1. Mark Anthony R. De Jesus
Contact Information
Address : Block 04 Lot 29&30 (LOT 5), Aguila St. cor. Pipit St. Camella Homes
2E, Brgy. Putatan, Muntinlupa City 1772
Home Tel. No. : (+632) 519-2550
Mobile No. : (63) 949-7115400
Email : markdejesus29@yahoo.com
Personal Particulars
Age : 33 years old
Date of Birth : 16 November 1982
Nationality : Filipino
Marital Status : Married
Religion : Catholic
Educational Background
Bachelor's/College Degree
Field of Study : Engineering
Major : Bachelor of Science in Electronics and Communications Engineering
Institute/University : Mapua Institute of Technology Intramuros, Manila
Graduation Date : January 2004
Achievement : Dean’s List Awardee (graduated at the top 10% of the class)
Employment History
Amkor Technology Philippines, Inc. (6 years)
Km. 22, East Service Road South Superhighway, Muntinlupa City
Nature of Business : Semiconductor Assembly
Position Title : Senior NPI Engineer – Dual, Quad, pMLF EOL
Duration : November 2015 – Present
Job Summary:
Responsible for review of applied package developmental requirements and proper execution on
the assembly of customer builds, engineering lots, qualification lots and other evaluations. Ensures
conformance of the assembly process to set specification and set guidelines, attainment of the
station’s optimum yield capacity, as well as high product quality and reliability, proper
implementation of established manufacturing processes. Identifies, modifies, recommends and
upgrades processes and their controls in order to meet set quality, yield and turn around time at
optimum cost.
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2. Accomplishments:
 Contributed to the improvement of on time delivery of engineering and qualification lots for
Dual, Quad and pMLF packages from 60% for Q4 2015 to 90% by Q2 2016
 Converted 2 qualification lots to HVM with a combined projected forecast of 300K/year
 Reduced EOL quality excursions and customer feedbacks for engineering and qualification lots
from 4 per month for Q4 2015 to 1 per month by Q2 2016
 Improved the Pre Qual Risk Assessment rate from 40% for Q4 2015 to 100% by Q1 2016
reducing the risk of assembly failures for new incoming devices
 Completed a total of 55 qualification lots
Position Title : Senior Mold Process Engineer – TSSOP, SOIC packages
Duration : April 2010 – October 2015
Main Responsibilities:
 Provides technical support and guidance on process implementation and analysis to ensure
conformance of the assembly process to set specifications
 Ensures attainment of the station’s optimum yield capacity, as well as high product quality and
reliability
 Ensures proper implementation of established manufacturing processes
 Identifies, modifies, and upgrades processes and controls in order to meet set quality, yield and
turn around time at optimum cost
 Attends to all customer issues, provides data analysis and their corrective and preventive
measures. Troubleshoots problems in manufacturing lines and responds to customer complaints
on technical matters.
 Assigned on special projects or programs to attain plant targets such as yield goals.
 Generates and reviews process documents such as specifications and work standard guides to
be used and implemented in production
 Ensures adherence to customer standards and recommends actions like stopping production
and hold shipment if necessary to contain and correct quality problems.
 Ensures quality of work to the satisfaction of customers (internal and external)
Accomplishments
 Improved mold process trapping capability by providing improved inspection backgrounds with
cost savings of $22,827 per year
 Generated a system for mold cavity bars that effectively monitors service life, accumulated shots
and utilization history
 Q1 2011 Best Employee Awardee
 2011 Best Technical Innovation Paper Awardee
 2012 Amkor Technical Symposium Presentor
 Eliminated wire defect related feedbacks of SOIC packages from 2 per month for Q1 2012 to 0 by
Q2 2012
 Reduced X-ray related feedbacks of SOIC packages from 0.48% per month for Q3 2012 to 0.17%
by Q4 2012
 Delivered 1 Technical Innovation Paper for 2013
 Consistent Extra Mile Awardee
 Advanced knowledge of transfer molding process
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3. First Sumiden Circuits Inc. (6 years)
Ampere St. cor. Main Avenue, Light Industry and Science Park 1,
Bo. Diezmo, Cabuyao Laguna
Nature of Business : Full Process Flexible Printed Circuit Manufacturer
Position Title : FOL Process Engineer
Duration : September 2009 – April 2010
Accomplishments
 Improved the defective rate of standard products from 0.49% Q3 2010 to 0.37% by Q4 2010
 Improved the yield of Nintendo product line from 4.70% to 0.50% generating a cost savings of
4KUSD per month
 Improved consumption rate of silver paste ink from 4 lots per can to 28 lots generating cost
savings of 20KUSD per month
Position Title : New Product Introduction Engineer
Duration : August 2006 – September 2009
Main Responsibilities:
 Develops new design or modifies existing product designs to meet customer requirements
 Establishes standards, specification, processes and methods for new designs, products and
service lines
 Oversees and monitors test runs conducted to determine new design reliability and adaptability
to standard processes.
 Coordinates closely with Sales and Marketing regarding product, process and material changes
to be taken and seeks approval prior to implementation.
 Defines, updates and issues procurement specifications, qualification procedures and
storage/handling requirement and procedures.
 Generates/consolidates reports in evaluation and studies conducted.
 Oversees and monitors actual production, seeks ways and means to improve process documents
status and progress.
Accomplishments
 Responsible for setting-up new processes e.g Solder Resist, Polyimide-Solder Resist, Silver Pastes
and Topcoats which opened new business ventures
 Qualified a total of 65 new products that contributed a net sales of 46.47MUSD from 2007 –
2009
Position Title : EOL Process Engineer
Duration : April 2004 – July 2006
Main Responsibilities:
 Implements processes that will cater to a particular customer needs and specifications.
 Conducts failure analysis, trouble shootings, and recommends corrective actions to maintain
specified quality levels and yield.
 Generates reports on various activities including evaluation of new or improved processes for
new products.
 Evaluates problems that arise during production run to determine causes of defects on lots and
recommends action needed to eliminate such.
 Ensures compliance to company SOPs, policies and procedures.
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4. Accomplishments
 Increased utilization of half-cut punching machines from 30% to 95%
 Increased utilization of vacuum hotpress machines from 10% to 50%
 Reduced the defective level of copper exposure defects from 0.40% to 0.10% for 12 months
generating a cost-saving of 12KUSD per month
 Certified Six Sigma Greenbelt
 Delivered 1 Six Sigma Project with cost-savings of 25KUSD per month
 Product champion on the first product with Flip Chip assembly process
Major Trainings
SIX SIGMA GREENBELT CERTIFICATION (February 2005)
POLYIMIDE SOLDER RESIST TECHNOLOGY (April 2009)
STATISTICAL BOOTCAMP (October 2010)
REVERSE FMEA (May 2014)
3X5 WHY ANALYSIS (July 2015)
8D REFORMING MINDSET (April 2016)
Character References
Elen Adame
Materials Planning and Control Section Manager
First Sumiden Circuits, Inc.
0917-500-3235
Sherwin Cosio
Production Planning and Control Section Manager
First Sumiden Circuits, Inc.
0917-512-7078
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