SMA Sunny Island 6.0H Off-grid and On-grid Solar Battery Inverter 2016 teardown reverse costing report published by Yole Developpement
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With a nominal power of 4.6kW and a peak efficiency of 96%, the Sunny Island 6.0H battery inverter enables several configurations for off-grid or on-grid applications. The Sunny Island supplies AC loads from a battery or charges the battery with the energy provided by different external energy sources (PV inverter, generator or public grid). Its IP54 classification and its performant cooling system able the inverter to be used in a wide range of environment. Moreover it can be used with Li-Ion as well as Lead Acid Batteries. More information on that report at http://www.i-micronews.com/reports.html
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3-Axis & 6-Axis eCompass Comparison Technology and Cost Review 2015 teardown ...
Magnetometers are widely integrated in consumer applications. More and more devices will require a positioning system and magnetometers are essential for such a purpose. A CAGR of +8% in units is forecasted by Yole Developpement from 2015 to 2020.
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SMA Sunny Boy SB 1.5 1-vl40 1500W 2015 teardown reverse costing report publis...
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Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
Safran Colibrys is the leading European supplier of high-performance silicon-based MEMS providing long-term bias stability under harsh environments. In a global market worth around $100M in 2016, high-performance silicon-based MEMS accelerometers address a wide range of applications, from commercial aerospace applications to the defense market. Amongst these, the industrial market remains attractive and the most dynamic. Thanks to performance improvements and reduced size and cost, more opportunities are appearing.
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Fairchild FIS1100 6-Axis MEMS IMU 2015 teardown reverse costing report publis...
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STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
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SiTime Corporation SiT1552 MEMS Oscillator 2015 teardown reverse costing repo...
THE SMALLEST MEMS OSCILLATOR ON THE MARKET ASSEMBLED IN AN INNOVATIVE WAFER LEVEL CHIP SIZE PACKAGE
SiTime presents its first MEMS oscillator assembled in Wafer Level Chip Scale package to get the word smallest (1.2mm2) ultra-low power oscillator for consumer and industrial applications.
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InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...
InvenSense MP67B
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InvenSense's first design win in Apple iPhone
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With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
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The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
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Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
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Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
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Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
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This report combines the analysis of two components in order to offer a broad vision of the technologies used by UVC LEDs in terms of applications and power output. The UVTOP270TO39HS and SS35DF227513 are two 275nm UVC LEDs from Sensor Electronic Technology Inc. (SETi). The UVTOP270TO39HS, with its hemispherical lens and 0.1mm² LED, is adapted for fluorescent spectroscopy and chemical /
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The two LED dies are based on the same technology: an AlN template layer deposited on a sapphire substrate. The AlGaN active layers are epitaxied on the AlN layer, but the thickness is very different between the two dies. The SS35DF227513 is manufactured using the latest SETi technological evolution. The new AlN and AlGaN structure reduces the defect density to enhance external quantum efficiency. At 1mm², the SS35DF227513 is 9x taller than SETi’s first UVC LED and boasts 15x more power.
The TO39 with a hemispherical lens is an expensive package, but it is destined for instrumentation. The new SMD3535 package in the SS35DF227513’s ceramic is cheaper and designed for disinfection with a large viewing angle and better thermal resistance that allows continuous use of the 1mm² LED.
This report delivers a deep technology analysis of the packaging and the components, with images of the complex AlN and AlGaN epitaxy layer stack and electrode structure. Also included are a production cost analysis and an overall comparison with the first SETi UVC LED.
More information on that report at http://www.i-micronews.com/reports.html
Toyota Prius 4 PCU Power Modules - teardown reverse costing report published ...
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system.
For its latest Prius 4 Toyota has designed a new power control unit (PCU). The PCU has two types of power module, one for the motor inverter and the other for the boost converter and generator inverter.
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The module integrates Toyota’s latest power card packaging, with double side cooling. It allows the modularity and scalability of the PCU’s inverters to be optimized and also enables better thermal dissipation thanks to the use of copper heatsinks and spacers. The power cards can be placed in parallel to have a single thermal dissipation circuit in a limited space.
This package includes two pairs of wire bonded IGBTs and freewheeling diodes and is plastic molded.
This report offers a deep technical analysis of the module structure, packaging, and of the IGBT and diode die.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode.
Moreover, the report compares the Prius 4 PCU with the Chevrolet Volt power module, analyzing the technical choices of the packaging and the die. This comparison highlights the huge differences in design and manufacturing process and their impact on device size and production cost.
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
This reverse costing study analyzes the manufacturing cost and estimated selling price of the STMicroelectronics LSM9DS0 9-axis MEMS IMU component. The LSM9DS0 integrates a 3-axis gyroscope, 3-axis accelerometer, and 3-axis magnetometer. It is produced in a 4x4x1mm LGA 24-pin package. The report details the physical analysis of the device and its dies, the manufacturing processes, and provides a cost analysis that estimates the total cost to be $4.28.
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Bosch SMI130 6-Axis Automotive MEMS IMU 2015 teardown reverse costing report ...
This document provides a reverse costing analysis of the Bosch SMI130 6-Axis MEMS IMU. It begins with an executive summary describing the SMI130's key characteristics. The physical analysis identifies the package and die details. Manufacturing process flow is then examined, including the ASIC front-end, MEMS front-end, and packaging back-end stages. A cost analysis is conducted to estimate production costs. Finally, estimated selling prices are provided based on manufacturer financial ratios. The analysis aims to provide technology and cost insights into this MEMS inertial sensor.
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...
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The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
Maxim Integrated MAX30102 Optical Heart-Rate Sensor 2016 teardown reverse cos...
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More information on that report at http://www.i-micronews.com/reports.html
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The document provides a reverse costing analysis of the Qorvo TQF-6405 front-end module used in the Apple iPhone 6s Plus. It includes a physical analysis of the component and its packaging. The report focuses on the manufacturing cost analysis of the SMR BAW filter die. It estimates the cost of materials and manufacturing steps to determine the total cost of the MEMS wafer and die. This cost is then used to estimate the potential selling price based on the company's financial ratios.
Infineon DPS310 Capacitive Pressure Sensor
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module 2016 teardown reverse cos...
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
More information on that report at http://www.i-micronews.com/reports.html
Continental MFC430T and ZF-TRW S-Cam 3 and Bosch–MPC2 reports - teardown reve...
• Detailed Photos
• Precise Measurements
• Material Analysis
• Complete Bill of Material
• Component Pricing
• Image Sensor Detailed Analysis
• Manufacturing Process Flow
• Supply Chain Evaluation
• Manufacturing Cost Analysis
• Selling Price Estimation
Transphorm TPH3002PS 600V GaN on Silicon HEMT 2015 teardown reverse costing r...
High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package
The TPH3002PS is a 600V EZ-GaN™ HEMT for high frequency operations from Transphorm. Manufactured by Fujitsu and assembled in a TO220 package, it features the Quiet-TabTM scheme which increases switching speed by 200%. With a 7.5ns turn-on and a 10ns turn-off, the TPH3002PS has a higher switch frequency than the best CoolMOS.
The TPH3002PS is based on a cascode configuration of a GaN on Silicon HEMT transistor to hold the high voltage and a standard low voltage MOSFET to drive high frequency and to make a normally-off transistor from a normally-on GaN HEMT.
The device is assembled in a TO220 package for an easy integration in converter electronic system. Moreover, it integrates a Quiet-Tab™ and a Gate-Source-Drain (GSD) pin-out arrangement in order to reduce the parasitic inductance and capacitance in high frequency and to allow 200% increase in switching speed compared to traditional TO-220.
The report presents a deep technology analysis of the packaging and the components with TEM images of the complex GaN epitaxy layer stack and transistor structure.
It also includes production cost analysis and overall comparison with GaN Systems GS66508P 650V HEMT.
More information on that report at http://www.i-micronews.com/reports.html
Bosch Mid Range Radar (MRR) Sensor - teardown reverse costing report publishe...
A compact, cost-effective and high-performance driving assistance system.
The Mid Range Radar Sensor, with its three Transmitter and four Receiver channels, operates in the 76-77 GHz frequency band that is standard for automotive radar applications. The front version works with an aperture angle of up to +/- 45 degrees and can detect objects up to 160 meters away. With a compact design (using fan-out RF components from Infineon), the system is easy to integrate into a vehicle’s body.
The system integrates two electronic boards including Bosch, Freescale and STMicroelectronics circuits. The RF board is manufactured with an asymmetric structure using Hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHZ SiGe Monolithic Microwave Integrated Circuits (MMIC) are used as High-Freqency transmitter and receiver.. The two RF dies are packaged is the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon.
Relative Humidity Sensors Technology and Cost Review - teardown reverse cost...
Humidity Sensors from the main players analyzed and compared!
Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years.
In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost.
Single-chip and multi-chip devices are compared between suppliers and references evolution.
Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration.
The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.
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InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...
InvenSense MP67B
6-Axis MEMS IMU in iPhone 6 & 6 Plus
InvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.
More information on that report at http://www.i-micronews.com/reports.html
Yole freescale fxth87 MEMS TPMS 2015 teardown reverse costing report publishe...
This 150-page report provides a full reverse costing analysis of Freescale's FXTH87 Tire Pressure Monitoring Sensor (TPMS). The report includes a detailed teardown analysis of the package, ASIC die, MEMS pressure sensor die, and MEMS accelerometer die. Manufacturing process flows are established for the ASIC front-end, MEMS pressure sensor, and MEMS accelerometer. Cost analyses are conducted for the various components and manufacturing steps. The report also provides a cost comparison with Infineon's competing SP37 TPMS solution and analyzes the evolution of Freescale's previous-generation TPMS devices.
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
The first MEMS IMU (3-Axis Gyro + 3-Axis Accelero on the same die) from Maxim Integrated (Maxim) in industry thinnest 3x3x0.83mm package
With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.
The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.
Assembled in a LGA 3.0x3.0x0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.
The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.
Discover all the details in the report!
SETi - UVTOP270TO39HS and SS35DF227513 UVC LEDs for Disinfection and Chemical...
Deep ultraviolet LEDs with 275nm peak emission in 0.1mm² and 1mm² dies.
This report combines the analysis of two components in order to offer a broad vision of the technologies used by UVC LEDs in terms of applications and power output. The UVTOP270TO39HS and SS35DF227513 are two 275nm UVC LEDs from Sensor Electronic Technology Inc. (SETi). The UVTOP270TO39HS, with its hemispherical lens and 0.1mm² LED, is adapted for fluorescent spectroscopy and chemical /
biological analysis. The SS35DF227513, with its flat window, is designed for disinfection.
The two LED dies are based on the same technology: an AlN template layer deposited on a sapphire substrate. The AlGaN active layers are epitaxied on the AlN layer, but the thickness is very different between the two dies. The SS35DF227513 is manufactured using the latest SETi technological evolution. The new AlN and AlGaN structure reduces the defect density to enhance external quantum efficiency. At 1mm², the SS35DF227513 is 9x taller than SETi’s first UVC LED and boasts 15x more power.
The TO39 with a hemispherical lens is an expensive package, but it is destined for instrumentation. The new SMD3535 package in the SS35DF227513’s ceramic is cheaper and designed for disinfection with a large viewing angle and better thermal resistance that allows continuous use of the 1mm² LED.
This report delivers a deep technology analysis of the packaging and the components, with images of the complex AlN and AlGaN epitaxy layer stack and electrode structure. Also included are a production cost analysis and an overall comparison with the first SETi UVC LED.
More information on that report at http://www.i-micronews.com/reports.html
Toyota Prius 4 PCU Power Modules - teardown reverse costing report published ...
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system.
For its latest Prius 4 Toyota has designed a new power control unit (PCU). The PCU has two types of power module, one for the motor inverter and the other for the boost converter and generator inverter.
PCU power module toyota prius 4 system plus consulting
The module integrates Toyota’s latest power card packaging, with double side cooling. It allows the modularity and scalability of the PCU’s inverters to be optimized and also enables better thermal dissipation thanks to the use of copper heatsinks and spacers. The power cards can be placed in parallel to have a single thermal dissipation circuit in a limited space.
This package includes two pairs of wire bonded IGBTs and freewheeling diodes and is plastic molded.
This report offers a deep technical analysis of the module structure, packaging, and of the IGBT and diode die.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode.
Moreover, the report compares the Prius 4 PCU with the Chevrolet Volt power module, analyzing the technical choices of the packaging and the die. This comparison highlights the huge differences in design and manufacturing process and their impact on device size and production cost.
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
This reverse costing study analyzes the manufacturing cost and estimated selling price of the STMicroelectronics LSM9DS0 9-axis MEMS IMU component. The LSM9DS0 integrates a 3-axis gyroscope, 3-axis accelerometer, and 3-axis magnetometer. It is produced in a 4x4x1mm LGA 24-pin package. The report details the physical analysis of the device and its dies, the manufacturing processes, and provides a cost analysis that estimates the total cost to be $4.28.
Continental ARS4-A 77GHz Radar 2017 teardown reverse costing report published...
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Bosch SMI130 6-Axis Automotive MEMS IMU 2015 teardown reverse costing report ...
This document provides a reverse costing analysis of the Bosch SMI130 6-Axis MEMS IMU. It begins with an executive summary describing the SMI130's key characteristics. The physical analysis identifies the package and die details. Manufacturing process flow is then examined, including the ASIC front-end, MEMS front-end, and packaging back-end stages. A cost analysis is conducted to estimate production costs. Finally, estimated selling prices are provided based on manufacturer financial ratios. The analysis aims to provide technology and cost insights into this MEMS inertial sensor.
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
Maxim Integrated MAX30102 Optical Heart-Rate Sensor 2016 teardown reverse cos...
Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7
Maxim Integrated is a respected supplier for Samsung’s mobile phone flagships. From the 5th generation Galaxy S5 to the latest Galaxy S7, Maxim’s heart-rate sensor has always been found in the back of the smartphone. The Galaxy S7 uses the latest version of the heart-rate sensor, designed for both smartphone and wearables but very different to previous versions: the MAX30102.
The Samsung Galaxy S7 heart-rate sensor is located on the main board of the smartphone under the camera. The sensor is an optical heart-rate module and a pulse oximeter sensor in an LED reflective solution.
The main die features a photodiode area and an analysis part, with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim’s proprietary technology. The component features two LEDs: one infra-red (IR) and one red. The LEDs are bonded on silicon substrates, the IR led is manufactured from AlInGaP material and the red LED from GaAs material.
The component is assembled with multiple devices in the package. Compared to the previous generation the design footprint and packaging are totally different. This has made the component more reliable.
Thanks to all these innovations, the MAX30102 is very cost effective, enforcing Maxim’s leadership in this domain.
Complete chip fabrication processes and cost estimation are presented in the report. It also includes comparison with the previous generation of the sensor that can be found in the Samsung Galaxy S6, highlighting and measuring all the differences.
More information on that report at http://www.i-micronews.com/reports.html
Wolfspeed C3M™ Platform SiC 900V MOSFET - teardown reverse costing report pub...
This document provides a summary of a report by System Plus Consulting on Wolfspeed's 900V SiC MOSFET family. The report includes a technical and cost analysis of Wolfspeed's third generation C3M0280090D 900V 11.5A SiC MOSFET device, an overview of the C3M0120090D and C3M0065090D, and a cost evolution analysis over five years. It also compares the C3M family to previous generations of Cree SiC MOSFETs and provides a cost comparison to Infineon Si MOSFETs and GaN Systems GaN HEMTs.
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...
The document provides a reverse costing analysis of the Qorvo TQF-6405 front-end module used in the Apple iPhone 6s Plus. It includes a physical analysis of the component and its packaging. The report focuses on the manufacturing cost analysis of the SMR BAW filter die. It estimates the cost of materials and manufacturing steps to determine the total cost of the MEMS wafer and die. This cost is then used to estimate the potential selling price based on the company's financial ratios.
Infineon DPS310 Capacitive Pressure Sensor
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module 2016 teardown reverse cos...
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
More information on that report at http://www.i-micronews.com/reports.html
Continental MFC430T and ZF-TRW S-Cam 3 and Bosch–MPC2 reports - teardown reve...
• Detailed Photos
• Precise Measurements
• Material Analysis
• Complete Bill of Material
• Component Pricing
• Image Sensor Detailed Analysis
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• Supply Chain Evaluation
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Transphorm TPH3002PS 600V GaN on Silicon HEMT 2015 teardown reverse costing r...
High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package
The TPH3002PS is a 600V EZ-GaN™ HEMT for high frequency operations from Transphorm. Manufactured by Fujitsu and assembled in a TO220 package, it features the Quiet-TabTM scheme which increases switching speed by 200%. With a 7.5ns turn-on and a 10ns turn-off, the TPH3002PS has a higher switch frequency than the best CoolMOS.
The TPH3002PS is based on a cascode configuration of a GaN on Silicon HEMT transistor to hold the high voltage and a standard low voltage MOSFET to drive high frequency and to make a normally-off transistor from a normally-on GaN HEMT.
The device is assembled in a TO220 package for an easy integration in converter electronic system. Moreover, it integrates a Quiet-Tab™ and a Gate-Source-Drain (GSD) pin-out arrangement in order to reduce the parasitic inductance and capacitance in high frequency and to allow 200% increase in switching speed compared to traditional TO-220.
The report presents a deep technology analysis of the packaging and the components with TEM images of the complex GaN epitaxy layer stack and transistor structure.
It also includes production cost analysis and overall comparison with GaN Systems GS66508P 650V HEMT.
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A compact, cost-effective and high-performance driving assistance system.
The Mid Range Radar Sensor, with its three Transmitter and four Receiver channels, operates in the 76-77 GHz frequency band that is standard for automotive radar applications. The front version works with an aperture angle of up to +/- 45 degrees and can detect objects up to 160 meters away. With a compact design (using fan-out RF components from Infineon), the system is easy to integrate into a vehicle’s body.
The system integrates two electronic boards including Bosch, Freescale and STMicroelectronics circuits. The RF board is manufactured with an asymmetric structure using Hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHZ SiGe Monolithic Microwave Integrated Circuits (MMIC) are used as High-Freqency transmitter and receiver.. The two RF dies are packaged is the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon.
Relative Humidity Sensors Technology and Cost Review - teardown reverse cost...
Humidity Sensors from the main players analyzed and compared!
Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years.
In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost.
Single-chip and multi-chip devices are compared between suppliers and references evolution.
Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration.
The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.
Denso DNMWR009 Cruise Control Radar Distance Sensor
A cruise control radar distance sensor with Infineon SiGe CMOS Technology for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnmwr009-cruise-control-radar-distance-sensor/
Denso DNSRR004 Short Range Radar
A PTFE-free radar, with single receive-transmit MMIC based on TowerJazz’s SiGe CMOS technology, for the first time associated with a phased array antenna.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnsrr004-short-range-radar/
Samsung Galaxy S5 Home Button Synaptics Fingerprint Sensor teardown reverse c...
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
The global capsule endoscopy systems market is expected to show a significant growth with the rise in aging population who require much medical care. However, since 2009, the number of new patent applications are decreasing. As the industry matures, there’s less and less room for breakthrough innovation and fundamental patents that could shape the industry. In such conditions, we can expect an increase in patent cross-licensing agreements, acquisitions (e.g. Covidien acquisition of Given Imaging) and litigation between the industry players in the next few years.
Capsule endoscopy is a medical procedure which has revolutionized endoscopy as it has enabled for the first time a painless inspection of the small intestine. The procedure was unveiled in 2000 and is based on a vitaminsize pill which captures images of the digestive tract while it is transported passively by peristalsis. The device consists of an image sensor, an illumination module, a radio-frequency transmitter and a battery.
More information on that report at http://www.i-micronews.com/reports/Capsule-Endoscopy-Patent-Landscape-2014/4/458/
mCube Single-Chip 3-Axis Accelerometer teardown reverse costing report publis...
NewplayermCube,mainlyactiveontheChinesemarket,isgettingtractionwithnewtechnologiesallowingverylowmanufacturingcostwithoutdecreasingperformance.mCubemanagedtodesignasmartintegrationandistheonlyproviderofsingle-chipaccelerometersforconsumerelectronics.
mCube3DMEMSprocessconsistsinMEMSelementsfabricatedontopofthedriveICandconnectedusingthroughsiliconvias(TSV).ToprotecttheMEMSelements,acapissealedwithaneutecticalloybondingprocess.
ThemCubeaccelerometerisassembledinastandardLGA2x2mmpackage.
Withthiscleverintegration,mCubeispositionedonestepaheadofSTMicroelectronicsandBoschSensortecrelatedtosizeandmanufacturingcost
Ainstein T-79: Automotive 79GHz Short Range Radar
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse co...
The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS.
Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market...
AMS AV-MLV-P2 VOC MEMS Gas Sensor 2015 teardown reverse costing report publis...
irst product of AMS in their new gas sensor activity after the acquisition of AppliedSensor.
Still focused on industrial and building applications with low volume, the gas sensor begins to penetrate the consumer market. It is a change in the market and volume.
It is to enter this growing market that AMS bought AppliedSensor in July 2014. Winning strategy with the integration of the first sensor for the Consumer in a home monitor from Withings.
The AV-MLV-P2 is a volatile organic compounds gas sensor which can detect alcohols, aldehydes, ketones, organic acids, amines, aliphatic and aromatic hydrocarbons.
With a very small footprint, less than to 3mm², the die sensor of the AV-MLV-P2 is well adapted to consumer applications.
Coming from industry, the technologies of AMS/AplliedSensor are reliable, robust, accurate and mature. The die is based on a Metal Oxide sensitive layer made on a micro hotplate. This allows a low power consumption: 34mW in continuous operation.
The experience of AppliedSensor in specific nitride layers explains the very thin membrane. A platinum heater and an electrode structure complete the micro hotplate.
Yole AMS AV MLV P2 VOC MEMS Gas Sensor July 2015 Image1
The report provides all details on the structure of the component and the supply chain to produce this MEMS sensor. The report includes a detailed technology and cost analysis describing the innovations of AMS AplliedSensor.
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.
The Audi A8 zFAS ADAS Platform by Aptiv
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Infineon RASIC: RRN7740 & RTN7750 76GHz Radar Dies teardown reverse costing r...
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- The terms cannot be modified and any
Mando MRR20 77GHz Mid-Range Radar
This document provides a teardown analysis and cost report of the Mando MRR20 77GHz mid-range radar. The report includes a teardown analysis of the electronic board and housing, a cost analysis estimating material and manufacturing costs, and an estimated manufacturer price analysis. The teardown analysis includes high-resolution photos of the electronic board and identification of key components. The cost analysis builds a bill of materials and estimates costs for the PCB, integrated circuits, housing, and manufacturing costs. The report concludes with an estimated manufacturer price for the radar system.
OSRAM OSTAR Automotive Headlamp Pro
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
Continental SRR3-B 24GHz Blind-Spot Radar - 2018 teardown reverse costing re...
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
Investor presentation deck q1 v4 short
The document is an investment opportunity overview for Square1 Energy, LLC that aims to reduce emissions and increase fuel efficiency for combustion engines using their Hydro-Maxx technology. It describes the benefits of the technology such as reduced emissions by 60-100%, fuel savings of 10-40%, and increased engine power and torque. It also provides market analysis estimates for potential revenue opportunities in North America and discusses the management team's experience.
Investor presentation deck q1 v2 short
This investment document summarizes an opportunity to invest in Square1 Energy, LLC, a company that has developed a technology called Hydro-Maxx to reduce emissions and fuel consumption in combustion engines. The technology injects hydrogen and oxygen gas into engines. Test results show reductions in emissions of 10-100% and fuel savings of 10-40%. The document is seeking $500,000 from investors and outlines the management team, product, market opportunity, test results, and current business developments.
LG Display Medianav ECU Available in the Dacia Duster
A competitive high resolution, high luminance and wide viewing angle automotive display.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/lg-display-medianav-ecu-available-in-the-dacia-duster/
Aptiv’s Third Generation of 77 GHz-Based Short-Range Radar (SRR3)
The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/aptivs-third-generation-of-77-ghz-based-short-range-radar-srr3/
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Denso DNMWR009 Cruise Control Radar Distance Sensor
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mCube Single-Chip 3-Axis Accelerometer teardown reverse costing report publis...
mCube Single-Chip 3-Axis Accelerometer teardown reverse costing report publis...
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AMS AV-MLV-P2 VOC MEMS Gas Sensor 2015 teardown reverse costing report publis...
AMS AV-MLV-P2 VOC MEMS Gas Sensor 2015 teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Infineon RASIC: RRN7740 & RTN7750 76GHz Radar Dies teardown reverse costing r...
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FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
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Continental SRR3-B 24GHz Blind-Spot Radar - 2018 teardown reverse costing re...
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LG Display Medianav ECU Available in the Dacia Duster
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Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
Programming Foundation Models with DSPy - Meetup Slides
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
Best 20 SEO Techniques To Improve Website Visibility In SERP
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Skybuffer SAM4U tool for SAP license adoption
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
UiPath Test Automation using UiPath Test Suite series, part 6
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
June Patch Tuesday
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
みなさんこんにちはこれ何文字まで入るの？40文字以下不可とか本当に意味わからないけどこれ限界文字数書いてないからマジでやばい文字数いけるんじゃないの？えこ...
ここ3000字までしか入らないけどタイトルの方がたくさん文字入ると思います。
Main news related to the CCS TSI 2023 (2023/1695)
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
HCL Notes and Domino License Cost Reduction in the World of DLAU
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Introduction of Cybersecurity with OSS at Code Europe 2024
I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
The first topic is CVE (Common Vulnerabilities and Exposures). I have published CVEs many times. But what exactly is a CVE? I'll provide a basic understanding of CVEs and explain how to detect and handle vulnerabilities in OSS.
Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
I'll share insights into how the Ruby and RubyGems core team works to keep our ecosystem safe. By the end of this talk, you'll have a better understanding of how to safeguard your code.
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
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Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean Lotus cyber threat actors represent a sophisticated, persistent, and politically motivated group that poses a significant risk to organizations and individuals in the Southeast Asian region. Their continuous evolution and adaptability underscore the need for robust cybersecurity measures and international cooperation to identify and mitigate the threats posed by such advanced persistent threat groups.
National Security Agency - NSA mobile device best practices
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
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みなさんこんにちはこれ何文字まで入るの？40文字以下不可とか本当に意味わからないけどこれ限界文字数書いてないからマジでやばい文字数いけるんじゃないの？えこ...
みなさんこんにちはこれ何文字まで入るの？40文字以下不可とか本当に意味わからないけどこれ限界文字数書いてないからマジでやばい文字数いけるんじゃないの？えこ...
HCL Notes and Domino License Cost Reduction in the World of DLAU
HCL Notes and Domino License Cost Reduction in the World of DLAU
Introduction of Cybersecurity with OSS at Code Europe 2024
Introduction of Cybersecurity with OSS at Code Europe 2024
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
National Security Agency - NSA mobile device best practices
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SMA Sunny Island 6.0H Off-grid and On-grid Solar Battery Inverter 2016 teardown reverse costing report published by Yole Developpement
- 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr March 2016 - Version 1 written by David LE GAC
- 2. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 1. Overview/Introduction 3 – Executive Summary – Company Profile: SMA – SMA Sunny Island 6.0H Main Features – Reverse Costing Methodology 2. Physical Analysis 11 Views and Dimensions of the Packaging Packaging Opening Accessories Box Views and Dimensions of the Inverter Inverter Opening Specific Power Transformer Electronic Boards • Main Board – Top Side – Global View • Main Board – Top Side – High Definition Photo • Main Board – Top Side – Components Identification • Main Board – Bottom Side – Global View • Main Board – Bottom Side – High Definition Photo • Main Board – Bottom Side – Components Identification • Power Board • Control Board • Interface Board 3. Cost Analysis 57 – Accessing the BOM – Estimation of the cost of the PCBs – Estimation of the Housing Part Cost – Estimation of the Front Cover Part Cost – BOM Cost - Packaging – BOM Cost - Housing – BOM Cost - Main Board – BOM Cost - Power Board – BOM Cost - Control Board – BOM Cost - Interface Board – Material Cost Breakdown – Accessing the Added Value (AV) cost – Main Board Manufacturing Flow – Details of the Main Board AV Cost – Details of the Housing Assembly & Test Costs – Details of the Packaging Assembly AV Cost – Added Value Cost Breakdown – Manufacturing Cost Breakdown 4. Estimated Price Analysis 90 – Estimation of the Manufacturing Price – Functional Cost Breakdown Contact 94
- 3. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3 This Reverse Costing analysis has been conducted in several phases : • The initialization of the analysis Pictures of the elements to be studied. Identification of the components. • Description of the material in the “SYScost+” software Creation of an “estimation project” of the studied board with SYScost+software. Construction of the Bill of Material (BOM). • Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. • Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. • Production cost & selling price Estimation of the production cost & selling price. • Report A report is edited. SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
- 4. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4
- 5. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
- 6. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
- 7. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
- 8. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
- 9. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
- 10. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
- 11. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11
- 12. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12
- 13. SMA Sunny Island 6.0H Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 13 • The Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. • These results are open for discussion. We can re-evaluate this system with your information. Please contact us: • Consulting and Specific Analysis – North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – Japan & Asia: Takashi Onozawa, Representative Director, Yole KK Email: onozawa@yole.fr – RoW: Jean-Christophe Eloy, CEO & President, Yole Développement Email eloy@yole.fr • Report business – North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: khamassi@yole.fr – Japan & Asia: Takashi Onozawa, Representative Director, Yole KK. Email: onozawa@yole.fr – Korea: Hailey Yang, Business Development Manager, Korean Office Email: yang@yole.fr – Taiwan: Mavis Wang, Business Development Director Email: wang@yole.fr • Financial services – Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr • General: Email: info@yole.fr