8000i wire-bonder overview

8000i Wire Bonder
& Ball (Stud) Bumper
© Palomar Technologies, Inc. www.palomartechnologies.com 1

8000i Die Bonder
At a Glance
• Fully automatic, thermosonic, high-speed bumper,
ball bonder
• Unique bond-head motion patented dual Z-axis with
linear and rotary motion, allowing for formation of
precise gold ball bumps by repeatable, smooth and
tailless shearing of the wire
• Consistent formation of flat <20 micron high bumps,
eliminating the need for a secondary coining process
• Comes equipped with Intelligent Interactive
Graphical Interface™ (i2Gi™), a revolutionary
software capability for modern wire bonding
www.palomartechnologies.com 2© Palomar Technologies, Inc.

8000i Die Bonder
At a Glance
• Cycle Time
0.125 sec/wire; 0.077
sec/bump
• Placement Accuracy
+/- 2.5 micron, 3 sigma
• Versatility
Wire bonder and ball
bumper; deep access
with capillary of 11.10-
19.05mm (0.437 inch to
0.75 inch); in-line and
magazine handlers; tall
multi-level bonding
>12.7mm (>0.5 inch)
• Large Work Area
304.8 x 152.4mm (12 x 6
inch)

8000i: Meeting the Unfilled Need
Conventional
Hybrid Ball
Bonders
8000i Wire
Bonder
Semiconductor
Ball Bonders
Semiconductor Applications
Large
Small
Low High
Speed (Net UPH)
Work
Area
Hybrid & Wafer Applications
Unfilled
Market
Need

Large Work Area is More Flexible
2”
2”
8000i
Conventional semi-
conductor bonder
Large area ideal for:
• Large parts
• Multiple parts
• Wafers
• Low wire or bump counts
12”
6”

High Yield
High Throughput
Low Cost of Ownership
Market Requirement 8000i
Advantage
• Wire Bond & Ball Bump
Advanced Process Capability
√
• High Speed (uph)
√
• Large Work Area
√
• Deep Access To 20mm (Z Stroke)
√
• Fully Automated With In-situ, Closed Loop
Process Monitoring And Control Tools
√
• High Reliability
√
• Small Footprint
√
Most Advanced Large Area Ball Bonder

Key Features
• True Orthogonal Bonding
– Consistently produces high quality
bonds at varying surface heights
over 20mm range
• Deep Access Capability
– Enables wire placement into deep
electronic packages
• Semiconductor Wire Bonder
– Hybrid wire bonder integrated into
one compact, flexible unit
• Tailless Bump Mode
– Designed specifically for flip-chip
applications. It allows the formation
of bumps with a height consistency
of +/- 2 microns, 3 sigma

Key Features
• SMEMA Compatible
– Compact design promotes efficient clean
room layout in stand-alone installation or
integrated into a full line; innovative
handling systems eliminate indexing to
create non-stop bonding (zero-wait state)
• Cognex On-Screen Video
– Allows point and click selection of bond
placement slides
• Large Bonding Area
– 304.8 x 152.4mm (12 x 6 inch)
X-Y bond area minimizes loading time and
improves throughput time

Key Features
• i2Gi
 Supports advanced wire bond control
through three key critical command
tools, which work in concert to provide
a dynamic and intuitive user
experience
• Bond Data MinerTM
 Monitors machine and process trends
providing yields and predictive
maintenance
• Automated Assembly
 Quality components result in
extremely high yields and repeatable,
predictable electrical performance

Adaptive Bond Deformation™
• Tool enables direct and uniform
control of ball deformation
reducing process development
time, while increasing
productivity and reliability.

Applications
• Versatile, large work area and high reliability are
hallmarks of the 8000i Wire Bonder
• Improves production yields and eliminates sources
of variation in your microelectronic packaging
processes
• Industry-best finished bond height consistency of 2
microns is combined with +/- 2.5 micron, 3 sigma
placement accuracy

Common Applications*
• Large Complex Hybrids
• System in Packages (SiPs)
• Multi-chip Modules (MCMs)
• Automotive Assemblies
• LEDS with Running Stitch
• Disk Drive Assemblies
• Flex Circuits
• High-Bright/High-Power LED arrays
• Optoelectronic Packaging
• Chip on Board (COB)
• Solar Concentrator Packaging
• Specialty Lead Frames
• Fine Pitch Devices *partial list

• One work stage bonds while other is loaded
– Part index time reduced or eliminated
• Bonder accepts automated & manual handlers
– In-line, push-pull, dual lane
– Auer Boats
Push-Pull Handler

Patented 8000i Dual-Axis Bondhead
ZL
ZR
•ZL & ZR optimize delivery of force & ultrasonics
-Repeatable ball deformation
-Improved shear strength and loop shape
•Enables formation of one-step flat-top bump

Dual-Axis Essential for Deep Access
• Dual access enables 20mm
(0.8”) Z travel
– For wire placement into deep
electronic packages
ZR Only
(Non-Orthogonal)
ZR + ZL
(Orthogonal)
Competition
8000

Wire Bonding & Ball Bumping

Excellent Loop & Pitch
Control
Long low loops
Fine pitch
Stitch
impression
Fine pitch
mimicking
ribbon
bonding
Standard ball
& stitch

Enhanced Loop Mode 2
Soft Knee
Sharp Knee
R (XY)
Z
X
Y R
θxy
ØAL
Loop Height um (mil) 516 (20.3)
Loop Length mm (mil) 3.85 (150)
Flat Length mm (mil) 1.50 (58.4)
Die Height um (mil)
Wire Dia um (mil) 25 (1.0)

Enhanced Loop Mode 2 (Flash)
Die Height um
(mil)
381 (15)
Pad Pitch um
(mil)
90 (3.54)
Wire Dia um
(mil)
32 (1.3)
Loop Height um (mil) 305 (12)
Flat Length mm (mil) .75 (19)
Short Wire
Loop Height um (mil) 305 (12)
Flat Length mm (mil) 1.5 (39)
Long Wire

Enhanced Loop Mode 2 (2 Level SoS)

Improved Looping Control
• 400 mils long proven in many applications
• 600 mils in development with new wire feed

Faster & Easier Loop Mode Development
• Especially helpful for long wires (>2mm)
–Important for fine pitch
• No need for parametric adjustment of
individual wires

Standard Ball and Wire

Chain Bonding with Security Bond
Chain BondSecurity Bond

Stitch-Stitch “Chain Bonding”

Stand-Off Stitch (SoS) & Reverse Bonding

Die to Die with SoS Bonding

Wedge Bond Emulation

Complex Solutions

LED Wire Bond Development

Dynamic Force Control
• Two step force control
– Typical: Low contact force, followed by a
higher bond force
– Safely bonds sensitive parts
– Increases shear strength, increases yield,
avoids cracking & cratering
Soft-
touch
Impact
Force
Increased
Bond
Force
No Die Cracks© Palomar Technologies, Inc. www.palomartechnologies.com 31

www.palomartechnologies.com
Full Range of Custom Bumps
Shapes
Turret bump
Triple bump
Double bump
Pointed bump Tailless bump
•For epoxy dipping
(break through top skin)
•Flat on top to provide
large contact area for wafer
probe testing
•Extra tip for un-even (non-
uniform) flip chip bonding
•Extra-high bump for
epoxy dipping
•Test points where
extreme height is required
© Palomar Technologies, Inc. 32

8000i Advantage: One-Step Planar BumpTM
Competitor
“Beard”
Step 1: Ball bump
Step 2: Coining
Not planar
2nd step required to produce flat, planar bump

Best Planarity in the Industry
• More consistent process
• Higher yield
• Able to produce flat
bumps <20μ in height
Planarity ±2μ

Process Tool Kit
• Windows platform
• Bond Data Miner
• Adaptive Bond Deformation
• Process Control Software
• RAM Statistics
• Intuitive User Interface

Bond Data Miner Creates “Smart” Bonder
• Three levels of capability through Bond Data Miner
software system, Process Control, and Adaptive Bond
Deformation
– Level 1: Data collection, archiving & analysis
• Traceability data
– Level 2: Process monitoring
• Set upper & lower control limits
– Level 3: Closed-loop automatic process control
(“Smart” system)
• Links together system and bonding parameters
• Proven improvement of yield, process development
time, predictive maintenance, and repair time

The Ultimate Analytical Tool
• Bond Data Miner collects electrical and
robotic data from extensive array of
sensors
– Analyzes, time-stamps & archives data
– Provides clear picture of process, machine
performance and stability
– Allows traceability of bond parameters &
system state for individual bonds
– Data can be viewed across multiple systems
and platforms, including third-party equipment
• Powerful tool to improve yield & utilization

Unparalled Process Control
RAM Statistics
Fiducial Tracking Adaptive Bond Deformation
Bond Data Miner (BDM)
Data Acquisition & Analysis Tool
Third-Party Equipment
BDM
Calibration & Validation Data
Factory BDM
Bond Deformation

RAM (Repair and Maintenance) Statistics
• Tracks uptime statistics per SEMI E10-0701 & E58-0301
• Tracks accumulated bond statistics

Process Control Software
• “Supervises” standard
or adaptive bond
deformation process
• Collects real-time
bonded ball & stitch
deformation data
• User can set upper &
lower deformation
control limits
– Bonder stops bonding if
limits exceeded
– Prevents yield loss

Uniform Ball Bump Deformation Test
Deformation versus Bump
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
0 5 10 15 20 25 30 35
Bump
Deformation[um]
Shear Force (gram)
0
50
100
150
200
250
0 5 10 15 20 25 30 35
Deformation 3S
ABD ON 0.5 um
ABD OFF 4.0 um
* Micrometers 3sigma
• Deformation variance
>8X better with ABD
• Shear force not
significantly affected
(Process intentionally set for large variation for ABD OFF)

Uniform Ball Bump Deformation

Adaptive Bond DeformationTM
(ABD)
Mashed Ball Height (um)
70.0
72.0
74.0
76.0
78.0
80.0
82.0
84.0
86.0
0 5 10 15 20 25 30 35
Series2
Series3
• Software feature option
• Enables direct, uniform control of ball deformation
(height and/or diameter)
w/o ABD
w/ ABD

ABD: Automatic Process Control
• Uses closed-loop, in-situ process
control
-Allows user to define ball/bump height
or diameter; bonder optimizes
parameters automatically
• Uniform bump size regardless of
variations lot-to-lot, in material, and in
environment

ABD: Field-Proven to Improve Yield
• Customer A: From 95% to
≥99.5% w/ ABD (5
machines, bumping app.)
• Customer B: Triple-bump
stack not possible without
ABD
• Only bonder w/ ABD
capability

Intelligent Interactive Graphical
Interface (i2Gi)

Common Configurations for Automated Production
Automated production line with customizable
magazine handlers and hotrail conveyers. Ideal
for high-mix, complex automated production.
Ergonomic kit that
supports both traditional
keyboard and track-ball
or a large glove-touch
compatible touch
screen (optional). Ideal
for complex
programming and
intuitive control of part
builds.
Standard for reduced
footprint and automated
production scalability.
Ideal for complex hybrid
device packaging with
flexibility to meet
changing production
needs.

Summary
• Superior large area ball
bonder
– Wire bonding
– Ball bumping
• Industry’s most advanced
hardware & software tools
for yield enhancement
– “Smart” bonder

8000i Wire Bonder Resources
• 8000i Wire Bonder data sheet
• Improved Wire Bond Reliability with Stand-Off Stitch
Chain Wire Bonding of a RF SOE Package Using a
Gold Ball Bonder
• Multipurpose Wire Bonding – Wires, Bumps and
Combination Interconnects Odd Form Factor
Packaging
• The Great Debate: Ball vs. Wedge

Corporate Headquarters: +1-760-931-3600
APAC: +65-6686-3096
EMEA: +49-9131-48009-30
Palomar Technologies
For more information visit
www.palomartechnologies.com

8000i wire-bonder overview

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8000i wire-bonder overview