Basic CPU presentation

1. Lesson 5a
Unit 2: Computer Systems

2. Learning Objectives
• Differentiate Intel and AMD CPU models
• Understand technologies for improving
performance, such as architecture, multitasking,
multiprocessing, multi-core, and cache
• Describe other CPU features such as clock speed,
overclocking, power management, and VT
• Describe characteristics and CPU compatibility of
processor sockets
• Identify the components used for cooling (heat
sinks and fans and liquid cooling systems)

3. Overview of CPUs
• Intel CPU Ranges
– Core
– Pentium
– Celeron
– Atom
– Xeon
• ARM
• AMD CPU Ranges
– Athlon
– Phenom
– Sempron
– Turion
– AMD Fusion (A series)
– AMD F
– Opteron

4. Manufacturing Process
• Doping process to create
millions of transistors on
silicon wafer
• Feature size measured in
microns or nanometers
• More features being added
on-die

5. CPU Architectures
• Fetch
– Control Unit fetches the next instruction in sequence from
system memory to the pipeline
• Decode
– The control unit decodes each instruction in turn and...
• Execute
– ...either executes it itself or passes it to the Arithmetic
Logic Unit (ALU) or Floating Point Unit (FPU) for execution
• Writeback
– The result of the executed instruction is written back to a
register or to system memory
– A register is a temporary storage area available to the
different units within the CPU

6. HyperThreading
• Multitasking means executing multiple
applications (threads)
• Superscalar pipelining used to
manage instruction throughput
• Simultaneous Multithreading /
HyperThreading execute multiple
instructions per clock cycle
• OS thinks it is working with 2 (or
more) CPUs
• HyperThreading used on P4, then
dropped, but is now being
reintroduced on Core 2 and Core i7
chips
• Microcode improvements
– MMX
– 3D-Now!
– SSE / SSE2 / SSE3 / SSE4

7. Multiprocessing and Multicore
• Multiprocessing makes
multiple CPUs available
– Utilize multiple CPUs with
separate sockets (SMP)
– Multi-core CPUs (CMP)
• SMP support depends on
OS and version
Cores Intel AMD
2 Core Duo, Core 2
Duo, Core i3, i5,
Xeon, Celeron,
Pentium D
X2 models of Athlon 64,
Sempron, Turion 64,
Phenom, Phenom II, and
Opteron
3 X3 models of Athlon II,
Phenom, Phenom II
4 Core 2 Quad, Core
i5, i7, Xeon
X4 models of Athlon II,
Phenom, Phenom II, and
Opteron
6 Opteron, Phenom II
8+ Xeon Opteron

8. Other Architectural Features
• Instruction sets (32-bit
versus 64-bit)
– x86 / IA-32 / x86-32
– IA-64
– AMD64 / EM64T
• Cache
• Addressing

9. Other CPU Features
• Clock speed
• Power management
(throttling)
• Virtualization
• Malware protection
(XD / NX)
• Integrated GPU

10. Intel Sockets and Slots
Designation Type
Release
Date
Supported
CPU Ranges
Supported
Memory
Socket T
(775 pins)
LGA 2004 Later
Pentium 4s
and Core 2
DDR2/DDR3
Socket B
(1366 pins)
LGA 2008 Core i7
(Nehalem)
DDR3 (triple-
channel)
Socket H
(1156 pins)
LGA 2009 Core i3/5/7
(Nehalem)
DDR3 (dual-
channel)
Socket H2
(1155 pins)
LGA 2011 Core i3/5/7
(Sandy
Bridge / Ivy
Bridge)
DDR3 (dual-
channel)

11. AMD Sockets
Designation Type
Release
Date
Supported CPU
Ranges
Supported
Memory
Socket 940 (940
pins)
PGA 2003 Athlon 64 FX DDR (Dual-
channel)
Socket AM2
(940 pins)
PGA 2006 Athlon 64 (FX, X2) /
Phenom Xx
DDR2 (Dual-
channel)
Socket AM2+
(940 pins)
PGA 2007
Socket F (1207
pins)
LGA 2006 Athlon 64 FX DDR2 (Dual-
channel)
Socket AM3
(941 pins)
PGA 2009 Athlon II / Phenom II DDR2/DDR3
(Dual-channel)
Socket AM3+
(942 pins)
PGA 2011
Socket FM1
(905 pins)
PGA 2011 A series / Athlon II DDR3 (Dual-
channel)

12. Cooling Systems
• Active versus
passive
• Heatsink / thermal
compound
• Fan
– Power connectors
– Shrouds / baffles
• Heat pipe / spreader
• Liquid cooling

13. Removing a CPU
• Heatsink / fan / cooling
device
• Remove CPU
– ZIF socket
– Slot
– LGA
• Motherboard
– Locate and remove screws
– Slide motherboard from case

14. Installing or Upgrading a CPU
• Check compatibility
• Locate pin 1
– Bevel
– White dot
– Spur
– Printed mark
• Insert CPU
• Replace heatsink/fan
assembly

15. Review
• Differentiate Intel and AMD CPU models
• Understand technologies for improving
performance, such as architecture, multitasking,
multiprocessing, multi-core, and cache
• Describe other CPU features such as clock speed,
overclocking, power management, and VT
• Describe characteristics and CPU compatibility of
processor sockets
• Identify the components used for cooling (heat
sinks and fans and liquid cooling systems)