1. Chang-Hsing Tsai (Samuel Tsai)
No.247, Yong Sheng St., Yong Kang Dist.
Tainan City, Taiwan 71043
Cell Phone: 886-988-618-681
E-mail: tsaichanghsing@gmail.com
Name Samuel Tsai (蔡長興)
Date of Birth March 8, 1971
Martial Status Done
Education National Cheng Kung University, Tainan, Taiwan, 1994 - 1996
Master degree in Chemical Engineering
National Cheng Kung University, Tainan, Taiwan, 1990- 1994
Bachelor degree in Chemical Engineering
Languages English, Mandarin, Taiwanese
Skill Semiconductor CMP/Etch, Polymerization, MS office, Car driving
Certificate
 Certificate of VLSI Process & Technology on Dec 6, 2001. Issued by National
Cheng-Kung University
 Certificate of Centura 5200 System Platform Functional Description on Apr. 13,
2000. Issued by Applied Materials Taiwan
 Certificate of Centura 5200 System DPS Chambers Functional Description on
Apr. 21, 2000. Issued by Applied Materials Taiwan
 Certificate of P5000 Centura Optical Emission Endpoint Training on Feb. 6, 2001.
Issued by Applied Materials Taiwan
 Certificate of Mirra CMP System Preventive Maintenance on Oct. 11, 2001.
Issued by Applied Materials Taiwan
 Certificate of Compass on June 21, 2002. Issued by Applied Materials Taiwan
 Certificate of SEMVISION on Apr. 23, 2002. Issued by Applied Materials Taiwan
Training

2. AMAT Etch platform training
AMAT CMP platform training
ROHM HAAS CMP pad/slurry training
Honor/Award
 2011 TSMC supplier Recognition Award for Dow Chemical
 Applied Material Corporate Quality Recognition Award for Wafer Arcing
Improvement (FY01Q4)
 Applied Material Corporate Quality Recognition Award for Buffer tool Process
Qualifications (FY07Q1)
 Applied Material Outstanding Employee ( FY02 Q1 and FY06 Q4)
 Customer Award for Entek System Penetration
 Customer Award for Buffer tool Improvement
 Customer Thank You letter by F6 and F14.
Specialty
 Support 1st
300mm pilot line ramping up @TSMC F14 in 2004.
 Pi-run 1st
450mm CMP tool (Sycamore)@AMAT in SCLA.
 Position 1st
Dow slurry K1730 into TSMC F6 production line, new business win for
>10M/year.
Work Experience
Feb 08 – Feb 16 Rohm & Haas (Dow Chemical after Apr. 09)
Sr. FSE leader (技術副理)
Responsibilities:
 Tainan site FSE team coordination.
 New Product promotion and penetration.
 Market trend & competitor monitoring.
 Customer complaint handling.
 Maintain customer intimacy.
 Cross link with internal quality team for customer request.
Achievements:
 Meet Customer requirement for project/request and issue.
- Receive TSMC best supplier award in 2011.
- Receive TSMC best service recognition in 2015.
- First slurry project penetration with TSMC.
- Long pad life extension for customer cost incentive
Reason for leaving: due to personal health consideration
Mar 00 – Feb 08 Applied Materials
Etch senior engineer, Mar 00 ~ Mar 02
CMP specialist, Mar 02 ~ Feb 08
Responsibilities:
♦ Entek system Project Management

3. Responsible to: Entek system (eMax) process penetration.
♦ Super e Process Installation and Tuning
Responsible to: Passivation layer wafer arcing issue
improvement.
♦ eMax Process Installation and Tuning
Responsible to: Process Tuning & Troubleshooting of FSG and 2
in 1 layers.
♦ 300mm eMAX Installation and Tuning
Responsible to: First 300mm eMAX tool start up and process
development in customer site.
♦ Buffer tool Project Management, new process development
Responsible to: WiW NU% and WPH improvement.
♦ Low cost Project Management
Responsible to: Well co-work with customer to implement low
cost package.
♦ P3CLC Project Management
Responsible to: WTW NU% performance improvement.
Reason for leaving: Rohm Hass offer higher pay/incentive for position change
Aug 98 – Oct 99 R&D Department, Cyntec Co., Ltd., Hsin-Chu, Taiwan
Process engineer
Responsibilities:
♦Process Engineer for Thick Film RC Network Printing Process
(1/99 to 10/99)
Responsible to (1) Layout Design for Bottom Layer Metal,
Dielectric Layer, Top Layer Metal, Resistor Layer, Protective
Layer, and Marking Layer; (2) Stencil Printing Process for each
layer.
♦ Process Engineer for Thin Film sensor (08/98 to 12/98)
Responsible to Simens product yield improvement.
Reason for leaving: Personal plan and try to move back to Tainan
Previous Salary monthly salary x 14 months fixed + year-end bonus: 2~4 months +
company car, etc
Expected Salary Open for discussion
Availability Open for discussion
Profile
Samuel Tsai, Born in 03.08.1971, Peikang, Yunlin, Taiwan.
I have 2 sisters and got married already, two daughters for senior & junior

4. high school respectively. Graduated in NCKU chemical engineering for
master degree, major in polymer process especially in C60.
First job for my career was process engineer who served in Cyntec Co.
Ltd since I completed my military service in Jun 1998. Cyntec produce
sensors and resistors in electronic field. The most important event for me in
Cyntec was to develop capacitor. Although it is not still put in production line
before I leave Cyntec. It still offers me a clear picture for the concept of
R&D.
Follow up I were worked in Applied Materials Taiwan since Year 2000.
I dedicated on Etch and CMP product for 2 and 6 years respectively. I am not
only learning a lot of customer dealing skill in Applied Materials but also gain
good customer relationship. I have experienced Oxide / Metal etcher and
CMP polisher process. By the way, English skill is a necessary tool for us to
communicate with US folks for customer related issue troubleshooting and
new process development. In Applied Materials I learned Customer dealing
skill and Project management capability.
I was working at the Dow chemical for CMP consumables (pad &
slurry) and in charge of Tainan TSMC & UMC account. Over 8 years, I have
learned lots of pre-sales skill and earned customer’s recognition. Technical
service is my primary role to consult customer for new product engagement
and position Dow’s leadership in CMP field. Totally around 12 years CMP
experiences including Dow (consumables) and AMAT (platform) for
technical service function.
Around one year ago I just got left Dow chemical due to recover my
health, now I’m starting to seek a job opportunity to come back to career
field. Wish I have the chance & pleasure to serve your company and to share
my previous working experiences in the future.
Best Regards
Samuel Tsai
12/09/2016