More information on DRAM report at https://www.i-micronews.com/report/product/dram-service-–-memory-research.html
and NAND report : https://www.i-micronews.com/report/product/nand-service-–-memory-research.html
Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Déve...Yole Developpement
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
Internet of Things RF Protocols and their Impacts on the Electronics IndustryYole Developpement
The challenge for Radio-Frequency (RF) electronics manufacturers to secure value in the Internet of Things (IoT) industry stays relevant today.
More information on that report at: https://www.i-micronews.com/report/product/internet-of-things-rf-protocols-and-their-impacts-on-the-electronics-industry.html
DRAM & NAND Service – Memory Research 2019 Monitors by Yole DéveloppementYole Developpement
2018 DRAM & NAND markets: the end of an incredible multi-year rally…
More information on DRAM monitors at: https://www.i-micronews.com/produit/dram-service-memory-research/
More information on NAND monitors at: https://www.i-micronews.com/produit/nand-service-memory-research/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
Emerging Non-Volatile Memory 2018 - Market and Technology Report by Yole Déve...Yole Developpement
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
Internet of Things RF Protocols and their Impacts on the Electronics IndustryYole Developpement
The challenge for Radio-Frequency (RF) electronics manufacturers to secure value in the Internet of Things (IoT) industry stays relevant today.
More information on that report at: https://www.i-micronews.com/report/product/internet-of-things-rf-protocols-and-their-impacts-on-the-electronics-industry.html
DRAM & NAND Service – Memory Research 2019 Monitors by Yole DéveloppementYole Developpement
2018 DRAM & NAND markets: the end of an incredible multi-year rally…
More information on DRAM monitors at: https://www.i-micronews.com/produit/dram-service-memory-research/
More information on NAND monitors at: https://www.i-micronews.com/produit/nand-service-memory-research/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
LiDARs for Automotive and Industrial Applications 2018 Report by Yole Develop...Yole Developpement
Will automotive change the LiDAR market?
More information on that report at https://www.i-micronews.com/report/product/lidars-for-automotive-and-industrial-applications-2018.html
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
Status of Panel Level Packaging 2018 Report by Yole Developpement Yole Developpement
Panel level packaging players are ready for high volume production.
More information on that report at https://www.i-micronews.com/report/product/status-of-panel-level-packaging-2018.html
Technological reality is piercing the hype for virtual and
augmented realities, reminding everyone about all the challenges that are yet to be overcome.
More information on : https://www.i-micronews.com/report/product/displays-optical-vision-systems-for-vr-ar-mr.html
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Gas and Particle Sensors 2018 - Technology, Industry, and Market Trends repor...Yole Developpement
Air quality is breathing life into the sensor market!
More information on : https://www.i-micronews.com/category-listing/product/gas-and-particle-sensors-2018.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Sensors for robotic vehicles 2018 report by yole developpement i-micronewsYole Developpement
High end industrial sensors will win in the emerging robotic vehicle industry.
THE ROBOTIC VEHICLE SUPPLY CHAIN IS NOW STARTING
Announcements are piling up from companies like
Waymo, Uber, Lyft, Baidu and their automotive
manufacturing partners such as Fiat Chrysler
Automobiles, Mercedes, BMW and Renault-
Nissan. 2018 will most probably be the initial launch
year for robotic taxis in several cities around the
globe. The move has direct consequences for
technology providers in high-end sensing and
computing equipment. The vehicle count that we
can collect suggests several tens of thousands of
vehicles on the road worldwide before end of
2022. As far as we know, each robotic vehicle will
be equipped with a suite of sensors encompassing
Lidars, radars, cameras, Inertial Measurement
Units (IMUs) and Global Navigation Satellite
Systems (GNSS). The technology is ready and
the business models associated with autonomous
driving (AD) seem to match the average selling
prices for those sensors.
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Keynote presentation from Flash Memory Summit 2016 by Dr. Siva Sivaram.
Learn his perspective on opportunities and challenges in developing a memory cell solution for the Storage Class Memory market, and lessons learned from 3D NAND.
Status of Panel Level Packaging 2018 Report by Yole Developpement Yole Developpement
Panel level packaging players are ready for high volume production.
More information on that report at https://www.i-micronews.com/report/product/status-of-panel-level-packaging-2018.html
Technological reality is piercing the hype for virtual and
augmented realities, reminding everyone about all the challenges that are yet to be overcome.
More information on : https://www.i-micronews.com/report/product/displays-optical-vision-systems-for-vr-ar-mr.html
Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 Report by...Yole Developpement
Polymeric materials market revenue will double over the next five years.
More information on that report at : https://www.i-micronews.com/report/product/polymeric-materials-for-advanced-packaging-at-the-wafer-level.html
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Gas and Particle Sensors 2018 - Technology, Industry, and Market Trends repor...Yole Developpement
Air quality is breathing life into the sensor market!
More information on : https://www.i-micronews.com/category-listing/product/gas-and-particle-sensors-2018.html
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
MEMS Pressure Sensor Market and Technologies 2018 Report by Yole DeveloppementYole Developpement
Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
More information on that report at https://www.i-micronews.com/report/product/mems-pressure-sensor-market-and-technologies-2018.html
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Sensors for robotic vehicles 2018 report by yole developpement i-micronewsYole Developpement
High end industrial sensors will win in the emerging robotic vehicle industry.
THE ROBOTIC VEHICLE SUPPLY CHAIN IS NOW STARTING
Announcements are piling up from companies like
Waymo, Uber, Lyft, Baidu and their automotive
manufacturing partners such as Fiat Chrysler
Automobiles, Mercedes, BMW and Renault-
Nissan. 2018 will most probably be the initial launch
year for robotic taxis in several cities around the
globe. The move has direct consequences for
technology providers in high-end sensing and
computing equipment. The vehicle count that we
can collect suggests several tens of thousands of
vehicles on the road worldwide before end of
2022. As far as we know, each robotic vehicle will
be equipped with a suite of sensors encompassing
Lidars, radars, cameras, Inertial Measurement
Units (IMUs) and Global Navigation Satellite
Systems (GNSS). The technology is ready and
the business models associated with autonomous
driving (AD) seem to match the average selling
prices for those sensors.
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
Automotive Packaging: Market and Technologies Trends 2019 report by Yole Déve...Yole Developpement
Automotive Packaging: Market and Technologies Trends 2019
More information on https://www.i-micronews.com/products/automotive-packaging-market-and-technologies-trends-2019/
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Status of the Power Module Packaging Industry 2019 - Yole DéveloppementYole Developpement
Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain.
More information on: https://www.i-micronews.com/products/status-of-the-power-module-packaging-industry-2019/
Keynote presentation from Flash Memory Summit 2016 by Dr. Siva Sivaram.
Learn his perspective on opportunities and challenges in developing a memory cell solution for the Storage Class Memory market, and lessons learned from 3D NAND.
Emerging NVM technological choices are about to be made by key players: STTMRAM or RRAM?
Over the last two years, the complex emerging non-volatile memory (NVM) situation has been greatly simplified.
In 2014, Micron, the main phase-change memory (PCM) promoter for stand-alone memory, stopped actively selling PCM chips following the collapse of sales targeting the shrinking entry-level mobile phone market. At the same time, Micron developed a resistive random access memory (RRAM or ReRAM) chip with Sony, part of a technology class that includes conductive bridge RAM (CBRAM). At 16 Gb the Micron-Sony RRAM has the highest density commercialized among emerging NVM technologies. Thus, we believe that PCM is now out of the race for stand-alone memory. For embedded microcontroller unit (MCU) applications 2015 will be a key year as STMicroelectronics, the main PCM promoter in this market, will choose if PCM will remain in its roadmap.....
More information at http://www.i-micronews.com/reports.html
Physical and cost analysis of Micron’s fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
In-depth physical and cost analysis of Samsung’s ‘1y-nm’ low power DRAM.
More information: https://www.systemplus.fr/reverse-costing-reports/samsung-lpddr5-12gb-mobile-memory/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Market Research Reports, Inc. has announced the addition of “Global Data Center Rack PDU Market 2017 - 2021” research report to their offering. See more at - http://mrr.cm/3V8
3D NAND Flash Memory devices appeared on the market in 2015 with 3D V-NAND – 32L of Samsung Electronics, followed in 2016 with 3D NAND V2 – 36L of SK Hynix, 3D NAND – 48L of Toshiba/SanDisk and 3D NAND – 32L of Micron/Intel. In recent times, it happens a lot in the 3D non-volatile memory (3D NVM) field with the acquisition of SanDisk by Western Digital, The investments of Chinese government in memory, or the Intel announcement of the Intel/Micron separation for further development of 3D NAND. We witnessed these evolves in the IP landscape through the recent increase of 3D NVM-related patents filed by Chinese players (YMTC/YRST) and the numerous Samsung’s patents published the latest months in China, USA and Korea, reflecting its willing to strengthen its 3D NVM IP portfolio. Also, we observed non-practicing entities (NPEs) like Conversant IP and WiLAN are entering the landscape. The presence of such companies is a tangible sign of the market explodes, heralding future IP battles when they will assert their patents to make money.
In this report, KnowMade has thoroughly investigated the patents related to 3D non-volatile memories and draws a picture of the current patent landscape and its potential evolution. SanDisk/Western Digital, Samsung and Toshiba are leading the 3D NVM patent landscape. They hold together more than 65% of the patents, Western Digital and Toshiba signed a JV extension until 2029, and Samsung and Western Digital renewed a patent cross-license agreement until 2024. On the other hand, we witness the emergence of Chinese players in the IP landscape. Patent activity related to 3D non-volatile memory (3D NVM) emerged in the 1990s with Toshiba and SanDisk. They signed Joint Venture agreement on Flash Memory in 1999. In the end 2000s, the research and development of 3D architectures appeared with IP related to BiCS (Bit Cost Scalable, SanDisk and Toshiba), TCAT (Terabit Cell Array Transistor, Samsung Electronics) and FG (Floating Gate, SK Hynix). Few years later Micron Technology developed also FG architecture, and Macronix International developed in 2015 SGVC architecture (Single Gate Vertical Channel). Since 2008, the number of patents related to 3D NVM has continuously increased, and today the 3D NVM patent landscape represents over 3,400 patent families including more than 9,400 patents. The landscape is very competitive, with several big companies and the entrance of Chinese players these last years.
In this deck from the Open Compute Summit, Walter Hinton, Senior Global Director of Enterprise & Client Compute Solutions Marketing at Western Digital presents: The State of the Solid State Drive SSD.
"In 2013, Western Digital acquired flash storage hardware and software supplier, Virident, for $685 million in cash. They followed that up in May 2016, with the acquisition of SanDisk Corporation. The addition of SanDisk makes Western Digital Corporation a comprehensive storage solutions provider with global reach, and an extensive product and technology platform that includes deep expertise in both rotating magnetic storage and non-volatile memory (NVM)."
Watch the video presentation: http://wp.me/p3RLHQ-guI
Learn more: https://www.wdc.com/
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
We are in the big transition from HDD to Flash based SSD drive for intensive data storage industry. This presentation overviews Flash Memory basics, and why it is happening now. This also mentions beyond 3D-NAND Flash memory candidates.
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
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End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
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My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
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This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
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Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
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Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
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This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
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Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
18. Thehyper-growthofthememorymarketin2017
positioned both DRAM and NAND memory
as leading devices within the semiconductor
market. With the memory markets significantly
impacting the semiconductor industry in
terms of profits, CAPEX, and sales, Yole
Développement has decided to publish two
new reports covering the fast-moving DRAM
and NAND markets. Beginning this year,
Yole Développement will publish world-
class research, data, and insights covering the
memory markets in quarterly installments that
analyze the evolution of the DRAM and NAND
markets in terms of revenue, shipments,
CAPEX, and near-term price evolution, as
well as demand per market segment, DRAM
and NAND technology evolution, and detailed
profiles of main suppliers. Yole Développement
will also introduce DRAM and NAND monthly
pricing monitors to track the price evolution of
key components and packaged solutions.
DRAM SERVICE – MEMORY RESEARCH
Market & Pricing Monitors - June 2018
MEMORY IS NOW THE PRIMARY MARKET SEGMENT FOR SEMICONDUCTOR
PRODUCTS
2018 will be the peak year for DRAM market value, with price moving down Q3.
WHAT ABOUT THE DRAM
SERVICE - MEMORY RESEARCH?
A full package:
The DRAM Quarterly Market Monitor
and the Monthly Pricing Monitor
include the following deliverables:
• Excel database with all historical and
forecast data
• PDF slide deck with graphs and
comments/analysis covering
expected evolutions
• Direct access to a Yole
Développement analyst for one
year, providing an opportunity for
on-demand QA and discussions
regarding trends, analyses, forecasts,
and breaking news
Frequency:
Receive every quarter the updated
Market Monitor documents and every
month the updated Pricing Monitor
documents
Options:
• Pricing Monitors can be bought
individually (NAND, DRAM or both)
• Memory Research are available for
DRAM, NAND and both
Check the different options on the
order form page.
MEGATRENDS ARE PUSHING MORE DRAM INTO PRODUCTS, LEADING TO A
RECORD 2018
The megatrends boosting the entire
semiconductor industry have a very positive
impact on the memory market, especially
DRAM. Mobile phone in general and the 5G
revolution in particular, along with hyperscale
data center, Artificial Intelligence (AI) and
machine learning, and autonomous driving are
all pushing DRAM adoption, with a CAGR of
more than 22% for bit demand over the next
five years.
The DRAM market is constantly evolving and
changing. New Chinese suppliers threaten the
current market balance, and emerging memory
technologies are poised to cannibalize huge
chunks of DRAM demand while the demand-
drivers of the past (PCs and smartphones) lose
steam and no longer push industry demand.
The DRAM market’s future promises to be
as dynamic as its past. Yole Développement’s
quarterly and monthly monitors will answer the
pressing questions facing the industry, including:
• Will the three primary DRAM suppliers -
Samsung, SK Hynix, and Micron - continue to
manage supply and drive industry revenue to
even higher levels?
(Yole Développement, June 2018)
Others
Samsung
SK hynix
Micron
Revenue forecast
Average Selling Price growth
Bit growth
DRAM market dynamics per quarter
19. DRAM SERVICE – MEMORY RESEARCH
WHAT DO THE UPCOMING QUARTERS HOLD?
DRAM QUARTERLY MARKET MONITOR AND MONTHLY PRICING MONITOR -
CONTENT
Strong bit growth and increasing price will drive
revenue up $28B for the current quarter. 2018
prices are expected to increase by more than
22% (detailed in the Quarterly Monitor), leading
to another record year for DRAM, with revenue
over $110B - a 50% jump from 2017.
Total 2018 growth will easily reach a new high,
thanks to strong pricing trends and modest
shipment growth. The emergence of Chinese
DRAM production by 2020 will reduce revenue as
the market shifts into pronounced oversupply.
Bit growth is expected to remain around 20% -
25% over the long-term: lower than historical
bit growth because of tech difficulties linked
to shrinking lithography. As a direct impact, bit
growth is becoming more expensive and more
processing steps are needed with each migration
node because of multi-patterning, and therefore
more cleanroom space per wafer-out.
Prices are expected to begin declining in 2H/18,
down through 2022. Supply will exceed demand
in 2019 and prices are expected to fall modestly.
The DRAM Quarterly Market Monitor and DRAM
Monthly Pricing Monitor contain all of the data
related to DRAM revenue per quarter, DRAM
shipments, pricing per DRAM type, near and long-
term revenue, market share per quarter, CAPEX
per company, and market demand/supply forecast,
as well as a complete analysis and details of the
demand side with a deep dive into data centers,
mobile, automotive, graphics, and PC.
For the top seven players (Micron, Nanya,
Powerchip, Samsung, SK Hynix, and Winbond),
the DRAM Quarterly Market Monitor provides
a detailed analysis of CAPEX, shipments, wafer
production per technology (process mix) and
per fab, as well as the expected impact of DRAM
technology changes.
The DRAM Quarterly Market Monitor and the
Monthly Pricing Monitor include the following
deliverables:
• Excel database with all historical and forecast data
• PDF slide deck with graphs and comments/
analysis covering expected evolutions
• Direct access to a Yole Développement analyst
for one year, providing an opportunity for on-
demand QA and discussions regarding trends,
analyses, forecasts, and breaking news.
• Will China’s entrance in the DRAM market
disrupt the current market balance?
• Will DRAM manufacturing’s enormous technical
challenges and the lack of access to DRAM
intellectual property prove too difficult for China
to overcome?
• What demand segments will emerge to
compensate for the diminishing PC and
smartphone categories?
• How much farther will the DRAM roadmap
extend? Is there a future beyond 14nm?
• How will AI and machine learning impact DRAM
demand and the technology roadmap?
• Will autonomous vehicles meaningfully impact
the DRAM market? If so, when?
• Will DRAM capital expenditures continue their
recent trend upwards, or will capital intensity
climb too high and threaten supplier stability?
• Will DRAM wafer demand push the overall
semiconductor market into drastic undersupply?
• Will HBM2 emerge as the dominant DRAM
graphics technology?
• When will LPDDR5 and DDR5 become available,
and will they ever dominate the market?
• Have the recent DRAM price increases hurt
demand, or is DRAM demand-elasticity dead?
Yole Développement provides its opinions and
answers all of these questions on a quarterly basis
with its new DRAM Quarterly Market Monitor and
DRAM Monthly Pricing Monitor.
(Yole Développement, June 2018)
DRAM market forecast
DRAM market forecast
Q1-17 Q2-17 Q3-17 Q4-17 Q1-18 Q2-18 Q3-18 Q4-18 Q1-19 Q2-19 Q3-19 Q4-19 2017 2018 2019 2020 2021 2022 2023
Revenue ($m) $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX
% Change X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X%
Shipments (m GB) XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX
% Change X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X%
ASP ($/GB) $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX $XX
% Change X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X% X%
DRAM Market Monitor Q1 2018
20. MARKET PRICING MONITORS
Find more
details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)
Micron, Nanya, Powerchip, Samsung, SK Hynix, Winbond, and more...
DRAM Quaterly Market Monitor
(PPT file)
DRAM market overview
Revenue
Shipments
Quarterly revenue - near and long-term
Pricing
Market share
CAPEX
Sufficiency
Near-term pricing outlook
DRAM demand
Segment bit demand and share
Data center
PC
Mobile
Graphics
Automotive
DRAM technology
Shipments by technology
Shipments by density
Mobile shipments
Graphics shipments
3DXpoint
DRAM supply
Industry wafer production
Industry process mix
Bits per wafer
Bit growth - sources
Samsung details
SK Hynix details
Micron details
Nanya details
A complete Excel file with the analysis’
numerical data is included with the PPT
presentation
DRAM Monthly Pricing Monitor
(Excel file)
Monthly price evolution from 2017 - 2019
for:
Mobile DRAM ($/unit)
LPDDR2 8Gb
LPDDR2 16Gb
LPDDR3 8Gb
LPDDR3 12Gb
LPDDR3 16Gb
LPDDR3 24Gb
LPDDR4 16Gb
LPDDR4 32Gb
LPDDR4 48Gb
Server DRAM ($/unit)
DDR3 2GB R-DIMM
DDR3 4GB R-DIMM
DDR3 8GB R-DIMM
DDR3 16GB R-DIMM
DDR4 8GB R-DIMM
DDR4 16GB R-DIMM
DDR4 32GB R-DIMM
DDR4 64GB R-DIMM
PC DRAM
DDR3 1GB DIMM
DDR3 2GB DIMM
DDR3 4GB DIMM
DDR3 8GB DIMM
DDR4 4GB DIMM
DDR4 8GB DIMM
Components
SDR 16Mb
SDR 64Mb
DDR 256Mb
DDR 512Mb
DDR2 512Mb
DDR2 1Gb
DDR3 1Gb
DDR3 2Gb
DDR3 4Gb
DDR4 4Gb
DDR4 8Gb
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Memory Packaging Market and Technology
Report 2017
• Emerging Non-Volatile Memory 2017
RELATED REPORTS
Benefit from our Bundle Annual Subscription offers and access our analyses at the best available
price and with great advantages
AUTHOR
Mike Howard is member of the
memory team at Yole Développement
(Yole) as VP of DRAM and Memory
Research within the Semiconductor
Software division.
Mike is a daily contributor to the business
development of memory activities with
a special focus on the DRAM industry.
Mike’s mission at Yole, is to propose a
comprehensive understanding of the
entire memory and semiconductor
markets, with a dedicated collection of
market updates, Market Monitors and
Pricing Monitors. Mike developed a
broad DRAM memory expertise with
a relevant combination of industrial
and market research experiences.
Prior his position as Senior Director of
DRAM and Memory Research for more
than a decade, Mike served at Micron
Technology. He had several roles in
corporate development, marketing,
and as photolithography engineer in
RD. Mike earned a Master of Business
Administration at The Ohio State
University (United-States), a Bachelor of
Science in Chemical Engineering as well
as a Bachelor of Arts in Finance at the
University of Washington (Washington,
United-States).
Find all our reports on www.i-micronews.com
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Market forecast through 2023 in Gb,
US$, units, wafers, $/Gb
• Supplier market shares (Micron,
Nanya, Powerchip, Samsung,
SK Hynix, Winbond) from 2015
to present by revenue (US$),
bit shipments (Gb), geography
(US$),segment (US$), average selling
price ($/Gb)
• Demand forecast through 2023 by
category (PC, data center, mobile,
consumer, Auto…) in units, revenue
(US$), bit demand (Gb)
• Production forecast through 2019 by
supplier for wafer production (wpm,
by Fab), bit production (Gb, by Fab),
process mix (% of wafers), average
process node (nm, bit basis wafer
basis), average Gb per wafer
21. ORDER FORM
DRAM Service – Memory Research
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Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date: June 21, 2018
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DRAM Pricing Monitor – Monthly Update: $12 000
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NAND Service – Memory Research
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and
image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced
Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
MEDIA EVENTS
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• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports