Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse costing report published by Yole Developpement

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The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS. Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
January 2015 - Version 1 written by David Le Gac

Seek Thermal Camera
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This Reverse Costing analysis has been conducted in several phases :
• The initialization of the analysis
Pictures of the elements to be studied.
Identification of the components.
• Description of the material in the “SYScost+” software
Creation of an “estimation project” of the studied board with SYScost+software.
Construction of the Bill of Material (BOM).
• Assessing the material
Searching for the price of each reference among distributors and manufacturers.
Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)
The BOM is valued with SYScost+ : price simulation according to the requested quantities.
• Assessing the assembling and test phases
Assembly and test lines are modeled with the SYScost+ software.
The assembly and tests costs are estimated.
• Production cost & selling price
Estimation of the production cost & selling price.
• Report
A report is edited.
SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More
information on the software can be found at www.systemplus.fr.

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Global view of the Seek Thermal Camera.
Total Weight: 14g
Rear Cover
Lens
Micro-USB
Connector
Front Cover
Lens Hood

Seek Thermal Camera
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Seek Thermal Camera
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Seek Thermal Camera
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PGDW: Potential Good Dies per Wafer

Seek Thermal Camera
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Microbolometer level – SEM View

Seek Thermal Camera
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Seek Thermal Camera
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Seek Thermal Camera
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Seek Thermal Camera
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
North America Office
• Steve LaFerrière, Director of Northern America Business Development, YOLE INC
Cell Phone: +1 (310) 600 8267, Email: laferriere@yole.fr
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• David Jourdan, Headquarter Sales Coordination & Customer Service, Lyon - France
Tel: 33 472 83 01 90, Email: jourdan@yole.fr
Japan Office
• For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Phone: (81) 362 693 457 - Cell: (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: katano@yole.fr
• For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. (Tokyo)
Phone: (81) 36 869 6970 - Cell: (81) 80 4371 4887 - Email: onozawa@yole.fr
Korea Office
• Hailey Yang, Business Development Manager (Seoul)
Phone: (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 - Email: yang@yole.fr

Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost! Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation. The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer… On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously. To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.

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Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war. Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology. The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core. Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module. The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.

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3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027. INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report. For more information please visit our website: https://www.i-micronews.com/reports.html

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An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer. Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision. The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time. More information on that report at http://www.i-micronews.com/reports.html

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The interministerial project AWARE a consortium of 10 renowned French industrials firms launched in 2014 for a duration of 36 months.This project aims to develop a driver-and pilot-assistance solution for improving decision-making in all types of vehicles (road or airborne). The solution offers reliable detection of vulnerable pedestrians or obstacles in all weathers conditions (fog, rain, at night).Thermal imagers developed by ULIS address to this need on the spectral range 8-14µm (LWIR) in contrast to other available technologies (visible, NIR, SWIR).

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Relative Humidity Sensors Technology and Cost Review - teardown reverse cost...

Yole Developpement

Humidity Sensors from the main players analyzed and compared! Humidity sensors are integrated in many different consumer applications; in each of them different specifications are required. Moreover humidity sensors are integrated in environmental sensors for mobile applications; especially in harsh environment devices. An increase of humidity sensors market is forecasted by next years. In this report, humidity sensors from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost. Single-chip and multi-chip devices are compared between suppliers and references evolution. Size and technology is very different for every player. Nevertheless, the mainly used technology is the capacitive one. Moreover the majority of components are single-chip devices. Some devices, such as Bosch environmental sensor for example, are paving the way for the multichip integration. The report includes a description of each humidity sensor device and a comprehensive supply chain evaluation. The cost of each device is estimated and compared.

LG Display Medianav ECU Available in the Dacia Duster

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Infineon RASIC: RRN7740 & RTN7750 76GHz Radar Dies teardown reverse costing r...

Yole Developpement

New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon The new integrated Radar and Camera (RACam) 76GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology. The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB. The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers. The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.

Intel® Curie™ Module High Density System-in-Package for IoT 2016 teardown rev...

Yole Developpement

Ultra-small, low-power hardware module for wearables Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3. This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module. Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top. More information on that report at http://www.i-micronews.com/reports.html

SiTime Corporation SiT1552 MEMS Oscillator 2015 teardown reverse costing repo...

Yole Developpement

THE SMALLEST MEMS OSCILLATOR ON THE MARKET ASSEMBLED IN AN INNOVATIVE WAFER LEVEL CHIP SIZE PACKAGE SiTime presents its first MEMS oscillator assembled in Wafer Level Chip Scale package to get the word smallest (1.2mm2) ultra-low power oscillator for consumer and industrial applications. SiTime is taking fully benefit of all semiconductor manufacturing processes and infrastructures in order to develop a really compact device and compete with quarts solutions for the same application. This full Reverse Costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the SiTime SiT1552 low-power 32kHz Temperature Compensated Crystal Oscillator. The report includes comparisons with SiT8002 Oscillator and with the Dicera DSC8002 and Silicon Lab Si504 Oscillators. SiTime SiT1552 uses an innovative 1.55x0.85 mm Wafer Level Chip Scale Packaging containing two stacked dies: a MEMS oscillator and an ASIC for signal conditioning. The MEMS oscillator is flipped and connected to the ASIC by solder bumps. The component is protected by a polymeric coating and electrically connected by solder balls. For this new generation oscillator, SiTime has integrated many new technologies in order to be competitive to quartz devices. The MEMS oscillator is manufactured on SOI wafer using MEMSFirstTM and EpiSealTM processes licensed by Robert Bosch GmbH.

Continental MFC430T and ZF-TRW S-Cam 3 and Bosch–MPC2 reports - teardown reve...

Yole Developpement

ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...

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Maxim Integrated MAX30102 Optical Heart-Rate Sensor 2016 teardown reverse cos...

Yole Developpement

Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7 Maxim Integrated is a respected supplier for Samsung’s mobile phone flagships. From the 5th generation Galaxy S5 to the latest Galaxy S7, Maxim’s heart-rate sensor has always been found in the back of the smartphone. The Galaxy S7 uses the latest version of the heart-rate sensor, designed for both smartphone and wearables but very different to previous versions: the MAX30102. The Samsung Galaxy S7 heart-rate sensor is located on the main board of the smartphone under the camera. The sensor is an optical heart-rate module and a pulse oximeter sensor in an LED reflective solution. The main die features a photodiode area and an analysis part, with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim’s proprietary technology. The component features two LEDs: one infra-red (IR) and one red. The LEDs are bonded on silicon substrates, the IR led is manufactured from AlInGaP material and the red LED from GaAs material. The component is assembled with multiple devices in the package. Compared to the previous generation the design footprint and packaging are totally different. This has made the component more reliable. Thanks to all these innovations, the MAX30102 is very cost effective, enforcing Maxim’s leadership in this domain. Complete chip fabrication processes and cost estimation are presented in the report. It also includes comparison with the previous generation of the sensor that can be found in the Samsung Galaxy S6, highlighting and measuring all the differences. More information on that report at http://www.i-micronews.com/reports.html

Toyota Prius 4 PCU Power Modules - teardown reverse costing report published ...

Yole Developpement

Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system. For its latest Prius 4 Toyota has designed a new power control unit (PCU). The PCU has two types of power module, one for the motor inverter and the other for the boost converter and generator inverter. PCU power module toyota prius 4 system plus consulting The module integrates Toyota’s latest power card packaging, with double side cooling. It allows the modularity and scalability of the PCU’s inverters to be optimized and also enables better thermal dissipation thanks to the use of copper heatsinks and spacers. The power cards can be placed in parallel to have a single thermal dissipation circuit in a limited space. This package includes two pairs of wire bonded IGBTs and freewheeling diodes and is plastic molded. This report offers a deep technical analysis of the module structure, packaging, and of the IGBT and diode die. Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode. Moreover, the report compares the Prius 4 PCU with the Chevrolet Volt power module, analyzing the technical choices of the packaging and the die. This comparison highlights the huge differences in design and manufacturing process and their impact on device size and production cost.

Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...

Yole Developpement

Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm. The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs. The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. COMPLETE TEARDOWN WITH: - Detailed Photos - Precise Measurements - Material Analysis - Manufacturing Process Flow - Supply Chain Evaluation - Manufacturing Cost Analysis - Selling Price Estimation - Comparison with previous technology choices from Sony More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/

Xiaomi Mi 8 Explorer Teardown and Identification of Key Components

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OSRAM OSTAR Automotive Headlamp Pro

Yole Developpement

igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment. The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report. Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency. This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM. More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/

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