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6500 Die Bonder
Precision Assembly Solutions
Precision Eutectic Die Bonder
6500 Die Bonder
The right Die Bonder could determine
the future of your business
© 2012 Palomar Technologies, Inc. 2www.palomartechnologies.com
6500 Die Bonder
• Versatility
• Flexible Work Area
• Microsoft Windows
• Multiple Configurations
• Worldwide Technical
Support
• Contract Assembly
• Cost-Optimization
• High Reliability
3© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
6500 Die Bonder
• +/- 1.5 micron (3 sigma) Post-Eutectic
Accuracy
• High Accuracy Pick and Place <7 Seconds
• < +/- 0.1 Degree Post-Placement Rotation
• <10 grams Touch Force, +/- 1 g (3 sigma)
• 6 Position Tool Turret
• Programmable Eutectic Pulse-Heating
• Compact (<24 ft2 Footprint)
System Capabilities:
© 2012 Palomar Technologies, Inc. 4www.palomartechnologies.com
Ultra Fine-Pitch Hybrid Modules
Data Storage
Flip Chip on Glass
MEMS components
High Frequency RF Modules
VCSEL Modules
P-Side Down Laser Attachment
6500 Die Bonder Processes:
© 2012 Palomar Technologies, Inc. 5www.palomartechnologies.com
High
Speed
Linear
Motors
6 tool Bi-
Directional
turret
Compact
Footprint
Large
Work Area
Precision
Eutectic
Control
Data
Mining and
RAM
Statistics
DIFFERENTIATING FEATURES
© 2012 Palomar Technologies, Inc. 6www.palomartechnologies.com
Key Features
Advantage:
All pick tools
needed are
changed ‘on the
fly’. No need to
dock/undock.
Benefit:
Faster
Throughput.
© 2012 Palomar Technologies, Inc. 7www.palomartechnologies.com
Key Features
System fits
within 4x4
foot area
Reduced
clean room
cost
Up to twice the UPH in ½
the linear dimensions !
“A”
“C”
“D”
© 2012 Palomar Technologies, Inc. 8www.palomartechnologies.com
Key Features
Advantage:
Large 6x12
inch work area.
No need to
purchase
additional
pick/place
heads.
Benefit:
Reduced
system cost.
© 2012 Palomar Technologies, Inc. 9www.palomartechnologies.com
Key Features
Advantage:
Rapid Cycle Times on a
frictionless surface.
Benefit:
Higher UPH, less
maintenance, better Cost
of Ownership (COO)
© 2012 Palomar Technologies, Inc. 10www.palomartechnologies.com
Key Features
Advantage:
Precise control
and process
tracking of
temperature
profiles within 2
deg. C.
Benefit:
Higher Yield,
reduced
development
time.
© 2012 Palomar Technologies, Inc. 11www.palomartechnologies.com
Key Features
Advantage:
Automated
tracking of
placement and
Reliability,
Availablility, and
Maintainability
(RAM) statistics.
Benefit: Higher Yield.
© 2012 Palomar Technologies, Inc. 12www.palomartechnologies.com
Key Features
Advantage:
Multiple placement
algorithms using
advanced COGNEX
vision systems
Benefit:
Higher Accuracy,
Higher Yield
© 2012 Palomar Technologies, Inc. 13www.palomartechnologies.com
Automated Assembly Lines
Palomar specializes in building
customized automated packaging
assembly lines fully integrating:
1) Ultra high accuracy die and wire
bonders
2) Customized stages and tooling for
complex components
3) Fluid dispensers
4) Die ejectors
5) Wafer and magazine handlers
6) Upstream and downstream auer
boat conveyors
7) An array of test and measurement
equipment
8) Computerized Paperless
Manufacturing Infrastructure that
does data mapping and enables the
user to solve problems quickly,
closing the feedback loop and
cutting cost
9) For factories overseas or away from
management, remote access to
bonders can be built. This enables
management to monitor bonders
and create work order flow tags for
on-site engineers, operators and
technicians
Ultra high accuracy pick and place line for LED print head assembly
Seamless production, improving yield and increasing throughput
6500 Die
Bonder
Die Ejector
Fluid Dispenser
Inspector
Mag handler
© 2012 Palomar Technologies, Inc. 14www.palomartechnologies.com
Automated Assembly Lines
LED Print head using Epoxy Die Attach
© 2012 Palomar Technologies, Inc. 15www.palomartechnologies.com
Die Ejector with Wafer Handling
• Size Range: 0.5mm - 13mm
• Thickness: 0.1mm - 1.2mm
• Die Placement Accuracy:
+/-30um die presentation to
6500 with XY vision aided
• Wafer Input: 200mm, 300mm
• Dimensions:
Length: 1.6m
Width: 1.70m
Height: 2.1m
Weight: 1500 kg
16© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Eutectic Stage
• Stage Type
– 1.0 x 1.5 cm heated area, low
thermal mass ceramic hot bar
• Ramp Times
- >100°/Sec, +/- 2° control through
cycle
• Stage Control
– Windows XP Graphical User
• Interface with up to 16 profiles per
program
17© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Performance
• Cycle Times
-1200 UPH *process and material dependent
• Post-Placement Accuracy
– 1.5 micron, 3-sigma
• Placement Force
– 10-100g, +/- 2g at 3-sigma
18© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
Applications
• P-Side Down Laser Diode Attachment
• Silicon Bench (V-Groove) Placement
• High Density RF Power Transistors
• Ultra-Fine Pitch Hybrid Assemblies
• MEMs Componets
• VCSEL Modules
• Data Storage
• High Bright/High Power LED Arrays
• Optoelectronic Packaging
• LED Printhead Attachment
19© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
6500 Die Bonder Resources
• 6500 Die Bonder data sheet
• Pulsed Heat System data sheet
• AuSi / AuSn Eutectic Die Attach Case Studies
• Micron-Level Placement Accuracy for High Aspect Ratio Die in
Printing Products
• Micron-Level Placement Accuracy for Optoelectronic
Components
• Micron-Level Placement Accuracy for Wafer Scale Packaging of
P-Side Down Lasers in Optoelectronic Components
www.palomartechnologies.com 21© 2012 Palomar Technologies, Inc.
Corporate Headquarters: +1-760-931-3600
APAC: +65-6686-3096
EMEA: +49-9131-48009-30
Palomar Technologies
For more information visit
www.palomartechnologies.com
© 2012 Palomar Technologies, Inc. 22www.palomartechnologies.com

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6500 die-bonder overview

  • 2. Precision Assembly Solutions Precision Eutectic Die Bonder 6500 Die Bonder The right Die Bonder could determine the future of your business © 2012 Palomar Technologies, Inc. 2www.palomartechnologies.com
  • 3. 6500 Die Bonder • Versatility • Flexible Work Area • Microsoft Windows • Multiple Configurations • Worldwide Technical Support • Contract Assembly • Cost-Optimization • High Reliability 3© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
  • 4. 6500 Die Bonder • +/- 1.5 micron (3 sigma) Post-Eutectic Accuracy • High Accuracy Pick and Place <7 Seconds • < +/- 0.1 Degree Post-Placement Rotation • <10 grams Touch Force, +/- 1 g (3 sigma) • 6 Position Tool Turret • Programmable Eutectic Pulse-Heating • Compact (<24 ft2 Footprint) System Capabilities: © 2012 Palomar Technologies, Inc. 4www.palomartechnologies.com
  • 5. Ultra Fine-Pitch Hybrid Modules Data Storage Flip Chip on Glass MEMS components High Frequency RF Modules VCSEL Modules P-Side Down Laser Attachment 6500 Die Bonder Processes: © 2012 Palomar Technologies, Inc. 5www.palomartechnologies.com
  • 6. High Speed Linear Motors 6 tool Bi- Directional turret Compact Footprint Large Work Area Precision Eutectic Control Data Mining and RAM Statistics DIFFERENTIATING FEATURES © 2012 Palomar Technologies, Inc. 6www.palomartechnologies.com
  • 7. Key Features Advantage: All pick tools needed are changed ‘on the fly’. No need to dock/undock. Benefit: Faster Throughput. © 2012 Palomar Technologies, Inc. 7www.palomartechnologies.com
  • 8. Key Features System fits within 4x4 foot area Reduced clean room cost Up to twice the UPH in ½ the linear dimensions ! “A” “C” “D” © 2012 Palomar Technologies, Inc. 8www.palomartechnologies.com
  • 9. Key Features Advantage: Large 6x12 inch work area. No need to purchase additional pick/place heads. Benefit: Reduced system cost. © 2012 Palomar Technologies, Inc. 9www.palomartechnologies.com
  • 10. Key Features Advantage: Rapid Cycle Times on a frictionless surface. Benefit: Higher UPH, less maintenance, better Cost of Ownership (COO) © 2012 Palomar Technologies, Inc. 10www.palomartechnologies.com
  • 11. Key Features Advantage: Precise control and process tracking of temperature profiles within 2 deg. C. Benefit: Higher Yield, reduced development time. © 2012 Palomar Technologies, Inc. 11www.palomartechnologies.com
  • 12. Key Features Advantage: Automated tracking of placement and Reliability, Availablility, and Maintainability (RAM) statistics. Benefit: Higher Yield. © 2012 Palomar Technologies, Inc. 12www.palomartechnologies.com
  • 13. Key Features Advantage: Multiple placement algorithms using advanced COGNEX vision systems Benefit: Higher Accuracy, Higher Yield © 2012 Palomar Technologies, Inc. 13www.palomartechnologies.com
  • 14. Automated Assembly Lines Palomar specializes in building customized automated packaging assembly lines fully integrating: 1) Ultra high accuracy die and wire bonders 2) Customized stages and tooling for complex components 3) Fluid dispensers 4) Die ejectors 5) Wafer and magazine handlers 6) Upstream and downstream auer boat conveyors 7) An array of test and measurement equipment 8) Computerized Paperless Manufacturing Infrastructure that does data mapping and enables the user to solve problems quickly, closing the feedback loop and cutting cost 9) For factories overseas or away from management, remote access to bonders can be built. This enables management to monitor bonders and create work order flow tags for on-site engineers, operators and technicians Ultra high accuracy pick and place line for LED print head assembly Seamless production, improving yield and increasing throughput 6500 Die Bonder Die Ejector Fluid Dispenser Inspector Mag handler © 2012 Palomar Technologies, Inc. 14www.palomartechnologies.com
  • 15. Automated Assembly Lines LED Print head using Epoxy Die Attach © 2012 Palomar Technologies, Inc. 15www.palomartechnologies.com
  • 16. Die Ejector with Wafer Handling • Size Range: 0.5mm - 13mm • Thickness: 0.1mm - 1.2mm • Die Placement Accuracy: +/-30um die presentation to 6500 with XY vision aided • Wafer Input: 200mm, 300mm • Dimensions: Length: 1.6m Width: 1.70m Height: 2.1m Weight: 1500 kg 16© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
  • 17. Eutectic Stage • Stage Type – 1.0 x 1.5 cm heated area, low thermal mass ceramic hot bar • Ramp Times - >100°/Sec, +/- 2° control through cycle • Stage Control – Windows XP Graphical User • Interface with up to 16 profiles per program 17© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
  • 18. Performance • Cycle Times -1200 UPH *process and material dependent • Post-Placement Accuracy – 1.5 micron, 3-sigma • Placement Force – 10-100g, +/- 2g at 3-sigma 18© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
  • 19. Applications • P-Side Down Laser Diode Attachment • Silicon Bench (V-Groove) Placement • High Density RF Power Transistors • Ultra-Fine Pitch Hybrid Assemblies • MEMs Componets • VCSEL Modules • Data Storage • High Bright/High Power LED Arrays • Optoelectronic Packaging • LED Printhead Attachment 19© 2012 Palomar Technologies, Inc. www.palomartechnologies.com
  • 20. 6500 Die Bonder Resources • 6500 Die Bonder data sheet • Pulsed Heat System data sheet • AuSi / AuSn Eutectic Die Attach Case Studies • Micron-Level Placement Accuracy for High Aspect Ratio Die in Printing Products • Micron-Level Placement Accuracy for Optoelectronic Components • Micron-Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Components www.palomartechnologies.com 21© 2012 Palomar Technologies, Inc.
  • 21. Corporate Headquarters: +1-760-931-3600 APAC: +65-6686-3096 EMEA: +49-9131-48009-30 Palomar Technologies For more information visit www.palomartechnologies.com © 2012 Palomar Technologies, Inc. 22www.palomartechnologies.com