufacturing process
46
A Review Paper on CMOS, SOI and FinFET Technology By Pavan H Vora, Ronak Lad (Einfochips Pvt. Ltd.)
47. Trigate FinFET
• An extension of the FinFET structure, and
allows variable device widths
• Can have multiple fins connected
together to increase the total drive
strength
• It requires aggressive lithography
techniques.
47
Image :https://www.semiwiki.com/forum/content/3591-intel-ansys-enable-14nm-chip-production.html