Huawei has transformed from a small workshop in China to the world's largest telecommunications company through a focus on research and development. It began by reverse engineering foreign technology and developing its own telecommunications switches. Through aggressive pricing, expanding R&D spending, and a focus on underserved rural markets, Huawei was able to become the dominant player in China and then expand globally, now serving over 30% of the world's population. However, concerns over its links to the Chinese government and accusations of intellectual property theft have limited its success in some Western markets.
Huawei has transformed from a small workshop in China to the world's largest telecommunications company through a focus on research and development. It began by reverse engineering foreign technology and developing its own telecommunications switches. Through aggressive pricing, expanding R&D spending, and a focus on underserved rural markets, Huawei was able to become the dominant player in China and then expand globally, now serving over 30% of the world's population. However, concerns over its links to the Chinese government and accusations of intellectual property theft have limited its success in some Western markets.
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權，是一組事前設計好並驗證完畢、可重複使用的功能組塊，屬於半導體產業的上游，隨著 IC 產業垂直分工化的趨勢而崛起，具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用，初次會收取授權金 (License)，往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進，全球矽智財市場也高速成長，終端市場以消費性電子為大宗，車用與 AI 應用則為主要成長動能。
1) 3D IC designs stack multiple silicon dies on top of each other using through-silicon vias (TSVs) to connect the dies. This overcomes limitations of conventional 2D designs like Moore's law.
2) Key advantages of 3D IC include higher density, performance and lower power consumption from shorter interconnects. It also enables heterogeneous integration and improves reliability.
3) Challenges include developing 3D transistor architectures, managing variability and thermal issues across stacked dies, and ensuring design and manufacturing tools are ready to support 3D IC. Major applications are seen in memory, imaging sensors and processors.
【Intern Case Study_矽智財】
矽智財 (IP) 是 IC 設計所使用的智慧財產權，是一組事前設計好並驗證完畢、可重複使用的功能組塊，屬於半導體產業的上游，隨著 IC 產業垂直分工化的趨勢而崛起，具有高進入門檻、無庫存、高毛利等特色。
矽智財產業的商業模式為將設計好的 IP 模組授權給買家使用，初次會收取授權金 (License)，往後開始量產則轉為收取權利金 (Royalty)。隨著先進製程不斷演進，全球矽智財市場也高速成長，終端市場以消費性電子為大宗，車用與 AI 應用則為主要成長動能。
1) 3D IC designs stack multiple silicon dies on top of each other using through-silicon vias (TSVs) to connect the dies. This overcomes limitations of conventional 2D designs like Moore's law.
2) Key advantages of 3D IC include higher density, performance and lower power consumption from shorter interconnects. It also enables heterogeneous integration and improves reliability.
3) Challenges include developing 3D transistor architectures, managing variability and thermal issues across stacked dies, and ensuring design and manufacturing tools are ready to support 3D IC. Major applications are seen in memory, imaging sensors and processors.
