This document provides information on three types of panel boards: binderless wood particle board, cement bonded particle board, and gypsum board. It discusses the history, manufacturing process, uses, advantages and disadvantages of each type. For binderless board, it focuses on how temperature, compression, and particle composition affect the binding properties and final density profile. Cement bonded board and gypsum board are summarized with regards to their production levels globally and various applications.

1. FWT- 3203
Panel Products, Adhesion, Adhesive and Finishes
Cement Bonded Particle Board,
Gypsum Board,
Binder less Board, Other board
Md. Sajjad Hossain Tuhin
Student ID: 100510
Forestry and Wood Technology Discipline
Khulna University
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2. Presentation outline
2. Cement Bonded Particle Board
History
Manufacturing Process
Production
Uses
Advantages and Disadvantage
3. Gypsum Wood Particle Board
History
Manufacturing Process
Uses
Types
Advantages and Disadvantage8/14/2014 Group 5 2
1. Binderless Wood Particle Board
Advantages and Dis-advantages
Uses
Manufacturing Process
Density profile

3. Binderless Wood Particle Board
 A panel of wood particles (e.g., cellulosic fibers) formed by using only
water, heat and pressure and without any adhesives.
 Binder less particle Board is the type of panel where no external adhesives
are used and in wood lignin and hemicelluloses acts as adhesives.
 Hot pressing Temperature can be 150°C- 250°C and for cold pressing it is
pressed with water and 20-25°C
 Compression rate is depends on particle type and pressing system usually it
is 0.1-3Mpa
 Density is around 450 kg/m3 - 1350 kg/m3
 Heat and pressure is depends upon the particles properties.(e.g. density, MC)
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4. Particle
preparation
Final pressing
160-170°C
Mat Forming
Removal of the
frame
Hot pressing
MC: 20%Framing
Final panel
Manufacturing process
Hot Pressing
150°C- 250°C
0.6- 1 Mpa
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5. Particle composition based on mesh analysis
Mesh Size (mm) Weight %
<0.25 6.4
0.25 - 0.50 14.4
0.50 – 1.00 37.3
1.00 – 2.00 37.2
>2.00 4.7
Particle composition in coconut Husk board
0
5
10
15
20
25
30
35
40
0.12 0.35 0.75 1.5 2
Percentage
Mesh size in mm
Particle composition analysis
Weight %
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6. Influence of temperature
By increasing of temperature MOR of the produced panel is increased ,
Water absorption and roughness is decreased. Internal board strength is
increasing but decreasing after 190°C
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7. Binding Properties
 In wood 38-50% Cellulose, Hemicellulose 23-32% and Lignin 15-25%
 Around 50-55% is Hemicellulose 23-32% and Lignin 15-25%
 Hemicellulose and Lignin are much more thermoplastic than Cellulose
 Lignin shows thermal softening at 127-235°C
 Hemicellulose shows thermal softening at 167-217°C
 Cellulose shows thermal softening at 231-253°C
 In 20% MC Lignin thermal softening point at 72-128°C and Hemicellulose
is 54-142°C
 Cellulose shows decreasing thermal softening point only 6-9°C
 So binding temperature used at 170-180°C with 20% MC
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8. Influence of Compression
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9. FIG.1 shoes a density profile for a binderless fiberboard having uniform density
throughout the thickness of the panel.
Density Profile
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10. Uses of Binderless wood particle board
Decorative use
Light construction
Internal use
Sound insulation
Partition wall making
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11.  Produce thick board of medium density.
 Density profile significantly more uniform
 Supplementary particle can be used,
 Good appearance
 Environmentally friendly.
 Less costly
 Can be recycled
 Good insulating properties
 Less water absorption
Advantages and Dis-advantages of Binderless wood panel
Dis-advantages
 Not much durable
 Require more pressure
 Difficult to prepare
 Low MOR and MOE
Advantages
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12. Cement Bonded Particle Board
 Also known as Wood- Cement Board (WCB)
 First commercially manufactured in the early nineteen seventies (1970)
 It is a mixture of wood particles and Portland cement together with some
additives
 Ratio: Cement 50-60%, Wood 20-25%, Water 25-30%. (2.2:1:1-1.1)
 It is very good sound insulator and dimensionally stable
 Density is around 1100 kg/m3 - 1200 kg/m3
 Density can be decreased at 850 kg/m3 in Oriented-wood-cement
Boards(OWCB)
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13.  1900 - The first mineral bonded board was produced by an Austrian carpenter
using wood shavings and gypsum.
 1920 - The first Wood Wool Cement Board (WWCB) is produced in Austria.
Several others in Europe followed.
 1930 - Wooden lath reinforced WWCB roofing boards produced in Holland,
along with the first Cement Bonded Wood Chips (Durisol) boards.
 1950 - Velox boards produced in Austria from course wood particles and
cement.
 1970 - The first Cement Bonded Particle Board (CBPB), called Duripanel,
was produced in Switzerland.
 2000 - Eltomation developed a fully automatic plant for Wood Strand Cement
Board with approx. 1100 kg/m³, called EltoBoard
History
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14. Manufacturing Process
Cement
Water
Wood Mixer
Mat
distribution
on form board
Pressing
Curing
room/yard
Trimming and
finishing
Final Panel
C:R:W=2.2:1:1-1.1
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15.  It is manufactured by 43 companies world wide.
 CBPB is currently produced by 16 manufacturers around the world
 18% of world-wide cement board production.
Most of the major cement board producers are privately owned companies that do not
publish financial reports, limiting the analysis of company progress
0 2 4 6 8
Developed
countries
Global
2011
2012
2013
2014
Production
Percentages
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Source: http://www.globalcement.com

16. Uses of WCB
 Exterior and partition walls
 Coating of the wall
 Decoration
 Acoustic and thermal insulation.
 Flooring
 Large size prefabricated elements for permanent shuttering of concrete walls
 The production of complete prefabricated houses.
 Roofing, shingles and shades.
 Ceilings and architraves.
 Fire resistant construction.
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17. 15%
20%
15%
25%
5%
20%
0%
5%
10%
15%
20%
25%
30%
Floors Office containers, House
manufacturers
industry Facades other
Use Pattern of WCB
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Source: http://www.wbpionline.com/features/building-the-future-on-strong-foundations

18. High fire resistance
Wet and dry rot resistance because of its high alkalinity (pH 11)
Freeze-thaw resistance
Termite and vermin resistance
Excellent workability
Exceptional insulation and acoustic performance
Low cost and ease of manufacture
Can be used in both exterior and interior purposes
Advantages of WCB
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19. Disadvantage of WCB
High Density
For high density it is very difficult to handle in manufacturing and use. Need
more transportation cost and can not used in light constructions like
furniture.
For long curing time manufacturing process is more complex and time
consuming. Needed extra care and attention in hydration process of
cement. Need more labor.
Long curing time
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20. Solution of the problems
 Density Problem: Oriented wood-cement boards (OWCB)
Oriented wood-cement boards (OWCB) were manufactured with wood/cement
(w/w) ratio of 1:1 and SiO2 used as cement replacement up to 20%. Specific
gravity 850 kg/m3 and MOR 2.1 to 2.8 Mpa.
 Time problem: Mainly reduction of alkalinity from 13-17 to around 10.
1. Using additives: CaCO3, CaSO4,Calcium Salfoaluminate (CSA). etc.
2. Carbon-di- oxide treatment.
3. Converting manufacturing temperature( 1500°C to 1200°C)
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21. Gypsum
Gypsum is a mineral found in sedimentary rock formations in a crystalline
form known as calcium sulfate di-hydrate CaSO4•2H2O
Gypsum Wood Particle Board (Drywall)
Gypsum Particle board
 Gypsum board is the generic name for a family of panel products that
consist of a noncombustible core, composed primarily of gypsum, and a
paper surfacing on the face, back and long edges.
 Gypsum board is often called drywall, wallboard, or plasterboard.
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22.  The first plasterboard plant in the UK was opened in 1888.
 Rochester Kent Sackett Board was invented in 1894 by Augustine Sackett and
Fred Kane.
 The first mineral bonded board was produced by an Austrian carpenter using
wood shavings and gypsum in 1900
 In 1910 United States Gypsum Corporation bought Sackett Plaster Board
Company and by 1917 came out with a product they called Sheetrock.
 Gypsum Board evolved between 1910 and 1930 beginning with wrapped
board edges, and elimination of the two inner layers of felt paper in favor of
paper-based facings.
History
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23. Manufacturing Zones Sizes
Canada and the United States Width : 48-inch (1.2 m),54-inch (1.4 m) and
96-inch (2.4 m)
Thicknesses: 1⁄2-inch (13 mm) , 5⁄8-inch (16
mm), and 1⁄4-inch.
Europe Width: 20 cm ,90 cm and 60 cm
Lengths: 250, 260, 270, 280, 300 cm
Thicknesses: 9.5 mm to 25 mm
Australia and New Zealand Thicknesses:10mm, 13mm, and 16mm, and
up to 25mm.
 Mainly Produced in U.S.A, Canada, Europe, Australia and New Zealand
 Over 8 Billion Pounds of Drywall Scrap Annually in the U.S.A.
Production
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24. Manufacturing process
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25. Uses of Drywall
 Gypsum board can be applied over wood or metal framing.
 It can be applied to masonry and concrete surfaces.
 To overcome dampness in exterior walls.
 Use for decorative purpose
Use pattern of Drywall from 1995-2008
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26.  Abuse-resistant gypsum board (Greater resistance to surface friction)
 Eased edge gypsum board (Has a tapered and slightly rounded)
 Exterior gypsum soffit board (Use on the undersides of eaves)
 Foil-backed gypsum (Aluminum foil laminated to the surface)
 Gypsum base for veneer plaster (Coats with gypsum veneer plaster)
 Mold-resistant board
 Non-paper-faced gypsum (has a facing other than paper)
 Regular gypsum board
 Sag-resistant board
Types of used Drywall
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27.  Ease of installation
 It can also be adhesively attached to many substrates.
 Lightweight material.
 It is an excellent fire-resistive building material.
 Preventing the transfer of unwanted sound .
 Gypsum board is used to construct strong, high quality
walls and ceilings.
 Cheap manufacturing cost
Advantages of Gypsum Board
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28. Drywall may become damaged when exposed to water.
Water mold damage.
Environmentally not sound
Harmful for health produce toxic SO2 gas
 High wastage in use and manufacturing 2,000 Square Foot
House = 1 Ton of Waste
 High density about 1.1-1.4
Disadvantages of Drywall
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29. Wood-based panels
(OSB, plywood)
Drywall
(Gypsum board)
Wood-cement materials
(CBPB, WWCB)
Concrete
Water resistance    
Fire resistance    
Fungal/termite/
mold resistance
   
Acoustic
insulation    
Bending strength    
Lightweight    
Nail holding
capacity    
Workability    
Durability    
Compare among different wood boards
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30. References
 Almeida, R. R.; Del Menezzi, C. H. S.; Teixeira, D. E. 2002. Utilization of the coconut shell of
Babaçu (Orbignya sp.) to produce cement-bonded particleboards. Bioresource Technology 85
(2): 159-163.
 Hashim R ,Hamid SHA , Sulaiman O, Ismail N, Ibrahim M H, Jais H, et al. 2009, Extractable
formaldehyde from waste medium density fibreboard .J Trop ForestSci2009;21:25–33
 Hermawan D (2001). Manufacture of cement-bonded particleboard using carbon dioxide
curing technology. A Dissertation present to the Department of Forest and Biomass Science,
Graduate School of the Faculty of Agriculture, Kyoto University, Japan
 http://books.google.com.bd
 http://en.wikipedia.org/wiki/Cement_board
 http://en.wikipedia.org/wiki/Drywall
 http://www.thefreelibrary.com/Binderless+particleboard+resistance+to+termite+attack.-
a0318492657
 M. Sato, 2002 “Study on manufacture and mechanical properties of kenaf binderless
board”,Timber construction in the new millennium, World Conference on Timber Engineering,
vol.2, 2002, pp.262-268.
 Mobarak F,Fahmy Y,Augustin H.1982, Binderless lignocelluloses composite from bagasse and
mechanism of self bonding. Holzforshung 1982;36:131–5
 Viswanathan, R., and Gothandapani, L., 1999. Pressure density relationships and stress
relaxation characteristics of coirpith". Journal of Agricultural Engineering Research, 73
,pp.217-225.
 Widyorini R, XuJ, Watanabe T, Kawai S. 2005, Chemical changes in steam-pressed kenaf core
binderless particleboard. J Wood Sci 2005;51:26–32.
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31. Question?????
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