After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
More details here: https://www.i-micronews.com/report/product/emerging-non-volatile-memory-2018.html
Status of Panel Level Packaging 2018 Report by Yole Developpement Yole Developpement
Panel level packaging players are ready for high volume production.
More information on that report at https://www.i-micronews.com/report/product/status-of-panel-level-packaging-2018.html
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
This document summarizes information about flash memory, including:
- An overview of flash memory technology and how it differs from traditional hard drives
- Details on NAND flash memory organization and operation including blocks, pages, and cells
- Challenges of using flash like data loss over time and disturbance errors
- Techniques used in flash translation layers to map data and address wear leveling and garbage collection
- Linux support for flash through drivers, error correction, and the Universal Flash Storage Interface
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels f...Leah Wilkinson
OIF Presents:
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems
ECOC Market Focus
New Technologies & Systems/New Markets/New Packaging Platforms
Wed, 15 September 2021
Jeff Hutchins / Ranovus
OIF PLL Working Group Co-Packaging Vice Chair
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
Status of Panel Level Packaging 2018 Report by Yole Developpement Yole Developpement
Panel level packaging players are ready for high volume production.
More information on that report at https://www.i-micronews.com/report/product/status-of-panel-level-packaging-2018.html
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
This document summarizes information about flash memory, including:
- An overview of flash memory technology and how it differs from traditional hard drives
- Details on NAND flash memory organization and operation including blocks, pages, and cells
- Challenges of using flash like data loss over time and disturbance errors
- Techniques used in flash translation layers to map data and address wear leveling and garbage collection
- Linux support for flash through drivers, error correction, and the Universal Flash Storage Interface
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels f...Leah Wilkinson
OIF Presents:
Co-Packaged Optics: The OIF’s Work to Standardize Higher Integration Levels for Next-Generation Data Center Systems
ECOC Market Focus
New Technologies & Systems/New Markets/New Packaging Platforms
Wed, 15 September 2021
Jeff Hutchins / Ranovus
OIF PLL Working Group Co-Packaging Vice Chair
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
ALD/CVD applications, equipment and precursors in high volume manufacturingJonas Sundqvist
This document discusses trends in atomic layer deposition (ALD) and chemical vapor deposition (CVD) applications, equipment, and precursors for high-volume manufacturing. It notes that ALD equipment sales have grown to $1.8-1.9 billion annually, with 300mm spatial ALD and multi-wafer tools gaining market share. Advanced logic and memory nodes like 10nm and 7nm are driving increased use of ALD for applications like high-k dielectrics. Key precursor suppliers are also discussed.
GaN Systems GS61004B GaN HEMT 2018 teardown reverse costing report published ...system_plus
There are only two main players in the low-voltage GaN HEMT market: EPC and GaN Systems. GaN Systems wants to compete with EPC, the market leader, by unveiling its latest device, the GS61004B. The GS61004B is a GaN-on-silicon HEMT transistor packaged in GaN Systems' unique GaNpx embedded die package. This package has no wire bonding and its design increases heat dissipation while simplifying the manufacturing process to reduce costs. A teardown analysis estimates the production costs for the epitaxy and package. The report also compares the GS61004B to standard 100V Si MOSFETs and the competition.
The document describes an electronic voting system that consists of two units: a voting unit and a counting unit. Both units contain a microcontroller, GSM module, and LCD display. The voting unit allows users to cast votes for different candidates that are then sent to the counting unit via the GSM module. The counting unit tabulates the votes received and displays the current vote totals for each candidate on the LCD screen. Diagrams show the electrical connections between the components in each unit including the Arduino board, GSM module, and LCD shield. References are provided at the end related to electronic voting systems, sending/receiving SMS using GSM modules, and using Arduino microcontrollers.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
The document discusses using GPIO pins on a TMS320C6745 processor to interface with LEDs and switches. It describes the GPIO peripheral features, how to connect an LED to the GPIO pins, the GPIO registers used to configure the pins as inputs or outputs and read/write values. It provides code to blink an LED by writing values to the output data register and read the state of switches by reading the input data register.
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
The document summarizes a presentation on AVR microcontrollers. It discusses the AVR family of microcontrollers, highlighting their RISC architecture, 32 general purpose registers, and single cycle instruction execution. It also covers new AVR features, application specific AVRs for tasks like motor control, USB, and CAN, and automotive-qualified AVRs using CMOS process technology.
The 2010 State of supply chain performance study in Semiconductor industry was conducted with 52 companies with annual turnover exceeding USD 400 million.
The study was conducted from September to November 2010 by iCognitive consultants.
The Study used the same standard online questionnaire in all countries.
In addition, telephone interviews were carried out for verification of online results and additional qualitative data.
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
This document describes the components, working, circuit, source code, and scope of an obstacle avoidance robot powered by an Arduino. The main components are a chassis, Arduino UNO microcontroller, DC motor, motor driver, ultrasonic sensor, and servo motor. The robot uses the ultrasonic sensor to calculate distances and detects obstacles. It then controls the DC motor and servo motor using the motor driver and Arduino to avoid obstacles and navigate autonomously. The source code contains functions for movement, distance calculation, and sensor control. Potential applications discussed for further development include using it as a firefighting, mining, driverless vehicle, or cleaning robot.
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
DRAM & NAND Service – Memory Research 2018 Reports by Yole Developpement Yole Developpement
More information on DRAM report at https://www.i-micronews.com/report/product/dram-service-–-memory-research.html
and NAND report : https://www.i-micronews.com/report/product/nand-service-–-memory-research.html
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
ALD/CVD applications, equipment and precursors in high volume manufacturingJonas Sundqvist
This document discusses trends in atomic layer deposition (ALD) and chemical vapor deposition (CVD) applications, equipment, and precursors for high-volume manufacturing. It notes that ALD equipment sales have grown to $1.8-1.9 billion annually, with 300mm spatial ALD and multi-wafer tools gaining market share. Advanced logic and memory nodes like 10nm and 7nm are driving increased use of ALD for applications like high-k dielectrics. Key precursor suppliers are also discussed.
GaN Systems GS61004B GaN HEMT 2018 teardown reverse costing report published ...system_plus
There are only two main players in the low-voltage GaN HEMT market: EPC and GaN Systems. GaN Systems wants to compete with EPC, the market leader, by unveiling its latest device, the GS61004B. The GS61004B is a GaN-on-silicon HEMT transistor packaged in GaN Systems' unique GaNpx embedded die package. This package has no wire bonding and its design increases heat dissipation while simplifying the manufacturing process to reduce costs. A teardown analysis estimates the production costs for the epitaxy and package. The report also compares the GS61004B to standard 100V Si MOSFETs and the competition.
The document describes an electronic voting system that consists of two units: a voting unit and a counting unit. Both units contain a microcontroller, GSM module, and LCD display. The voting unit allows users to cast votes for different candidates that are then sent to the counting unit via the GSM module. The counting unit tabulates the votes received and displays the current vote totals for each candidate on the LCD screen. Diagrams show the electrical connections between the components in each unit including the Arduino board, GSM module, and LCD shield. References are provided at the end related to electronic voting systems, sending/receiving SMS using GSM modules, and using Arduino microcontrollers.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Power Management: Technology, Industry and Trends 2019 - by Yole DéveloppementYole Developpement
China, 300mm, societal impacts, and important strategic decisions are shuffling the cards in the power
IC industry.
More on: https://www.i-micronews.com/products/power-management-technology-industry-and-trends-2019/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
The document discusses using GPIO pins on a TMS320C6745 processor to interface with LEDs and switches. It describes the GPIO peripheral features, how to connect an LED to the GPIO pins, the GPIO registers used to configure the pins as inputs or outputs and read/write values. It provides code to blink an LED by writing values to the output data register and read the state of switches by reading the input data register.
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
The document summarizes a presentation on AVR microcontrollers. It discusses the AVR family of microcontrollers, highlighting their RISC architecture, 32 general purpose registers, and single cycle instruction execution. It also covers new AVR features, application specific AVRs for tasks like motor control, USB, and CAN, and automotive-qualified AVRs using CMOS process technology.
The 2010 State of supply chain performance study in Semiconductor industry was conducted with 52 companies with annual turnover exceeding USD 400 million.
The study was conducted from September to November 2010 by iCognitive consultants.
The Study used the same standard online questionnaire in all countries.
In addition, telephone interviews were carried out for verification of online results and additional qualitative data.
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Power Module Packaging 2018: Material Market and Technology Trends report by ...Yole Developpement
Power packaging is continuously adapting to power application market trends.
More information on that report at : https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html
This document describes the components, working, circuit, source code, and scope of an obstacle avoidance robot powered by an Arduino. The main components are a chassis, Arduino UNO microcontroller, DC motor, motor driver, ultrasonic sensor, and servo motor. The robot uses the ultrasonic sensor to calculate distances and detects obstacles. It then controls the DC motor and servo motor using the motor driver and Arduino to avoid obstacles and navigate autonomously. The source code contains functions for movement, distance calculation, and sensor control. Potential applications discussed for further development include using it as a firefighting, mining, driverless vehicle, or cleaning robot.
The GaN RF market enjoyed a healthy increase in 2015.
2015 was a significant year for the GaN RF industry, with a dramatic increase in wireless infrastructure market sales driven by the massive adoption of LTE networks in China. By year’s end, the total RF GaN market was close to $300M.
Sales will likely not soar as high over the next two years, but growth will continue, mainly driven by increased adoption of GaN technology in the wireless infrastructure and defense markets. A significant boost will occur around 2019 – 2020, led by the implementation of 5G networks. Market size will be multiplied by 2.5 by the end of 2022, posting a CAGR of 14%...
More information on that report at http://www.i-micronews.com/reports.html
Compound Semiconductors,RF, Power Electronics
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiation.
PCM leads the race to storage-class memory (SCM), but RRAM will catch up soon
In 2015, the Micron/Intel alliance presented a breakthrough stand-alone memory product called 3D Xpoint, developed in secret for many years, which uses PCM material instead of RRAM as we expected. Thus, after being down and out for a while, PCM made a big comeback in the emerging NVM race. This product has an amazingly high density for an emerging NVM (128 Gb), which is close to the latest NAND thanks to high node (20nm), a 3D crosspoint structure, and a good selector. We expect PCM will have the largest emerging NVM market share by 2021, thanks to its prominent promoters (Micron/Intel), which have sufficient influence to create a new SCM category using 3D Xpoint in the memory hierarchy. Indeed, creating a new memory category is a sea-change that will require numerous hardware and software developments by all memory ecosystem players. And while there is no general agreement, many experts believe DRAM sales will decrease due to SCM’s increased use. For this reason, many incumbent players, especially DRAM ones, have postponed their SCM product introduction in order to extend their DRAM profits, which over the last several years have been very high.
DRAM & NAND Service – Memory Research 2018 Reports by Yole Developpement Yole Developpement
More information on DRAM report at https://www.i-micronews.com/report/product/dram-service-–-memory-research.html
and NAND report : https://www.i-micronews.com/report/product/nand-service-–-memory-research.html
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
DRAM & NAND Service – Memory Research 2019 Monitors by Yole DéveloppementYole Developpement
2018 DRAM & NAND markets: the end of an incredible multi-year rally…
More information on DRAM monitors at: https://www.i-micronews.com/produit/dram-service-memory-research/
More information on NAND monitors at: https://www.i-micronews.com/produit/nand-service-memory-research/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Emerging NVM technological choices are about to be made by key players: STTMRAM or RRAM?
Over the last two years, the complex emerging non-volatile memory (NVM) situation has been greatly simplified.
In 2014, Micron, the main phase-change memory (PCM) promoter for stand-alone memory, stopped actively selling PCM chips following the collapse of sales targeting the shrinking entry-level mobile phone market. At the same time, Micron developed a resistive random access memory (RRAM or ReRAM) chip with Sony, part of a technology class that includes conductive bridge RAM (CBRAM). At 16 Gb the Micron-Sony RRAM has the highest density commercialized among emerging NVM technologies. Thus, we believe that PCM is now out of the race for stand-alone memory. For embedded microcontroller unit (MCU) applications 2015 will be a key year as STMicroelectronics, the main PCM promoter in this market, will choose if PCM will remain in its roadmap.....
More information at http://www.i-micronews.com/reports.html
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Global and china memory industry report, 2011ResearchInChina
The document analyzes the global and China mobile phone and tablet PC market with a focus on the memory industry and memory used in mobile devices. It highlights memory vendors and their market shares. Key details include memory vendors converting processes to smaller nodes, the growth of mobile DRAM and flash markets, and market shares of major memory vendors in 2011.
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High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
How will AI impact the semiconductor market through consumer applications?
More information on that report at : https://www.i-micronews.com/report/product/hardware-and-software-for-ai-2018-consumer-focus.html
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Yole Developpement
New functions are pushing change in CMOS image sensors, boosting the market toward $18.8B in 2021 at 10.4% CAGR
Beyond $10B: The CMOS image sensor industry keeps growing at high pace
Driven by renewed mobile and automotive applications, the CMOS image sensor (CIS) industry is expected to expand at a compound annual growth rate (CAGR) of 10.4% from 2015 to 2021, reaching US$18.8B market value by 2021.
Yole Développement expects sustained growth of the CMOS image sensor industry for the next five years. Increasing camera content in smartphones will more than offset slower smartphone volume growth. The trend for dual and 3D cameras will have a major impact on CIS volumes. While it is too early to fully describe the strategy of the main actors yet, some products are already on the market. The 2016 report comprehensively covers key market and technology choices.
One big story this year is the consumer market, which is recovering from the total collapse of digital photography. While action cameras seem to have reached a ceiling, new applications such as drones, robots, virtual reality and augmented reality are ready to rejuvenate this emblematic market. The Automotive camera market has established itself as a key growth market for CIS. The Advanced Driver Assistance (ADAS) trend is further increasing pressure on vendors to provide sensors beyond their current technical capabilities. Image analysis is the new frontier and early usage of artificial intelligence is catching people’s imagination. We are therefore in the middle of an explosive growth pattern that will not slow down before 2021. An exceptionally high 23% CAGR is predicted in automotive for the 2015-2021 period.
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Innovative MEMS technologies are spearheading the inkjet printing industry’s transformation.
From technology push to market pull, inkjet printing is entering a new era
Inkjet printing, which offers a flexible, cost-effective solution for printing personal documents, is still largely associated with home and small office printing. In parallel, large & wide format printing for CAD and graphic arts applications considers inkjet printing as its technology-of-choice for single prints and very small print runs. The democratization of digital applications in the early 2000s, spurred on by greater home internet usage and the appearance of digital cameras (which dramatically impacted the photo business), has influenced OEM printer manufacturers to develop high-quality, high-resolution printheads. MEMS technologies represent an attractive solution for creating a higher native density of nozzles-per-printheads at an acceptable manufacturing cost via mass production.
Office printing is one of the sectors that has recently benefited from MEMS printhead performance, competing with entry-level to mid-end laser printers. Moreover, the digital revolution is also gaining momentum in new sectors. For years, commercial and industrial applications have used analog printing solutions like flexography, offset printing, and screen-printing due to their high-volume production capacity and associated lower cost. However, these techniques are restrictive due to the use of a master, and not compatible with short runs < 4000m² printing surface. Today’s industrial and commercial applications require more diversity, as well as more instant service customization. Digital printing, specifically inkjet printing, is the solution to penetrating the three trillion square meters (m²) industrial market.
Non-volatile Memory Market - Comprehensive assessment of advanced storage tec...Arushi00
This document summarizes a report on the global non-volatile memory market. It discusses how non-volatile memory can retain data when power is turned off, and examples include ROM, flash memory, and hard disks. The market is growing due to rising demand for fast access and low power consumption. However, limited storage capacity and write endurance may inhibit growth. The market is largest in Asia Pacific due to data centers and consumer electronics. Leading companies include Micron, Fujitsu, Samsung, and Intel.
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Market Opportunities for Thermal Management Components in Smartphones 2017 - ...Yole Developpement
The growing smartphone market, expected to reach almost $2.1 billion smartphones annually by 2022, represents a great opportunity for suppliers of different smartphone components and technology solutions.
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
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More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
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32. Ever-growing data generation driven by mobile
devices, the cloud, the internet of things (IoT), and
big data, as well as novel AI applications, requires
continuous advancements in memory technologies.
Flash NAND (non-volatile) and Dynamic Random
Access Memory (DRAM - volatile) are the stand-
alone workhorse options, and will maintain their
leading position for another several years thanks
to new technical solutions that enable further
scalability. However, there exists a large speed-
capacity gap between NAND and DRAM, one which
must be reduced to improve overall performance of
computing systems. Storage-class memory (SCM)
serves precisely this purpose and has long been
awaited.
Hitherto, emerging non-volatile memories (NVMs) –
e.g. phase-change memory (PCM), magnetoresistive
random access memory (MRAM), spin transfer
torque MRAM (STT-MRAM) and resistive RAM
(RRAM) – have been restricted to niche applications
because of poor scalability, high cost, and a lack
of support from major memory makers. In 2015,
Micron and Intel presented a new SCM technology,
3D XPoint, which uses phase-change memory
(PCM) materials that the companies researched for
more than 15 years. The first 3D XPoint products
– OptaneTM
Solid State Drives (SSDs) and storage
accelerators – were introduced by Intel in 2017, and
persistent-memory modules (OptaneTM
Dual Inline
Memory Modules (DIMMs)) are expected in 2019.
Despite the coming end of the Intel-Micron joint
venture (IMFT), Micron has confirmed its continuing
strategic involvement with 3D XPoint by announcing
its acquisition of Intel’s stake in IMFT, along with
plans to introduce its own 3D XPoint products
(QuantXTM
) in 2019.
Over the next three years, 3D XPoint sales will grow
by more than one order of magnitude thanks to
Intel’s dominant position in the enterprise processor
business. Optane DIMMs will be sold in combination
with the latest generation of Intel’s Xeon server
processors (i.e. Cascade Lake). Moreover, Intel’s
new brand strategy for client systems that includes
Optane caching pre-installed (Intel Core i+), will
support sales growth.
Due to the rise of 3D XPoint sales, SCM is expected
to be the dominant application for emerging NVMs
in the coming years, reaching more than 90% of the
emerging NVM market by 2019.
EMERGING NON-VOLATILE MEMORY 2018
Market & Technology report - November 2018
EMERGING NVM SALES WILL GROW BY MORE THAN ONE ORDER OF
MAGNITUDE IN THE NEXT THREE YEARS, THANKS TO SCM APPLICATIONS
After more than 15 years in development, PCM has finally taken off in stand-alone applications.
STT-MRAM will lead the embedded memory race.
KEY FEATURES
• 2017 - 2023 market forecast in units,
Gbit, $US, and number of wafers
• Competitive landscape and market
dynamics
• Emerging non-volatile memory
(NVM) - potential applications and
market drivers
• Technology roadmap, with time-to-
market
• Price evolution, by application and
technology
• Technology description and main
technical trends by technology,
along with overview of main players,
and roadmap
WHAT’S NEW
• Redefinition of embedded market
segments, highlighting newly
emerging artificial intelligence (AI)
applications as well as eDynamic
Random Access Memory
(eDRAM)/Static Random Access
Memory (SRAM) replacement in
mobile AP and high-end processors
• Updated market forecast for
phase-change memory (PCM),
spin transfer torque MRAM (STT-
MRAM) and resistive RAM (RRAM)
• Updated analysis of technical trends
for PCM, (STT-)MRAM, and RRAM
• Updated analysis of the stand-alone
and embedded memory markets
• Updated analysis of China’s
memory market, and a detailed list
of emerging Chinese NVM players
• In-depth analysis of Non-Volatile
Dual Inline Memory Modules
(NVDIMM) technology and its
market
• Analysis of PCM’s development
history, including the latest news
on Micron and Intel’s 3D XPoint
activities
• Review of materials suppliers and
equipment players
• Analysis of 3D XPoint products,
and comparison with Samsung’s
Z-NAND
• Examination of newly emerging
technologies, including Ferroelectric
Field-Effect Transistor (FeFET) and
Nanotube RAM (NRAM)
• Updated analysis of new entrants
and startup funding
• Analysis of memory technologies
for artificial intelligence (AI)
applications
(Yole Développement, November 2018)
2017
~$99M
2018
~$280M
2019
~$1.08B
CAGR2017-2019
~230%
Embedded NonVolatile Memory - Microcontrollers (MCU)
Industrial and transportation and consumer electronics
Entreprise storage-class memory (SCM)
Client storage-class memory
Emerging non-volatile memory market – breakdown by application
In the stand-alone business, emerging NVMs will
not replace DRAM and NAND but will be used in
combination with them inside memory modules,
e.g. SSDs, DIMMs, and NVDIMMs. In 2023, PCM
will maintain its lead in the stand-alone memory
market thanks to the increasing adoption of 3D
XPoint as an enterprise and client SCM. It is worth
noting that Samsung and Toshiba took a different
IN THE NEXT FIVE YEARS, PCM-BASED 3D XPOINT WILL DRIVE THE STAND-
ALONE EMERGING NVM MARKET, WHEREAS STT-MRAM WILL LEAD
EMBEDDED TECHNOLOGY
33. EMERGING NON-VOLATILE MEMORY 2018
EMERGING NVM PLAYERS WILL USE “TROJAN HORSE” STRATEGIES TO INTRODUCE
THEIR TECHNOLOGIES TO THE MEMORY MARKET
In the stand-alone business, emerging NVM brings
new features and functionalities, but at a higher price.
Thus, new solutions must be found for triggering this
NVM’s market penetration. Among big IDMs, Intel
has a unique position: it is both a stand-alone memory
supplier and a Central Processing Unit (CPU) leader.
Intel can combine its 3D XPoint products with its
new generation of Xeon processors, which will act
as the aforementioned Trojan horse for introducing
3D XPoint into the data-center technology market.
STT-MRAM developers are rather small companies
(e.g. Everspin, Avalanche, Spin Memory) that view
memory module suppliers (Smart Modular, for
example) as the ideal partner for entering the
enterprise storage market. These module suppliers
are midsized companies inclined to develop niche
applications in the early stages.
In the embedded business, the top foundries are
the key decision makers: they can promote the
adoption of new embedded NVM in applications such
as MCUs or cache memory. Therefore, it is critical
for IP memory companies to convince foundries to
develop edge-node (28/22nm) technology platforms
for emerging NVM, a goal that has already been
achieved by STT-MRAM players. In fact, RRAM has
been adopted at 22nm by TSMC, but other foundries
are hesitating to scale down to 28/22nm.
Yole Développement invites you to read our comprehensive
analysis on the ecosystem and market landscape,
highlighting the challenges and opportunities towards
large adoption of emerging NVM.
strategic path by developing 3D NAND-based SCM
solutions such as Z-NAND (Samsung) and XL-Flash
(Toshiba, showcased in August 2018). However,
these technologies will be used in enterprise SSDs
and will not compete with DDR4-compatible Optane
DIMMs, which we expect will represent more than
50% of overall 3D XPoint sales.
Resistive RAM (RRAM) was expected to be the first
stand-alone technology to compete with 3D XPoint,
but it has suffered repeated delays due to technical
challenges. We presume that RRAM could return
in the race for SCM after 2020, and possibly start
competing with NAND for mass storage applications.
Spin transfer torque MRAM (STT-MRAM), thanks to
its high speed and high endurance, is promising for
enterprise storage SCM. However, its success will
be much lower compared to stand-alone PCM due
to higher costs, greater fabrication complexity, and
challenging scalability.
Compared to stand alone, the embedded emerging
NVM market is relatively small, representing ~3% of
the emerging NVM market in 2017. The market is
dominated today by RRAM, since only a few RRAM-
based microcontrollers (MCUs) are available on the
market. However, all top foundries are now getting
ready with 28/22nm technology processes for STT-
MRAM whereas RRAM adoption has been delayed
by approximately two years by SMIC and UMC.
Therefore, we expect that STT-MRAM will be the
first to take-off in the coming years and will lead the
embedded emerging NVM market, especially MCUs,
which represent the most important embedded
segment.
Emerging memory will first replace eFlash, which is
facing major scaling challenges due to rising fabrication
complexity/costs for technology nodes ≤ 28nm. The
adoption of STT-MRAM as an embedded cache
memory (SRAM or eDRAM) in high-end processors
and mobile AP will occur later due to more strict
scalability requirements (≤ 14nm).
AI on the edge is the most innovative application
for embedded emerging NVM. Crossbar recently
demonstrated various AI applications, i.e. face
recognition, through the use of RRAM chips. We
expect that such RRAM-based AI devices will enter
the market after 2021.
Examples of market entry strategies for stand-alone
and embedded emerging non-volatile memory*
(Yole Développement, November 2018)
Evolution of the emerging non-volatile memory market – breakdown
by technology for stand-alone and embedded memories
(Yole Développement, November 2018)
~$6.4M ~$1.1B
~$273M ~$6.1B
2018 2023
Resistive random access
memory (RRAM)
(Spin transfer torque)
magnetoresistive random
access memory ((STT)MRAM)
Phase-change memory (PCM)
Stand-alone
Embedded
Source: Everspin
Source: STMicroelectronics
Stand-alone chip provider Modules Systems
FlashCoreTM
Module
OptaneTM
DIMM
XeonTM
Processor
Embedded NVM IP** provider
STT-MRAM
Enterprise-Storage
Players
3D XPoint
IoT, general purpose
and automotive MCUs***
integrators
Foundries
Bundle
* Non exhaustive list of companies
**Non Volatile Memory Intellectual Property
***Microcontrollers
34. MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
4DS, A*STAR, Adesto, Aeroflex, Apple, Atmel, Avalanche, Buffalo, Canon, CEA Leti,
Cisco, CNE, Crocus, Crossbar, Cypress, Dell, EBay, EMC, Evaderis, Everspin, Facebook,
Ferroelectric Memory Company, Freescale, Fujitsu, Fusion IO, Fujian Jinhua Integrated
Circuit Co., Ltd, Gemalto, Giesecke Devrient, GigaDevice, GlobalFoundries, Google,
Hefei Chang Xin, H-Grace, Hikstor, HLMC, Honeywell, HP, Huawei, IBM, Imec, Infineon,
Intermolecular, Innovative Silicon, Intel, ITRI, Lenovo, Materion, Macronix, Maxim, Mediatek,
Microchip, Micron-Elpida, Morpho, Mythic, Nantero, Nanya, National Tsing Hua University,
NEC, NetApp, Nike, Nokia, Numonyx, NXP, Oberthur, Panasonic, Qualcomm, Quantum,
Rambus - Unity, Reliance, Renesas, Samsung, Sandisk, Seagate, SGI, Sino King Technology,
SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spreadtrum,
STMicroelectronics, Stanford University, STEC, Sun, Syntiant, TDK, Tezzaron, TMS, Tohoku
University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCO, Tsinghua
Unigroup , TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC,
Yangtze River Storage Technologies, new Chinese emerging NVM players and more…
Find more
details about
this report here:
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Simone Bertolazzi,
PhD is a Technology
Market analyst at Yole
Développement (Yole) working with the
Semiconductor Software division. He is
member of the Yole’s memory team and
he contributes on a day-to-day basis to the
analysis of nonvolatile memory technologies,
their related materials and fabrication
processes. He (co-) authored more than
ten papers in high-impact scientific journals.
Simone obtained a PhD in physics in
2015 from École Polytechnique Fédérale
de Lausanne (Switzerldand), where he
investigated novel flash memory cells based
on heterostructures of 2D materials and
high-k dielectrics.
AUTHORS
Executive summary 13
Standard memory market introduction 44
Market and technology overview 54
NAND
DRAM
NVDIMM
Niche stand-alone memory
Embedded MCU/SoC memory
Memory market players overview 86
China memory landscape 95
Emerging NVM overview 100
Emerging NVM applications 127
Market segments 138
Industrial, transportation consumer
Electronics applications
Enterprise storage SCM applications
Client SCM Aapplications
Mass storage NAND applications
Embedded NVM in Microcontrollers (MCUs)
Embedded cache memory in mobile devices
Embedded cache memory in high-end
processors
Embedded NVM for artificial intelligence
MRAM/STT-MRAM technology, forecast,
and players 190
Technology description, roadmap, time to
market/application, forecast by application, key
players, key products, main trends
RRAM technology, forecast, and players 215
Technology description, roadmap, time to
market/application, forecast by application, key
players, key products, main trends
PCM technology, forecast, and players 242
Technology description, roadmap, time to
market/application, forecast by application, key
players, key products, main trends
Other emerging NVM 263
General conclusions 270
Noteworthy news 2017-2018 280
Yole Développement’s presentation 286
TABLE OF CONTENTS (complete content on i-Micronews.com)
OBJECTIVES OF THE REPORT
Present an overview of the semiconductor memory market:
• NAND, DRAM, NVDIMM, embedded MCU, and mobile AP - main markets, market forecast,
and main trends
• Current technological status and roadmap for the coming years
• Market landscape
Provide an understanding of emerging NVM applications:
• A total of eight application fields - four for stand-alone and four for embedded: total addressable
market, market drivers and challenges, technology roadmap, players, main trends
• Roadmap with time-to-market, by application
Deliver market forecasts for emerging NVM businesses:
• 2017 - 2023 market forecast in units, Gb, $US/Gb, and number of wafers
• Price evolution, by application and technology
• Forecast for eight applications and three technologies (MRAM/STT-MRAM, RRAM, PCM)
Describe emerging NVM technologies:
• Working principle, manufacturing methods, advantages/limitations, development status, price,
time-to-market
• Roadmap with technology nodes, chip-density evolution, and main players
• Latest product development status for each key market player
Detail and analyze the competitive landscape:
• Recent acquisitions and funding
• Latest company news
• Key players, by technologies and applications
YanndeCharentenay
works as a Technology
Market Senior Analyst for
Yole Développement (Yole). Yann is strongly
involved in the technology market analysis
of the applications of disruptive technologies
and components: memory, MEMS and
sensors... Prior his mission at Yole, Yann
was engaged as a marketing engineer at
the Commissariat à l’Energie Atomique
(CEA, France) as well as a consultant at
Algoe (France). He has spoken in numerous
international conferences and has authored
or co-authored numerous press articles.
Yann graduated from the University of
Compiegne (France) with a master degree in
innovation management. He is also graduated
from INP Phelma (Grenoble, France) with a
master degree in materials science.
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