This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It discusses AT&S's focus on niche growth markets like smartphones, automotive, medical, and industrial applications. It highlights AT&S's broad technology portfolio and patented solutions that enable increasingly high-performance and thinner circuit boards. Finally, it emphasizes AT&S's commitment to quality, environmental protection, and successful long-term business growth.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It discusses AT&S's portfolio of advanced circuit board technologies including HDI, rigid-flex, and embedded component packaging. The document also outlines AT&S's production facilities, markets served, quality standards and commitment to sustainability.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
This document provides an overview of technological trends in circuit board design and manufacturing. It discusses how the circuit board market is dominated by Asia, with standard multilayer boards making up the largest share. Emerging technologies like HDI, rigid-flex boards, and embedded components are allowing for increased miniaturization and functionality. Key challenges include further reducing board thickness while maintaining performance. The document outlines several advanced manufacturing techniques and new substrate materials enabling these trends.
Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It begins with a disclaimer and agenda setting out the topics to be covered. It then discusses AT&S's product portfolio and technology capabilities. Subsequent sections cover the company's history, management team, business segments, growth strategy, locations, mid-term strategy including plans to enter the IC substrate market, an overview of the Chongqing project, financial results and debt profile. The document aims to present AT&S as a quality leader in its industry with a profitable growth path.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has 6 manufacturing sites globally and supplies "blue chip" customers. AT&S is entering the growing IC substrate market with a new plant in Chongqing, China starting production in 2016. Key trends in electronics like miniaturization, connectivity, and the internet of things are driving demand for AT&S' complex, high-quality printed circuit board and substrate solutions. AT&S aims to strengthen its technology leadership position and enter attractive new markets.
Global and china rigid pcb industry report, 2015ResearchInChina
The document provides an overview and analysis of the global rigid printed circuit board (PCB) industry. It discusses the industry's output value and trends from 2001-2015. It also examines the PCB industries and major companies in regions like Taiwan, China, Europe, North America, and Japan. The document aims to establish an updated, factual information base and strategic analysis of the leading global PCB companies and competitive landscape to assist with business and investment decisions. It includes sections on PCB technology trends, downstream markets, industry analysis, and in-depth profiles of 35 major PCB companies.
The document discusses RFID and printed electronics. It outlines 5 levels of integration for both surface mount technology (SMT) and printed electronics technology (PET). PET allows for lower cost solutions compared to SMT due to printing processes. RFID applications discussed include ticketing, pharmaceuticals, healthcare, marketing and gaming. Cost is driven by factors such as components, printing method, and integration level. Fully printed RFID systems could realize significant cost reductions over traditional RFID systems through optimization of materials, processes, and components.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It discusses AT&S's portfolio of advanced circuit board technologies including HDI, rigid-flex, and embedded component packaging. The document also outlines AT&S's production facilities, markets served, quality standards and commitment to sustainability.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
This document provides an overview of technological trends in circuit board design and manufacturing. It discusses how the circuit board market is dominated by Asia, with standard multilayer boards making up the largest share. Emerging technologies like HDI, rigid-flex boards, and embedded components are allowing for increased miniaturization and functionality. Key challenges include further reducing board thickness while maintaining performance. The document outlines several advanced manufacturing techniques and new substrate materials enabling these trends.
Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It begins with a disclaimer and agenda setting out the topics to be covered. It then discusses AT&S's product portfolio and technology capabilities. Subsequent sections cover the company's history, management team, business segments, growth strategy, locations, mid-term strategy including plans to enter the IC substrate market, an overview of the Chongqing project, financial results and debt profile. The document aims to present AT&S as a quality leader in its industry with a profitable growth path.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has 6 manufacturing sites globally and supplies "blue chip" customers. AT&S is entering the growing IC substrate market with a new plant in Chongqing, China starting production in 2016. Key trends in electronics like miniaturization, connectivity, and the internet of things are driving demand for AT&S' complex, high-quality printed circuit board and substrate solutions. AT&S aims to strengthen its technology leadership position and enter attractive new markets.
Global and china rigid pcb industry report, 2015ResearchInChina
The document provides an overview and analysis of the global rigid printed circuit board (PCB) industry. It discusses the industry's output value and trends from 2001-2015. It also examines the PCB industries and major companies in regions like Taiwan, China, Europe, North America, and Japan. The document aims to establish an updated, factual information base and strategic analysis of the leading global PCB companies and competitive landscape to assist with business and investment decisions. It includes sections on PCB technology trends, downstream markets, industry analysis, and in-depth profiles of 35 major PCB companies.
The document discusses RFID and printed electronics. It outlines 5 levels of integration for both surface mount technology (SMT) and printed electronics technology (PET). PET allows for lower cost solutions compared to SMT due to printing processes. RFID applications discussed include ticketing, pharmaceuticals, healthcare, marketing and gaming. Cost is driven by factors such as components, printing method, and integration level. Fully printed RFID systems could realize significant cost reductions over traditional RFID systems through optimization of materials, processes, and components.
Global and china ic substrate industry report, 2015ResearchInChina
IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.
Linx Consulting provides insights into the electronic materials supply chain and helps clients succeed through experience in industries such as semiconductors, LCDs, packaging, photovoltaics, and nanotechnology. They analyze challenges for the future including 3D packaging, 450mm wafers, new memory technologies, EUV lithography, and changes in the global market drivers as mobile devices surpass desktop and laptop computers. Process complexity is driving higher materials demand growth than wafer start growth, with segments such as photoresist and ancillaries showing stronger increases than overall wafer production.
Printed electronic applications From concept to pilot productionPit Teunissen
The document discusses printed electronic applications from concept to pilot production. It describes Holst Centre, an open innovation research institute focusing on flexible and stretchable electronics. Holst Centre takes concepts from partners or for technology testing and develops them through a process involving design, prototyping, process development, pilot production and potential outsourcing. This is demonstrated through examples including a smart blister, skinpatch, and smart garments with printed sensors. The goal is developing mass producible printed electronic applications.
This document provides an overview and introduction to a course on digital telecommunications technology. It discusses course objectives to give students an understanding of technology to make informed decisions. It analyzes why certain telecom products like Iridium satellite phones, ISDN, and in-flight phones failed, often due to high prices and lack of customer demand despite impressive technology. Customer perceptions of fairness, ease of use and acceptable prices are important factors in product success or failure beyond just technical performance.
Report’s Key Features
• PDF >130 slides
• Excel file with >3,800 patents
• Competitive landscape from a patent perspective, offering a very complementary vision to market research.
• Key patent owners, their IP and technology strategies and their future intents.
• New entrants, their technology and their market areas of interest.
• Know competitors’ strengths and weaknesses in terms of patents and technologies.
• Follow technology developments, identify emerging technologies and know key technical solutions to solve hot technical issues.
• Identify free technologies which can be used safely and to mitigate the risks of patent infringement.
• Identify technologies to acquire and potential R&D partners.
• Benefit from a useful Excel database with all patents analyzed in the report, including technology segmentation.
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Rold Skov Sawmill implemented a Motorola Solutions Wi-Fi network and barcode scanning system to track timber inventory in real-time. The network connects handheld and vehicle-mounted scanners and computers to read barcodes on wood and communicate data to the back office. This allows the sawmill to know inventory levels and locations at all times to efficiently process orders and adjust production. The rugged Motorola devices can withstand the harsh environmental conditions and physical impacts of the sawmill. The new system provides complete real-time inventory visibility and has improved customer service, planning, and reduced administration efforts.
Globaland china consumer electronics case & structure industry report,2009 2010ResearchInChina
The document summarizes key information about various consumer electronics industries and manufacturers of cases and structures for notebooks, TVs, digital cameras, and mobile phones. In the notebook industry, plastic cases still dominate but metal case manufacturers are increasing capacity. Mobile phone case manufacturer Jabil Green Point expanded significantly in 2009, while KH-VATEC benefited from contracts with Nokia. In digital cameras, manufacturers of metal cases saw increased revenue, with AVY Precision Technology becoming the leading manufacturer. Guangzhou Echom Science & Technology Group maintained its leadership in the TV castings and structures industry.
This document discusses AT&S, a leading manufacturer of printed circuit boards. It outlines AT&S's strategy to enter the IC substrate market, which produces substrates below 15 micrometers. IC substrates are needed as components continue to decrease in size. AT&S is well positioned to enter this market due to its quality leadership, technological expertise in high-end PCB production, and track record of successfully ramping up new high-tech plants in China. The document also reviews AT&S's growth strategy, which includes continuing to target high-end applications like smartphones and tablets, improving profit margins, and leveraging its chip embedding technology through strategic partnerships.
The document advertises an exclusive business catalog distributed by New Zealand Post to 60,000 businesses across Auckland on September 5-9. It offers businesses the opportunity to purchase advertising space at a 33% discount. The catalog will be delivered to business addresses and PO boxes along with other business mail. The booking deadline is August 18.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
The document discusses features of the Cinovate Multi-Call Application that allow users to create multiple task records from objects where calls can be logged, add additional contacts as attendees to tasks, add internal attendees who are Salesforce users, and view completed tasks and attendees on the task detail screen and related lists. Pricing for the application is $299 per year with discounts for non-profits, support is available Monday through Friday, and upgrades are included.
The document provides financial and operational information for AT&S for the first half of the 2014/15 fiscal year. Key points include:
- Revenue was stable at €302.1 million while EBITDA increased 10.5% to €72.3 million and profit for the period rose 29.5% to €28.4 million.
- The Mobile Devices & Substrates business unit achieved stable revenue while the Industrial & Automotive unit grew revenue by 8.8%.
- Construction of the new IC substrate plant in Chongqing is proceeding on schedule.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy of focusing on high-end technology applications, its balanced portfolio and global production footprint. Financial information shows steady revenue growth, above industry EBITDA margins of 18-20%, and strong cash flow generation. The outlook anticipates continued satisfactory business development in the current fiscal year provided macroeconomic stability.
The document advertises an exclusive business directory called the Auckland Business Catalogue that will be delivered by New Zealand Post to 60,000 businesses across Auckland from September 5-9. It offers businesses the opportunity to purchase advertising space at a 33% discount, with 40,000 catalogues printed for the cost and an additional 20,000 delivered free of charge. The deadline to book advertising is August 18. The catalog provides a way for B2B companies to reach many Auckland businesses at once.
- AT&S reported revenues of EUR 126 million for Q1 2012/13, up 14% from the same period a year earlier. However, EBIT fell to EUR 3.7 million due to lower-than-expected capacity utilization at its Shanghai plant from delays in new mobile device models.
- Industrial and automotive business grew steadily but demand from major industrial customers remained weak.
- Net profit was EUR 0.52 million, below expectations due to the issues faced in mobile devices. AT&S reaffirmed its guidance for sales and profit growth in 2012/13.
This document provides a summary of financial information for AT&S for the first three quarters of the 2013/14 fiscal year. It reports that revenue increased 11% to €451 million and EBITDA grew 34% to €100 million. Earnings per share rose from €0.24 to €1.08. It also announces management board and supervisory board changes, including a capital increase that raised over €12 million.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) as of March 31, 2014. It includes the consolidated statement of financial position, consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of cash flows, and notes to the consolidated financial statements. The notes provide information on AT&S' accounting policies, group structure and consolidation methods, financial performance and position.
The consolidated financial statements are presented in euros and were prepared in accordance with International Financial Reporting Standards and related interpretations as adopted in the European Union.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has production facilities in Europe and Asia. The presentation provides an overview of AT&S, including its business segments, product portfolio, global footprint, and key financial information. It also discusses trends in the electronics industry such as miniaturization and connectivity that drive demand for AT&S's complex, high-quality solutions. The company has a strategy to strengthen its technology portfolio and enter the growing IC substrate market to further push revenue growth. Financial highlights include steady revenue growth, solid EBITDA margins around 20%, and increasing operating cash flow.
Global and china ic substrate industry report, 2015ResearchInChina
IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.
Linx Consulting provides insights into the electronic materials supply chain and helps clients succeed through experience in industries such as semiconductors, LCDs, packaging, photovoltaics, and nanotechnology. They analyze challenges for the future including 3D packaging, 450mm wafers, new memory technologies, EUV lithography, and changes in the global market drivers as mobile devices surpass desktop and laptop computers. Process complexity is driving higher materials demand growth than wafer start growth, with segments such as photoresist and ancillaries showing stronger increases than overall wafer production.
Printed electronic applications From concept to pilot productionPit Teunissen
The document discusses printed electronic applications from concept to pilot production. It describes Holst Centre, an open innovation research institute focusing on flexible and stretchable electronics. Holst Centre takes concepts from partners or for technology testing and develops them through a process involving design, prototyping, process development, pilot production and potential outsourcing. This is demonstrated through examples including a smart blister, skinpatch, and smart garments with printed sensors. The goal is developing mass producible printed electronic applications.
This document provides an overview and introduction to a course on digital telecommunications technology. It discusses course objectives to give students an understanding of technology to make informed decisions. It analyzes why certain telecom products like Iridium satellite phones, ISDN, and in-flight phones failed, often due to high prices and lack of customer demand despite impressive technology. Customer perceptions of fairness, ease of use and acceptable prices are important factors in product success or failure beyond just technical performance.
Report’s Key Features
• PDF >130 slides
• Excel file with >3,800 patents
• Competitive landscape from a patent perspective, offering a very complementary vision to market research.
• Key patent owners, their IP and technology strategies and their future intents.
• New entrants, their technology and their market areas of interest.
• Know competitors’ strengths and weaknesses in terms of patents and technologies.
• Follow technology developments, identify emerging technologies and know key technical solutions to solve hot technical issues.
• Identify free technologies which can be used safely and to mitigate the risks of patent infringement.
• Identify technologies to acquire and potential R&D partners.
• Benefit from a useful Excel database with all patents analyzed in the report, including technology segmentation.
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Rold Skov Sawmill implemented a Motorola Solutions Wi-Fi network and barcode scanning system to track timber inventory in real-time. The network connects handheld and vehicle-mounted scanners and computers to read barcodes on wood and communicate data to the back office. This allows the sawmill to know inventory levels and locations at all times to efficiently process orders and adjust production. The rugged Motorola devices can withstand the harsh environmental conditions and physical impacts of the sawmill. The new system provides complete real-time inventory visibility and has improved customer service, planning, and reduced administration efforts.
Globaland china consumer electronics case & structure industry report,2009 2010ResearchInChina
The document summarizes key information about various consumer electronics industries and manufacturers of cases and structures for notebooks, TVs, digital cameras, and mobile phones. In the notebook industry, plastic cases still dominate but metal case manufacturers are increasing capacity. Mobile phone case manufacturer Jabil Green Point expanded significantly in 2009, while KH-VATEC benefited from contracts with Nokia. In digital cameras, manufacturers of metal cases saw increased revenue, with AVY Precision Technology becoming the leading manufacturer. Guangzhou Echom Science & Technology Group maintained its leadership in the TV castings and structures industry.
This document discusses AT&S, a leading manufacturer of printed circuit boards. It outlines AT&S's strategy to enter the IC substrate market, which produces substrates below 15 micrometers. IC substrates are needed as components continue to decrease in size. AT&S is well positioned to enter this market due to its quality leadership, technological expertise in high-end PCB production, and track record of successfully ramping up new high-tech plants in China. The document also reviews AT&S's growth strategy, which includes continuing to target high-end applications like smartphones and tablets, improving profit margins, and leveraging its chip embedding technology through strategic partnerships.
The document advertises an exclusive business catalog distributed by New Zealand Post to 60,000 businesses across Auckland on September 5-9. It offers businesses the opportunity to purchase advertising space at a 33% discount. The catalog will be delivered to business addresses and PO boxes along with other business mail. The booking deadline is August 18.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
The document discusses features of the Cinovate Multi-Call Application that allow users to create multiple task records from objects where calls can be logged, add additional contacts as attendees to tasks, add internal attendees who are Salesforce users, and view completed tasks and attendees on the task detail screen and related lists. Pricing for the application is $299 per year with discounts for non-profits, support is available Monday through Friday, and upgrades are included.
The document provides financial and operational information for AT&S for the first half of the 2014/15 fiscal year. Key points include:
- Revenue was stable at €302.1 million while EBITDA increased 10.5% to €72.3 million and profit for the period rose 29.5% to €28.4 million.
- The Mobile Devices & Substrates business unit achieved stable revenue while the Industrial & Automotive unit grew revenue by 8.8%.
- Construction of the new IC substrate plant in Chongqing is proceeding on schedule.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy of focusing on high-end technology applications, its balanced portfolio and global production footprint. Financial information shows steady revenue growth, above industry EBITDA margins of 18-20%, and strong cash flow generation. The outlook anticipates continued satisfactory business development in the current fiscal year provided macroeconomic stability.
The document advertises an exclusive business directory called the Auckland Business Catalogue that will be delivered by New Zealand Post to 60,000 businesses across Auckland from September 5-9. It offers businesses the opportunity to purchase advertising space at a 33% discount, with 40,000 catalogues printed for the cost and an additional 20,000 delivered free of charge. The deadline to book advertising is August 18. The catalog provides a way for B2B companies to reach many Auckland businesses at once.
- AT&S reported revenues of EUR 126 million for Q1 2012/13, up 14% from the same period a year earlier. However, EBIT fell to EUR 3.7 million due to lower-than-expected capacity utilization at its Shanghai plant from delays in new mobile device models.
- Industrial and automotive business grew steadily but demand from major industrial customers remained weak.
- Net profit was EUR 0.52 million, below expectations due to the issues faced in mobile devices. AT&S reaffirmed its guidance for sales and profit growth in 2012/13.
This document provides a summary of financial information for AT&S for the first three quarters of the 2013/14 fiscal year. It reports that revenue increased 11% to €451 million and EBITDA grew 34% to €100 million. Earnings per share rose from €0.24 to €1.08. It also announces management board and supervisory board changes, including a capital increase that raised over €12 million.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) as of March 31, 2014. It includes the consolidated statement of financial position, consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of cash flows, and notes to the consolidated financial statements. The notes provide information on AT&S' accounting policies, group structure and consolidation methods, financial performance and position.
The consolidated financial statements are presented in euros and were prepared in accordance with International Financial Reporting Standards and related interpretations as adopted in the European Union.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has production facilities in Europe and Asia. The presentation provides an overview of AT&S, including its business segments, product portfolio, global footprint, and key financial information. It also discusses trends in the electronics industry such as miniaturization and connectivity that drive demand for AT&S's complex, high-quality solutions. The company has a strategy to strengthen its technology portfolio and enter the growing IC substrate market to further push revenue growth. Financial highlights include steady revenue growth, solid EBITDA margins around 20%, and increasing operating cash flow.
A global enterprise like AT&S must be able to see the big picture
if it is to overcome the challenges presented by the market, and
the social and physical environment in which it operates. Sustainability
has always been one of our guiding principles, and it
is integral to our culture at all of our sites. To us, sustainability
is less about following trends than setting them. Our outstanding
environmental performance has made us a benchmark in
China, and our entire industry regards AT&S as a trailblazer.
We believe that
AT&S Investor and Analyst Presentation September 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has a strong focus on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and high profitability. Key strategies include focusing on high-end technologies and applications with above average growth potential.
- AT&S is a leading high-tech printed circuit board (PCB) company based in Austria with production facilities in Europe and Asia.
- The company is strategically focusing on high-end technologies like HDI PCBs and IC substrates for applications in mobile devices, automotive, industrial, and medical markets.
- AT&S is currently investing €480 million to build a new plant in Chongqing, China that will produce IC substrates and substrate-like PCBs starting in 2016, allowing the company to enter new high-growth market segments.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
The document provides an overview of products and events from Weidmüller, an electrical connectivity company. In the summary:
- Weidmüller exhibited products at various industry events in the UK, including their upcoming Surge Seminar, and have booked exhibitions for next year.
- The issue highlights Weidmüller's Push In PCB terminals for supporting SMD assembly and their FieldPower modular base for decentralized automation.
- Industrial Ethernet solutions featured include unmanaged and Power-over-Ethernet switches, gateways, and adapters shown on pages 14-19.
- The document invites readers to learn more about Weidmüller's products and contact them for discussions.
The document discusses E-T-A, a leading manufacturer of circuit breakers for equipment protection. It describes E-T-A's history of over 50 years of safety and reliability, research and development efforts, modern manufacturing facilities, and global network of subsidiaries and representatives. The document also highlights several of E-T-A's circuit breaker and power distribution products suited for the communication industry, including hydraulic-magnetic and thermal circuit breakers, as well as rack-based power distribution systems.
This document provides summaries of several companies that provide electronic components, design services, assembly services, equipment, materials, and substrates. It lists the services and products offered by each company, including RF/microwave amplifiers, ASIC development, satellite components, circuit design, semiconductor assembly, precision tools, adhesives, thick film pastes, ceramic grinding, thin film deposition, hermetic packages, and ceramic substrates. Contact information is provided for each company.
Gemtron technologies european presentation (2)DMacspain
Gemtron Technologies is an electronics manufacturing services company established in 1988 in Taiwan that provides cable assemblies, plastic molding, metal stamping, and OEM manufacturing services. The company aims to build long-term global partnerships through quality services and total solutions. It has locations in Taiwan, Hong Kong, USA, Japan, UK, China, and Hungary.
From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.
UmTRX is an open-source hardware project developing a low-cost, mid-range, power-efficient GSM base station transceiver. The first prototype is planned by the new year with a test deployment in 2012 at Mayotte. It uses a single-chip transceiver and modified open-source software to work with existing open GSM network components. The goal is to enable affordable mobile communications for small carriers, developing areas, and rural locations not served by large providers.
General Cable Wire Harness and Assembly BrochureMark Bittner
General Cable produces custom wire harnesses, fiber optic assemblies, and cable assemblies designed to meet exact specifications for a variety of industries. They offer end-to-end support from design and prototyping to volume production. With over 50 years of experience serving major OEMs, General Cable has the expertise to respond flexibly to changing customer needs.
- ST is one of the world's largest semiconductor companies with $12.8 billion in revenues in 2021 and 48,000 employees globally.
- It has a global presence with 14 manufacturing sites and over 80 sales & marketing offices serving over 200,000 customers.
- ST focuses on four key markets: automotive, industrial, personal electronics, and communications equipment. Its strategy is to lead in areas like car electrification, power management, and selected smartphone applications.
- The company's broad portfolio includes microcontrollers, analog and power ICs, MEMS sensors, and ASIC solutions enabled by its proprietary technologies like FD-SOI and Silicon Carbide.
Pentair provides electronics protection solutions including subracks, cases, cabinets, and integrated systems. Their Schroff brand offers over 6,000 standardized products as well as customized solutions. Pentair has expertise in industries like communications, infrastructure, industrial automation, security, medical, and more. They provide solutions from component level up to fully integrated systems, and have testing capabilities to ensure product quality and compliance with standards.
The document reviews opportunities in information and communication technologies for the South West region. It analyzes 210 regional companies, identifying strengths in areas like semiconductor design, telecom chip design, and content storage. Near field communications, all-optical networking, low power chips, and vertical chips are highlighted as opportunities based on their market size, growth, and the region's relevance. Regional companies mentioned as leaders in these areas include Samsung, Innovision, Atmel, AT&T Bell Labs, Gooch & Housego, Nortel, Infineon, Zarlink, and Broadcom.
The document describes Technifor's F-Series fibre laser marking systems. Key points:
- Fibre laser technology provides reliable, high-definition marking at fast speeds suitable for integration into production processes.
- The laser systems are available in a range of powers for various marking applications and materials.
- Technifor offers software, accessories, integration support and global customer service to provide complete laser marking solutions.
3M Double Coated Tape GPT-020F is a general purpose industrial thin bond tape that can bond to many substrates including stainless steel, plastics, aluminum, and glass. It has high initial tack, thermal and humidity resistance, and peel performance on many surfaces. The tape is suitable for various markets like appliances, industrial machinery, transportation, and electronics as it can adhere metals to some plastics and is easy to handle.
STMicroelectronics is one of the world's largest semiconductor companies with $16.1 billion in revenues in 2022. It has over 50,000 employees worldwide, including 9,000+ in R&D. The company has a global presence with 14 main manufacturing sites and over 80 sales and marketing offices serving over 200,000 customers. STMicroelectronics' strategy focuses on key markets like automotive, industrial, and internet of things, with strategic objectives to lead in areas like car electrification and power management.
STMicroelectronics is one of the world's largest semiconductor companies with $16.1 billion in revenues in 2022. It has over 50,000 employees including 9,000+ in R&D. The company has a global presence with 14 main manufacturing sites and over 80 sales and marketing offices worldwide. STMicroelectronics addresses four main end markets - automotive, industrial, personal electronics, and communications equipment - with strategic objectives to lead in areas like car electrification, power management, sensors, and selected smartphone applications.
Tyco Electronics is a leading provider of electronic components and solutions for the automotive industry. They offer terminals and connectors, sensors, cable assembly systems, inductive systems, mechatronics, and components for alternative power vehicles. Tyco Electronics is committed to supporting their customers' RoHS requirements by assessing over 1.5 million products for compliance and identifying compliant part numbers.
This document provides information about TouchWo, a manufacturer of touchscreen products. It summarizes TouchWo's product lines, facilities, certifications, applications, and customization services. TouchWo is headquartered in Guangzhou with branches in other Chinese cities and exports to over 20 countries. It focuses on providing smart touch products and overall solutions for industries like education, retail, healthcare, and more.
This document provides an overview of a large semiconductor company with over $16 billion in annual revenues and over 50,000 employees worldwide. It details the company's global presence with 14 main manufacturing sites and over 80 sales and marketing offices serving over 200,000 customers. The company is a leader in microcontrollers, analog and power chips, and MEMS and optical sensors helping enable trends in smart mobility, power management, and the Internet of Things.
1) The document is an annual report from AT&S, a leading manufacturer of printed circuit boards and IC substrates, reporting on the 2019/20 fiscal year.
2) It highlights key figures such as revenue declining 2.7% year-over-year to €1 billion, EBITDA falling 22.2% to €195 million, and profit for the period declining 75.9% to €21.5 million.
3) AT&S discusses major trends in the industry like 5G mobile networks, increasing data volumes, and growing markets for IC substrates that the company is positioned to capture through expansion.
- AT&S is a leading provider of printed circuit boards and IC substrates for applications such as mobile devices, automotive, industrial, medical, and more.
- In fiscal year 2019/20, AT&S achieved over €1 billion in revenue but saw declines in EBITDA and earnings per share due to lower sales volume, unfavorable product mix, and impacts of COVID-19.
- However, AT&S remained profitable with an EBITDA margin within its guided range of 18-20% and continues investing in expanding IC substrate capacities for future growth opportunities in high-performance computing.
This document provides an investor and analyst presentation for AT&S, a leading producer of printed circuit boards and IC substrates. It summarizes that AT&S has a unique market position as a provider of high-end PCBs and substrates for growth applications in mobile devices, automotive, industrial, and medical industries. It also outlines AT&S' global production footprint and technology leadership through continuous R&D efforts. The presentation discusses the company's growth strategy through incremental investments to capture opportunities in megatrend markets and its goal of sustainable profitability above industry averages.
- AT&S reported lower revenue and earnings for the first nine months of the 2019/20 financial year compared to the same period last year, due to market upheavals and the economic climate. Revenue was down 4.7% and EBITDA declined 29.1%.
- While some segments like IC substrates and medical saw increases, declines were seen in the mobile devices and industrial segments due to changes in product mix and price pressure.
- AT&S adjusted its outlook for the full financial year due to the effects of the coronavirus, and now expects revenue of €960 million and an EBITDA margin of 18-20%. Medium-term growth targets were maintained.
AT&S presented financial results for Q1-3 2019/20. Revenue declined slightly to €753.2 million from challenging market conditions, though remained within target margins. EBITDA fell to €156.4 million due to higher R&D and preparation costs for future applications. The automotive segment performed steadily despite difficulties, while industrial was weaker. Ongoing investments in IC substrate capacity will support long-term growth opportunities in high-performance computing.
AT&S Investor and Analyst Presentation September 2019 AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates. The summary is:
1) AT&S provides an overview of the company, its global footprint, investment highlights including its technology leadership position and financial results for Q1 2019/20.
2) Revenue was flat for Q1 2019/20 at €222.7 million due to diversified products compensating for market fluctuations, though EBITDA declined due to seasonal effects and a challenging market environment.
3) The presentation discusses the company's strategic focus on high-end technologies and driving future trends through innovation and expansion to achieve medium-term targets.
AT&S Investor and Analyst Presentation August 2019 von AT&S_IRAT&S_IR
AT&S presented its investor and analyst presentation for August 2019. Some key points:
- AT&S is a leading provider of high-end printed circuit boards and IC substrates.
- In Q1 2019/20, revenue was flat at €222.7 million but EBITDA declined due to challenging market conditions and higher R&D costs.
- Growth opportunities exist across all segments due to trends like 5G, AI, and electric vehicles. However, some segments like automotive currently face temporary slowdowns.
- AT&S is initiating its next growth step with a planned €1 billion investment over 5 years in a new IC substrate plant in China and expansion in Austria to capture demand for high
- Revenue for AT&S was stable at €222.7 million for the quarter, though earnings declined as expected due to market factors and investments in strategic expansion. EBITDA was €34.9 million, down 32.9%.
- Demand was weaker in the Mobile Devices, Automotive and Industrial segments, leading to underutilization of production capacity. The IC Substrates and Medical & Healthcare segments saw sales increases.
- AT&S initiated an investment project of up to €1 billion to significantly increase IC substrate capacity, with production starting in 2021. This is expected to double revenue to €2 billion in the next 5 years and improve margins long-term.
This document contains the consolidated financial statements of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) for the fiscal year ending March 31, 2019. It includes the consolidated statement of profit or loss, consolidated statement of financial position, notes to the consolidated financial statements, and independent auditor's reports on the consolidated and standalone financial statements. AT&S manufactures printed circuit boards and provides related services for industries including mobile devices, automotive, industrial, medical, and others.
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. In the past fiscal year, AT&S achieved over €1 billion in revenue with approximately 9,800 employees worldwide. The company focuses on providing solutions for mobile devices, automotive, industrial, medical and other applications. Looking ahead, AT&S expects growth to continue driven by digital megatrends and increasing demand for its solutions to support areas like mobility, autonomous driving, industrial automation and more.
AT&S Investor and Analyst Presentation January 2019AT&S_IR
This document provides an investor and analyst presentation for AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Some key points:
- AT&S is a leading global provider of printed circuit boards and IC substrates, serving growing end markets like mobile devices, automotive, industrial, and medical.
- In the first nine months of FY 2018/19, AT&S achieved revenue growth to €790.1 million and an increase in EBITDA to €220.5 million, demonstrating strong financial performance.
- The company is well positioned in high-end technologies through its focus on miniaturization and modularization. Its technology leadership and quality are keys to outperforming the broader
AT&S Investor and Analyst Presentation February 2019AT&S_IR
The document is an investor and analyst presentation from AT&S, a leading provider of printed circuit boards and IC substrates.
In the first 3 sentences:
AT&S reported revenue growth of 3.2% to €790.1 million for the first nine months of the fiscal year, with strong demand for IC substrates and in medical applications. EBITDA increased 15.9% to €220.5 million due to efficiency improvements and the absence of start-up costs in Chongqing. The presentation discusses AT&S' financial results, markets, strategy to become a leading high-end interconnect solutions provider, and outlook.
- Revenue for AT&S grew slightly to €790.1 million in the first three quarters of 2018/19, while EBITDA increased significantly by 15.9% to €220.5 million.
- Improved profitability was driven by efficiency gains, the absence of startup costs, and a better product mix, despite weaker demand in mobile devices and automotive.
- Earnings per share jumped 83.2% to €2.21, reflecting higher profits and stable number of shares outstanding.
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2. AT&S
at a glance
Application
Areas
AT&S is one of the world’s leading manufacturers of high-value
printed circuit boards
Leading manufacturer of HDI printed circuit boards, at the heart of
the electronics industry with high-tech production in China
Today’s digital industry would be
nothing without printed circuit
boards. They are the ‘brains’ of virtually all electronic appliances – smartphones, navigation systems, cameras,
automotive electronics, aeronautics –
and a large number of modern industrial and medical technologies. They
are central to our everyday life.
AT&S operates in attractive niche growth markets
Smartphones and tablets as growth drivers for Mobile Devices,
AT&S the leading supplier to the premium segment of the European automotive industry, more than 500 customers in the industrial
area, medical technology as a profitable niche market, and a strong
standing in Asia – the world’s largest growth market
AT&S puts its customers and their needs first
One-stop-shop solutions from prototype design to series production, delivering to major reductions in product development lead
times for customers
AT&S uses problem-solving skills to add value
Broad-based technology portfolio, user-focused solutions at the
cutting edge of the printed circuit board technology, patented technologies for increasingly high-performance and thinner printed
circuit boards, adding value beyond the production section of the
value chain
AT&S cultivates European engineering traditions
Around five percent of the Group’s revenue is reinvested in research
and development, 83 patent families, and countless partnerships
with leading international research institutions
AT&S is committed to the highest quality standards
Certification of all plants according to ISO 9001 and/or ISO/TS
16949, as one of just a handful of printed circuit board manufacturers that has achieved certification under the EN ISO 13485 standard
for medical technology and the EN 9100 aerospace standard
AT&S plays a pioneering role in environmental protection
Production of highly complex printed circuit boards with a minimal
impact on people and the environment, and annual reductions in
CO2 emissions and fresh water consumption
AT&S is a successful business
Diversification by industries and geographical markets, constant
revenue growth with strong margins, a stable ownership structure
that safeguards the Group’s long-term development
AT&S – part of your daily life
3. Mobile devices
AT&S is one of the world’s leading manufacturers of
high-end printed circuit boards for devices such as
smartphones, tablets, digital cameras, portable music
players. Its specialised skills and expertise, and innovative production technologies enable AT&S to meet
its customers’ increasingly demanding technical requirements.
Industrial Electronics
AT&S’s industrial market comprises a large number
of customers with an extremely wide range of technological requirements. A high degree of flexibility and
the ability to adapt to new technical specifications are
crucial success factors in this business.
Automotive & aviation
In its automotive and aviation businesses, AT&S activities focus principally on safety systems, entertainment, electromobility, weight reduction and future
driver assistance systems for driverless cars. The
product portfolio covers the full range of technologies
used in the automobile industry. Virtually all of the
major tier one European automotive component suppliers in the premium segment are AT&S customers.
Medical & health care
In medical and health care applications, reductions in
size and weight, and product reliability are the prime
concern, especially for devices such as pacemakers and
hearing aids. Here, our wealth of experience gained in
the mobile devices business is an additional benefit to
our customers.
Advanced packaging
Advanced Packaging bundles the activities based on
ECP® (Embedded Component Packaging) technology.
ECP® is a patented AT&S packaging technology used
to embed active and passive electronic components directly in the printed circuit board.
3D X-ray image of4
embedded electronic components
4. AT&S product portfolio
Double-sided printed circuit boards
Double-sided plated-through printed circuit boards are in use throughout the electronics
sector, and more particularly in industrial and automotive applications. AT&S specialises in series production of double-sided printed circuit boards with thicknesses in the
0.1-3.2mm range.
AT&S offers double-sided plated-through printed circuit boards with the following special features:
ƒƒ
Edge plating for shielding and ground connection
ƒƒ
Metal core for high thermal conductivity
(metal, copper or aluminium)
ƒƒ
Copper inlay for hotspot cooling
ƒƒ
Solder resist in green, white, black, blue, grey, brown, etc.
ƒƒ
Copper thickness of over 140μm
ƒƒ surfaces which are commonly used in the printed circuit
All
board industry
Multilayer printed circuit boards
Multilayer printed circuit boards came into the industry with the advent of SMD population. They are found almost everywhere, wherever electronics are in use – from aircraft to
motorcycles, and storage power stations to photovoltaics. AT&S produces printed circuit
boards in whatever numbers are required – from individual prototypes to small batches
and mass production. The number of layers ranges from 4 to 28, with a maximum thickness of 3.2mm.
AT&S offers multilayer printed circuit boards with the following special technologies:
ƒƒ
Edge plating for shielding and ground connection
ƒƒ
High frequency base materials for applications up to 80 GHz
ƒƒ
Cavities, countersunk holes or depth milling
ƒƒ
Thick copper up to 105μm (inner and outer layers)
ƒƒ
500μm thick copper inlays using HSMtec technology
ƒƒ
Solder resist in green, white, black, blue, grey, brown, etc.
ƒƒ
Controlled impedances (single, differential, etc.)
ƒƒ recognised printed circuit board industry surfaces available
All
5. AT&S is a world leader in the global market for high-end printed circuit boards – a reflection of its acknowledged competence in the production of top quality, custom solutions using state-of-the-art printed circuit board technologies.
HDI microvia printed circuit boards
The history of AT&S has been shaped by high density interconnect (HDI) printed
circuit boards. In 1997 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications
throughout the electronics industry, and their use was given additional impetus by
the introduction of BGA/CSP components. AT&S offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.
Special technologies offered by AT&S in connection with HDI:
ƒƒ
Edge plating for shielding and ground connection
ƒƒ
Copper-filled microvias
ƒƒ
Stacked and staggered microvias
ƒƒ
Cavities, countersunk holes or depth milling
ƒƒ
Solder resist in black, blue, green, etc.
ƒƒ
Minimum track width and spacing in mass production
around 50μm
ƒƒ
Low-halogen material in standard and high Tg range
ƒƒ
Low-DK Material for Mobile Devices
ƒƒ recognised printed circuit board industry surfaces available
All
HDI any-layer printed circuit boards
HDI any-layer printed circuit boards are the next technological enhancement of HDI
microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is
that all the layers can be freely interconnected. AT&S uses two technologies to produce
these circuit boards: the basic method uses laser-drilled microvias electroplated with
copper, and the alternative uses Panasonic’s conductive paste to fill the microvias
(ALIVH® Technology). ALIVH® is a registered trade mark of Panasonic Corporation.
Special technologies used with HDI any-layer printed circuit boards:
ƒƒ
Edge plating for shielding and ground connection
ƒƒ
Minimum track width and spacing in mass production around 40μm
ƒƒ
Stacked microvias (plated copper or filled
with conductive paste)
ƒƒ
Cavities, countersunk holes or depth milling
ƒƒ
Solder resist in black, blue, green, etc.
ƒƒ
Low-halogen material in standard and high Tg range
ƒƒ
Low-DK Material für Mobile Devices
ƒƒ recognised printed circuit board industry surfaces available
All
6. Flexible printed circuit boards
Flexible printed circuit boards are now in use throughout the electronics industry. The
circuit board is generally installed bent, folded or twisted. Flexible printed circuit boards
are primarily used to replace wiring and connectors, and to create configurations and
complex geometries that would be impracticable with rigid printed circuit boards.
AT&S offers the following product range:
ƒƒ
Flexible printed circuit boards based on polyimide,
from single-sided to multilayer flex
ƒƒ use in dynamic or static applications
For
ƒƒ
With SMD population and underfill
Semiflexible printed circuit boards
Semiflexible printed circuit boards differ from fully flexible ones in the materials used, as
well as in the restricted bending radii and the limited number of bending cycles. Instead
of polyimide, we use standard FR4 thin laminate materials as a more economical alternative in certain applications.
In semiflexible printed circuit boards, AT&S offers:
ƒƒ
Thin, double-sided FR4 materials
ƒƒ
Maximum of five bending cycles with a 5mm bending radius
ƒƒ
Cost effective flex-to-install solutions
ƒƒ
Soldering without pre-baking
ƒƒ
More stable construction, simplifying handling during assembly
Rigid-flexible printed circuit boards
Rigid-flexible printed circuit boards directly combine the advantages of flexible and
rigid printed circuit boards. This combination of technologies brings the user a variety
of advantages especially in terms of signal transmission, overall size, assembly and stability. AT&S produces this technology in three of its plants, allowing it to offer a wide
range of products and expertise.
In rigid-flexible printed circuit boards, AT&S offers:
ƒƒ
Printed circuit boards with rigid areas, and flexible areas with reduced
numbers of layers
ƒƒ
Combination of polyimide and FR4, or FR4 and thin laminate
ƒƒ
Rigid-flexible printed circuit boards, which connect rigid boards without
the need for cables or connectors, resulting in better signal transmission
ƒƒ
With SMD population and underfill
ƒƒ commonly used surfaces available
All
7. Flexible printed circuit boards on aluminium
The use of LEDs in the automotive industry and in lighting in buildings has posed new
challenges in the shape and design of printed circuit boards. When installing LEDs in
front headlights, for example, the printed circuit board is bonded to an aluminium heat
sink to which the LEDs are then attached. The printed circuit boards offered by AT&S
have either one, two or three layers (HDI).
AT&S offers the following options:
ƒƒ
Aluminium or copper heat sinks
ƒƒ
Available with thermally conductive bonding material or
prepreg (0.3-3.0 W/(m•K))
ƒƒ
Available in punched version, or routed
HDI rigid-flex printed circuit boards
In response to market requirements, AT&S also offers mass production of its core HDI
technology in combination with flexible printed circuit boards. To make this possible,
AT&S has entered into a collaborative agreement with a world market leader in flexible
circuit board technology.
In HDI rigid-flex, AT&S can offer the following features:
ƒƒ
Combination of HDI rigid and HDI flex layers
ƒƒ
Stacked and staggered microvias on all layers
ƒƒ
Halogen-free base material (medium Tg) and polyimide
ƒƒ
SMD population
ƒƒ
Mechanical assembly in or on the housing
Insulated metal substrate (IMS) printed circuit boards
In the single side printed circuit board business, AT&S focuses on IMS boards. These are
used primarily as heat sinks for LEDs and power components. To enable heat dissipation,
the base material used has one side that is an aluminium or copper layer either 1.0mm or
1.6mm thick.
AT&S offers the following special features:
ƒƒ
Materials with prepreg or thermally conductive resins
ƒƒ
Thermal conductivity in the 0.35-8.0 W/(m•K) range
ƒƒ
Scored or routed versions
ƒƒ
White or black solder resist
ƒƒ
Based on highly reflective aluminium e.g. Alanod®
ƒƒ
Special surfaces are possible, such as ceramic surfaces
8. AT&S Technologies
ECP® Embedded Component Packaging
ECP® is the patented AT&S packaging technology used to embed active and passive electronic components directly in the inner layers of the printed circuit board. The technology is used to miniaturise circuits and reduce
the space they require, and to increase reliability and product lives. In line with the general trend, printed circuit boards produced with ECP® technology are used in ever smaller, more efficient and more powerful devices,
such as smartphones, tablets, digital cameras, and hearing aids.
Advantages
ƒƒ
Efficient circuit miniaturisation through component embedding
ƒƒ
Performance enhancement through integration of new
functionalities
ƒƒ
Increases in reliability and product lives
ƒƒ
Enhanced signal quality through copper connection of the
integrated components
ƒƒ
Cooling optimisation
ƒƒ
Compatibility with traditional SMT processes
2.5D® Technology Platform
The 2.5D® Technology Platform is a patented AT&S technology for combining mechanical and electronic miniaturisation. It can be used to make cavities in the printed circuit board so that electronic components can be
positioned lower, with the result that the complete assembly has a thinner profile. In addition to cavities, flexto-install printed circuit boards with inner and outer flex layers are also possible. The use of polyimide-free
base materials makes for extremely reliable printed circuit boards.
Advantages
ƒƒ
Cost advantages over conventional cavity and rigid-flex approaches
as a result of the elimination of several process steps (e.g. stamping)
and the use of standard printed circuit board materials (e.g.
prepregs, RCC foils)
ƒƒ
Cavities of different depths on the same printed circuit board, and
no restrictions on cavity shapes
ƒƒ restrictions on base materials, and use of state-of-the-art design
No
rules
ƒƒ
Surfaces of cavities suitable for solder resist
ƒƒ
Different technologies can be combined (e.g. rigid-flex and cavity)
ƒƒ approval for cavity and rigid-flex applications
UL
9. The portfolio of patented technologies focuses on the continuing trend towards miniaturisation combined with performance enhancement and reduced consumption of natural resources.
NucleuS® Environmentally-friendly single-card manufacturing concept
The patented NucleuS® production technology allows for optimal use of the production format in the series
production of individual cards. These are then fitted with their frames before being shipped out to subcontract
assemblers for population. This brings advantages both in printed circuit board production and in board population.
Advantages
ƒƒ
Material and energy savings as a result of more efficient panel
usage
ƒƒ
Minimal reject rates
ƒƒ
Reduction in registration errors in individual cards
ƒƒ
Flexibility in the design of cards with minimal impact on costs
(spacing, frames)
ƒƒ
Potential for increasing card sizes with improved registration
accuracy
ƒƒ
Potential for card standardisation and increase in population
capacities
ALIVH® Any Layer Interstitial Via Hole
The ALIVH® Technology (ALIVH® is a registered trade mark of Panasonic Corporation) uses a copper-resin paste
for through-hole connections and filling laser-drilled holes, in a screen printing process developed specially
for the purpose. This replaces the electroplating process generally used in the printed circuit board industry to
create the electrical connections between the individual layers. The advantages are a reduction in the thickness
of the printed circuit board, improved etching properties resulting in finer tracks through the use of thinner
copper foil, and greater impedance accuracy in series production. ALIVH® Technology also helps conserve resources (water, energy, copper, etc.) and makes possible the uses of more environmentally friendly processes.
Advantages
ƒƒ
Reduction in circuit board thickness
ƒƒ
Stacked and staggered microvias
ƒƒ to 12 layers with three HDI build-up layers per side (ALIVH-C®)
Up
ƒƒ to 12 layers with connections across all layers (ALIVH-G®)
Up
ƒƒ
Halogen-free base material (Tg ~ 150°C)
ƒƒ
Etching of finer tracks on all layers (< 50μm)
ƒƒ
Greater impedance accuracy
ƒƒ
Reduced series delivery times
=> Parallel processing methods
ƒƒ
More environmentally friendly production
process, with reduced consumption of resources
10. Global presence
AT&S locations and competences
ƒƒ
Production facilities in Europe and Asia
ƒƒ
Headquarters in Leoben, Austria
ƒƒ
Procurement centre in Hong Kong, China
ƒƒ
Design centre in Düren, Germany
ƒƒ
Sales network spanning four continents
ƒƒ
Approximately 7,300 staff
Each AT&S plant concentrates on a specific portfolio of technologies. The
Austrian plants primarily supply the European market and increasingly the
American one. In Europe, short lead times, special applications and closeness
to customers are typically the most important considerations. The plants in
Austria, India and Korea generally concentrate on small and medium-sized
batches for industrial and automotive customers. In Shanghai, the focus is
on large-volume production of HDI printed circuit boards for mobile communications customers, and increasingly also for the automotive industry. In
Chongqing, also in China, a new plant is under construction. In collaboration
with a leading semiconductor manufacturer, it will concentrate on the production of IC substrates.
Shanghai and Leoben are major technology drivers within the AT&S Group
thanks to their research and development facilities.
Plants
Sales offices /
representations
Leoben,
Austria
Fehring,
Austria
Nanjangud,
India
Headquarters
ƒƒ Staff: 800
ƒƒ Opened: 1982
ƒƒ Production capacity:
110,000 square metres
ƒƒ Customer orientation:
Automotive, Industrial, Medical
ƒƒ Staff: 400
ƒƒ Opened: 1974
ƒƒ Production capacity:
300,000 square metres
ƒƒ Customer orientation:
Automotive, Industrial
ƒƒ Staff: 1,100
ƒƒ Opened: 1999
ƒƒ Production capacity:
380,000 square metres
ƒƒ Customer orientation:
Automotive, Industrial
Technologies
ƒƒ Double-sided
plated-through printed
circuit boards
ƒƒ Rigid-flex printed
circuit boards
ƒƒ Flexible printed circuit boards
ƒƒ Metal core printed
circuit boards
Technologies
ƒƒ Standard multilayer
circuit boards
ƒƒ Double-sided
plated-through printed
circuit boards
Technologies
ƒƒ Standard printed circuit boards
ƒƒ HDI Multilayer printed circuit boards
ƒƒ Rigid-flex printed circuit boards
ƒƒ ECP® (Embedded Component Packaging)
ƒƒ Printed circuit boards for high
voltage applications
ƒƒ Prototypes, test- and reference boards
Certifications
ƒƒ ISO 9001:2008
ƒƒ ISO/TS 16949:2009
ƒƒ ISO 14001:2004
ƒƒ OHSAS 18001:2007
ƒƒ DS/EN ISO 13485:2003
ƒƒ Sony Green Partner Certificate
ƒƒ EN9100:2009
ƒƒ AEO Certificate
ƒƒ UL Listing
Certifications
ƒƒ ISO 9001:2008
ƒƒ ISO/TS 16949:2009
ƒƒ ISO 14001:2004
ƒƒ OHSAS 18001:2007
ƒƒ Sony Green Partner Certificate
ƒƒ AEO Certificate
ƒƒ UL Listing
Certifications
ƒƒ ISO 9001:2008
ƒƒ ISO/TS 16949:2009
ƒƒ ISO 14001:2004
ƒƒ OHSAS 18001:2007
ƒƒ UL Listing
11. Leoben, Austria
Fehring, Austria
Ansan, Korea
Shanghai, China
Chongqing, China
Nanjangud, India
Chongqing,
China
Shanghai ,
China
Ansan,
Korea
ƒƒ Groundbreaking ceremony:
June 2011
ƒƒ Focus: IC-substrates
ƒƒ Under construction
ƒƒ Staff: 4,500
ƒƒ Opened: 2002
ƒƒ Production capacity:
790,000 square metres
ƒƒ Customer orientation:
Mobile Devices, Automotive
ƒƒ Staff: 300
ƒƒ Opened: 2006
ƒƒ Production capacity:
120,000 square metres
ƒƒ Customer orientation:
Industrial, Automotive,
Mobile Devices, Medical
Technologies
ƒƒ HDI multilayer printed
circuit boards
ƒƒ ALIVH® printed
circuit boards
ƒƒ Rigid-flex HDI printed
circuit boards
ƒƒ HDI any-layer printed
circuit boards
Certifications
ƒƒ ISO 9001:2008
ƒƒ ISO/TS 16949:2009
ƒƒ ISO 14001:2004
ƒƒ OHSAS 18001:2007
ƒƒ Sony Green Partner
Certificate
ƒƒ Canon Green Partner
Certificate
ƒƒ UL Listing
Technologies
ƒƒ Single and double-sided
flexible printed circuit
boards
ƒƒ Flexible multilayer
circuit boards
ƒƒ Rigid-flex printed
circuit boards
ƒƒ Flexible printed circuit
boards with metal
reinforcement
Certifications
ƒƒ ISO 9001:2008
ƒƒ ISO/TS 16949:2009
ƒƒ ISO 14001:2004
ƒƒ OHSAS 18001:2007
ƒƒ UL Listing
12. AT&S Headquarters
Technical contacts
Fabriksgasse 13
8700 Leoben
Austria
Tel.: +43 3842 200-0
E-Mail: sales@ats.net
Hubert Haidinger
Fabriksgasse 13
8700 Leoben
Austria
Tel.: +43 3842 200 5852
E-Mail: h.haidinger@ats.net
Roland Wilfing
5000, Jin Du Road, Xinzhuang Industry Park
Minhang District, Shanghai 201108,
P.R. China
Tel.: +86 2124 080 190
E-Mail: r.wilfing@ats.net
www.ats.net