The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
DRAM & NAND Service – Memory Research 2018 Reports by Yole Developpement Yole Developpement
More information on DRAM report at https://www.i-micronews.com/report/product/dram-service-–-memory-research.html
and NAND report : https://www.i-micronews.com/report/product/nand-service-–-memory-research.html
The document discusses Nick Gutwein's presentation at Goldman Sachs' "Exhilarated by Electronics" forum on July 12, 2005. It includes forward-looking statements and non-GAAP financial data. The presentation agenda covers Rohm and Haas' performance in 2004, its diverse business portfolio, end markets served, and focus on sales growth, margin expansion, cash generation, and strong governance. It also provides an overview of Rohm and Haas' electronic materials business, including its circuit board, semiconductor, and packaging/finishing technologies and growth strategies in R&D and Asia.
Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Déve...Yole Developpement
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
DRAM & NAND Service – Memory Research 2019 Monitors by Yole DéveloppementYole Developpement
2018 DRAM & NAND markets: the end of an incredible multi-year rally…
More information on DRAM monitors at: https://www.i-micronews.com/produit/dram-service-memory-research/
More information on NAND monitors at: https://www.i-micronews.com/produit/nand-service-memory-research/
Status of the LED Industry 2013 Report by Yole DeveloppementYole Developpement
This document provides a summary of the LED industry and market analysis. It discusses LED applications, market status, players and main trends. Some key points include:
- LED adoption rates are expected to increase substantially between 2013 and 2020, especially in lighting applications and large displays.
- The LED supply chain has become more regionalized in recent years, with China gaining significant market share since 2010.
- The LED industry experienced overcapacity issues after a surge of new capacity was added in China between 2010-2012. Consolidation is expected to help absorb excess capacity by mid-2014.
- LED prices have declined sharply since 2010 across all package types, though this may limit revenue growth in saturated markets like phones
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
MarketResearchReprots.com has announced the addition of “Forecast of Global Semiconductor Inspection Equipment Players Market 2023” research report to their offering. See more at- http://mrr.cm/w3C
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
DRAM & NAND Service – Memory Research 2018 Reports by Yole Developpement Yole Developpement
More information on DRAM report at https://www.i-micronews.com/report/product/dram-service-–-memory-research.html
and NAND report : https://www.i-micronews.com/report/product/nand-service-–-memory-research.html
The document discusses Nick Gutwein's presentation at Goldman Sachs' "Exhilarated by Electronics" forum on July 12, 2005. It includes forward-looking statements and non-GAAP financial data. The presentation agenda covers Rohm and Haas' performance in 2004, its diverse business portfolio, end markets served, and focus on sales growth, margin expansion, cash generation, and strong governance. It also provides an overview of Rohm and Haas' electronic materials business, including its circuit board, semiconductor, and packaging/finishing technologies and growth strategies in R&D and Asia.
Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Déve...Yole Developpement
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
DRAM & NAND Service – Memory Research 2019 Monitors by Yole DéveloppementYole Developpement
2018 DRAM & NAND markets: the end of an incredible multi-year rally…
More information on DRAM monitors at: https://www.i-micronews.com/produit/dram-service-memory-research/
More information on NAND monitors at: https://www.i-micronews.com/produit/nand-service-memory-research/
Status of the LED Industry 2013 Report by Yole DeveloppementYole Developpement
This document provides a summary of the LED industry and market analysis. It discusses LED applications, market status, players and main trends. Some key points include:
- LED adoption rates are expected to increase substantially between 2013 and 2020, especially in lighting applications and large displays.
- The LED supply chain has become more regionalized in recent years, with China gaining significant market share since 2010.
- The LED industry experienced overcapacity issues after a surge of new capacity was added in China between 2010-2012. Consolidation is expected to help absorb excess capacity by mid-2014.
- LED prices have declined sharply since 2010 across all package types, though this may limit revenue growth in saturated markets like phones
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
MarketResearchReprots.com has announced the addition of “Forecast of Global Semiconductor Inspection Equipment Players Market 2023” research report to their offering. See more at- http://mrr.cm/w3C
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Sample MEMS Microphone Technology and Patent Infringement Risk AnalysisKnowmade
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade and System Plus Consulting are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks
of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
KEY FEATURES OF THE REPORT
• Deep insight on technology data and manufacturing processes
• Comparative studies of product features
• Key patents related to the target product features per company
• Cross analysis of potential patent infringement risks
• Excel database with all patents analyzed in the report
OBJECTIVES OF THE REPORT
• Find the technical and manufacturing process similarities and differences of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphones.
• Identify key patents held by Knowles,STMicroelectronics, OMRON, AAC
Technologies, Infineon Technologies,Analog Devices and InvenSense, and
related to the target product features.
• Find the link between patentedtechnological solutions and marketed products.
• Discover the potential infringing parties and help to find evidence of use.
• Understand potential risks of patent infringement and identify the patents
which require a more in depth legal assessment.
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
This report provides a technology and patent infringement risk analysis of recent MEMS microphones from four suppliers: Knowles, STMicroelectronics/Omron, AAC Technologies/Infineon Technologies, and InvenSense/Analog Devices. The report analyzes the microphones' features and manufacturing processes, identifies relevant patents held by the suppliers, and evaluates the potential risks of patent infringement between the suppliers. It aims to understand the links between the suppliers' patented technologies and marketed products, and identify features that require further legal assessment regarding infringement risks.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping SampleKnowmade
Knowles owns over 500 patent families related to audio technologies including MEMS microphones. This report provides a patent mapping of Knowles' IP portfolio relevant to the MEMS microphones in the Apple iPhone 7 Plus. The mapping covers 20 Knowles patent families and identifies key patents related to microphone packaging, housing, RF shielding, embedded capacitance, and cavity design. The report also describes past patent litigations between Knowles and other companies regarding MEMS microphone technologies.
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
Emerging MEMSPatent Investigation 2014 Report by Yole DeveloppementYole Developpement
Who owns key patents for high-growth emerging MEMS innovations?
The report provides essential patent data, technology analysis and market forecasts for 7 selected Emerging MEMS (eMEMS) technologies that we believe will soon reach the marketplace: autofocus, AOC MEMS, chemical sensors, micro-speakers, scanning micro-mirrors, Si microfluidic and ultrasonic MEMS. The market for emerging MEMS covered in this report is expected to grow from US$171M in 2013 to US$2.8B in 2019, corresponding to a 58.2% CAGR.
UNDERSTAND WHICH COMPANIES OWN THE KEY PATENTS FOR THE FUTURE OF EMERGING MEMS
Patent activity related to eMEMS began in the 1990s and we observe a takeoff of patent publications for AutoFocus (AF), scanning micro-mirrors and ultrasonic MEMS technologies since the mid-2000s.
MEMS AF patent activity is new, but has increased since its emergence in 2009. This period also corresponds to the growth of the CMOS image sensor market for consumer applications, requiring more compact camera modules with more functionalities. Cambridge Mechatronics and DigitalOptics are currently the leading patent holders, but Korean giant LG has become a major force since 2010. Today MEMS AF is still a hot topic especially for cell phones and tablets, but wasn’t adopted in 2013. Although MEMS AF has promising market potential, it still faces strong market and technical challenges, which might explain the increasing patent activity of recent years.
More information on that report at http://www.i-micronews.com/mems-sensors-report/product/emerging-mems-patent-investigation-2014.html
This document outlines TechIPm's methodology for analyzing wireless and mobile patents. It discusses their approaches to patent landscaping, essentiality analysis, portfolio evaluation, valuation, acquisition feasibility analysis, and developing essential patents. The methodologies involve searching patent databases, categorizing patents by technology and standards, comparing claims to specifications, and evaluating portfolios for quality, strengths/weaknesses, market value, and risks. The overall aim is to provide clients insights into technology innovations, competitive landscapes, intellectual property strategies, and business acquisition opportunities in wireless industries.
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
This document provides a summary of a patent landscape analysis report on nanopore sequencing technologies. The analysis found that patent publications on nanopore sequencing have significantly increased from 2008-2013, following early work proving the concept. While industrial players are increasingly active, Harvard University's portfolio remains the strongest, followed by Illumina, Agilent, University of California, and Roche. Oxford Nanopore Technologies' portfolio is not the strongest but the company benefits from university partnerships. Several microelectronics companies have also recently filed solid-state nanopore patents. Most major assignees have an international IP strategy with a strong US and European presence. The report provides a detailed analysis of patents segmented by nanopore technology and application, as well as profiles of key
This report provides a detailed picture of the patent landscape for III-nitride materials grown on silicon substrate.
This report covers patents published worldwide up to December 2013. More than 560 patent families relevant to the scope of this report have been selected. Those have been manually segmented by type and organized in various technology segments as described below.
Market data from Yole Développement are also provided to add some context regarding business trends and metrics.
The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation
density reduction and stress management for preventing crack generation and warpage of the wafer.
It identifies more than 50 holders of GaN-on-Si related intellectual property. It provides in-depth analysis of key technology
segments and key players including:
– Time evolution of patent publications and countries of patent filings.
– Current legal status of patents.
– Ranking of main patent applicants.
– Joint developments and IP collaboration network of main patent applicants.
– Key patents.
– Granted patents near expiration.
– Relative strength of main companies IP portfolio.
– Overview of patent litigations.
– Matrix applicants/technology issues for more than 20 companies.
A special focus is provided on key issues and approaches:
– Buffer type
– Defect reduction
– Stress management
– Non/Semi polar
– (001)-oriented silicon substrate
– Layer Transfer Technology
Cree (Wolfspeed) has the strongest patent portfolio in RF GaN technology, especially for GaN-on-SiC devices, well ahead of competitors like Sumitomo Electric and Fujitsu. The report provides an analysis of over 3,750 patents related to GaN devices for radio frequency applications, identifying the key patent holders and technology trends. It examines the intellectual property landscape for GaN semiconductors, integrated circuits, packaging, and key applications like power amplifiers, switches, and filters. The analysis shows American and Japanese companies dominating the RF GaN patent landscape, with growing activity from Chinese firms like HiWafer and new entrants focusing on areas like GaN-on-Silicon technology.
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
Similar to Emerging Non-Volatile Memories patent landscape 2014 (20)
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Cancer diagnostics startup identification 2020 sampleKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Cancer diagnostics startup identification 2020 flyerKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Microneedles for drug delivery patent landscape 2020 flyerKnowmade
Report’s Key Features
• PDF with > 140 slides
• Excel file > 2,450 patent families
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to applications: Cancer therapy, Cosmetic, Diabetes, Ophthalmic, Pain management and Vaccine.
• Summary of the IP related to technologies: Applicators, housing, Coated, Hollow, Porous, Soluble, Hydrogel and Solid microneedles.
• Analysis of patent oppositions (Europe) and review of key patents.
• Excel database containing all patents analyzed in the report, including applications and technologies segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 160 slides
• Excel file > 5,500 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to the physical isolation: size, deformability, electrical charges or density.
• Summary of the IP related to the biological isolation: positive or negative enrichment.
• Summary of the IP related to the CTC detection: nucleic acid, protein or functional assay.
• Analysis of patent litigations and review of key patents.
• Excel database containing all patents analyzed in the report, including biological and physical isolation and detection segmentations
Report’s Key Features
• PDF with > 200 slides
• Excel file > 2,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Patent segmentation per application: Optoelectronics and Photonics, Power, RF, PV and Sensors
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Established players and new entrants
• IP profile of key players, their key patents and their recent IP activity
• Patents recently expired and patents near expiration date
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Solid electrolytes for lithium ion solid state batteries patent landscape 201...Knowmade
Report’s Key Features
• PDF with > 250 slides
• Excel file > 5,800 patents
• IP trends, including time-evolution of published patents, legal status, countries of patent filings, etc.
• Ranking of main patent assignees
• Patent categorization by type of electrolyte (polymer, inorganic, inorganic/polymer) and inorganic electrolyte materials (sulfide glass ceramics, Thio-LISICON, argyrodite, oxide glass ceramics, NASICON, perovskite, garnet, anti-perovskite, hydride)
• For each technical segment: IP dynamics, ranking of main patent assignees, newcomers, key IP players (leadership, blocking potential, portfolio strength), key patents, and recent development trends
• For each key IP player (100+ companies): Time-evolution of patenting activity, legal status of patents and countries of patent filings, patent segmentation by electrolyte material, IP strengths and weaknesses by electrolyte material
• Excel database containing all patents analyzed in this report, including technology and material segmentations
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape sampleKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape flyerKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxSitimaJohn
Ocean Lotus cyber threat actors represent a sophisticated, persistent, and politically motivated group that poses a significant risk to organizations and individuals in the Southeast Asian region. Their continuous evolution and adaptability underscore the need for robust cybersecurity measures and international cooperation to identify and mitigate the threats posed by such advanced persistent threat groups.
OpenID AuthZEN Interop Read Out - AuthorizationDavid Brossard
During Identiverse 2024 and EIC 2024, members of the OpenID AuthZEN WG got together and demoed their authorization endpoints conforming to the AuthZEN API
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/building-and-scaling-ai-applications-with-the-nx-ai-manager-a-presentation-from-network-optix/
Robin van Emden, Senior Director of Data Science at Network Optix, presents the “Building and Scaling AI Applications with the Nx AI Manager,” tutorial at the May 2024 Embedded Vision Summit.
In this presentation, van Emden covers the basics of scaling edge AI solutions using the Nx tool kit. He emphasizes the process of developing AI models and deploying them globally. He also showcases the conversion of AI models and the creation of effective edge AI pipelines, with a focus on pre-processing, model conversion, selecting the appropriate inference engine for the target hardware and post-processing.
van Emden shows how Nx can simplify the developer’s life and facilitate a rapid transition from concept to production-ready applications.He provides valuable insights into developing scalable and efficient edge AI solutions, with a strong focus on practical implementation.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
AI 101: An Introduction to the Basics and Impact of Artificial IntelligenceIndexBug
Imagine a world where machines not only perform tasks but also learn, adapt, and make decisions. This is the promise of Artificial Intelligence (AI), a technology that's not just enhancing our lives but revolutionizing entire industries.
1. Emerging Non-Volatile Memories
Patent Landscape
February 2014
IBM
University of Houston
IBM
Integrated Magneto Electronics
2405 route des Dolines
06902 Sophia Antipolis, France
www.knowmade.com
Macronix
IBM
SanDisk