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Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse costing report published by Yole Developpement

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Yole Developpement
Yole Developpement

The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS. Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market...

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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr January 2015 - Version 1 written by David Le Gac
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 This Reverse Costing analysis has been conducted in several phases : • The initialization of the analysis Pictures of the elements to be studied. Identification of the components. • Description of the material in the “SYScost+” software Creation of an “estimation project” of the studied board with SYScost+software. Construction of the Bill of Material (BOM). • Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. • Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. • Production cost & selling price Estimation of the production cost & selling price. • Report A report is edited. SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3 Global view of the Seek Thermal Camera. Total Weight: 14g Rear Cover Lens Micro-USB Connector Front Cover Lens Hood
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 6 PGDW: Potential Good Dies per Wafer
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Microbolometer level – SEM View
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 8
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 10
Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: North America Office • Steve LaFerrière, Director of Northern America Business Development, YOLE INC Cell Phone: +1 (310) 600 8267, Email: laferriere@yole.fr Europe/USA Office • David Jourdan, Headquarter Sales Coordination & Customer Service, Lyon - France Tel: 33 472 83 01 90, Email: jourdan@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell: (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. (Tokyo) Phone: (81) 36 869 6970 - Cell: (81) 80 4371 4887 - Email: onozawa@yole.fr Korea Office • Hailey Yang, Business Development Manager (Seoul) Phone: (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 - Email: yang@yole.fr

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Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse costing report published by Yole Developpement

  • 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr January 2015 - Version 1 written by David Le Gac
  • 2. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 This Reverse Costing analysis has been conducted in several phases : • The initialization of the analysis Pictures of the elements to be studied. Identification of the components. • Description of the material in the “SYScost+” software Creation of an “estimation project” of the studied board with SYScost+software. Construction of the Bill of Material (BOM). • Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. • Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. • Production cost & selling price Estimation of the production cost & selling price. • Report A report is edited. SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.
  • 3. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3 Global view of the Seek Thermal Camera. Total Weight: 14g Rear Cover Lens Micro-USB Connector Front Cover Lens Hood
  • 4. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4
  • 5. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 5
  • 6. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 6 PGDW: Potential Good Dies per Wafer
  • 7. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Microbolometer level – SEM View
  • 8. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  • 9. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 9
  • 10. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  • 11. Seek Thermal Camera Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: North America Office • Steve LaFerrière, Director of Northern America Business Development, YOLE INC Cell Phone: +1 (310) 600 8267, Email: laferriere@yole.fr Europe/USA Office • David Jourdan, Headquarter Sales Coordination & Customer Service, Lyon - France Tel: 33 472 83 01 90, Email: jourdan@yole.fr Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell: (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. (Tokyo) Phone: (81) 36 869 6970 - Cell: (81) 80 4371 4887 - Email: onozawa@yole.fr Korea Office • Hailey Yang, Business Development Manager (Seoul) Phone: (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 - Email: yang@yole.fr