This slide deck was used to present public webinar "SAP HANA On-Premise Deployment Options" - additional information including replay information can be found here: http://scn.sap.com/community/hana-in-memory/blog/2016/05/25/sap-hana-distinguished-engineer-hde-webinar-overview-of-sap-hana-on-premise-deployment-options

1. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA: Overview of On-Premise Deployment
Options(update 26.5.2016)
Tomas KROJZL, SAP HANA Distinguished Engineer, SAP Mentor

2. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
2
Disclaimer
This presentation is based on official IBM and SAP information however it is not
representing official position of IBM nor SAP and does not contain statements about
future direction. Content of this presentation is based on personal view and
experience of presenter and cannot be associated with IBM or SAP corporations.
This document is provided without a warranty of any kind, either express or implied,
including but not limited to, the implied warranties of merchantability, fitness for a
particular purpose, or non-infringement. IBM nor SAP assumes no responsibility for
content of this document.

3. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Agenda
3
• SAP HANA Appliance Approach
• SAP HANA Tailored Datacenter Integration
• SAP HANA Virtualization
• SAP HANA Stacking Options

4. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
What is SAP HANA Appliance
• SAP HANA “appliance”
• is not really appliance (not serviceable device) – SAP HANA needs to be regularly maintained
• is pre-integrated easy-to-deploy solution with well defined and fixed architecture
4
SAP HANA “appliance”
=
Fixed Configuration
SAP HANA®
Operating System
SUSE Linux Enterprise Server for SAP
Red Hat Enterprise Linux for SAP HANA
Server HW
Internal
Network
Storage
Subsystem
https://service.sap.com/sap/support/notes/2000003 - FAQ: SAP HANA (entry point into SAP HANA related SAP Notes)

5. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Basic Deployment Options
5
Using Shared Storage Using Local Disks
Central
Storage
Node
01
Single-node
(Scale-up)
Scale-out
Central
Storage(s)
Inter-node networking
Node
01
Node
02
Node
03
Node
04
Node
05
Node
06
Node
01
Node
02
Node
03
Node
04
Node
05
Node
06
Available only for
Lenovo models.
Inter-node networking
Distributed
“Storage”
(IBM GPFS)
Node
01

6. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Main aspects of SAP HANA Appliances
• Expected dominant analytic workload
(OLAP) that is CPU intensive
• Conservative approach – more restrictive
CPU:RAM ratio is enforced
• If relational model can be easily partitioned
(like for SAP Business Warehouse) then
scale-out is available
6
• Dominant transactional workload (OLTP)
that is less CPU intensive then OLAP
• For SAP Business Suite applications
relaxed CPU:RAM ratio can be used
• Complex relational model – table
distribution across nodes is not simple –
single-node deployment is available (GA)
General Purpose Appliances Suite-on-HANA Specific

7. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA appliances for SAP applications
• SAP S/4 HANA (with dominant OLAP workload)
• SAP NetWeaver on HANA
• SAP Business Warehouse (BWoH)
+ add-ons released for SAP HANA
• Standalone SAP HANA
• Other scenarios unless stated otherwise
• Conservative approach in case that workload
type is not known
7
• SAP S/4 HANA (with dominant OLTP workload)
• SAP Business Suite on HANA (SoH)
• SAP Enterprise Resource Planning
• SAP Customer Relationship Management
• SAP Supplier Relationship Management
• SAP Supply Chain Management
• SAP Product Lifecycle Management (as ERP
add-on)
+ add-ons released for SAP HANA
General Purpose Appliances Suite-on-HANA Specific

8. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
RAM [GB] 2 CPUs 4 CPUs 6 CPUs 8 CPUs 12 CPUs 16 CPUs 20 CPUs General SoH
128 2 CPUs 2 CPUs
256 scale-out 2 CPUs 2 CPUs
384 2 CPUs 2 CPUs
512 scale-out scale-out 2 CPUs 2 CPUs
768 4 CPUs 2 CPUs
1024 scale-out scale-out 4 CPUs 2 CPUs
1536 8 CPUs 2 CPUs
2048 scale-out 8 CPUs 4 CPUs
3072 4 CPUs
4096 8 CPUs
4608 8 CPUs
6144 8 CPUs
8192 12 CPUs
9216 12 CPUs
10240 16 CPUs
12288 16 CPUs
15360 20 CPUs
Available CPU:RAM configurations
8
• General Purpose appliances (green area)
can used for any application (including
SAP Business Suite)
• Suite-on-HANA appliances (orange area)
can be used only for SAP Business Suite
applications
• Various HW vendors are offering upgrade
paths to “grow” the appliance to bigger
model by adding additional resources
• Only selected models can scale-out
• SAP Business Suite is not allowed to run
on scale-out environment in GA
Ivy Bridge (v2) based models
Note: State as of 26th May 2016.

9. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Available CPU:RAM configurations
9
Ivy Bridge (v2) based models Haswell (v3) based models
RAM [GB] 2 CPUs 4 CPUs 6 CPUs 8 CPUs 12 CPUs 16 CPUs 20 CPUs General SoH RAM [GB] 2 CPUs 4 CPUs 6 CPUs 8 CPUs 12 CPUs 16 CPUs 20 CPUs General SoH
128 2 CPUs 2 CPUs 128 2 CPUs 2 CPUs
256 scale-out 2 CPUs 2 CPUs 256 2 CPUs 2 CPUs
384 2 CPUs 2 CPUs 384 2 CPUs 2 CPUs
512 scale-out scale-out 2 CPUs 2 CPUs 512 scale-out 2 CPUs 2 CPUs
768 4 CPUs 2 CPUs 768 2 CPUs 2 CPUs
1024 scale-out scale-out 4 CPUs 2 CPUs 1024 scale-out scale-out 4 CPUs 2 CPUs
1536 8 CPUs 2 CPUs 1536 scale-out 4 CPUs 2 CPUs
2048 scale-out 8 CPUs 4 CPUs 2048 scale-out scale-out 4 CPUs 4 CPUs
3072 4 CPUs 3072 scale-out 8 CPUs 4 CPUs
4096 8 CPUs 4096 scale-out 8 CPUs 6 CPUs
4608 8 CPUs 4608 6 CPUs
6144 8 CPUs 6144 8 CPUs
8192 12 CPUs 8192 12 CPUs
9216 12 CPUs 9216 12 CPUs
10240 16 CPUs 10240 16 CPUs
12288 16 CPUs 12288 16 CPUs
15360 20 CPUs 15360 20 CPUs
Note: State as of 26th May 2016.

10. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Agenda
10
• SAP HANA Appliance Approach
• SAP HANA Tailored Datacenter Integration
• SAP HANA Virtualization
• SAP HANA Stacking Options

11. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - Phases
11
1
2
3
https://scn.sap.com/docs/DOC-63140
Central
Storage
Node
01
Single-node:
Scale-out:
1
Central
Storage(s)
Inter-node networking
Node
01
Node
02
Node
03
Node
04
Node
05
Node
06
SAP HANA TDI - Phase 1: Storage
Goal: To offer customer choice which storage they would like
to use (storage must be certified for SAP HANA usage, special
KPIs must be met)
1
SAP HANA TDI - Phase 2: Network
Goal: To offer customer option to build their own network
instead having to use prescribed solution (network throughput
KPIs must be met)
2
SAP HANA TDI - Phase 3: Entry x86 Servers
Goal: To offer customer choice select cheaper CPU model –
Intel Xeon E5 v2/v3 with more flexibility (restrictions: max. 2
sockets, single-node only - no support for scale-out)
3
SAP HANA TDI - Phase 4: SAP HANA on Power
Goal: To offer customer additional HW platform. Supported
only under TDI program (based on storage and network
solutions as defined in phases 1 and 2).
4
Phase 4 is covered in detail
as part of SAP HANA virtualization

12. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - Phase 1: Storage
• Only certified storage solutions can be used:
https://global.sap.com/community/ebook/2014-09-02-hana-
hardware/enEN/enterprise-storage.html
• Vendor specific configuration guide is helping
customers to understand how to properly implement
their storage solution
• Special considerations are required to enable High
Availability setup for “SAP HANA Host Auto-Failover”
• Local disks can also be used with Intel Xeon E7
models (see https://scn.sap.com/docs/DOC-62942)
12
https://go.sap.com/documents/2015/03/74cdb554-5a7c-0010-82c7-eda71af511fa.html
Storage
Connector
Vendor
Certified
Storages
SAN
Datacore 1
Dell 2
EMC 6
Fujitsu 3
Fusion-io 1
Hewlett Packard 4
Hitachi 4
Huawei 3
Infinidat 1
IBM 4
NEC 1
NetApp 3
Nimble Storage 2
Pure Storage 2
Violin Memory 1
GPFS
IBM 1
Lenovo 1
NAS
Infinidat 1
NetApp 2
Total 43
Note: State as of 26th May 2016.

13. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - HWCCT tool
• After implementation customer (or its delegate) is responsible to ensure that
mandatory SAP data throughput and latency KPIs are met
• SAP developed HWCCT tool to benchmark existing storage setup – all measured
data throughput and latency values must
meet prescribed SAP KPIs for TDI setup
• HWCCT tool is also used to measure
network throughput between individual
nodes of scale-out configuration
13
https://service.sap.com/sap/support/notes/1943937 (including attachment)
Note: State as of 26th May 2016.
Volume
Block
Sizes
Test
File
Size
Min. throughput in MB/s Max.
Latency
[µs]
Initial
Write
Over-
write
Read
Log
4 KB 5 GB - 30 - 1000
16 KB 16 GB - 120 - 1000
1 MB 16 GB - 250 250 -
Data
4 KB 5 GB - - - -
16 KB 16 GB 40 100 - -
64 KB 16 GB 100 150 250 -
1 MB 16 GB 150 200 300 -
16 MB 16 GB 200 250 400 -
64 MB 16 GB 200 250 400 -

14. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - Phase 2: Network
• Network TDI is “regulating” only network communication between individual SAP
HANA nodes of scale-out system – no hard requirements for any other networks
• No certification for network solutions – any network setup can be used as long as
SAP requirements including mandatory SAP data throughput KPIs are met (see
SAP Note 1943937 and “SAP HANA TDI – Network Whitepaper” for more details):
https://scn.sap.com/docs/DOC-63221
• Redundant 10Gbit dedicated network is required for internal SAP HANA
communication (low latency network is recommended however latency limit is not
prescribed)
• Network throughput is measured by HWCCT benchmarking tool
14
https://scn.sap.com/docs/DOC-63221

15. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
• In general server components from certified “appliances”
must be used (even for TDI) – goal is to ensure that
server is configured to meet SAP requirements
• Alternatively customer can productively use cheaper Intel
Xeon X5 “entry level systems” with additional flexibility
https://global.sap.com/community/ebook/2014-09-02-hana-hardware/enEN/entry-level-
systems.html
• Intel Xeon E5-26xx v2/v3/v4 – 2 socket only with minimum 8 cores
• Supported only for single-node configurations (not scale-out)
• Cheaper and less regulated configuration (no HW certification
required)
SAP HANA TDI - Phase 3: Entry x86 Servers
15
https://blogs.saphana.com/2014/10/20/sap-extends-openness-and-partner-co-innovation-with-sap-hana-phase-3-tailored-data-center-integration
Certified Systems
based on E5-26xx
Vendor v2 v3 v4
Cisco 3 3 3
Dell 5 6 6
Fujitsu 2 4 4
Hewlett Packard 3 3 3
Hitachi 1 2 1
Huawei 1
Lenovo 6 9 9
NEC 3 7
VCE 2
Total 23 37 26
Note: State as of 26th May 2016.

16. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - Phase 4: SAP HANA on IBM Power Systems
• Based on TDI Phase 1 (Storage) and TDI Phase 2 (Network) principles – not
delivered as an appliance
• Support for very large LPARs
• SAP BWoH: up to 4.7 TB RAM/LPAR with ability to scale-out up to 16 nodes
• SAP SoH: up to 9 TB RAM/LPAR
• Offers options to consolidate multiple systems on one server
• Non-productive HANA and/or productive non-HANA workloads being located in shared pool
• Additional resiliency (RAS) features of Power platform
• SAP HANA on Power is covered in detail later as part of SAP HANA virtualization
16
https://service.sap.com/sap/support/notes/2055470

17. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Cost-Optimized Infrastructure for Non-Production Usage
• Available ONLY for non-productive usage under “special agreement”
• CPU: Same as for certified SAP HANA appliances, TDI Phase 3 (E5-26xx v2/v3/v4), or
Westmere EX (E7-x8xx) or Ivy Bridge EX (E7-x8xx V2) or Haswell EX (E7-x8xx v3)
• RAM: Maximum memory possible for particular server
• Storage: Any local or shared storage with RAID 1 (or higher)
Performance KPIs are NOT relevant
• Disclaimer: This setup is approved ONLY for non-production usage where
performance does not matter = customer accepts that performance will be
degraded
17
https://blogs.saphana.com/2014/08/12/cost-optimized-sap-hana-infrastructure-requirements-for-non-production-usage
https://service.sap.com/sap/support/notes/2271345 (including attachments)

18. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA TDI - Overview
18
Scale-out
Single-
node
Any storage or local disks
(SAP KPIs are optional)
Non
production
only
Server
component
Network
component
Storage
component
Production
Non
production
Certified Appliance
(server part)
Any network meeting
SAP KPIs for scale-out
Storage certified for SAP HANA TDI or local disks
(SAP KPIs must be achieved)
Server
component
Network
component
Storage
component
Hardware based on “production hardware” (above) – maximum RAM allowed
Certified Appliance Entry Level System Additional CPUs
No requirements
(scale-out not supported)
Entry Level System
(TDI Phase 3)
No requirements
(scale-out not supported)
No requirements
for single node

19. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA Appliance vs. SAP HANA TDI
• Pre-integrated solution
• End-to-end support
• Guaranteed top performance
• Sizing is always done memory wise
• Limited options to customize – fixed
configuration
• Vendor selection is fixed
19
• Build-yourself solution
• Multiple-vendor support
• Performance depends on deployment
• Sizing depends on TDI design
• Solution can be tailored to customer
preferences
• Option to select hardware vendors
SAP HANA Appliance SAP HANA TDI

20. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Agenda
20
• SAP HANA Appliance Approach
• SAP HANA Tailored Datacenter Integration
• SAP HANA Virtualization
• SAP HANA Stacking Options

21. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA Virtualization Options
• VMware vSphere 5.1 (non-production only)
• VMware vSphere 5.5 (also for production)
• VM limits: 64 vCPU, 1 TB RAM
• [GA] Single-VM only see note 1995460
• [GA] Multi-VM support see note 2024433
• [GA] BWoH Scale-out see note 2157587
• VMware vSphere 6.0 (also for production)
• VM limits: 128 vCPU, 4 TB RAM
• [GA] Single-VM only see note 2315348
• KVM or XEN (non-production only)
21
• [GA] HANA-on-Power see note 2230704
• Hardware partitioning:
• [GA] HP nPartitions see note 2103848
• [GA] Fujitsu PPARs see note 2111714
• [GA] Lenovo FlexNode see note 2232700
• Other options:
• [CA] Hitachi LPAR 2.0
• [CA] Huawei FusionSphere 3.1, 5.1
Hardware Vendor Independent Hardware Vendor Specific
https://service.sap.com/sap/support/notes/1788665 (including attachment) [GA] General Availability [CA] Controlled Availability

22. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA on VMware – Best Practices
• Validate latest support statement at: https://scn.sap.com/docs/DOC-60470
• Follow recommended VMware Best Practice documents:
https://www.vmware.com/files/pdf/SAP_HANA_on_vmware_vSphere_best_practices_guide.pdf
https://www.vmware.com/files/pdf/sap-hana-scale-out-deployments-on-vsphere.pdf
• Underlying hardware MUST meet CPU:RAM requirements for all hosted VMs
• CPU and memory over-provisioning must not be used
• All SAP HANA VMs must be able to meet TDI KPIs simultaneously
• In case only non-productive VMs are deployed then TDI KPIs are optional
• Scale-out systems need proper network bandwidth – dedicated 10 GBit for EACH scale-out VM
• SAP HANA Tailored Datacenter Integration (TDI) is best-fit for larger deployments
• Smaller (single-server) deployments can be built on appliance or TDI
22
https://scn.sap.com/docs/DOC-60470

23. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
• TDI approach required
• Network TDI KPIs must be met
• Appliance or TDI approach
• Check VMware sizing examples
SAP HANA on VMware – Production Support
• Appliance or TDI approach
23
Single-VM Multi-VM Scale-out BWoH
VMware vSphere cluster
Host 01
VM 01
VM 04
App.01
Host 02
VM 02
VM 05
App.02
Host 03
VM 03
VM 06
Central
Storage(s)
vSphere
Host 01
VM 01
VM 02
App.01
Local
Disks
VMware vSphere cluster
Host 01
VM 01
VM 04
App.01
Host 02
VM 02
VM 05
App.02
Host 03
VM 03
VM 06
Central
Storage(s)
vSphere
Host 01
Local
Disks
VM 01
VMware vSphere cluster
Host 01 Host 02 Host 03
Central
Storage(s)
VM 01 VM 02 VM 03
Technically possible - but not really useful
vSphere
5.5 only
vSphere
5.5 only
vSphere
5.5 and 6.0

24. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA on IBM Power Systems – Best Practices
• Additional information can be found in Planning Guide and Implementation Guide:
https://www.ibm.com/support/techdocs/atsmastr.nsf/WebIndex/WP102502
• LPARs for productive SAP HANA workloads must run as dedicated or dedicated-donating
• Other workloads (like non-productive SAP HANA or productive non-HANA) can run in Shared
Processor Pool
• LPARs for productive SAP HANA workloads must follow specified CPU:RAM guidelines
• LPARs for non-productive SAP HANA workloads can use more relaxed CPU:RAM sizing
• SAP HANA on Power is not delivered as appliance – SAP HANA Tailored Datacenter
Integration (TDI) certified storage is required
• All productive SAP HANA LPARs must be able to meet TDI KPIs simultaneously
24
https://service.sap.com/sap/support/notes/2055470

25. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
SAP HANA on IBM Power Systems
https://service.sap.com/sap/support/notes/2188482 https://service.sap.com/sap/support/notes/2230704
Cores per
Production LPAR
Maximum Prod.
CPU:RAM ratio
Maximum Prod.
RAM per LPAR
Power 8
Model
Minimal Maximal
General
(SPS11+)
SoH
General
(SPS11+)
SoH Maximum LPARs (options)
S822 8 20 32 96 640 1920
• 3x dedicated prod. LPAR
• 2x dedicated-donating LPAR +
shared pool for non-production
S822L 8 24 32 96 768 2304
S824 8 24 32 96 768 2304
S824L 8 24 32 96 768 2304
E850 8 32 32 96 1024 3072
E870 8 80 50 96 4000 7680 • 4x dedicated prod. LPAR
• 3x dedicated-donating LPAR +
shared pool for non-productionE880 8 96 50 96 4800 9216
25
Sizing for non-productive
SAP HANA systems can
be more relaxed.

26. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
VIOS
(optional)
VIOS
(optional)
SAP TDI
Storage(s)
SAP HANA on IBM Power Systems
26
• SAP HANA on IBM Power Systems solution is
using SAP TDI certified storage
• Multiple productive SAP HANA LPARs can be
deployed in dedicated mode (four LPARs for
E870/E880, three LPARs for other models)
Single-VM and Multi-VM
Power 8 E870 / E880
Productive
HANA 01
Productive
HANA 02
Productive
HANA 03
Productive
HANA 04
Dedicated LPARs

27. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
VIOS
(optional)
VIOS
(optional)
SAP TDI
Storage(s)
Dedicated-donating LPARs
SAP HANA on IBM Power Systems
26
• SAP HANA on IBM Power Systems solution is
using SAP TDI certified storage
• Multiple productive SAP HANA LPARs can be
deployed in dedicated mode (four LPARs for
E870/E880, three LPARs for other models)
• Alternative is to use shared processor pool
instead of one productive LPAR; productive
LPARs are running in dedicated-donating
mode giving CPU cycles to shared pool
• Shared pool can host non-productive SAP
HANA workloads or any other productive or
non-productive workloads (for example
application servers)
Single-VM and Multi-VM
Power 8 E870 / E880
Productive
HANA 01
Productive
HANA 02
Productive
HANA 03
Shared Processor Pool
Productive
NW AS 02
Productive
NW AS 01
Productive
NW AS 03
Non-prod.
HANA 04
Non-prod.
HANA 05
Other
workload
Non-prod.
NW AS 04
Non-prod.
NW AS 06
Non-prod.
NW AS 05

28. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Agenda
27
• SAP HANA Appliance Approach
• SAP HANA Tailored Datacenter Integration
• SAP HANA Virtualization
• SAP HANA Stacking Options

29. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Multiple Components One System
SAP HANA Stacking Options
Multiple Components One Database
(can be also same schema)
28
Multi-tenant Database Containers
[GA] MCOD [GA] MDC [GA] MCOS
RHEL/SLES
HANA 01
DB 01
HANA 02
DB 02
RHEL/SLES
HANA 01
DB 01
HANA 03
DB 03
App 01 App 02 App 03
Scale-out
Only for
non-Production
RHEL/SLES
HANA 01
DB 01
HANA 02
DB 02
App 01 App 02
Single-node
Production or
non-Production
Single-node or Scale-out
Production or
non-Production
RHEL/SLES
HANA 01
RHEL/SLES
HANA 01
MDC 04
RHEL/SLES
HANA 01
MDC 02
MDC 03
MDC 01 MDC 01
App 01 App 02 App 03 App 04
Single-node
Production or
non-Production
App 01 App 02
RHEL/SLES
HANA 01
DB 01
SCH 01
SCH 02
Scale-out
Production or
non-Production
RHEL/SLES RHEL/SLES
HANA 01 HANA 01
DB 01
SCHEMA 01
SCHEMA 02
App 01 App 02

30. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Multiple Components One System
Production:
Supported only for single-node
installation: see note 1681092
Non-production: No restrictions
Disadvantages:
• Can lead to resource contention
which might impact performance
It is customer responsibility to properly
size infrastructure (TDI) and to activate
resource management parameters.
SAP HANA Stacking Options
Multiple Components One Database
(can be also same schema)
Production:
Supported only for specific
combinations on “white list”:
• General: see note 1661202
• SoH: see note 1826100
Non-production: No restrictions
Disadvantages:
• Shared binaries (landscape
implications – upgrade, compatibility)
• No backup/restore ability on schema
level (all or nothing decision)
29
Multi-tenant Database Containers
Production:
All combinations are supported.
Additional guidance is in notes
2104291 (FAQ), 1666670 (BW) and
2121768 (BW) + MCOD/MCOS notes
Non-production: No restrictions
Disadvantages:
• Shared binaries (landscape
implications – upgrade, compatibility)
• Some limitations as in note 2096000
[GA] MCOD [GA] MDC [GA] MCOS

31. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Combining SAP HANA Deployment Options
• SAP HANA Stacking is always
associated with compromise
• In general it is best to avoid any
stacking unless explicitly
recommended by SAP
• Infrastructure need to be properly
sized to support stacking without
performance degradation (TDI)
• SAP HANA Business Continuity
options are on Infrastructure level
30
MCOD
MDC
MCOS
SAP HANA
TDI
SAP HANA
Appliance
Virtualization
Stacking
Options
Infrastructure
Options

32. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
Agenda
31
Please join me at SAP TechEd 2016 Las
Vegas (September 19-23) for session:
SAP HANA: Deployment options with
Business Continuity (HA and DR)
Once available session details will be published
on twitter: @krojzl

33. © 2016 IBM Corporation
SAP HANA
Distinguished
Engineers
32
Tomas KROJZL
SAP HANA Distinguished
Engineer, SAP Mentor
IBM Delivery Center CE
Technicka 2995/21
616 00 Brno
Czech Republic
Mobile: +420-731-435-817
tomas_krojzl@cz.ibm.com
Thank You!