The document discusses RFID and printed electronics. It outlines 5 levels of integration for both surface mount technology (SMT) and printed electronics technology (PET). PET allows for lower cost solutions compared to SMT due to printing processes. RFID applications discussed include ticketing, pharmaceuticals, healthcare, marketing and gaming. Cost is driven by factors such as components, printing method, and integration level. Fully printed RFID systems could realize significant cost reductions over traditional RFID systems through optimization of materials, processes, and components.
Prof. Harri Kopola gave a presentation on Printing based Manufacturing and Integration
of Flexible Electronic Systems at PE2013, in Dresden, Germany, 9.10.2013.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Prof. Harri Kopola gave a presentation on Printing based Manufacturing and Integration
of Flexible Electronic Systems at PE2013, in Dresden, Germany, 9.10.2013.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
application and advantages of printed electronics.
Revolutionary technique of making electronics
components
•Printed electronics is based on new materials
and manufacturing processes.
•Simple way of fabrication of simple electronics
components
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
ON Semiconductor Corporate Overview PresentationON Semiconductor
ON Semiconductor (Nasdaq: ONNN) is driving innovation in energy efficient electronics, empowering design engineers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help customers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information visit http://www.onsemi.com.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends 2017 Re...Yole Developpement
The GaN power device supply chain is acting to support market growth.
THE SUPPLY CHAIN FOR POWER GAN PREPARES FOR PRODUCTION
The supply chain is close to being settle for the Power GaN market and deals during 2017 show confidence that GaN will be a successful market. First of all, there have been big investments from the main foundries to increase their capacity to handle mass production. Navitas just announced the partnership with TSMC and Amkor to ramp production capacity. Moreover, BMW i Ventures has just invested in GaN Systems. The Taiwan’s Ministry of Economic Affairs is also interested in using GaN for clean and green technologies, also in collaboration with GaN Systems.
GaN manufacturers continue developing new products and provide samples to customers, as is the case with EPC and its wireless charging line. During 2017, Panasonic announced the mass production of its 650 V products and Exagan successfully produced its first high voltage devices on 8-inch wafers. Other players are in the final phase of R&D or qualification for their GaN products to be launched in 2018. In both cases, manufacturers and clients are pushing to use GaN HEMTs in emerging technologies.
Yole Développement differentiates the Power GaN supply chain into two main models: the Integrated Device Manufacturer (IDM) model and the foundry model. We think that both IDM and foundry models will co-exist while there are different needs on the market, for example in consumer and industrial applications. In addition to the existing models, China is introducing a model with an R&D research center or design center, an external epitaxial supplier and a foundry for manufacturing, to support large-scale demand in the future.
This report furnishes an overview of the GaN power industry, covering the value chain from epitaxy and device design to device processing. It updates the supply chain and there is an overview of the year’s investments.
More information on that report at http://www.i-micronews.com/reports.html
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
IDTechEx Research: Printed Electronics for the Automotive IndustryIDTechEx
The total market for flexible and printed electronics in automotive applications is expected to reach $5.5bn by 2026, spearheaded by significant growth expected by OLED displays and lighting as well as in-mold electronics applications in the next decade. These slides from IDTechEx focus on these, along with other technologies that benefit from additive processing and flexibility in form factor and will include advances in printed sensors, haptics, thin film photovoltaics and others. Slides cover: Market forecasts for printed electronics in vehicles; Mature markets; Fast growing opportunities; Opportunities in the long term.
IDTechEx Research: Problems That Printed Electronics is SolvingIDTechEx
From IDTechEx Research: This presentation reviews why printed electronics is not a solution looking for a problem: this presentations looks at big problems in different industries that printed electronics is tackling today
application and advantages of printed electronics.
Revolutionary technique of making electronics
components
•Printed electronics is based on new materials
and manufacturing processes.
•Simple way of fabrication of simple electronics
components
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
ON Semiconductor Corporate Overview PresentationON Semiconductor
ON Semiconductor (Nasdaq: ONNN) is driving innovation in energy efficient electronics, empowering design engineers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help customers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information visit http://www.onsemi.com.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends 2017 Re...Yole Developpement
The GaN power device supply chain is acting to support market growth.
THE SUPPLY CHAIN FOR POWER GAN PREPARES FOR PRODUCTION
The supply chain is close to being settle for the Power GaN market and deals during 2017 show confidence that GaN will be a successful market. First of all, there have been big investments from the main foundries to increase their capacity to handle mass production. Navitas just announced the partnership with TSMC and Amkor to ramp production capacity. Moreover, BMW i Ventures has just invested in GaN Systems. The Taiwan’s Ministry of Economic Affairs is also interested in using GaN for clean and green technologies, also in collaboration with GaN Systems.
GaN manufacturers continue developing new products and provide samples to customers, as is the case with EPC and its wireless charging line. During 2017, Panasonic announced the mass production of its 650 V products and Exagan successfully produced its first high voltage devices on 8-inch wafers. Other players are in the final phase of R&D or qualification for their GaN products to be launched in 2018. In both cases, manufacturers and clients are pushing to use GaN HEMTs in emerging technologies.
Yole Développement differentiates the Power GaN supply chain into two main models: the Integrated Device Manufacturer (IDM) model and the foundry model. We think that both IDM and foundry models will co-exist while there are different needs on the market, for example in consumer and industrial applications. In addition to the existing models, China is introducing a model with an R&D research center or design center, an external epitaxial supplier and a foundry for manufacturing, to support large-scale demand in the future.
This report furnishes an overview of the GaN power industry, covering the value chain from epitaxy and device design to device processing. It updates the supply chain and there is an overview of the year’s investments.
More information on that report at http://www.i-micronews.com/reports.html
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
IDTechEx Research: Printed Electronics for the Automotive IndustryIDTechEx
The total market for flexible and printed electronics in automotive applications is expected to reach $5.5bn by 2026, spearheaded by significant growth expected by OLED displays and lighting as well as in-mold electronics applications in the next decade. These slides from IDTechEx focus on these, along with other technologies that benefit from additive processing and flexibility in form factor and will include advances in printed sensors, haptics, thin film photovoltaics and others. Slides cover: Market forecasts for printed electronics in vehicles; Mature markets; Fast growing opportunities; Opportunities in the long term.
IDTechEx Research: Problems That Printed Electronics is SolvingIDTechEx
From IDTechEx Research: This presentation reviews why printed electronics is not a solution looking for a problem: this presentations looks at big problems in different industries that printed electronics is tackling today
Opportunities and challenges in printed electronics productionQuad Industries
Printed electronics represents an enormous potential in a world of interconnected appliances. But there is still a large gap between the technology that is available and the potential for real-life applications. “That’s why we are focusing so strongly on intensive collaboration with our customers,” says Wim Christiaens, R&D director at Quad Industries.
Revista virtual, artesanal, en que coinciden, se conocen, dialogan, cooperan, amigas y amigos de la ecología y de la poesía, de los cuentos y de los derechos humanos, de los ensayos y de los sueños, del espesor de la cotidianidad y del vuelo del espíritu.
La percepción es la realidad. La visibilidad de la profesión del profesional de la información depende de la imagen mental que su usuario y la sociedad en general tengan no sólo del bibliotecario sino de su actividad profesional. Los estereotipos, imágenes y prejuicios deben ser tomados como base para un reposicionamiento como socio estratégico de la información.
Guía de los Mejores Colegios de España 2013Mayte Guillén
Servicios e instalaciones de los mejores colegios concertados y privados en cada provincia de España. Información adicional sobre el sistema educativo español, claves para seleccionar un centro y ayudas económicas.
In this invited keynote talk at Europe's largest event on printed electronics, PARC Vice President and Director of the Electronic Materials and Devices Laboratory Dr. Ross Bringans highlights the opportunity in flexible and printed electronics applications, shares examples from printed transistors and circuits, and discusses what the industry needs for growth.
Mydisplays Katalog 2015 (Deutsch mit Preisen)Mydisplays GmbH
Der neue Mydisplays Katalog 2015 (Deutsch mit Preisen)
Über Mydisplays:
Die Mydisplays GmbH ist Ihr kompetenter und zuverlässiger Partner, wenn es um erstklassige Werbetechnik und mobile Messe- und Displaysysteme geht.
Unser professionelles Team ist immer bemüht, Ihnen günstige, aber dennoch qualitativ hochwertige Lösungen für Ihre Werbetechnik anzubieten. Eine sorgenfreie Auftragsabwicklung und schnelle Hilfe bei Problemen, sorgen seit 12 Jahren für höchste Zufriedenheit unserer Kunden.
Neben den klassischen Werbeartikeln wie Faltdisplays, Roll-Ups und modularen Messeständen, gehören innovative Werbetechniken wie 3D Buchstaben oder aufblasbare Werbeträger zu unserem Sortiment. Selbstverständlich entwickelt und produziert die Mydisplays GmbH auch maßgeschneiderte und individuelle Werbekonzepte.
Mit Hilfe unseres modernen Maschinenparks, können wir Ihre Werbegrafiken nach höchsten Qualitätsanforderungen im Platten- und Textildruck ökologisch umsetzen und der direkte Zugriff auf die Großformatdruckerei am Standort Burscheid, garantiert eine konstante Qualität und extrem kurze Reaktionszeiten.
1 to 1 iPad forum involving Catholic Education Diocese of Parramatta schools sharing their journey so far and plans for future. This slideshare captures the information links and ideas of the day via tweets by topic.
Annuaire de référence des acteurs RFID et NFCCNRFID
Le CNRFID a constitué un annuaire de référence des acteurs RFID et NFC au niveau européen.
Cet annuaire a pour vocation de devenir la référence de l’ensemble des offreurs présents en France et en Europe.
RFID based smart shopping cart and billing systemlaharipothula
To make the shopping easy by automated billing at the shopping mall/ super maeket. This module mainly cocnsists of Arduino, RFID tags & reader and zigbee module.
Design of a Digital Baseband Processor for UWB Transceiver on RFID Tagtheijes
The International Journal of Engineering & Science is aimed at providing a platform for researchers, engineers, scientists, or educators to publish their original research results, to exchange new ideas, to disseminate information in innovative designs, engineering experiences and technological skills. It is also the Journal's objective to promote engineering and technology education. All papers submitted to the Journal will be blind peer-reviewed. Only original articles will be published.
RFID in PV Solar Manufacturing Industryiaitoinfotech
Government of India had come out with the new mandate guideline under JNNSM that each of the PV modules used under this mission should be attached with the RFID tags to keep its accountability,authenticity & performance measurement.RFID allows better monitoring of the PV manufacturing processes with expedient raw material flow and more effective planning and control.
Parking Lot Security System using RFID Technologyijtsrd
Radio Frequency Identification RFID technology is widely used in various applications such as attendance system, tracking system, monitoring system or parking system. In this paper, the Parking Lot Security System using RFID technology and embedded technology is presented. In conventional parking system, manual entrance system is applied that permission must be requested from the security guard to access the premise. Therefore, a security guard has to be hired to monitor the premise. In addition, the security guards need to monitor all movement of the vehicle that enters or leave the premise. As a result, the unauthorized vehicle can easily access the premise. To address this problem, the proposed system which can control a vehicle's movement that enters or leave the specific area or place by scanning the RFID tag has been implemented. The potential benefit is it can improve security for both security guards and users. Besides that, this parking system can facilitate access control for users and improve traffic flow and reduce traffic jams. Dr. Thida Aung "Parking Lot Security System using RFID Technology" Published in International Journal of Trend in Scientific Research and Development (ijtsrd), ISSN: 2456-6470, Volume-3 | Issue-5 , August 2019, URL: https://www.ijtsrd.com/papers/ijtsrd26512.pdfPaper URL: https://www.ijtsrd.com/engineering/electronics-and-communication-engineering/26512/parking-lot-security-system-using-rfid-technology/dr-thida-aung
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RFID in the world of Printed Electronics
1. RFID in the world of Printed Electronics
Application/Cost/Supply Chain
Dr. Andreas Schaller
ASC
Andreas Schaller Technology Consulting
info@andreas-schaller.de
Dr. Andreas Schaller
RFID in the world of Printed Electronics
1
2. SMT Hierarchy
RFID in the world of Printed Electronics2
Connections between physically separate
systems such as host computer to
terminals, computer to printers, and so on.
Level 5 Connections between systems
Level 4 Subassembly
Level 3 Connections between PWBs
Level 2 Printed Wiring Board (PWB)
Level 1 Integrated Circuits
Level 0 Monolithic Silicon Chip Gate-to-gate interconnections on a
monolithic silicon chip
Connections between two subassemblies.
For example, a rack or frame may hold
several shelves of subassemblies that
must be connected together to make up a
complete system.
Connections between PWBs, including
PWB-to-PWB interconnections or card-to-
motherboard interconnections.
Printed wiring board (PWB) level of
interconnections. Printed conductor paths
connect the device leads of components
to PWBs and to the electrical edge
connectors for off-the-board
interconnection.
Packaging of silicon chips into dual-in-line
packages (DIPs), small outline integrated
circuit (SOICs), chip carriers, multichip
packages, and so on, and the chip-level
interconnects that join the chip to the lead
frames.
3. PET Hierarchy
RFID in the world of Printed Electronics3
Level 5 Connections between systems Ambient Intelligence
Level 4 Subassembly System Integration
Level 3 Connections between PWBs Smart System
Level 2 Printed Wiring Board (PWB) System-in-Foil
Level 1 Integrated Circuits Functional Layers
Level 0 Monolithic Silicon Chip Printable Ink
Silver Ink
Printed
Antenna
RFID Label
Battery Assisted
Label
Smart Package
RFID System
SMT PET Example
4. PET Applications and KPI
RFID in the world of Printed Electronics4
PET Products
Large Area Printing
Small Feature Printing
min
5. PET Market Players examples only
RFID in the world of Printed Electronics5
6. PET Benefits beyond cost
RFID in the world of Printed Electronics6
Smart Objects are driven by LEVEL 5
(Content driven) Connectivity enables an object to become ”smart”
Flexible Electronics is driven by LEVEL 4
Customer Benefits is flexible-to-install vs. flexible-to-use
Integrated Smart Systems are driven by LEVEL 3
Application driven system integration
Large Area Electronics is driven by LEVEL 2
Macro electronics for functional area maximization (vs. microminiaturization)
Printed Electronics is driven by LEVEL 1
Low cost and environmental preferred manufacturing
Organic(Inorganic) Electronics is driven by LEVEL 0
Multi-functional materials for electronic and sensing functions
7. Printed RFID Markets
RFID in the world of Printed Electronics7
Ticketing (Disposable)
(Integrated Smart System)
Pharma (New Services )
(Smart Objects)
ehealth ( Hygiene )
(Integrated Smart System)
eMarketing ( HMI )
(Large Area Electronics )
Games (New Services)
(Smart Objects)
All use cases are disposable !
14. Additional Printed RFID Components
RFID in the world of Printed Electronics14
Contact Readout Conductive Readout RF Readout
Passive
Active
(Sensing)
ROM /WORM
RAM ROM /WORMROM /WORM
WORM / RAM
Primary Batteries Primary / Secondary Batteries
Sensing !
15. Smart Packaging Examples
RFID in the world of Printed Electronics15
Smart Packaging
Non-Inductive Tag Printed EAS Tag Printed RFID Tag UHF RFID Tag Hybrid Tag
Comparison
………… …… …………
16. Smart Packaging Costs
RFID in the world of Printed Electronics16
Ink
(Organic and/or Inorganic)
Foils and/or Paper Inkjet / Gravure / Screen
Printing
Assembly
(Lamination)
Lamination
Labeling
(none if integrated)
Battery and/or IC
Antenna and/or Sensor
Connectingwire / wireless
Tagged Object
( included in BOM)
20. Smart Packaging Cost Drivers
RFID in the world of Printed Electronics20
Component System
Passive Harvesting Active
Active
Passive
Driven by Higher PET Levels
DrivenbyLowerPETLevels
Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3
Cost%Cost%
TBD TBD
21. Printed Sensor Tag
RFID in the world of Printed Electronics21
System-in-Foil
Write
Function : Sensing
Energy Harvesting
EventData
Function : Storing
Information
Function : Computing
Function : Connecting
Energy Harvesting
Knowledge
Read/Write
22. Cost Breakdown
RFID in the world of Printed Electronics22
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
Bill Of Material (BOM)= cost of purchased row materials, sub-assemblies, components, parts
Conversion Costs (CC)= cost of changing row materials into finished or semi-finished products
23. Optimization Potential (Theoretical)
RFID in the world of Printed Electronics23
Level Action Potential for Reduction
• Level 5 : Update only Infrastructure Firmware
• Level 4 : Integrate Automated Inline Customization - 50%
• Level 3 : Focus on Passive Solutions
• Level 2 : Reduce Numbers of Layers (Avoid Alignment) - 85%
• Level 1 : Switch from Batch to Inline Printing Processes - 50%
• Level 0 : Change from Contactless (13.56 MHz) to a
Sweep/Contact Readout - 40%
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
- 60%
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
24. Net Present Value Breakdown
RFID in the world of Printed Electronics24
% Net Present Value (NPV)
Net Present Value (NPV) = Method for using the time value of money to appraise long-term projects
Interest Rate =15%
Profit Margin [Level]
25. Questions ?
RFID in the world of Printed Electronics25
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Dr. Andreas Schaller
Email : Andreas.Schaller@t-online.de
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Office : Schulstr. 11, 95676 Wiesau
Management : Dr. Andreas Schaller
District Court : AG Weiden, HRB 3499