More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends - 20...Yole Developpement
GaN power devices: a promising, fast-growing market
A GROWING MARKET WITH LOTS OF EXCITING NEWS IN 2015 - 2016
2015 - 2016 has been an exciting year for the gallium nitride (GaN) power business. Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from Efficient Power Conversion (EPC), but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.
Also, a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea
of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.
Despite these exciting developments, the GaN power market remains small compared to the gigantic $335B silicon semiconductor market. In fact, according to Yole Développement (Yole) investigation the GaN power business was less than $10M in 2015. But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market.
The first GaN devices were not commercially available until 2010, so we are talking about an industry that is only six years old. What is most important is the GaN market’s future potential – and Yole expects the GaN power business to grow, reaching a market size of around $300M in 2021 at a 2016 – 2021 CAGR of 86%.
This report provides a structured vision of the GaN power device market in terms of uses, applications, and potential trends.
Inverter Technology Trends and Market Expectations 2016 Report by Yole Develo...Yole Developpement
Growing at 6% per year from 2015-2021 and with increased presence from Chinese players, the inverter industry is heading towards higher power density converters.
2015 was a historic year for solar inverter and wind turbine installations.
The inverter market that Yole Développement covers in this report is continuing its growth, reaching $48B in 2015. Applications span electric and hybrid electric vehicles (EV/HEV), wind turbines, photovoltaic (PV) inverters, rail traction, uninterruptible power supplies (UPS) and industrial motor drives. The market is driven by three macroeconomic factors: electrification trends in transportation, the need for power conversion optimization for CO2 emission reduction, and the development of clean electricity sources. Governmental incentives and especially the Chinese government’s control of their local market drives an expanding inverter market, which is now largely oriented towards the Asian giant...
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
GaN and SiC for power electronics applications 2015 Report by Yole DeveloppementYole Developpement
The SiC market is expected to treble and GaN is expected to explode - if challenges are overcome
In 2014, the SiC chip business was worth more than $133M. As in previous years, power factor correction (PFC) and photovoltaics (PV) are still the leading applications.
SiC diodes represent more than 80% of the market. In 2020, diodes will remain the main contributor across various applications, including electric and hybrid electric vehicles (EV/HEV), PV, PFC, wind, Uninterruptible Power Supplies (UPS) and motor drives.
SiC transistors will grow in parallel with diodes, driven by PV inverters. Challenges must be overcome prior to the adoption of pure SiC solutions for EV power train inverters, which is nevertheless expected by 2020.
Including the growth in both diodes and transistors we expect the total SiC market to more than treble by 2020, reaching $436M...
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends - 20...Yole Developpement
GaN power devices: a promising, fast-growing market
A GROWING MARKET WITH LOTS OF EXCITING NEWS IN 2015 - 2016
2015 - 2016 has been an exciting year for the gallium nitride (GaN) power business. Up until late 2014, 600V/650V GaN HEMTs’ commercial availability was still questionable, despite some announcements from different players. Fast-forward to 2016 end users can now buy not only low-voltage GaN (<200V) devices from Efficient Power Conversion (EPC), but also high-voltage (600V/650V) components from several players, including Transphorm, GaN Systems, and Panasonic.
Also, a new start-up, Navitas Semiconductor, announced their GaN power IC in March 2016, followed by Dialog Semiconductors revealing their GaN power IC in August 2016. The idea
of bringing GaN from the power semiconductor market to the much bigger analog IC market is of interest to several other players too. For example, EPC and GaN Systems are both working on a more integrated solution, and Texas Instruments, a well-established analog IC player, has also been engaged in GaN activities, releasing an 80V power stage and 600V power stage in 2015 and 2016, respectively.
Despite these exciting developments, the GaN power market remains small compared to the gigantic $335B silicon semiconductor market. In fact, according to Yole Développement (Yole) investigation the GaN power business was less than $10M in 2015. But before you think twice about GaN, remember that a small market size is not unusual for products just appearing on the market.
The first GaN devices were not commercially available until 2010, so we are talking about an industry that is only six years old. What is most important is the GaN market’s future potential – and Yole expects the GaN power business to grow, reaching a market size of around $300M in 2021 at a 2016 – 2021 CAGR of 86%.
This report provides a structured vision of the GaN power device market in terms of uses, applications, and potential trends.
Inverter Technology Trends and Market Expectations 2016 Report by Yole Develo...Yole Developpement
Growing at 6% per year from 2015-2021 and with increased presence from Chinese players, the inverter industry is heading towards higher power density converters.
2015 was a historic year for solar inverter and wind turbine installations.
The inverter market that Yole Développement covers in this report is continuing its growth, reaching $48B in 2015. Applications span electric and hybrid electric vehicles (EV/HEV), wind turbines, photovoltaic (PV) inverters, rail traction, uninterruptible power supplies (UPS) and industrial motor drives. The market is driven by three macroeconomic factors: electrification trends in transportation, the need for power conversion optimization for CO2 emission reduction, and the development of clean electricity sources. Governmental incentives and especially the Chinese government’s control of their local market drives an expanding inverter market, which is now largely oriented towards the Asian giant...
Status of the Power Electronics Industry 2019 by Yole DéveloppementYole Developpement
Long term growth of the power electronics market is driving 300mm wafer-based production.
More information on: https://www.i-micronews.com/products/status-of-the-power-electronics-industry-2019/
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...Yole Developpement
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Status of the Power Electronics Industry - 2016 Report by Yole DeveloppementYole Developpement
With strong price pressure and a very strong leader, how will the power electronics market and landscape evolve in the future?
Vehicle hybridization is pulling the power electronics market
The 21st century is full of challenges to overcome, including population growth, reducing CO2 emissions and developing energy sources to replace liquid fuel. Power electronics will play a key part in solving these problems. Among the applications Yole Développement follows, motor drives are helping increase motor efficiency, photovoltaics and wind turbines continue expand their role in energy supply, and rail networks are moving more people. But one application stands out thanks to the huge volumes involved: electric vehicles. In the 2000s MOSFETs drove growth, and in the early 2010s it was renewable energy. The late 2010s and 2020s could be the golden era for electric vehicles, if customers adopt it and governments keep on subsidizing the field.
2015 has been a difficult year for the power electronics market, with the global value of power ICs, power modules and discrete components decreasing from $15.7 billion to $15.2 billion, a 3% drop. This fall is explained mainly by strong Average Selling Price (ASP) decreases at IGBT module level. We expect this ASP trend to continue, mainly because of price pressure from the automotive market. But overall IGBT module and global power electronics market value should increase, as volume growth outweighs this ASP fall. The automotive market will strengthen its position, as we expect electric and hybrid electric vehicles (EV/HEV) to represent a major part of the IGBT module market by 2021. Over this time the power MOSFET market is expected to grow slightly for all applications, going from $1 billion to $1.2 billion value.
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
SiC & GaN - Technology & market knowledge updatePntPower.com
Wide Band Gap semiconductor are more and more used in power electronics. Silicon Carbide and Gallium Nitride are now involved in the race to replace silicon. With huge R&D investments and start-ups facing historical players, market and technology knowledge becomes key. Point The Gap presented a SiC & GaN market knowledge update. All the information needed to understand this market, gathered in a few slides by a power electronics market intelligence specialist. Also available on www.PointThePower.com.
Including company names like Transphorm, Infineon, EPC corp., Cambridge electronics, Rohm, Cree, Toyota, Finsix, Zolt, Avogy, etc...
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
orvo started as a supplier for Apple’s iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo’s Module in its flagship. In iPhone 6s series, Apple integrates Qorvo’s LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flip™) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
Gate Driver Market and Technology Trends - 2017 Report by Yole DeveloppementYole Developpement
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
The gate driver IC market will benefit from the steady growth of the power semiconductor industry
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
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Cree-Wolfspeed Strategic and Competitive Analysis by Yole DéveloppementYole Developpement
What could happen after Cree’s strategy pivot?
CREE HAS PIVOTED!
In February 2018, Cree announced a strategic pivot on its investor day. The company decided to change its focus and invest primarily in its smallest business, Wolfspeed. This announcement comes after a series of actions:
• It decided to spin out the SiC power and radio frequency (RF) GaN business, branded Wolfspeed in 2015
• It tried to sell Wolfspeed, including the SiC power and GaN RF businesses and its SiC wafer business, to Infineon for $850M in 2016, but was blocked by the Committee on Foreign Investment in the United States.
More information on: https://www.i-micronews.com/category-listing/product/cree-wolfspeed.html
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Solid-State Lighting Source Industry 2019 by Yole DéveloppementYole Developpement
From lighting to sensing: a new growth era for the solid-state lighting industry.
More information on: https://www.i-micronews.com/products/status-of-the-solid-state-lighting-source-industry-2019/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Status of the Chinese Power Electronics Industry 2015 Report by Yole Developp...Yole Developpement
Government initiatives and private companies are boosting power electronics market opportunities, enabling Chinese players to compete internationally.
Driven by government policy and private companies, Chinese power electronics are promising.
In 2014, almost 40% of power semiconductor devices, including FETs, IGBT, Thyristors, Rectifiers and Diodes, were shipped in China, representing a $6B market. There is no doubt that today’s China represents one of the most important markets for power electronics.
As for its macro-economy, the Chinese government plays an important role in directing the power electronics market. For example, because of serious pollution problems the Chinese government has established a comprehensive policy framework in terms of research, technology innovation, finance, and tax incentives to support the development of a New Energy Vehicle (NEV) industry. Many white papers have been released and different subsidies and tax cuts are available to promote the market...
SETi - UVTOP270TO39HS and SS35DF227513 UVC LEDs for Disinfection and Chemical...Yole Developpement
Deep ultraviolet LEDs with 275nm peak emission in 0.1mm² and 1mm² dies.
This report combines the analysis of two components in order to offer a broad vision of the technologies used by UVC LEDs in terms of applications and power output. The UVTOP270TO39HS and SS35DF227513 are two 275nm UVC LEDs from Sensor Electronic Technology Inc. (SETi). The UVTOP270TO39HS, with its hemispherical lens and 0.1mm² LED, is adapted for fluorescent spectroscopy and chemical /
biological analysis. The SS35DF227513, with its flat window, is designed for disinfection.
The two LED dies are based on the same technology: an AlN template layer deposited on a sapphire substrate. The AlGaN active layers are epitaxied on the AlN layer, but the thickness is very different between the two dies. The SS35DF227513 is manufactured using the latest SETi technological evolution. The new AlN and AlGaN structure reduces the defect density to enhance external quantum efficiency. At 1mm², the SS35DF227513 is 9x taller than SETi’s first UVC LED and boasts 15x more power.
The TO39 with a hemispherical lens is an expensive package, but it is destined for instrumentation. The new SMD3535 package in the SS35DF227513’s ceramic is cheaper and designed for disinfection with a large viewing angle and better thermal resistance that allows continuous use of the 1mm² LED.
This report delivers a deep technology analysis of the packaging and the components, with images of the complex AlN and AlGaN epitaxy layer stack and electrode structure. Also included are a production cost analysis and an overall comparison with the first SETi UVC LED.
More information on that report at http://www.i-micronews.com/reports.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Gas Sensor Technology and Market - 2016 Report by Yole DeveloppementYole Developpement
Gas sensors on the verge of massive market adoption
Air quality is becoming a major concern, and therefore gas sensors are increasingly attracting interest. Gas sensing technologies are not new. Gas sensors embedded in gas detectors for defense and industrial safety applications form a highly regulated and mature market. But the growing awareness of the air quality challenge humankind faces is creating new applications and opportunities. These include gas sensors in consumer products like home devices, wearables and smartphones, or for buildings and cars, including indoor/in-cabin air quality monitoring.
Yole Développement’s Gas Sensor report estimates that the gas sensor market is currently growing, driven by Heating, Ventilation Air Conditioning (HVAC) and future consumer applications. It was worth $560M in 2014 and will reach almost $920M in 2021, at 7.3% CAGR. An upside market of almost $65M in 2021 is possible if gas sensors are widely adopted in consumers products.
There are numerous market drivers that will contribute to the growth:
• Driven by better energy management, the building market will experience 13.6% CAGR for a total market estimated at $237M in 2021.
• The medical industry is looking for very high sensitivity for asthma attack sensors or oxygen sensors for breath control.
• Consumer applications such as wearables and smartphones are driving the development of new gas sensors to reduce cost, power consumption and size with MEMS technologies.
• Driven by the desire for better outdoor air quality control, the environmental market will grow at almost 19% CAGR.
• The transport market is driven by oxygen sensors and future depollution applications.
The consumer market is very attractive as it can drive very large volumes depending on user case adoption, cost and technical maturity. The smartphone industry has revolutionized the sensor industry as mobile applications today aggregate ever more sensors. Gas sensors could be the next to be integrated in smart phones and/or wearables. As we believe that user cases are crucial for wide adoption of gas sensors in consumer products, we have built a list of potential applications and benchmarked them.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
The first UVA/UVB light sensor using innovative resin and very compact package from Capella, Samsung’s top light sensor supplier.
Historically known for its technological capabilities in optoelectronics and recently acquired by Vishay Intertechnology ($205M), Capella releases its integrated UV Sensor based on Filtron™ technology to provide accurate UVA/UVB light sensing.
Apple and Samsung are the first customer of this type of device.
The CM3512 is an UV sensor equipped with photodiode, amplifiers, and analog/digital circuits into a single chip. It is designed by CMOS process and has I2C protocol interface. The use of PCB substrate enables a very compact package.
Compared with state of the art UV Sensors supplied by Rohm Semiconductor and Silicon Labs, the new design developed by Capella is based on patented Filtron™ Technology resin which offers reliable light-filtering capabilities into a variety of polymeric substrates.
Assembled in a OPLGA 2.35 x 1.8 x 1.0mm package, the CM3512 is an advanced sensitivity UV sensor targeted for consumers applications.
More information on that report athttp://www.i-micronews.com/reports/Capella-Microsystems-CM3512-Ultraviolet-Light-Sensor/1/453/
PV Monitoring Business Analysis, Technology Trends and Players 2013 Report b...Yole Developpement
PV Monitoring is a key ingredient in future global energy management solutions, as it strengthens the link between PV inverter manufacturing and the services provided by PV system operators.
PV Monitoring – an indispensable element for future global energy management
Worldwide electricity demand is expected to rise quickly, due mainly to rapidly growing economies’ high energy consumption. Photovoltaics (PV) technology enables the transformation of solar energy into electricity in a clean, direct way, and is considered an important part of the energy solution for a sustainable future Earth. The PV market is poised for growth; by 2020, it will reach nearly 450 GWp of cumulative installed capacity. PV monitoring helps satisfy PV project developers’ and system owners’ key needs by guaranteeing maximum ROI from PV installations thanks to higher system availability, better performance, tighter safety and lower operational & maintenance costs.
This report analyzes market trends and explains how PV monitoring has become essential to global energy management systems and successful integration of large intermittent PV electricity volumes into the electrical grid. For largesize installations in mature PV markets, a PV monitoring solution is a mandatory element which should be factored in at the early stages of PV project development in order to increase project bankability and reduce costs related to financing and insurance.
New partnerships and M&A activities are on the way
During an installation’s lifetime, a number of companies are involved in PV monitoring on different levels, i.e. PV project assessment, PV system commissioning, PV monitoring equipment and PV monitoring services. PV monitoring’s supply chain is a work in progress and there are still many opportunities for small players - especially for companies working in software and data analysis, and firms involved on the local end (distribution, installation, maintenance, etc.). As this report shows, the trend towards vertical and horizontal integration within the PV monitoring value chain reflects efforts to capture more customers by proposing better, more complete and more geographically-accessible solutions.
The growing need for global energy management solutions provides an opportunity for large multinational companies, which are already looking for small, easy-to-acquire firms that can help them accelerate development of complete energy solutions such as autonomous PV-battery systems, smart homes and smart cities. Inverter and battery makers, providers of smart-data analysis methods and well-established local monitoring companies are the focus of ongoing Merger & Acquisition (M&A) and partnerships efforts.
More information on the report at http://www.i-micronews.com/reports/PV-Monitoring-Business-Analysis-Trends-Main-Players/5/387/
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...Yole Developpement
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Status of the Power Electronics Industry - 2016 Report by Yole DeveloppementYole Developpement
With strong price pressure and a very strong leader, how will the power electronics market and landscape evolve in the future?
Vehicle hybridization is pulling the power electronics market
The 21st century is full of challenges to overcome, including population growth, reducing CO2 emissions and developing energy sources to replace liquid fuel. Power electronics will play a key part in solving these problems. Among the applications Yole Développement follows, motor drives are helping increase motor efficiency, photovoltaics and wind turbines continue expand their role in energy supply, and rail networks are moving more people. But one application stands out thanks to the huge volumes involved: electric vehicles. In the 2000s MOSFETs drove growth, and in the early 2010s it was renewable energy. The late 2010s and 2020s could be the golden era for electric vehicles, if customers adopt it and governments keep on subsidizing the field.
2015 has been a difficult year for the power electronics market, with the global value of power ICs, power modules and discrete components decreasing from $15.7 billion to $15.2 billion, a 3% drop. This fall is explained mainly by strong Average Selling Price (ASP) decreases at IGBT module level. We expect this ASP trend to continue, mainly because of price pressure from the automotive market. But overall IGBT module and global power electronics market value should increase, as volume growth outweighs this ASP fall. The automotive market will strengthen its position, as we expect electric and hybrid electric vehicles (EV/HEV) to represent a major part of the IGBT module market by 2021. Over this time the power MOSFET market is expected to grow slightly for all applications, going from $1 billion to $1.2 billion value.
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
SiC & GaN - Technology & market knowledge updatePntPower.com
Wide Band Gap semiconductor are more and more used in power electronics. Silicon Carbide and Gallium Nitride are now involved in the race to replace silicon. With huge R&D investments and start-ups facing historical players, market and technology knowledge becomes key. Point The Gap presented a SiC & GaN market knowledge update. All the information needed to understand this market, gathered in a few slides by a power electronics market intelligence specialist. Also available on www.PointThePower.com.
Including company names like Transphorm, Infineon, EPC corp., Cambridge electronics, Rohm, Cree, Toyota, Finsix, Zolt, Avogy, etc...
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
orvo started as a supplier for Apple’s iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo’s Module in its flagship. In iPhone 6s series, Apple integrates Qorvo’s LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flip™) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
Gate Driver Market and Technology Trends - 2017 Report by Yole DeveloppementYole Developpement
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
The gate driver IC market will benefit from the steady growth of the power semiconductor industry
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
To get more information, please visit our website: https://www.i-micronews.com/reports.html
Cree-Wolfspeed Strategic and Competitive Analysis by Yole DéveloppementYole Developpement
What could happen after Cree’s strategy pivot?
CREE HAS PIVOTED!
In February 2018, Cree announced a strategic pivot on its investor day. The company decided to change its focus and invest primarily in its smallest business, Wolfspeed. This announcement comes after a series of actions:
• It decided to spin out the SiC power and radio frequency (RF) GaN business, branded Wolfspeed in 2015
• It tried to sell Wolfspeed, including the SiC power and GaN RF businesses and its SiC wafer business, to Infineon for $850M in 2016, but was blocked by the Committee on Foreign Investment in the United States.
More information on: https://www.i-micronews.com/category-listing/product/cree-wolfspeed.html
Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report b...Yole Developpement
GaN market growth is fed by Lidar, wireless charging and fast charging solutions.
More information on : https://www.i-micronews.com/category-listing/product/power-gan-2018-epitaxy-devices-applications-and-technology-trends.html
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Status of the Solid-State Lighting Source Industry 2019 by Yole DéveloppementYole Developpement
From lighting to sensing: a new growth era for the solid-state lighting industry.
More information on: https://www.i-micronews.com/products/status-of-the-solid-state-lighting-source-industry-2019/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
What is driving the advanced packaging market in China?
China has the world’s largest population, and its economy will continue to grow at a high pace (more than 6%), reaching around $16T by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. No business can afford to ignore China. China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. The Chinese IC market is expected to reach ~$149B by 2020, around 40% of the total IC market. There is a huge gap between China’s IC consumption and its manufacturing. In 2015, China produced only ~12.5% of the IC it consumes, and the gap between IC consumption and production is ~$91B. Currently, IC is China’s #1 import commodity, exceeding oil. China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments. This report gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. This report will also describe China’s semiconductor outlook, prospects, market drivers, key players, and supply chain evolution. It will discuss at length the Chinese government’s approach to developing China’s IC industry, including details about different private funds, their objectives, and investments made to date. Overall, this report will help local and global players identify challenges and opportunities in the Chinese IC market and assist them in developing strategies to maximize their market share in China’s fast-growing IC ecosystem, particularly in advanced packaging.
Status of the Chinese Power Electronics Industry 2015 Report by Yole Developp...Yole Developpement
Government initiatives and private companies are boosting power electronics market opportunities, enabling Chinese players to compete internationally.
Driven by government policy and private companies, Chinese power electronics are promising.
In 2014, almost 40% of power semiconductor devices, including FETs, IGBT, Thyristors, Rectifiers and Diodes, were shipped in China, representing a $6B market. There is no doubt that today’s China represents one of the most important markets for power electronics.
As for its macro-economy, the Chinese government plays an important role in directing the power electronics market. For example, because of serious pollution problems the Chinese government has established a comprehensive policy framework in terms of research, technology innovation, finance, and tax incentives to support the development of a New Energy Vehicle (NEV) industry. Many white papers have been released and different subsidies and tax cuts are available to promote the market...
SETi - UVTOP270TO39HS and SS35DF227513 UVC LEDs for Disinfection and Chemical...Yole Developpement
Deep ultraviolet LEDs with 275nm peak emission in 0.1mm² and 1mm² dies.
This report combines the analysis of two components in order to offer a broad vision of the technologies used by UVC LEDs in terms of applications and power output. The UVTOP270TO39HS and SS35DF227513 are two 275nm UVC LEDs from Sensor Electronic Technology Inc. (SETi). The UVTOP270TO39HS, with its hemispherical lens and 0.1mm² LED, is adapted for fluorescent spectroscopy and chemical /
biological analysis. The SS35DF227513, with its flat window, is designed for disinfection.
The two LED dies are based on the same technology: an AlN template layer deposited on a sapphire substrate. The AlGaN active layers are epitaxied on the AlN layer, but the thickness is very different between the two dies. The SS35DF227513 is manufactured using the latest SETi technological evolution. The new AlN and AlGaN structure reduces the defect density to enhance external quantum efficiency. At 1mm², the SS35DF227513 is 9x taller than SETi’s first UVC LED and boasts 15x more power.
The TO39 with a hemispherical lens is an expensive package, but it is destined for instrumentation. The new SMD3535 package in the SS35DF227513’s ceramic is cheaper and designed for disinfection with a large viewing angle and better thermal resistance that allows continuous use of the 1mm² LED.
This report delivers a deep technology analysis of the packaging and the components, with images of the complex AlN and AlGaN epitaxy layer stack and electrode structure. Also included are a production cost analysis and an overall comparison with the first SETi UVC LED.
More information on that report at http://www.i-micronews.com/reports.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Gas Sensor Technology and Market - 2016 Report by Yole DeveloppementYole Developpement
Gas sensors on the verge of massive market adoption
Air quality is becoming a major concern, and therefore gas sensors are increasingly attracting interest. Gas sensing technologies are not new. Gas sensors embedded in gas detectors for defense and industrial safety applications form a highly regulated and mature market. But the growing awareness of the air quality challenge humankind faces is creating new applications and opportunities. These include gas sensors in consumer products like home devices, wearables and smartphones, or for buildings and cars, including indoor/in-cabin air quality monitoring.
Yole Développement’s Gas Sensor report estimates that the gas sensor market is currently growing, driven by Heating, Ventilation Air Conditioning (HVAC) and future consumer applications. It was worth $560M in 2014 and will reach almost $920M in 2021, at 7.3% CAGR. An upside market of almost $65M in 2021 is possible if gas sensors are widely adopted in consumers products.
There are numerous market drivers that will contribute to the growth:
• Driven by better energy management, the building market will experience 13.6% CAGR for a total market estimated at $237M in 2021.
• The medical industry is looking for very high sensitivity for asthma attack sensors or oxygen sensors for breath control.
• Consumer applications such as wearables and smartphones are driving the development of new gas sensors to reduce cost, power consumption and size with MEMS technologies.
• Driven by the desire for better outdoor air quality control, the environmental market will grow at almost 19% CAGR.
• The transport market is driven by oxygen sensors and future depollution applications.
The consumer market is very attractive as it can drive very large volumes depending on user case adoption, cost and technical maturity. The smartphone industry has revolutionized the sensor industry as mobile applications today aggregate ever more sensors. Gas sensors could be the next to be integrated in smart phones and/or wearables. As we believe that user cases are crucial for wide adoption of gas sensors in consumer products, we have built a list of potential applications and benchmarked them.
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
The first UVA/UVB light sensor using innovative resin and very compact package from Capella, Samsung’s top light sensor supplier.
Historically known for its technological capabilities in optoelectronics and recently acquired by Vishay Intertechnology ($205M), Capella releases its integrated UV Sensor based on Filtron™ technology to provide accurate UVA/UVB light sensing.
Apple and Samsung are the first customer of this type of device.
The CM3512 is an UV sensor equipped with photodiode, amplifiers, and analog/digital circuits into a single chip. It is designed by CMOS process and has I2C protocol interface. The use of PCB substrate enables a very compact package.
Compared with state of the art UV Sensors supplied by Rohm Semiconductor and Silicon Labs, the new design developed by Capella is based on patented Filtron™ Technology resin which offers reliable light-filtering capabilities into a variety of polymeric substrates.
Assembled in a OPLGA 2.35 x 1.8 x 1.0mm package, the CM3512 is an advanced sensitivity UV sensor targeted for consumers applications.
More information on that report athttp://www.i-micronews.com/reports/Capella-Microsystems-CM3512-Ultraviolet-Light-Sensor/1/453/
PV Monitoring Business Analysis, Technology Trends and Players 2013 Report b...Yole Developpement
PV Monitoring is a key ingredient in future global energy management solutions, as it strengthens the link between PV inverter manufacturing and the services provided by PV system operators.
PV Monitoring – an indispensable element for future global energy management
Worldwide electricity demand is expected to rise quickly, due mainly to rapidly growing economies’ high energy consumption. Photovoltaics (PV) technology enables the transformation of solar energy into electricity in a clean, direct way, and is considered an important part of the energy solution for a sustainable future Earth. The PV market is poised for growth; by 2020, it will reach nearly 450 GWp of cumulative installed capacity. PV monitoring helps satisfy PV project developers’ and system owners’ key needs by guaranteeing maximum ROI from PV installations thanks to higher system availability, better performance, tighter safety and lower operational & maintenance costs.
This report analyzes market trends and explains how PV monitoring has become essential to global energy management systems and successful integration of large intermittent PV electricity volumes into the electrical grid. For largesize installations in mature PV markets, a PV monitoring solution is a mandatory element which should be factored in at the early stages of PV project development in order to increase project bankability and reduce costs related to financing and insurance.
New partnerships and M&A activities are on the way
During an installation’s lifetime, a number of companies are involved in PV monitoring on different levels, i.e. PV project assessment, PV system commissioning, PV monitoring equipment and PV monitoring services. PV monitoring’s supply chain is a work in progress and there are still many opportunities for small players - especially for companies working in software and data analysis, and firms involved on the local end (distribution, installation, maintenance, etc.). As this report shows, the trend towards vertical and horizontal integration within the PV monitoring value chain reflects efforts to capture more customers by proposing better, more complete and more geographically-accessible solutions.
The growing need for global energy management solutions provides an opportunity for large multinational companies, which are already looking for small, easy-to-acquire firms that can help them accelerate development of complete energy solutions such as autonomous PV-battery systems, smart homes and smart cities. Inverter and battery makers, providers of smart-data analysis methods and well-established local monitoring companies are the focus of ongoing Merger & Acquisition (M&A) and partnerships efforts.
More information on the report at http://www.i-micronews.com/reports/PV-Monitoring-Business-Analysis-Trends-Main-Players/5/387/
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
Touch screens displays semiconductor defense and consumer applications sapphi...Yole Developpement
Non substrate applications account for 25% of the US$1 billion sapphire industry. But emerging mobile phone applications could bring this total to more than $3 billion by 2018.
Display cover applications could more than triple the size of the industry within the next 5 years
Established applications could generate US$366 million in 2018. But adoption of sapphire for smartphone display covers could generate an additional $1.3 to $2.6 billion depending on the adoption scenario.
Sapphire is currently used in some exotic, luxury phones. However the sapphire price reduction combined with the massive adoption of touch screen in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.
Adoption of sapphire in mobile display covers represents the single largest opportunity discussed in this report. It remains, however, uncertain. We see 4 major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning's Gorilla. We estimate that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the Bill Of Material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.
It is difficult to predict the success of sapphire in this application. However, we expect that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 - early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.
Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.
In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging...
More information at http://www.i-micronews.com/reports/Sapphire-Applications-Touch-screens-displays-semiconductor/3/372/
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)
After being integrated in the latest Apple’s iPhone in 2013, Bosch is now the top MEMS supplier according to Yole’s Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report: http://www.i-micronews.com/reports/Bosch-Sensortec-BMA355-3-Axis-MEMS-Accelerometer/1/452/
SMA Sunny Boy SB 1.5 1-vl40 1500W 2015 teardown reverse costing report publis...Yole Developpement
With a nominal power of 1.5KWAC, the transformer-less inverter, which provides one MPPT and a peak efficiency of 97.2%, offers a suitable solution for small size photovoltaic system owners. It enables grid-injection as well as self-consumption, following the new trend in solar inverters. Integrated Ethernet and WLAN interfaces offer multiple possibilities for communication and data monitoring. Delivered without display, the integrated user interface makes possible to monitor system data on any smartphone, tablet or PC.
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
Fairchild’s first consumer IMU manufactured using a completely new bulk micro machining process and interconnection structure.
Fairchild enters the market of combo sensors, and particularly 6-axis IMU, with its first consumer IMU bundled with Fairchild's high-performance 9-axis sensor fusion algorithms, XKF3™, and on-chip AttitudeEngine™ motion processor.
Fairchild is presenting a product completely different than other devices on the market, from size, manufacturing process and cost point of view.
Fairchild proposes a 3.3x3.3x1mm device, a footprint increased by 18% when compared with the latest STMicroelectronics and Bosch 6-axis IMU.
The device presents one ASIC and one MEMS die stacked on 2 layers PCB and connected by wire bonding. The electrical connections in the MEMS structure are performed by TSV which allows a better utilization of the space and a larger gyroscope and accelerometer areas.
On the process side, new techniques has been introduced in the MEMS fabrication. The MEMS die is manufactured by bulk micromachining on three wafers bonded together by eutectic and direct bonding.
The FIS1100 targets wearable sensors for sports, fitness, and health; pedestrian navigation; autonomous robots; and virtual and augmented reality.
The report includes a detailed technology and cost comparison with ST’s new generation LSM6DS3 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer
Automotive MEMS Combo
Murata’s Second Generation Combo Sensors for Automotive & Harsh Environments
Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.
The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.
The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.
The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0x8.5x4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.
SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.
The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.
More information on that report at http://www.i-micronews.com/reports.html
Magnetometers are widely integrated in consumer applications. More and more devices will require a positioning system and magnetometers are essential for such a purpose. A CAGR of +8% in units is forecasted by Yole Developpement from 2015 to 2020.
In this report, 3-Axis & 6-Axis eCompasses from different suppliers and different generations are compared in term of technology choice, manufacturing process and cost. The main eCompass references have been extracted from a wide selection of smartphones and analyzed. Size and technology quickly evolve but the main players remain AKM and Yamaha, representing more than 80% of the market. Nevertheless, several products from other players have been analyzed as well. These players, like Aichi Steel, ALPS, Bosch, Everspin, Honeywell or MEMSIC use different technologies and could disrupt the market within the next years.
More information on that report at http://www.i-micronews.com/reports.html
Transphorm TPH3002PS 600V GaN on Silicon HEMT 2015 teardown reverse costing r...Yole Developpement
High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package
The TPH3002PS is a 600V EZ-GaN™ HEMT for high frequency operations from Transphorm. Manufactured by Fujitsu and assembled in a TO220 package, it features the Quiet-TabTM scheme which increases switching speed by 200%. With a 7.5ns turn-on and a 10ns turn-off, the TPH3002PS has a higher switch frequency than the best CoolMOS.
The TPH3002PS is based on a cascode configuration of a GaN on Silicon HEMT transistor to hold the high voltage and a standard low voltage MOSFET to drive high frequency and to make a normally-off transistor from a normally-on GaN HEMT.
The device is assembled in a TO220 package for an easy integration in converter electronic system. Moreover, it integrates a Quiet-Tab™ and a Gate-Source-Drain (GSD) pin-out arrangement in order to reduce the parasitic inductance and capacitance in high frequency and to allow 200% increase in switching speed compared to traditional TO-220.
The report presents a deep technology analysis of the packaging and the components with TEM images of the complex GaN epitaxy layer stack and transistor structure.
It also includes production cost analysis and overall comparison with GaN Systems GS66508P 650V HEMT.
More information on that report at http://www.i-micronews.com/reports.html
Bosch’s first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
The report provides essential patent data, technology analysis and market forecasts for 7 selected Emerging MEMS (eMEMS) technologies that we believe will soon reach the marketplace: autofocus, AOC MEMS, chemical sensors, micro-speakers, scanning micro-mirrors, Si microfluidic and ultrasonic MEMS. The market for emerging MEMS covered in this report is expected to grow from US$171M in 2013 to US$2.8B in 2019, corresponding to a 58.2% CAGR.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
Sapphire Applications & Market 2015 Report by Yole DeveloppementYole Developpement
After a false start in 2014, will Apple finally use sapphire display covers in 2016?
Investing activities continues in sapphire display cover supply chain? Why?
Apple will represents 20% of 2015 global sapphire consumption with its iPhone and watch sapphire components. But Lens recently announced plans to raise US$942M and invest US$532M of the proceed to further increasing sapphire growth and finishing capacity. In 2014, Apple, its partners and their suppliers spent close to US$2B to set up a sapphire display cover supply chain. GTAT built and installed 2135 ASF furnaces, Biel and Lens deployed close to 200 wire saws and 1000’s of finishing tools and ancillary equipment. But the projects faced many problems and Apple eventually gave up on sapphire for its iPhone 6. Reasons were multiple but can be summarized in “too early, to fast, too much”. The project was ambitious in its timeframe and targeted outputs while many of the necessary processes and technologies in crystal growth and finishing were still at an early stage of development. But the venture still set the stage for the future: the partners have developed an unrivalled expertise on how to work with sapphire in high volumes and cost controlled environment. A lot was also learned with the manufacturing of the complex 3D shaped Apple Watch cover...
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
Since 2017, Knowmade has been following the intellectual property (IP) trends related to RF front-end devices and their packaging. Recently, Knowmade witnessed increasing patenting activity related to PAMiD modules, RF front-end modules, RF filters and switch integration, and antennas for 5G and their packaging. Packaging of 5G systems requires the integration of RF, analog and digital functions along with passives and other system components in a single module. These systems exemplify the heterogeneous integration trend which becomes more important for 5G. Proximity of the transceiver and front-end module is also important, to reduce size and loss. This is achieved by integrating antennas with the RF module as well as simultaneous modeling of a heat dissipation solution to keep active components in acceptable thermal conditions. In the mm-wave antenna-in-package solutions, interconnections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is the form factor, and to meet it the industry is progressively moving from conventional interconnect techniques such as wire-bonding and flip-chip interconnections to emerging techniques referred to as Fan-Out packaging or ICembedding. Flip-chip and Fan-out interconnections were originally developed for highperformance computing or mobile processor applications, but their fine pitch and low electrical parasitic have pushed RF players to use them in their RF/mm-wave modules. Today, these approaches are getting more and more critical for the RF industry and are used in antenna-integrated modules. In this report, Knowmade analyzes the patent landscape related to antenna integrated in package (AiP, AoP). The AiP patent landscape is led by major semiconductor foundries and OSATs, SJ Semiconductor (SJSemi) being the main patent assignee, and it includes any links in the supply chain. Foundries/OSATs (SJSemi/SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs/fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have filed AiP-related patents to protect their structures/designs or manufacturing methods
Presentation of Yole Developpement Marketing and Strategy Consulting Company ...Yole Developpement
FROM TECHNOLOGIES TO MARKETS
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services.
With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
Jean-Christophe Eloy, CEO & President's Words:
“From our experience assessing emerging technologies for over a decade, we have developed a unique understanding of technologies that enables us to accurately evaluate markets, applications, solutions and strategies. We aim to build deep relationships, discussing and sharing information across our vast global network.
A rapid convergence of key technologies is driving unprecedented change. In this dynamic environment our goal is to understand our customers’ strengths and guide their success. The focus of our business is to help our customers grow.”
More information at www.yole.fr
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Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
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Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
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More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Le nuove frontiere dell'AI nell'RPA con UiPath Autopilot™UiPathCommunity
In questo evento online gratuito, organizzato dalla Community Italiana di UiPath, potrai esplorare le nuove funzionalità di Autopilot, il tool che integra l'Intelligenza Artificiale nei processi di sviluppo e utilizzo delle Automazioni.
📕 Vedremo insieme alcuni esempi dell'utilizzo di Autopilot in diversi tool della Suite UiPath:
Autopilot per Studio Web
Autopilot per Studio
Autopilot per Apps
Clipboard AI
GenAI applicata alla Document Understanding
👨🏫👨💻 Speakers:
Stefano Negro, UiPath MVPx3, RPA Tech Lead @ BSP Consultant
Flavio Martinelli, UiPath MVP 2023, Technical Account Manager @UiPath
Andrei Tasca, RPA Solutions Team Lead @NTT Data
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
SAP Sapphire 2024 - ASUG301 building better apps with SAP Fiori.pdfPeter Spielvogel
Building better applications for business users with SAP Fiori.
• What is SAP Fiori and why it matters to you
• How a better user experience drives measurable business benefits
• How to get started with SAP Fiori today
• How SAP Fiori elements accelerates application development
• How SAP Build Code includes SAP Fiori tools and other generative artificial intelligence capabilities
• How SAP Fiori paves the way for using AI in SAP apps
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
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Founded in 1998, Yole Développement has grown to become a
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time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the non-
breaching Party shall be entitled to terminate all the pending
orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the benefit
of the Seller itself, but also for its licensors, employees and agents.
Each of them is entitled to assert and enforce those provisions
against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and Conditions
or to any contract (orders) entered into in application of
these Terms and Conditions shall be settled by the French
Commercial Courts of Lyon, which shall have exclusive
jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the
Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES
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