Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
The document compares the LTE standard essential patent portfolios of Nokia and InterDigital. It finds that Nokia's portfolio contains 96 total patents related to LTE, with 17 identified as potential standard essential patents. InterDigital's portfolio contains 78 total patents, with 15 identified as potential standard essential patents. The analysis shows that Nokia's patent portfolio covers more of the key LTE standard specifications and technology components compared to InterDigital's more narrowly distributed portfolio.
The document provides a teardown analysis of the Texas Instruments AWR1642 79 GHz radar chipset. It includes:
- An overview of the chipset's features and TI's portfolio.
- A physical analysis of the package and die, identifying key blocks and the RF CMOS process.
- A cost analysis estimating wafer costs, die costs, and the packaged component cost.
- A comparison to other TI mmWave devices and a Delphi radar solution.
- An estimated selling price for the AWR1642 chipset based on its manufacturing costs and TI's financial parameters.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
This document discusses issues to consider when creating an intellectual property monetization strategy. It outlines common problems with patent portfolios such as unclear holdings and a lack of alignment with business objectives. It emphasizes analyzing patent families to identify valuable inventions and areas of deficiency. The goals of a strategic monetization program are to leverage exclusionary rights, enhance profitability, and transform the IP department into a profit center. Various deal structures and a privateer model are presented. Factors that determine patent family value and mistakes to avoid are also discussed.
This document summarizes a presentation on technology transfer from the European space programme and other organizations. It discusses:
1) How ESA's Technology Transfer Programme Office and Technology Transfer Network works to identify new business opportunities for space technologies and transfer them to non-space industries. This includes an online technology exchange catalog and business incubation centers.
2) Technologies available for licensing and commercialization include those developed by ESA each year for space applications as well as technologies sourced from across Europe. Support is available for both technology developers and non-space companies.
3) The University of Leicester has developed air quality monitoring technologies in collaboration with industry, including a novel imaging spectrometer and multiple rotating instruments for tomography, with the goal
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
This document summarizes nanogenerators, which are piezoelectric transducers at the nanoscale that harness mechanical energy and convert it to electrical energy. Dr. Zhong Lin Wang and his colleagues at Georgia Tech have made significant advances in developing nanogenerators using zinc oxide nanowires over the last decade. Nanogenerators consist of a base electrode, piezoelectric nanostructures such as ZnO nanowires, and a counter electrode. When the nanowires are bent or flexed, a voltage is generated via the piezoelectric effect. Nanogenerators have applications powering small electronics and can harvest energy from tiny motions like heartbeats or footsteps.
This document summarizes the fabrication and characterization of nanowire devices. It discusses the early history of nanotechnology and how the field has progressed. Various methods for synthesizing semiconductor nanowires are described, including vapor-liquid-solid growth and electrodeposition. The document shows images of nanowires made from materials like copper, cadmium sulfide, and zinc oxide. It also discusses the unique electrical and optical properties of nanowires and their potential applications in areas such as electronics, optoelectronics, and sensing. In conclusion, the author remarks that nanowires may serve as important building blocks for next-generation electronic and optoelectronic systems by enabling new device concepts.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
The document compares the LTE standard essential patent portfolios of Nokia and InterDigital. It finds that Nokia's portfolio contains 96 total patents related to LTE, with 17 identified as potential standard essential patents. InterDigital's portfolio contains 78 total patents, with 15 identified as potential standard essential patents. The analysis shows that Nokia's patent portfolio covers more of the key LTE standard specifications and technology components compared to InterDigital's more narrowly distributed portfolio.
The document provides a teardown analysis of the Texas Instruments AWR1642 79 GHz radar chipset. It includes:
- An overview of the chipset's features and TI's portfolio.
- A physical analysis of the package and die, identifying key blocks and the RF CMOS process.
- A cost analysis estimating wafer costs, die costs, and the packaged component cost.
- A comparison to other TI mmWave devices and a Delphi radar solution.
- An estimated selling price for the AWR1642 chipset based on its manufacturing costs and TI's financial parameters.
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
This document discusses issues to consider when creating an intellectual property monetization strategy. It outlines common problems with patent portfolios such as unclear holdings and a lack of alignment with business objectives. It emphasizes analyzing patent families to identify valuable inventions and areas of deficiency. The goals of a strategic monetization program are to leverage exclusionary rights, enhance profitability, and transform the IP department into a profit center. Various deal structures and a privateer model are presented. Factors that determine patent family value and mistakes to avoid are also discussed.
This document summarizes a presentation on technology transfer from the European space programme and other organizations. It discusses:
1) How ESA's Technology Transfer Programme Office and Technology Transfer Network works to identify new business opportunities for space technologies and transfer them to non-space industries. This includes an online technology exchange catalog and business incubation centers.
2) Technologies available for licensing and commercialization include those developed by ESA each year for space applications as well as technologies sourced from across Europe. Support is available for both technology developers and non-space companies.
3) The University of Leicester has developed air quality monitoring technologies in collaboration with industry, including a novel imaging spectrometer and multiple rotating instruments for tomography, with the goal
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
This document summarizes nanogenerators, which are piezoelectric transducers at the nanoscale that harness mechanical energy and convert it to electrical energy. Dr. Zhong Lin Wang and his colleagues at Georgia Tech have made significant advances in developing nanogenerators using zinc oxide nanowires over the last decade. Nanogenerators consist of a base electrode, piezoelectric nanostructures such as ZnO nanowires, and a counter electrode. When the nanowires are bent or flexed, a voltage is generated via the piezoelectric effect. Nanogenerators have applications powering small electronics and can harvest energy from tiny motions like heartbeats or footsteps.
This document summarizes the fabrication and characterization of nanowire devices. It discusses the early history of nanotechnology and how the field has progressed. Various methods for synthesizing semiconductor nanowires are described, including vapor-liquid-solid growth and electrodeposition. The document shows images of nanowires made from materials like copper, cadmium sulfide, and zinc oxide. It also discusses the unique electrical and optical properties of nanowires and their potential applications in areas such as electronics, optoelectronics, and sensing. In conclusion, the author remarks that nanowires may serve as important building blocks for next-generation electronic and optoelectronic systems by enabling new device concepts.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
• IP trends including time evolution of patent publications and patent filings countries
• Current legal status of patents (granted, pending application, abandoned, expired)
• Main patent assignees (ranking, time evolution, geographical coverage) • Joint developments and IP collaboration network of main patent assignees
• Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including:
- Technology and market data for TSV stacked memory
- Key patents
- Cross link analysis between teardown analysis, process flow and patents
- Technical challenges and relevant solutions found in the patents
- Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung)
• Excel database with all patents analyzed for the 5 key players, including technology segmentation
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
Non invasive Glucose Patent Landscape sampleKnowmade
The report provides essential patent data for non-invasive glucose monitoring including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration
• Relative strength of main companies IP portfolio
• Non-invasive glucose monitoring IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy
The report also provides an extensive Excel database with all patents analyzed in the study
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
Microfluidic technologies for diagnostic applications - SampleKnowmade
The report provides essential patent data for microfluidic technologies for diagnostic applications including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network
• Key patents and granted patents near expiration
• Relative strength of main companies IP portfolio
• IP profiles of 15 major companies
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
Sample MEMS Microphone Technology and Patent Infringement Risk AnalysisKnowmade
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade and System Plus Consulting are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks
of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
KEY FEATURES OF THE REPORT
• Deep insight on technology data and manufacturing processes
• Comparative studies of product features
• Key patents related to the target product features per company
• Cross analysis of potential patent infringement risks
• Excel database with all patents analyzed in the report
OBJECTIVES OF THE REPORT
• Find the technical and manufacturing process similarities and differences of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphones.
• Identify key patents held by Knowles,STMicroelectronics, OMRON, AAC
Technologies, Infineon Technologies,Analog Devices and InvenSense, and
related to the target product features.
• Find the link between patentedtechnological solutions and marketed products.
• Discover the potential infringing parties and help to find evidence of use.
• Understand potential risks of patent infringement and identify the patents
which require a more in depth legal assessment.
3D Cell Culture technologies Patent Landscape Sample 2016 Knowmade
The patent landscape related to 3D cell technologies is very open, involving important academic applicants as well as small companies. It includes over 2,500 patent families and involves over 1,000 patent applicants.
The report provides essential patent data for 3D cell culture technologies including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration.
• Relative strength of main companies IP portfolio
• 3D cell culture IP profiles of 10+ major companies with key patents, partnerships, and IP strength and strategy
SCiO is a handheld spectrometer device created by Consumer Physics Inc. that uses near-IR spectroscopy to scan materials and objects, identify their molecular properties, and provide composition information to users through a mobile app. It aims to make spectroscopy more accessible by being portable, affordable, and easy to use. While SCiO has garnered interest through crowdfunding, raising over $2.7 million on Kickstarter, some scientists remain skeptical of its capabilities and see limitations until it can be fully tested.
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
Patent Licensing Companies in the Semiconductor Market SampleKnowmade
The document discusses patent licensing companies (PLCs) that have acquired patents in the semiconductor market between 2013-2016. It provides an overview of the main PLCs, including WiLAN, Tessera, Conversant IP Management, Intellectual Ventures, and Acacia Research. The analysis includes rankings of PLCs by number of US patent acquisitions, dynamics of patent acquisitions and reassignments over time, breakdown of acquired patent portfolios by technology, and dynamics of patent litigation activities in the semiconductor market. The report aims to identify the most litigious PLCs, analyze their recent semiconductor patent acquisitions, and highlight potential targets for future patent lawsuits.
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
This report provides a detailed picture of the patent landscape for III-nitride materials grown on silicon substrate.
This report covers patents published worldwide up to December 2013. More than 560 patent families relevant to the scope of this report have been selected. Those have been manually segmented by type and organized in various technology segments as described below.
Market data from Yole Développement are also provided to add some context regarding business trends and metrics.
The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation
density reduction and stress management for preventing crack generation and warpage of the wafer.
It identifies more than 50 holders of GaN-on-Si related intellectual property. It provides in-depth analysis of key technology
segments and key players including:
– Time evolution of patent publications and countries of patent filings.
– Current legal status of patents.
– Ranking of main patent applicants.
– Joint developments and IP collaboration network of main patent applicants.
– Key patents.
– Granted patents near expiration.
– Relative strength of main companies IP portfolio.
– Overview of patent litigations.
– Matrix applicants/technology issues for more than 20 companies.
A special focus is provided on key issues and approaches:
– Buffer type
– Defect reduction
– Stress management
– Non/Semi polar
– (001)-oriented silicon substrate
– Layer Transfer Technology
Yole led phosphor_qd_ip_january_2016_sampleClotilde Fabre
This document provides an overview of the patent landscape report on phosphors and quantum dots for LED applications. The report analyzes over 7,500 relevant patent families and provides an in-depth examination of the major patent holders, key technologies, litigation and licensing activities, and emerging trends. It identifies the leading companies in different patent segments, such as phosphor compositions and quantum dots, and analyzes the strengths and weaknesses of their intellectual property portfolios.
Which companies own patents in microLED display? What are their major thrust areas and
portfolio strength?
Yole Développement has identified close to 1,500
patents filed by 125 companies and organizations
relevant to the microLED display field. Among
these are multiple startups, display makers, OEMs,
semiconductor companies, LED makers, and
research institutions.
More information on that report at http://www.i-micronews.com/reports.html
Patent investigation on LED phosphors and down-convertersKnowmade
The document discusses the history and development of LED phosphor technology and intellectual property (IP). It summarizes that the first commercial blue LEDs were created in the 1990s by researchers in Japan, enabling the development of white LEDs by combining blue LEDs with phosphors. This led to many foundational patents on using phosphors with LEDs. It notes that phosphor IP has played a major role in shaping the LED industry, with over 40 litigation cases and around 70 licensing agreements related to phosphor patents. The report aims to analyze the key players, technologies, litigation, and licensing deals related to LED phosphor IP over time.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
FOWLP Patent Analysis 2012 Report by Yole DeveloppementYole Developpement
dopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level Packaging (FO-WLP) is the most innovative, advanced packaging technology today. Analysing patent status is the key to understanding the business situation.
ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT
After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database...
More information on that report at http://www.i-micronews.com/advanced-packaging-report/product/fowlp-patent-analysis.html
The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Safe Nests in Global Nets - Innovation and IPAlberto Minin
This document discusses innovation and intellectual property (IP) management strategies of multinational companies. It presents research on the globalization of research and development (R&D) activities in the wireless telecommunications industry. The study finds that while the industry has strong drivers for globalization, large companies still concentrate much of their inventive activities related to essential patents in their home countries and headquarters. Reasons for this "non-globalization" of R&D include accumulated knowledge at headquarters, organizational inertia, maturation effects of internationalizing R&D, and the importance of centralized IP management. The conclusions discuss developing centers of excellence globally while maintaining "safe nests" of appropriable knowledge at headquarters through international R&D organization and local
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
KnowMade is specialized in analysis of patents and scientific information. We provide patent search, IP landscape, patent valuation, IP due diligence, scientific literature landscape, identification of technologies available for transfer/licensing/sale, alerts and updates.
Our service offer consists of custom studies, analysis reports, on-demand tracking and strategy consulting. Knowmade combines information search services, scientific expertise, powerful analytics and visualization tools, and proprietary methodologies for analyzing patents and scientific information.
With a solid focus on Microelectronics, Nanotechnology and Biotechnology, KnowMade supports research laboratories, industrial companies and investors in their business development.
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping SampleKnowmade
Knowles owns over 500 patent families related to audio technologies including MEMS microphones. This report provides a patent mapping of Knowles' IP portfolio relevant to the MEMS microphones in the Apple iPhone 7 Plus. The mapping covers 20 Knowles patent families and identifies key patents related to microphone packaging, housing, RF shielding, embedded capacitance, and cavity design. The report also describes past patent litigations between Knowles and other companies regarding MEMS microphone technologies.
Sapphire Applications & Market 2015 Report by Yole DeveloppementYole Developpement
After a false start in 2014, will Apple finally use sapphire display covers in 2016?
Investing activities continues in sapphire display cover supply chain? Why?
Apple will represents 20% of 2015 global sapphire consumption with its iPhone and watch sapphire components. But Lens recently announced plans to raise US$942M and invest US$532M of the proceed to further increasing sapphire growth and finishing capacity. In 2014, Apple, its partners and their suppliers spent close to US$2B to set up a sapphire display cover supply chain. GTAT built and installed 2135 ASF furnaces, Biel and Lens deployed close to 200 wire saws and 1000’s of finishing tools and ancillary equipment. But the projects faced many problems and Apple eventually gave up on sapphire for its iPhone 6. Reasons were multiple but can be summarized in “too early, to fast, too much”. The project was ambitious in its timeframe and targeted outputs while many of the necessary processes and technologies in crystal growth and finishing were still at an early stage of development. But the venture still set the stage for the future: the partners have developed an unrivalled expertise on how to work with sapphire in high volumes and cost controlled environment. A lot was also learned with the manufacturing of the complex 3D shaped Apple Watch cover...
Antenna for 5G patent landscape 2019 flyerKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
II-SDV 2016 Bob Stembridge We have all the Time in the World; a Review of ho...Dr. Haxel Consult
One of the key elements in understanding a technology sector or a competitor’s activities is to measure and detect any significant changes over time that may indicate a declining interest or a new hot emerging area.
But how do we spot the signal from the noise? What constitutes a significant change? This depends on how we measure change which in turn depends on the measure of time we use. In scientific literature, we have limited choice – publication date (but even that is changing with wide availability of electronic pre-prints). In patent literature, publication date provides a measure of when an invention is publicly disclosed, but priority date is perhaps a truer measure of when the invention was made. And is it better to look at individual dates, or use moving windows of time?
This presentation will consider these questions using a case study approach to determine the impacts and effectiveness of the different approaches.
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
This report provides a technology and patent infringement risk analysis of recent MEMS microphones from four suppliers: Knowles, STMicroelectronics/Omron, AAC Technologies/Infineon Technologies, and InvenSense/Analog Devices. The report analyzes the microphones' features and manufacturing processes, identifies relevant patents held by the suppliers, and evaluates the potential risks of patent infringement between the suppliers. It aims to understand the links between the suppliers' patented technologies and marketed products, and identify features that require further legal assessment regarding infringement risks.
Similar to Nanowire LED patent investigation Sample (20)
Cancer diagnostics startup identification 2020 sampleKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Cancer diagnostics startup identification 2020 flyerKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Microneedles for drug delivery patent landscape 2020 flyerKnowmade
Report’s Key Features
• PDF with > 140 slides
• Excel file > 2,450 patent families
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to applications: Cancer therapy, Cosmetic, Diabetes, Ophthalmic, Pain management and Vaccine.
• Summary of the IP related to technologies: Applicators, housing, Coated, Hollow, Porous, Soluble, Hydrogel and Solid microneedles.
• Analysis of patent oppositions (Europe) and review of key patents.
• Excel database containing all patents analyzed in the report, including applications and technologies segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 160 slides
• Excel file > 5,500 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to the physical isolation: size, deformability, electrical charges or density.
• Summary of the IP related to the biological isolation: positive or negative enrichment.
• Summary of the IP related to the CTC detection: nucleic acid, protein or functional assay.
• Analysis of patent litigations and review of key patents.
• Excel database containing all patents analyzed in the report, including biological and physical isolation and detection segmentations
Report’s Key Features
• PDF with > 200 slides
• Excel file > 2,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Patent segmentation per application: Optoelectronics and Photonics, Power, RF, PV and Sensors
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Established players and new entrants
• IP profile of key players, their key patents and their recent IP activity
• Patents recently expired and patents near expiration date
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Solid electrolytes for lithium ion solid state batteries patent landscape 201...Knowmade
Report’s Key Features
• PDF with > 250 slides
• Excel file > 5,800 patents
• IP trends, including time-evolution of published patents, legal status, countries of patent filings, etc.
• Ranking of main patent assignees
• Patent categorization by type of electrolyte (polymer, inorganic, inorganic/polymer) and inorganic electrolyte materials (sulfide glass ceramics, Thio-LISICON, argyrodite, oxide glass ceramics, NASICON, perovskite, garnet, anti-perovskite, hydride)
• For each technical segment: IP dynamics, ranking of main patent assignees, newcomers, key IP players (leadership, blocking potential, portfolio strength), key patents, and recent development trends
• For each key IP player (100+ companies): Time-evolution of patenting activity, legal status of patents and countries of patent filings, patent segmentation by electrolyte material, IP strengths and weaknesses by electrolyte material
• Excel database containing all patents analyzed in this report, including technology and material segmentations
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape sampleKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape flyerKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
This document provides a summary of a patent landscape analysis report on nanopore sequencing technologies. The analysis found that patent publications on nanopore sequencing have significantly increased from 2008-2013, following early work proving the concept. While industrial players are increasingly active, Harvard University's portfolio remains the strongest, followed by Illumina, Agilent, University of California, and Roche. Oxford Nanopore Technologies' portfolio is not the strongest but the company benefits from university partnerships. Several microelectronics companies have also recently filed solid-state nanopore patents. Most major assignees have an international IP strategy with a strong US and European presence. The report provides a detailed analysis of patents segmented by nanopore technology and application, as well as profiles of key
Cree (Wolfspeed) has the strongest patent portfolio in RF GaN technology, especially for GaN-on-SiC devices, well ahead of competitors like Sumitomo Electric and Fujitsu. The report provides an analysis of over 3,750 patents related to GaN devices for radio frequency applications, identifying the key patent holders and technology trends. It examines the intellectual property landscape for GaN semiconductors, integrated circuits, packaging, and key applications like power amplifiers, switches, and filters. The analysis shows American and Japanese companies dominating the RF GaN patent landscape, with growing activity from Chinese firms like HiWafer and new entrants focusing on areas like GaN-on-Silicon technology.
Report’s Key Features
• PDF >130 slides
• Excel file with >3,800 patents
• Competitive landscape from a patent perspective, offering a very complementary vision to market research.
• Key patent owners, their IP and technology strategies and their future intents.
• New entrants, their technology and their market areas of interest.
• Know competitors’ strengths and weaknesses in terms of patents and technologies.
• Follow technology developments, identify emerging technologies and know key technical solutions to solve hot technical issues.
• Identify free technologies which can be used safely and to mitigate the risks of patent infringement.
• Identify technologies to acquire and potential R&D partners.
• Benefit from a useful Excel database with all patents analyzed in the report, including technology segmentation.
Taking AI to the Next Level in Manufacturing.pdfssuserfac0301
Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
1. How quickly AI is being implemented in manufacturing.
2. Which barriers stand in the way of AI adoption.
3. How data quality and governance form the backbone of AI.
4. Organizational processes and structures that may inhibit effective AI adoption.
6. Ideas and approaches to help build your organization's AI strategy.
Programming Foundation Models with DSPy - Meetup SlidesZilliz
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
Dandelion Hashtable: beyond billion requests per second on a commodity serverAntonios Katsarakis
This slide deck presents DLHT, a concurrent in-memory hashtable. Despite efforts to optimize hashtables, that go as far as sacrificing core functionality, state-of-the-art designs still incur multiple memory accesses per request and block request processing in three cases. First, most hashtables block while waiting for data to be retrieved from memory. Second, open-addressing designs, which represent the current state-of-the-art, either cannot free index slots on deletes or must block all requests to do so. Third, index resizes block every request until all objects are copied to the new index. Defying folklore wisdom, DLHT forgoes open-addressing and adopts a fully-featured and memory-aware closed-addressing design based on bounded cache-line-chaining. This design offers lock-free index operations and deletes that free slots instantly, (2) completes most requests with a single memory access, (3) utilizes software prefetching to hide memory latencies, and (4) employs a novel non-blocking and parallel resizing. In a commodity server and a memory-resident workload, DLHT surpasses 1.6B requests per second and provides 3.5x (12x) the throughput of the state-of-the-art closed-addressing (open-addressing) resizable hashtable on Gets (Deletes).
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
This presentation provides valuable insights into effective cost-saving techniques on AWS. Learn how to optimize your AWS resources by rightsizing, increasing elasticity, picking the right storage class, and choosing the best pricing model. Additionally, discover essential governance mechanisms to ensure continuous cost efficiency. Whether you are new to AWS or an experienced user, this presentation provides clear and practical tips to help you reduce your cloud costs and get the most out of your budget.
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
FREE A4 Cyber Security Awareness Posters-Social Engineering part 3Data Hops
Free A4 downloadable and printable Cyber Security, Social Engineering Safety and security Training Posters . Promote security awareness in the home or workplace. Lock them Out From training providers datahops.com
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
In the realm of cybersecurity, offensive security practices act as a critical shield. By simulating real-world attacks in a controlled environment, these techniques expose vulnerabilities before malicious actors can exploit them. This proactive approach allows manufacturers to identify and fix weaknesses, significantly enhancing system security.
This presentation delves into the development of a system designed to mimic Galileo's Open Service signal using software-defined radio (SDR) technology. We'll begin with a foundational overview of both Global Navigation Satellite Systems (GNSS) and the intricacies of digital signal processing.
The presentation culminates in a live demonstration. We'll showcase the manipulation of Galileo's Open Service pilot signal, simulating an attack on various software and hardware systems. This practical demonstration serves to highlight the potential consequences of unaddressed vulnerabilities, emphasizing the importance of offensive security practices in safeguarding critical infrastructure.
Digital Banking in the Cloud: How Citizens Bank Unlocked Their MainframePrecisely
Inconsistent user experience and siloed data, high costs, and changing customer expectations – Citizens Bank was experiencing these challenges while it was attempting to deliver a superior digital banking experience for its clients. Its core banking applications run on the mainframe and Citizens was using legacy utilities to get the critical mainframe data to feed customer-facing channels, like call centers, web, and mobile. Ultimately, this led to higher operating costs (MIPS), delayed response times, and longer time to market.
Ever-changing customer expectations demand more modern digital experiences, and the bank needed to find a solution that could provide real-time data to its customer channels with low latency and operating costs. Join this session to learn how Citizens is leveraging Precisely to replicate mainframe data to its customer channels and deliver on their “modern digital bank” experiences.
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers