For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.
The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
This report analyzes and compares 24 camera modules from consumer and automotive applications. It examines 19 camera modules from flagship smartphones, including rear-facing standard, dual, and 3D modules as well as front-facing standard and dual/iris scanner modules. Physical analysis of the modules provides insights into their structure, integration, lenses, sensor resolution, and pixel size. It also analyzes 5 automotive camera modules. The report explains technology choices by major players and compares competitors. Mobile technology is driving demands for better performance in constrained footprints, transforming sensor technology with stacked BSI.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Image Signal Processor and Vision Processor Market and Technology Trends 2019...Yole Developpement
The document provides an in-depth analysis of the image signal processor and vision processor market including market forecasts, trends, technologies, and ecosystems from 2019-2024. It examines the IP and silicon markets, applications in mobile and automotive, and provides forecasts for unit shipments and revenues for ISPs and VPs by application. Key trends discussed include the growth of AI and computer vision algorithms in mobile and automotive vision systems.
SOFTWARE-DEFINED SUCCESS: THE NEXT GENERATION OF AUTOMOTIVE LIDARiQHub
The document discusses AEye's 4Sight software defined lidar solution, which uses a bistatic system architecture to enable programmable scanning capabilities. This allows for customized scan patterns based on use cases. AEye's business model involves licensing agreements with automotive tier-1 suppliers to develop lidar products for advanced driver assistance systems and autonomous vehicles. AEye has partnered with Continental to define requirements and develop vehicle-specific lidar products for automotive and industrial applications.
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
This report analyzes and compares 24 camera modules from consumer and automotive applications. It examines 19 camera modules from flagship smartphones, including rear-facing standard, dual, and 3D modules as well as front-facing standard and dual/iris scanner modules. Physical analysis of the modules provides insights into their structure, integration, lenses, sensor resolution, and pixel size. It also analyzes 5 automotive camera modules. The report explains technology choices by major players and compares competitors. Mobile technology is driving demands for better performance in constrained footprints, transforming sensor technology with stacked BSI.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
Image Signal Processor and Vision Processor Market and Technology Trends 2019...Yole Developpement
The document provides an in-depth analysis of the image signal processor and vision processor market including market forecasts, trends, technologies, and ecosystems from 2019-2024. It examines the IP and silicon markets, applications in mobile and automotive, and provides forecasts for unit shipments and revenues for ISPs and VPs by application. Key trends discussed include the growth of AI and computer vision algorithms in mobile and automotive vision systems.
SOFTWARE-DEFINED SUCCESS: THE NEXT GENERATION OF AUTOMOTIVE LIDARiQHub
The document discusses AEye's 4Sight software defined lidar solution, which uses a bistatic system architecture to enable programmable scanning capabilities. This allows for customized scan patterns based on use cases. AEye's business model involves licensing agreements with automotive tier-1 suppliers to develop lidar products for advanced driver assistance systems and autonomous vehicles. AEye has partnered with Continental to define requirements and develop vehicle-specific lidar products for automotive and industrial applications.
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
The document discusses Wibree, a wireless technology introduced by Nokia that allows for connectivity between mobile devices/PCs and small battery-powered devices. Wibree uses very low power (10x less than Bluetooth) and is optimized for applications requiring years of battery life on small batteries. It operates at 2.4GHz, supports star and star-bus network topologies, and will be implemented via standalone Wibree chips or chips with dual Wibree/Bluetooth functionality. Potential applications include wireless keyboards, toys, health/fitness sensors, and other small devices.
This document is a seminar report on image sensor systems submitted by three students - Jayesh Mangroliya, Miral Modi, and Jaydeep Bhayani. It contains an abstract that describes how digital image sensors work, focusing on how photons are converted into electrical signals. It also details the differences between CCD and CMOS sensor architectures and various metrics used to analyze sensor performance. The report includes a comparison of recent CCD and CMOS sensors using these metrics and develops a model relating well capacity and conversion gain.
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2018-embedded-vision-summit-girardin
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Division Director for photonics, sensing and displays at Yole Développement, presents the "From 2D to 3D: How Depth Sensing Will Shape the Future of Vision" tutorial at the May 2018 Embedded Vision Summit.
For several decades, 3D imaging and sensing technologies have matured, thanks to extensive, successful deployments in high-end applications, mainly in medical and industrial markets. More recently, as 3D sensor costs have dropped, 3D imaging and sensing devices have become a significant business, generating almost $2B in revenue in 2017, with strong growth prospects driven by consumer devices such as the iPhone X with its TrueDepth camera module.
Currently there are three main depth sensing approaches on the market: stereo vision, structured light and time-of-flight. Each of these approaches has pros and cons, from a technical point of view and with respect to cost. Girardin explains the key strengths and weaknesses of each of these technologies and analyzes the cost of adding them to a system based on his firm's recent teardown analyses. He also gives an overview of this depth sensing sensor market and the main factors driving it, and explores how this market could shape the future of vision.
Mixed-critical adaptive AUTOSAR stack based on VxWorks, Linux, and virtualiza...Andrei Kholodnyi
Since the first release of its standard in 2003, AUTOSAR has established itself as one of the primary software development standards for the global automotive industry. As the automotive industry is a now undergoing one of the significant changes in its history toward autonomous driving, connectivity and electrification new standards are needed to handle the complexity regarding software architecture for controlling the high-end processors, Ethernet communication, and over-the-air updates in the cloud-connected automobiles. The recent advent of the Adaptive AUTOSAR standard can help accommodate the extensive and complex requirements of autonomous driving by enabling a flexible, dynamic, and service based platform while still maintaining the integrity of high degree of functional safety standards and also properly engaging with established platforms. The standard itself replies on some technologies which are already established in the industry such as virtualization, POSIX PSE51, C++11/14 for application development, ISO26262/ASIL compliance, etc.
This presentation provides example of an implementation of mixed critical Adaptive AUTOSAR stack based on VxWorks RTOS, embedded Linux, and virtualization profile from Wind River. As one of the very few solutions available on the market which is already fulfilling the requirements described above, VxWorks is a strong example of a foundational software platform for Adaptive AUTOSAR-based autonomous driving development. We will also explain what challenges we have encounter with during this process and make some suggestions to the AUTOSAR consortium of how to overcome them in the future.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
This document provides an overview and analysis of the LiDAR market from 2018-2024. It finds that the total LiDAR market is expected to grow at a 29% CAGR to $6 billion by 2024, driven primarily by the automotive sector. Within automotive, ADAS vehicles are forecasted to have a 55% CAGR and become the main application. The report also examines the various LiDAR technologies, players, investments, costs, and timelines for integration into vehicles. It finds that while over 50 companies are targeting the automotive market, industry consolidation is expected as only a limited number will succeed.
Data Driven Development of Autonomous Driving at BMWDataWorks Summit
"The development of autonomous driving cars requires the handling of huge amounts of data produced by test vehicles and solving a number of critical challenges specific to the automotive industry.
In this talk we will describe these challenges and how we, at BMW, are overcoming them by adapting and reinventing existing big data solutions for our end-to-end data journey for autonomous driving. Our journey involves ingesting data produced by a variety of sensors into a dedicated Hadoop cluster, decoding the data, conducting quality control, processing and storing the data on the clusters, making it searchable, analyzing it and exposing it to the engineers working on the algorithms development.
In the first part of the talk we will present a general overview of the challenges we faced and the lessons we learned from them. In the second part we will deep dive into the most interesting technical issues. These include: dealing with automotive formats and standards that are not designed for distributed processing; defragmentation of sensory data; assuring the quality of the data coming from complex car hardware and software components; efficient data search across petabytes of data; and reprocessing the computing components running in the car inside the data center, which typically requires high performance computing."
Speakers:
Felix Reuthlinger, Data Engineer for Autonomous Driving, BMW Group
Dogukan Sonmez, Senior Software Engineer, BMW Group
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
3D OPTICAL STORAGE TECHNOLOGY technical seminar 4B.pptxMallaAbhinaya
This document discusses optical storage and 3D optical data storage. It describes how optical storage works by using lasers to burn data into optical disks in a spiral track. 3D optical storage can store data in three dimensions rather than two, potentially storing much more data in the same physical space. Some challenges to commercializing 3D optical storage have been destructive reading processes and issues with media stability and sensitivity. The document outlines the basic components, processes, and form factors of 3D optical storage systems.
Symbian OS is a mobile operating system developed by Symbian for smartphones. It was originally developed as a closed-source OS (EPOC) by Psion in the 1990s. In 1998, Symbian was established to continue developing EPOC OS, which was subsequently renamed Symbian OS. Over several versions, it became the most widely used smart OS. While initially popular, Symbian eventually declined as Android and iOS rose. The final version was released in 2013 before Nokia abandoned the platform.
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/12/driver-monitoring-systems-present-and-future-a-presentation-from-xperi/
For more information about edge AI and computer vision, please visit:
https://www.edge-ai-vision.com
Petronel Bigioi, CTO for Imaging at XPERI, presents the “Driver Monitoring Systems: Present and Future” tutorial at the September 2020 Embedded Vision Summit.
Monitoring drivers and passengers inside of vehicles is an increasingly critical capability. For example, driver monitoring is required in order for cars to obtain a top safety rating from NCAP. This presentation introduces XPERI’s driver and in-cabin monitoring solutions and examines real-world use-cases in which these solutions are being deployed.
Bigioi illustrates the evolution of these technologies as they have been used in conventional cars, as they are increasingly being used in cars with partial self-driving capability, and how they are likely to be used in fully automated vehicles. This goes well beyond driver monitoring to include new types of safety features as well as non-safety uses such as entertainment, personalization, human-machine interfaces and even monitoring occupant health.
The document provides an overview of the Tizen operating system. It discusses Tizen's history as a collaboration between Intel, Samsung and others to create an open, cross-platform OS. The objective is for Tizen to support a wide range of devices from smartwatches to TVs and allow applications to easily connect across platforms using HTML5. The architecture is based on Linux and allows both web and native applications. While Tizen offers cross-device connectivity and openness, its market share currently lags behind Android.
the term paper gives an outlook on luxury car industry with consumption pattern of consumers also it contains specific details of Bentley and their communication efforts
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation.
Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.
Only End to End Infotainment Test Solution available in market for Broadcast, Navigation, Connectivity, Cellular Standards, Audio, Video and HMI Testing.
Automotive infotainment system is growing rapidly because of the advancement in technology. More and more new technologies and devices are integrated into the system. Connected automotive infotainment is becoming a must have feature for car manufacturers.
Engineers in the automotive industry face new challenges with infotainment systems, which now introduce additional I/O like audio, video, and RF signals into systems that already have other sensor measurements. MaxEye In-Vehicle Infotainment test solution is powered by National Instruments PXI Platform, Universal Radio Signal Generation Software and LabVIEW Add-on toolkits. NI PXI platform combined with powerful software toolkits and APIs enable engineers to perform complicated tests on the many different I/O types at the same time using one chassis.
- FPD-Link III is a serializer/deserializer interface solution from National Semiconductor that enables high-speed video transport throughout vehicles for infotainment and driver assist applications like camera interfaces.
- It provides a high-speed forward channel and low-speed bidirectional control channel on a single differential pair, replacing multiple interfaces and wires.
- National Semiconductor's proprietary technology allows for real-time bidirectional control without restrictions, improving on alternatives that only allow control during blanking intervals.
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2021/01/cmos-image-sensors-a-guide-to-building-the-eyes-of-a-vision-system-a-presentation-from-gopro/
Jon Stern, Director of Optical Systems at GoPro, presents the “CMOS Image Sensors: A Guide to Building the Eyes of a Vision System” tutorial at the September 2020 Embedded Vision Summit.
Improvements in CMOS image sensors have been instrumental in lowering barriers for embedding vision into a broad range of systems. For example, a high degree of system-on-chip integration allows photons to be converted into bits with minimal support circuitry. Low power consumption enables imaging in even small, battery-powered devices. Simple control protocols mean that companies can design camera-based systems without extensive in-house expertise. Meanwhile, the low cost of CMOS sensors is enabling visual perception to become ever more pervasive.
In this tutorial, Stern introduces the basic operation, types and characteristics of CMOS image sensors; explains how to select the right sensor for your application; and provides practical guidelines for building a camera module by pairing the sensor with suitable optics. He highlights areas demanding of special attention to equip you with an understanding of the common pitfalls in designing imaging systems.
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
The document discusses Qualcomm's Snapdragon mobile processors. It describes the key features and technology innovations of the Snapdragon S4 processor, including its CPU, GPU, modem, and DSP components. The S4 introduced Qualcomm's Krait CPU architecture and integrated 3G/4G modem. It provided improved performance over previous generations while enhancing power efficiency. The document outlines the different versions of Snapdragon processors like the S4 Play, S4 Plus, S4 Pro, and S4 Prime that were designed for various mobile device tiers.
Principles of a vehicle infotainment platform - Hans-Ulrich Michel, BMWmfrancis
The document discusses trends in vehicle infotainment platforms, including a move towards service platform architectures and standardized networks. It outlines BMW's use of an OSGi-based infotainment platform in 5- and 6-series vehicles, and how OSGi and Autosar standards can work together. The document also covers opportunities and challenges around over-the-air software downloads and the need for end-to-end standardization.
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Yole Developpement
With its choice of a dual camera, Apple’s innovations include new objectives lens assemblies, new bonding processes and a new type of autofocus
In the iPhone 7 Plus, Apple introduced a new rear camera module. Like its competitors LG and Huawei, they have chosen to integrate a dual camera. The module features two sensors, one closed to the sensor in the previous flagship, and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its flagship, the P9, using a dual camera. Like the other main players except Samsung, Apple has now introduced a dual camera module. This module integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony, using Exmor-RS Technology. The wide-angle objective lens assembly features an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9 mm, is equipped with two sub-modules each including a Sony CIS. The wide-angle module is equipped with an optical image stabilization (OIS) voice coil motor (VCM), while the telephoto only comes with a general VCM. The CISs are assembled using a flip-chip process on a ceramic substrate with a gold stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple has innovated its offering in areas including phase detection autofocus (PDAF), its objective lens assembly structure, its sensor, and adopts a second generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight differences in structures, technical choices and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...Yole Developpement
InvenSense MP67B
6-Axis MEMS IMU in iPhone 6 & 6 Plus
InvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.
More information on that report at http://www.i-micronews.com/reports.html
The document discusses Wibree, a wireless technology introduced by Nokia that allows for connectivity between mobile devices/PCs and small battery-powered devices. Wibree uses very low power (10x less than Bluetooth) and is optimized for applications requiring years of battery life on small batteries. It operates at 2.4GHz, supports star and star-bus network topologies, and will be implemented via standalone Wibree chips or chips with dual Wibree/Bluetooth functionality. Potential applications include wireless keyboards, toys, health/fitness sensors, and other small devices.
This document is a seminar report on image sensor systems submitted by three students - Jayesh Mangroliya, Miral Modi, and Jaydeep Bhayani. It contains an abstract that describes how digital image sensors work, focusing on how photons are converted into electrical signals. It also details the differences between CCD and CMOS sensor architectures and various metrics used to analyze sensor performance. The report includes a comparison of recent CCD and CMOS sensors using these metrics and develops a model relating well capacity and conversion gain.
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2018-embedded-vision-summit-girardin
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Guillaume Girardin, Division Director for photonics, sensing and displays at Yole Développement, presents the "From 2D to 3D: How Depth Sensing Will Shape the Future of Vision" tutorial at the May 2018 Embedded Vision Summit.
For several decades, 3D imaging and sensing technologies have matured, thanks to extensive, successful deployments in high-end applications, mainly in medical and industrial markets. More recently, as 3D sensor costs have dropped, 3D imaging and sensing devices have become a significant business, generating almost $2B in revenue in 2017, with strong growth prospects driven by consumer devices such as the iPhone X with its TrueDepth camera module.
Currently there are three main depth sensing approaches on the market: stereo vision, structured light and time-of-flight. Each of these approaches has pros and cons, from a technical point of view and with respect to cost. Girardin explains the key strengths and weaknesses of each of these technologies and analyzes the cost of adding them to a system based on his firm's recent teardown analyses. He also gives an overview of this depth sensing sensor market and the main factors driving it, and explores how this market could shape the future of vision.
Mixed-critical adaptive AUTOSAR stack based on VxWorks, Linux, and virtualiza...Andrei Kholodnyi
Since the first release of its standard in 2003, AUTOSAR has established itself as one of the primary software development standards for the global automotive industry. As the automotive industry is a now undergoing one of the significant changes in its history toward autonomous driving, connectivity and electrification new standards are needed to handle the complexity regarding software architecture for controlling the high-end processors, Ethernet communication, and over-the-air updates in the cloud-connected automobiles. The recent advent of the Adaptive AUTOSAR standard can help accommodate the extensive and complex requirements of autonomous driving by enabling a flexible, dynamic, and service based platform while still maintaining the integrity of high degree of functional safety standards and also properly engaging with established platforms. The standard itself replies on some technologies which are already established in the industry such as virtualization, POSIX PSE51, C++11/14 for application development, ISO26262/ASIL compliance, etc.
This presentation provides example of an implementation of mixed critical Adaptive AUTOSAR stack based on VxWorks RTOS, embedded Linux, and virtualization profile from Wind River. As one of the very few solutions available on the market which is already fulfilling the requirements described above, VxWorks is a strong example of a foundational software platform for Adaptive AUTOSAR-based autonomous driving development. We will also explain what challenges we have encounter with during this process and make some suggestions to the AUTOSAR consortium of how to overcome them in the future.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
This document provides an overview and analysis of the LiDAR market from 2018-2024. It finds that the total LiDAR market is expected to grow at a 29% CAGR to $6 billion by 2024, driven primarily by the automotive sector. Within automotive, ADAS vehicles are forecasted to have a 55% CAGR and become the main application. The report also examines the various LiDAR technologies, players, investments, costs, and timelines for integration into vehicles. It finds that while over 50 companies are targeting the automotive market, industry consolidation is expected as only a limited number will succeed.
Data Driven Development of Autonomous Driving at BMWDataWorks Summit
"The development of autonomous driving cars requires the handling of huge amounts of data produced by test vehicles and solving a number of critical challenges specific to the automotive industry.
In this talk we will describe these challenges and how we, at BMW, are overcoming them by adapting and reinventing existing big data solutions for our end-to-end data journey for autonomous driving. Our journey involves ingesting data produced by a variety of sensors into a dedicated Hadoop cluster, decoding the data, conducting quality control, processing and storing the data on the clusters, making it searchable, analyzing it and exposing it to the engineers working on the algorithms development.
In the first part of the talk we will present a general overview of the challenges we faced and the lessons we learned from them. In the second part we will deep dive into the most interesting technical issues. These include: dealing with automotive formats and standards that are not designed for distributed processing; defragmentation of sensory data; assuring the quality of the data coming from complex car hardware and software components; efficient data search across petabytes of data; and reprocessing the computing components running in the car inside the data center, which typically requires high performance computing."
Speakers:
Felix Reuthlinger, Data Engineer for Autonomous Driving, BMW Group
Dogukan Sonmez, Senior Software Engineer, BMW Group
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
3D OPTICAL STORAGE TECHNOLOGY technical seminar 4B.pptxMallaAbhinaya
This document discusses optical storage and 3D optical data storage. It describes how optical storage works by using lasers to burn data into optical disks in a spiral track. 3D optical storage can store data in three dimensions rather than two, potentially storing much more data in the same physical space. Some challenges to commercializing 3D optical storage have been destructive reading processes and issues with media stability and sensitivity. The document outlines the basic components, processes, and form factors of 3D optical storage systems.
Symbian OS is a mobile operating system developed by Symbian for smartphones. It was originally developed as a closed-source OS (EPOC) by Psion in the 1990s. In 1998, Symbian was established to continue developing EPOC OS, which was subsequently renamed Symbian OS. Over several versions, it became the most widely used smart OS. While initially popular, Symbian eventually declined as Android and iOS rose. The final version was released in 2013 before Nokia abandoned the platform.
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2020/12/driver-monitoring-systems-present-and-future-a-presentation-from-xperi/
For more information about edge AI and computer vision, please visit:
https://www.edge-ai-vision.com
Petronel Bigioi, CTO for Imaging at XPERI, presents the “Driver Monitoring Systems: Present and Future” tutorial at the September 2020 Embedded Vision Summit.
Monitoring drivers and passengers inside of vehicles is an increasingly critical capability. For example, driver monitoring is required in order for cars to obtain a top safety rating from NCAP. This presentation introduces XPERI’s driver and in-cabin monitoring solutions and examines real-world use-cases in which these solutions are being deployed.
Bigioi illustrates the evolution of these technologies as they have been used in conventional cars, as they are increasingly being used in cars with partial self-driving capability, and how they are likely to be used in fully automated vehicles. This goes well beyond driver monitoring to include new types of safety features as well as non-safety uses such as entertainment, personalization, human-machine interfaces and even monitoring occupant health.
The document provides an overview of the Tizen operating system. It discusses Tizen's history as a collaboration between Intel, Samsung and others to create an open, cross-platform OS. The objective is for Tizen to support a wide range of devices from smartwatches to TVs and allow applications to easily connect across platforms using HTML5. The architecture is based on Linux and allows both web and native applications. While Tizen offers cross-device connectivity and openness, its market share currently lags behind Android.
the term paper gives an outlook on luxury car industry with consumption pattern of consumers also it contains specific details of Bentley and their communication efforts
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation.
Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.
Only End to End Infotainment Test Solution available in market for Broadcast, Navigation, Connectivity, Cellular Standards, Audio, Video and HMI Testing.
Automotive infotainment system is growing rapidly because of the advancement in technology. More and more new technologies and devices are integrated into the system. Connected automotive infotainment is becoming a must have feature for car manufacturers.
Engineers in the automotive industry face new challenges with infotainment systems, which now introduce additional I/O like audio, video, and RF signals into systems that already have other sensor measurements. MaxEye In-Vehicle Infotainment test solution is powered by National Instruments PXI Platform, Universal Radio Signal Generation Software and LabVIEW Add-on toolkits. NI PXI platform combined with powerful software toolkits and APIs enable engineers to perform complicated tests on the many different I/O types at the same time using one chassis.
- FPD-Link III is a serializer/deserializer interface solution from National Semiconductor that enables high-speed video transport throughout vehicles for infotainment and driver assist applications like camera interfaces.
- It provides a high-speed forward channel and low-speed bidirectional control channel on a single differential pair, replacing multiple interfaces and wires.
- National Semiconductor's proprietary technology allows for real-time bidirectional control without restrictions, improving on alternatives that only allow control during blanking intervals.
For the full video of this presentation, please visit:
https://www.edge-ai-vision.com/2021/01/cmos-image-sensors-a-guide-to-building-the-eyes-of-a-vision-system-a-presentation-from-gopro/
Jon Stern, Director of Optical Systems at GoPro, presents the “CMOS Image Sensors: A Guide to Building the Eyes of a Vision System” tutorial at the September 2020 Embedded Vision Summit.
Improvements in CMOS image sensors have been instrumental in lowering barriers for embedding vision into a broad range of systems. For example, a high degree of system-on-chip integration allows photons to be converted into bits with minimal support circuitry. Low power consumption enables imaging in even small, battery-powered devices. Simple control protocols mean that companies can design camera-based systems without extensive in-house expertise. Meanwhile, the low cost of CMOS sensors is enabling visual perception to become ever more pervasive.
In this tutorial, Stern introduces the basic operation, types and characteristics of CMOS image sensors; explains how to select the right sensor for your application; and provides practical guidelines for building a camera module by pairing the sensor with suitable optics. He highlights areas demanding of special attention to equip you with an understanding of the common pitfalls in designing imaging systems.
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
The document discusses Qualcomm's Snapdragon mobile processors. It describes the key features and technology innovations of the Snapdragon S4 processor, including its CPU, GPU, modem, and DSP components. The S4 introduced Qualcomm's Krait CPU architecture and integrated 3G/4G modem. It provided improved performance over previous generations while enhancing power efficiency. The document outlines the different versions of Snapdragon processors like the S4 Play, S4 Plus, S4 Pro, and S4 Prime that were designed for various mobile device tiers.
Principles of a vehicle infotainment platform - Hans-Ulrich Michel, BMWmfrancis
The document discusses trends in vehicle infotainment platforms, including a move towards service platform architectures and standardized networks. It outlines BMW's use of an OSGi-based infotainment platform in 5- and 6-series vehicles, and how OSGi and Autosar standards can work together. The document also covers opportunities and challenges around over-the-air software downloads and the need for end-to-end standardization.
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Yole Developpement
With its choice of a dual camera, Apple’s innovations include new objectives lens assemblies, new bonding processes and a new type of autofocus
In the iPhone 7 Plus, Apple introduced a new rear camera module. Like its competitors LG and Huawei, they have chosen to integrate a dual camera. The module features two sensors, one closed to the sensor in the previous flagship, and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its flagship, the P9, using a dual camera. Like the other main players except Samsung, Apple has now introduced a dual camera module. This module integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony, using Exmor-RS Technology. The wide-angle objective lens assembly features an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9 mm, is equipped with two sub-modules each including a Sony CIS. The wide-angle module is equipped with an optical image stabilization (OIS) voice coil motor (VCM), while the telephoto only comes with a general VCM. The CISs are assembled using a flip-chip process on a ceramic substrate with a gold stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple has innovated its offering in areas including phase detection autofocus (PDAF), its objective lens assembly structure, its sensor, and adopts a second generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight differences in structures, technical choices and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...Yole Developpement
InvenSense MP67B
6-Axis MEMS IMU in iPhone 6 & 6 Plus
InvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.
More information on that report at http://www.i-micronews.com/reports.html
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole De...Yole Developpement
Nokia Lumia 920 Camera Module with OIS
The first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology
While Digital Still Cameras commonly use optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.
To performs Optical Image Stabilization, the camera module includes a floating lens technology which consists in moving the 5-elements lens module in perfect synchronization with the camera movement.
More information on that report at http://www.i-micronews.com/reports/Nokia-Lumia-920-Camera-Module-OIS/19/370/
This report analyzes the Fairchild FIS1100 6-axis MEMS IMU through reverse costing analysis. The device contains one ASIC die and one MEMS die stacked on a 2-layer PCB package measuring 3.3x3.3x1mm. The MEMS die uses through-silicon vias for electrical connections, allowing for a larger sensing area than previous designs. Manufacturing process steps are estimated for the ASIC, MEMS dies, and packaging. Total estimated manufacturing costs are provided along with comparisons to other leading 6-axis IMUs and an estimated selling price. The analysis is intended to provide insight into the device's technology and costs.
Intel® Curie™ Module High Density System-in-Package for IoT 2016 teardown rev...Yole Developpement
Ultra-small, low-power hardware module for wearables
Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.
This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.
More information on that report at http://www.i-micronews.com/reports.html
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/advanced-system-in-package-technology-in-apples-airpods-pro/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The document provides a detailed analysis of the near infrared (NIR) camera sensor used in the Apple iPhone X for facial recognition. It includes a teardown of the true depth camera module containing the NIR sensor from STMicroelectronics. Physical analysis of the module reveals a lens module, filter, and ceramic substrate. Analysis of the ST NIR sensor die shows it has small pixels below 4 μm, a resolution of 2 megapixels, and was manufactured using ST's 140nm process on an Imager-SOI substrate from Soitec. The report also provides a cost analysis of manufacturing the sensor die and module, estimating the manufacturer price to be around $15. The document compares the ST sensor to other NIR sensors
This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.
The first UVA/UVB light sensor using innovative resin and very compact package from Capella, Samsung’s top light sensor supplier.
Historically known for its technological capabilities in optoelectronics and recently acquired by Vishay Intertechnology ($205M), Capella releases its integrated UV Sensor based on Filtron™ technology to provide accurate UVA/UVB light sensing.
Apple and Samsung are the first customer of this type of device.
The CM3512 is an UV sensor equipped with photodiode, amplifiers, and analog/digital circuits into a single chip. It is designed by CMOS process and has I2C protocol interface. The use of PCB substrate enables a very compact package.
Compared with state of the art UV Sensors supplied by Rohm Semiconductor and Silicon Labs, the new design developed by Capella is based on patented Filtron™ Technology resin which offers reliable light-filtering capabilities into a variety of polymeric substrates.
Assembled in a OPLGA 2.35 x 1.8 x 1.0mm package, the CM3512 is an advanced sensitivity UV sensor targeted for consumers applications.
More information on that report athttp://www.i-micronews.com/reports/Capella-Microsystems-CM3512-Ultraviolet-Light-Sensor/1/453/
The first 3-Axis MEMS Gyroscope to meet Automotive AEC-Q100 qualification
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).
This 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps. It has been designed and produced using the same manufacturing process (THELMA) than consumer products in order to get full benefit of STMicroelectronics 10 years of consumer electronic market.
Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.
It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense ICS-43432 Digital MEMS Microphone teardown reverse costing report...Yole Developpement
Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases a high performance digital MEMS Microphone for consumer applications.
The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed using CMOS process, it has I2S protocol interface and a high SNR of 65 dBA. It is assembled in a 6-pins LGA 4.0 x 3.0 x 1.0mm package with bottom port.
The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and central fixation.
The reverse costing report contains a detailed analysis of the device design and process, its manufacturing cost, as well as a benchmark with competitors’ MEMS microphones.
This reverse costing study analyzes the manufacturing cost and estimated selling price of the STMicroelectronics LSM9DS0 9-axis MEMS IMU component. The LSM9DS0 integrates a 3-axis gyroscope, 3-axis accelerometer, and 3-axis magnetometer. It is produced in a 4x4x1mm LGA 24-pin package. The report details the physical analysis of the device and its dies, the manufacturing processes, and provides a cost analysis that estimates the total cost to be $4.28.
Sensonor STIM210
High-precision MEMS Gyro Module
World highest performance silicon MEMS gyro available without export control.
Tactical grade with bias instability of 0.5°/h in a miniature 33cm3 package.
MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.
With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.
STIM210 applications are typically found within industrial, aerospace and defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.
More information on that report at http://www.i-micronews.com/reports/Sensonor-STIM210High-precision-MEMS-Gyro-Module/1/436/
Similar to Apple iphone 6 and 6 plus front camera module teardown reverse costing report published by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
Introduction of Cybersecurity with OSS at Code Europe 2024Hiroshi SHIBATA
I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
The first topic is CVE (Common Vulnerabilities and Exposures). I have published CVEs many times. But what exactly is a CVE? I'll provide a basic understanding of CVEs and explain how to detect and handle vulnerabilities in OSS.
Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
I'll share insights into how the Ruby and RubyGems core team works to keep our ecosystem safe. By the end of this talk, you'll have a better understanding of how to safeguard your code.
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on integration of Salesforce with Bonterra Impact Management.
Interested in deploying an integration with Salesforce for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
A Comprehensive Guide to DeFi Development Services in 2024Intelisync
DeFi represents a paradigm shift in the financial industry. Instead of relying on traditional, centralized institutions like banks, DeFi leverages blockchain technology to create a decentralized network of financial services. This means that financial transactions can occur directly between parties, without intermediaries, using smart contracts on platforms like Ethereum.
In 2024, we are witnessing an explosion of new DeFi projects and protocols, each pushing the boundaries of what’s possible in finance.
In summary, DeFi in 2024 is not just a trend; it’s a revolution that democratizes finance, enhances security and transparency, and fosters continuous innovation. As we proceed through this presentation, we'll explore the various components and services of DeFi in detail, shedding light on how they are transforming the financial landscape.
At Intelisync, we specialize in providing comprehensive DeFi development services tailored to meet the unique needs of our clients. From smart contract development to dApp creation and security audits, we ensure that your DeFi project is built with innovation, security, and scalability in mind. Trust Intelisync to guide you through the intricate landscape of decentralized finance and unlock the full potential of blockchain technology.
Ready to take your DeFi project to the next level? Partner with Intelisync for expert DeFi development services today!
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...Tatiana Kojar
Skybuffer AI, built on the robust SAP Business Technology Platform (SAP BTP), is the latest and most advanced version of our AI development, reaffirming our commitment to delivering top-tier AI solutions. Skybuffer AI harnesses all the innovative capabilities of the SAP BTP in the AI domain, from Conversational AI to cutting-edge Generative AI and Retrieval-Augmented Generation (RAG). It also helps SAP customers safeguard their investments into SAP Conversational AI and ensure a seamless, one-click transition to SAP Business AI.
With Skybuffer AI, various AI models can be integrated into a single communication channel such as Microsoft Teams. This integration empowers business users with insights drawn from SAP backend systems, enterprise documents, and the expansive knowledge of Generative AI. And the best part of it is that it is all managed through our intuitive no-code Action Server interface, requiring no extensive coding knowledge and making the advanced AI accessible to more users.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
This presentation provides valuable insights into effective cost-saving techniques on AWS. Learn how to optimize your AWS resources by rightsizing, increasing elasticity, picking the right storage class, and choosing the best pricing model. Additionally, discover essential governance mechanisms to ensure continuous cost efficiency. Whether you are new to AWS or an experienced user, this presentation provides clear and practical tips to help you reduce your cloud costs and get the most out of your budget.
Fueling AI with Great Data with Airbyte WebinarZilliz
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxSitimaJohn
Ocean Lotus cyber threat actors represent a sophisticated, persistent, and politically motivated group that poses a significant risk to organizations and individuals in the Southeast Asian region. Their continuous evolution and adaptability underscore the need for robust cybersecurity measures and international cooperation to identify and mitigate the threats posed by such advanced persistent threat groups.
22. Apple iPhone 6 & 6 Plus Front Camera
Modules from Sony
Very Innovative CMOS Image Sensor: new pixel array structure / Stacked ISP circuit
based on Exmor‐RS process/ manufacturing cost adapted to camera performances
For the iPhone 6 FaceTime camera module, Apple integrate an innovative
CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub‐microlenses
array mediated by the color filters to get the final 1.2 Mpixel
resolution. This technical choice has a strong impact on the camera
performances and on the device manufacturing cost.
The unique technology from Sony (Exmor‐RS) consists in a stacking of a pixel
array circuit which uses a Back‐Side Illuminated (BSI) technology and a logic
ISP circuit processed with a 65nm technology node. The CIS is assembled in
flip‐chip on a ceramic substrate with a gold stud bumping process. This
allows to raise the pixel array size by 15% and to considerably improve the
light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with
a 4‐elements lens module and a f/2.2 camera aperture which increase light
sensitivity.
The report includes a comparison of Apple’s technical choices between
iPhone6 Rear and Front camera.
TABLE OF CONTENTS
Camera Module Supply Chain & Companies Profile
Physical Analysis
• Camera Module
Camera Module View & Dimensions
Camera Module X‐Ray
Camera Module Disassembly
• CMOS Image Sensor
View & Dimensions
Pads, Tungsten Grid
TSV Connections
CIS Pixels
Logic Circuit (Transistors, SRAM)
• Cross‐Section: Camera Module
Overview
Ceramic Substrate, IR Filter & FPC
Lenses, Housing,
• Cross‐Section: CMOS Image Sensor
Overview
Pad Trenches
Pixel Array Circuit
Logic Circuit
TSVs
• Comparison with iPhone 6 Rear Camera CIS
REVERSE COSTING ANALYSIS
REPORT BY
Camera Module
101 pages
November 2014
Pdf file
Xls file
PRICE :
Full report: EUR 2,990
Bundle* report: EUR 6,000
COMPLETE TEARDOWN WITH:
• Detailed Photos
• Precise Measurements
• Material Analysis
• Manufacturing Process Flow
• Supply Chain Evaluation
• Manufacturing Cost Analysis
• Selling Price Estimation
• Comparison with iPhone 6
Rear camera CIS
* Bundle reports = front and rear camera modules
of Apple iPhone 6 and iPhone 6plus
CIS Manufacturing Process Flow
• Global Overview
• Logic Circuit Front‐End Process
• Pixel Array Circuit Front‐End Process
• BSI + TSV + Microlenses Process
• CIS Wafer Fabrication Unit
Cost Analysis
• Synthesis of the cost analysis
• Main steps of economic analysis
• Yields Hypotheses
• CMOS Image Sensor Cost
Logic Circuit Front‐End Cost
Pixel Array Front‐end Cost
BSI & TSV Front‐End Cost
Color Filters & Microlenses Front‐End
Cost
Total Front‐End Cost
Back‐End: Tests & Dicing
CIS Wafer and Die Cost
• Camera Module Assembly Cost
Lens Module Cost
Packaging Cost
Final Cost
• Camera Module Cost
Distributed by Performed by
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Please process my order for “iPhone 6 & 6 Plus Front Camera Modules” Reverse Costing Analysis:
Apple iPhone 6 Plus Front Camera Module Full Reverse Costing report: EUR 2,990*
“iPhone 6 & 6 Plus Front Camera Modules” & “iPhone Ref.: RS192A+B 6 & 6 Plus Rear Camera Modules” report: EUR 6,000*
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The present document is valid 24 months after its publishing date: Nov. 12, 2014.
Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research,
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1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED
BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non‐equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of
sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing,
orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
‐ within [1] month from the order for Products already released; or
‐ within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre‐release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no
charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non‐conformity shall be sent in writing to the Seller
within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective
price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty,
the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441‐6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he
makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or
inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be
free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor
costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for
non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further
damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen
Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late
deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own
internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
‐ Information storage and retrieval systems;
‐ Recordings and re‐transmittals over any network (including any local area network);
‐ Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
‐ Posting any Product to any other online service (including bulletin boards or the Internet);
‐ Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care
of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will
guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I‐micronews.com. In this respect, the Seller will give the Buyer a maximum of 10
password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture
done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation.
This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non‐breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem,
the non‐breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive
jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.