The document discusses new technologies for electrical sheet stacks that can help overcome challenges in mechatronics and miniaturization. It outlines trends toward smaller, more efficient electric motors and potential markets in medical devices and industrial machinery. The company presents several solutions using thinner materials, advanced coatings, precision manufacturing, and bonding techniques to enable higher performance motors through increased efficiency, torque, speed and noise reduction. Real-life examples are provided of miniaturized motors and components produced using these new technologies.

1. Overcoming the challenges in
Mechatronics and Miniaturisation
New technologies for electrical sheet stacks
Thomas Stäuble, SWD AG, June 2018
19.6.2018, 15:40-16:20h

2. Mechatronics and miniaturisation
Agenda
 Challenges & Trends
 Markets & Applications
 Solutions & Concepts
 Outlook

3. Mechatronics and miniaturisation
Who we are…
„We are your partner for your next
generation of electrical motors. As a technology
leader we develop electrical sheet stacks
which ensure your competitive advantage. We support
from your idea to the efficient serial production
and produce the stacks in each phase.“

4. Mechatronics and miniaturisation
Challenges and Trends
 Smaller size
 Higher efficiency
 Less losses
 Lower heat dissipation
 Higher performance
 Higher speed
 More torque
 Less vibrations and noise
 Higher cleanliness
► We need to re-think one of the most important
part of our electric motors – the lamination stack

5. Mechatronics and miniaturisation
Markets and applications
 Medtech
 Small/micro pumps for liquids (blood, medicals)
 Tools for dentists/surgeon (high speed, high torque, low temperature)
 Active implants (high efficiency, lowest temperature)
 ……
 Mechatronics
 Direct drives in machines (high speed, high torque, small size,…)
 Drives in collaborative robots
 …

6. Solutions and concepts
Main areas of improvements
 New materials and coatings, requirement specific coatings
 Highest precision punching and stacking to achieve new levels of precision
 Smallest geometries, combined with high stability
 Punching and stacking with many lanes without harming process capability
(and increasing productivity)
► Much more than you expect is possible already today

7. Solutions and concepts
Performance due to thinner material
 Thinner material from 0.35mm to NO20, NO15, NO10 or thinner
 Needs highest precision punching, exact and small clearances
 New and higher precision tooling concepts (e.g. micro alignment of punch and die, reduction of
tolerance accumulation)
 New stacking technologies as bonding (interlocking becomes more difficult), laser welding could
be an option

8. Solutions and concepts
Performance due to better material
 New materials with better magnetic properties
 Materials as Vacoflux, JNEX, a.s.o.
 Challenges in punching:
 Very brittle (JNEX supercore) to punch
 Material defects due to punching (Vacoflux 48),
annealing required
 Completely new punching concepts and stacking
concepts required and in concept studies at SWD AG
 Completely new processes Source: Vaccumschmelze GmbH & Co KG
► A new world to conquer
Electrical sheet 1.5T vs 2.3T
CoFe at working range

9. Solutions and concepts
Performance due to insulation
 Better electrical insulation between single sheets
 Less short cuts to lower losses
 Possible to have bonding varnish coating with 100% insulation between each sheet (!)
 Customer specific coatings possible (type, thickness, a.s.o.)
 In general: bonding varnish (Backlack) with good insulation between sheets (depending
on application, thickness, lot)

10. Solutions and concepts
Performance due to design freedom
 Better guidance of magnetism
 Smaller geometries, Radius/edges of <0.1mm, interconnections of <0.2mm
 Complex geometries, different combination of sheets, rotation of each sheet
 Highest precision punching, exact and small clearances, fine punching
 Combination of new punching and stacking technologies with complete, flat
interconnection of single sheets (bonding) opens new horizons
NO20
0.25mm

11. Solutions and concepts
Performance due to precision
 Higher precision
 Smaller air gap to increase performance
 Design of singe tooth stator for better winding
 High precision single tooth for narrow OD tolerance
Flatness 0.004mm over 53mm
Perpendicularity 0.005mm

12. Solutions and concepts
Performance due to filling factor
 Higher filling factor for copper wires
 More copper or thicker wire
 Requires stronger/stiffer lamination stacks and rounded edges (smaller end laminations,
machining, chamfering)
 Bonding varnish (Backlack) stacks are very stiff and can be machined
Radius shaping

13. Solutions and concepts
Performance due to silence
 Less vibration and noise
 Full area interconnection of single sheets reduces noise and vibration
 Special insulation varnishes can reduce noise
 Bonding varnish (Backlack) is a good solution for the issue

14. Solutions and concepts
Performance due to stiffness
 Higher stiffness of bonded stacks
 Lamination stacks becomes very stable, housing is not so important any more
 Winding of lamination stack or single teeth becomes more easy due to stiff stacks (e.g.
higher winding speed)
 Handling and atomisation becomes easier
 Packaging as bulk parts is possible

15. Solutions and concepts
Cleanliness
 Better cleanliness
 Parts can be cleaned (trovalisation) or other processes
 Vacuum packaging

16. Solutions and concepts
Volume packaging
 Packaging as for SMD electronic parts
 Parts can be produced in many lanes
 Cleaning (e.g. de-ionized air) and packaging of each part into blisters with sealing

17. Solutions and concepts
Application of Backlack
Source: C.D. Wälzholz
State A = liquid
State B = active
State C = passive

18. Bonding process controlled by: F, s, Q, t
Lose sheets
Measurement of
lose sheets (cold
stack length)
Heating up of
stack
Varnish reaction Cooling down
Lengthofstack
Solutions and concepts
Curing of Backlack
F1
F2 F3 F4

19. Solutions and concepts
Sample production
 Sample production
 Small, manually operated, high precision punching tools
 Laser cutting of single sheets, stacking and bonding
 Wire eroding of bonded lamination stacks

20. Solutions and concepts
Serial production
 Serial production
 Special design of tools and processes, combination of punching and stacking process
 Fast bonding process based on BPS® Backpaktiersystem® technology (curing time
between 5-15‘), 100% stable, no squeeze outs a.s.o.
 Fully synchronised processes, high output up to fully automated production lines
 Efficient production due to high output

21. Mechatronics and miniaturisation
Real life examples
 Blood pump in NO20
 Micro teeth for robot drives
 Micro teeth for medical applications (disclosed)
 New small motors for different applications, different designs
 …..
► Visit our booth to see examples

22. Mechatronics and miniaturisation
Summary
 A whole new world opens
 Share your vision on designs, concepts, requirements with us
 Let‘s bring the new possibilities into products for your customers

23. Benefits of new technologies
Summary
Best property
Process stable

24. Mechatronics and miniaturisation
A new world opens
Q&A
Visit us: hall 1.2, F24
www.swd-technology.com

25. SWD AG Stator- und Rotortechnik
Kaisermatt 3
CH-5026 Densbüren
T +41 (0)62 867 92 18
F +41 (0)62 867 92 15
www.swdag.ch
info@swdag.ch
"Your challenge is our drive!"
Visit us: hall 1.2, F24