2. Current design Heat Flow
Chips PCB
Heat sink
Fin
Air and
The Shell
Fan
Led package
Single High Powder
Cu Sheet
Cu Heat Pipe
Passive Heat
Conductive
Active Cooling Air Flow
4. A. Led Package Arrangement
Chips PCB
Led package
Single High Powder
Chips PCB
Chips PCB
Chips PCB
Chips PCB
Led package
Muti Low Powder
Current
Heat
Power
Heat Concentration
Number
5. B1. Redesign Heat Sink
Rectangular Heatsink
Passive Heat Conductive
Cylinder Heatsink
Area
Heat
Heat Conductivity
Shape
Better Passive Heat Conductive
Heatsink
Cu heatpipe
Heatsink
Cu heatpipe
Volume
7. C. Redesign the Fan to SynJet
Regular Fan SynJet
Life
Less Dust
Energy
https://www.youtube.com/watch?v=YADj5kWYiPs
Fan
Active Cooling Better Active Cooling
SynJet
Volume
Weight
x 10
Dust in and stay Dust one way out
8. D. Redesign the Shell
Original Shell New Shell
Air Flow
Volume
Original
Shell
Air flow Better Air flow
New
Shell
Weight
Space
Heat Flow
9. E. Other Methods
Materials Heat Conductive
Manufacturing
Cheap
Heat Resistance
Coating
Copper
other choice?
Heat Conductive
Water Resistance
Anti-aging
Adhesion
Ceramics
other choice?
Designs
Area
Air Flow
Size
Heat Conductive
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