Prof. Harri Kopola gave a presentation on Printing based Manufacturing and Integration
of Flexible Electronic Systems at PE2013, in Dresden, Germany, 9.10.2013.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Opportunities and challenges in printed electronics productionQuad Industries
Printed electronics represents an enormous potential in a world of interconnected appliances. But there is still a large gap between the technology that is available and the potential for real-life applications. “That’s why we are focusing so strongly on intensive collaboration with our customers,” says Wim Christiaens, R&D director at Quad Industries.
application and advantages of printed electronics.
Revolutionary technique of making electronics
components
•Printed electronics is based on new materials
and manufacturing processes.
•Simple way of fabrication of simple electronics
components
Prof. Harri Kopola gave a presentation on Printing based Manufacturing and Integration
of Flexible Electronic Systems at PE2013, in Dresden, Germany, 9.10.2013.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Opportunities and challenges in printed electronics productionQuad Industries
Printed electronics represents an enormous potential in a world of interconnected appliances. But there is still a large gap between the technology that is available and the potential for real-life applications. “That’s why we are focusing so strongly on intensive collaboration with our customers,” says Wim Christiaens, R&D director at Quad Industries.
application and advantages of printed electronics.
Revolutionary technique of making electronics
components
•Printed electronics is based on new materials
and manufacturing processes.
•Simple way of fabrication of simple electronics
components
In this invited keynote talk at Europe's largest event on printed electronics, PARC Vice President and Director of the Electronic Materials and Devices Laboratory Dr. Ross Bringans highlights the opportunity in flexible and printed electronics applications, shares examples from printed transistors and circuits, and discusses what the industry needs for growth.
These slides use concepts from my (Jeff Funk) course entitled Biz Models for Hi-Tech Products to analyze the business model for Fischer Tech, a supplier of smart plastics to electronics companies. These smart plastics contain printed electronics that provide increased functionality for plastic parts and products. Transceivers, microprocessors, and other electronics can be embedded in the plastic parts thus enabling doors to open without holding keys or cards and plastic parts to act as dials, controls, and other forms of input. This firm is enabling smart homes and the Internet of Things. These slides describe the value proposition, customers, method of value capture, scope of activities and the method of strategic control for Fischer Tech.
Feasibility Of Graphene Inks In Printed Electronics V5Vishnu Chundi
Presentation delivered at the International Conference on Nanoscience and Technology,India, January,2012. Evaluating the technical and commercial aspects of using graphene inks for printed electronics applications. Suggested a road-map for the future applications. Touches upon the competing technologies for ITO replacement. Performed SWOT analysis of graphene inks
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
RECENT DEVELOPMENTS IN LED MANUFACTURING 2016 Presentation by Santosh KUMAR o...Yole Developpement
INTRODUCTION TO YOLE DÉVELOPPEMENT AND LED ACTIVITIES
•LED MARKET OVERVIEW
•RECENT DEVELOPMENTS IN LED MANUFACTURING
•2015 STATUs OF THE LED INDUSTRY (AND FUTURE TRENDS)
•CONCLUSION
•APPENDIX-DETAILLED PRESENTATION OF YOLE DEVELOPPEMENT AND LED ACTIVITIES
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Embedded Image and Vision Processing 2017 report by Yole DeveloppementYole Developpement
From algorithms included in the image processing pipeline to neural networks running in vision processors, focus on the evolution of hardware in vision systems and how software disrupts this domain.
SOFTWARE IN VISION SYSTEMS
Vision systems are becoming increasingly important. Therefore, this report shows and explains the close links between embedded software and hardware in vision systems at the technology and market levels. What are the software technologies? How do they impact the hardware? Which hardware is impacted? What kinds of markets are affected? And how will they evolve?
We can consider software in vision systems as having two different levels. The first is very close to the hardware, inscribed inside standalone field programmable gate array (FPGA) or application specific integrated circuit (ASIC) chips, or integrated into more complicated architectures. This layer, not often considered, is the most important step in any image treatment after image acquisition by pixels. Image processing, realized in the image signal processor (ISP), has a quite simple function. It must transform a signal from the sensor to an understandable image for the human eye. It is composed as a pipeline of multiple blocks, where each block takes as input the output of the previous block. A lot of different algorithms are implemented to accomplish tasks such as removing artefacts, color correction and reproduction. This is done at a single-pixel or pixel-group level and does not need a lot of memory or power.
More information on that report at http://www.i-micronews.com/reports.html
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
More info on: https://www.i-micronews.com/report/product/microled-displays-2018.html
These slides use concepts from my (Jeff Funk) class to analyze the near-term future for touch-screen displays. Improvements in durability, sensitivity, and flexibility are being implemented
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
In this invited keynote talk at Europe's largest event on printed electronics, PARC Vice President and Director of the Electronic Materials and Devices Laboratory Dr. Ross Bringans highlights the opportunity in flexible and printed electronics applications, shares examples from printed transistors and circuits, and discusses what the industry needs for growth.
These slides use concepts from my (Jeff Funk) course entitled Biz Models for Hi-Tech Products to analyze the business model for Fischer Tech, a supplier of smart plastics to electronics companies. These smart plastics contain printed electronics that provide increased functionality for plastic parts and products. Transceivers, microprocessors, and other electronics can be embedded in the plastic parts thus enabling doors to open without holding keys or cards and plastic parts to act as dials, controls, and other forms of input. This firm is enabling smart homes and the Internet of Things. These slides describe the value proposition, customers, method of value capture, scope of activities and the method of strategic control for Fischer Tech.
Feasibility Of Graphene Inks In Printed Electronics V5Vishnu Chundi
Presentation delivered at the International Conference on Nanoscience and Technology,India, January,2012. Evaluating the technical and commercial aspects of using graphene inks for printed electronics applications. Suggested a road-map for the future applications. Touches upon the competing technologies for ITO replacement. Performed SWOT analysis of graphene inks
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
RECENT DEVELOPMENTS IN LED MANUFACTURING 2016 Presentation by Santosh KUMAR o...Yole Developpement
INTRODUCTION TO YOLE DÉVELOPPEMENT AND LED ACTIVITIES
•LED MARKET OVERVIEW
•RECENT DEVELOPMENTS IN LED MANUFACTURING
•2015 STATUs OF THE LED INDUSTRY (AND FUTURE TRENDS)
•CONCLUSION
•APPENDIX-DETAILLED PRESENTATION OF YOLE DEVELOPPEMENT AND LED ACTIVITIES
Photonics market data on sensors, date centers, detectors, lighting (LED and ...Carlos Lee
Yole report abstract for EPIC 2016 International Optoelectronics Association presented by Carlos Lee, on 23 April 2016 in Zurich, Switzerland. For more information contact carlos.lee@epic-assoc.com
TOPICS: Sensors for Drones and robots, Gas sensor market and technology trends, Technology challenges for data center: the photonic case, Infrared detector market, LED modules technology and market trends, OLED for lighting, Medical imaging, Microbolometers.
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Embedded Image and Vision Processing 2017 report by Yole DeveloppementYole Developpement
From algorithms included in the image processing pipeline to neural networks running in vision processors, focus on the evolution of hardware in vision systems and how software disrupts this domain.
SOFTWARE IN VISION SYSTEMS
Vision systems are becoming increasingly important. Therefore, this report shows and explains the close links between embedded software and hardware in vision systems at the technology and market levels. What are the software technologies? How do they impact the hardware? Which hardware is impacted? What kinds of markets are affected? And how will they evolve?
We can consider software in vision systems as having two different levels. The first is very close to the hardware, inscribed inside standalone field programmable gate array (FPGA) or application specific integrated circuit (ASIC) chips, or integrated into more complicated architectures. This layer, not often considered, is the most important step in any image treatment after image acquisition by pixels. Image processing, realized in the image signal processor (ISP), has a quite simple function. It must transform a signal from the sensor to an understandable image for the human eye. It is composed as a pipeline of multiple blocks, where each block takes as input the output of the previous block. A lot of different algorithms are implemented to accomplish tasks such as removing artefacts, color correction and reproduction. This is done at a single-pixel or pixel-group level and does not need a lot of memory or power.
More information on that report at http://www.i-micronews.com/reports.html
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
More info on: https://www.i-micronews.com/report/product/microled-displays-2018.html
These slides use concepts from my (Jeff Funk) class to analyze the near-term future for touch-screen displays. Improvements in durability, sensitivity, and flexibility are being implemented
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Advanced Packaging Role after Moore’s Law: Transition from Technology Node Er...Yole Developpement
The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole
Before you attempt to hand wash your rug yourself, you should realize that it may be a better idea in the long run to take it to professionals for cleaning.
New Innovative Additive Manufacturing processes KTN
On July 10th Innovate UK and the KTN held a business innovation day to showcase 30 of the Innovate UK projects that are currently active in the area of Additive Manufacturing. The presentations and pitches made on the day are now available to view. Topic 1: New Additive Manufacturing Processes
This webinar was hosted in partnership with Quantum Computing & Simulation Hub, by the Quantum Technologies Innovation Network https://ktn-uk.org/quantum/.
Learn of the potential of cryo-electronics in quantum computing and other disciplines.
Cryogenic electronics is of critical importance in many fields including quantum technologies, astronomy and particle physics. This event was designed to bring scientists, engineers and industry across all relevant disciplines to advance the integration of electronics at cryogenic temperatures and combine resources to solve common challenges.
With this meeting, we hope to progress towards demonstrating the relevance and market size of cryogenic electronics. We welcome foundries and industry stakeholders in considering further engagement with this technology and present a state-of-the-art picture for all relevant stakeholders.
3 d printing-for-everyone-from-personnal-to-professional-applications-sirrisSirris
Intellectual property, traceability and the counterfeiting of 3D printable objects
3D printing for everyone - From personal to professional applications
Julien Magnien - Sirris
Presented for TTI Vanguard "Shift Happens" conference (http://bit.ly/TTIVshifthappens) visit to PARC, this is an overview of an all-printed and therefore low-cost, disposable sensor that conforms to the curvature of a helmet.
Developed for DARPA to monitor soldiers' blast exposure and prevent traumatic brain injury, the technology can be applied to multiple biomedical and other applications.
Printed electronic applications From concept to pilot production
1.
2. Printed electronic applications:
From concept to pilot production
Pit Teunissen
Eric Rubingh
Milan Saalmink
Jeroen Schram
Roel Kusters
Jeroen van den Brand