1. BARBRA MAE I. RAÑA
Bacoor City, Cavite, Philippines
Email: barbramaerana@yahoo.com
LinkedIn Profile: https://ph.linkedin.com/in/bmrana
SUMMARY OF QUALIFICATIONS
 Materials science engineering professional with a uniquely diversified combination of background
and experience in the areas of material and process development, material characterization and
failure analysis, project management and technology and patent research and analysis with excellent
communication, organization and time management skills, strong multi-tasking abilities, needing
little to no supervision and works well both independently and as a contributing member of the
team.
SUMMARY OF EXPERTISE
Material and Process Development Patent Research and Analysis
Materials Science Failure Analysis Patent and Technology Search
Polymer Science Design of Experiments Patent Analysis
Materials Engineering Process Development and
Improvement
Portfolio Analysis
Composite Engineering Hands-On Sample Preparation Subject Matter/Claim Chart
Formulation
Materials Analysis Hands-On Molding Equipment
Operation
Prior Art Research
Materials Characterization Quality Assurance and Control Technology Scouting/Mining
EMPLOYMENT HISTORY
Intellectual Property Engineer, Patent Search Group, Emerson Philippines: March 2014 - Present
Global engineering and technology company employing 3000 employees in the Philippines. Patent Search
Group provides technology research, patent search and analysis services to the different business units under
Emerson.
Responsibilities:
 Performs invention disclosure review and analysis, subject matter/claim chart formulation and
patentability, freedom to operate, validity and prior art searches, and patent and portfolio analysis.
Accomplishments:
 Efficiently provided patent search reports that were used in decision making of business units such
as product releases, acquisitions, and diversifications.
 Successfully evaluated using Criteria Based Decision Making and recommended the use of an
additional patent search and analytics platform for the Patent Search Group. The evaluation results
made the decision to subscribe to the platform easier and add analytics capability to the team. The
use of the additional platform contributed to the group's improvements on Quality, by utilizing the
additional database to determine prior art and Productivity, by turning several hours of manual
computation into automatic results that now can be generated within a couple of minutes.
 FY15 Patent Search Group Top Performer Awardee
Packaging Engineer (Subject Matter Expert for Mold Process), Core Development Team
Texas Instruments Philippines: January 2012 – November 2013
Global semiconductor design and manufacturing company employing about 7000 employees in two sites in
the Philippines, Clark and Baguio City. Core Development Team supports material and process development
of new products.

2. Responsibilities:
 Performed material and process risk assessment on capability and manufacturability of new
products for volume production, material and process development and validation for new products
specifically on new molding compounds, molding process and molding technology. Performed
material and process development and validation for new products specifically on new molding
compounds, molding process and molding technology. Worked with suppliers for improvement of
current materials as well as new material recommendations for new product requirements.
Identified material specifications for new materials and updated current specifications for existing
materials. Supported processing of new packages and under development packages in mold
processing.
Accomplishments:
 Successfully resolved wire sweep issue of the jrBGA packages through mold compound formulation
improvement of the existing material used for production.
 Completed mold compound selection and evaluation for fine pitch applications for both pBGA and
nFBGA packages.
 Co-authored 2 technical papers, both papers presented in 2013 Asia Packaging Conference in Taipei,
Taiwan, one of which won the Best Paper Award.
On-The-Job Trainee, Materials Science Division, Industrial Technology Development Institute
Department of Science and Technology (Philippines): August 2010 – July 2011
Responsibilities:
 Conducted reviews of literature on current projects. Fabricated composite materials using hand lay-
up process. Prepared rubber paved tiles with different formulations by compression molding using a
hydraulic press. Prepared test specimens for SEM, FTIR, mechanical and chemical resistance testing.
Conducted mechanical and chemical testing, SEM, FTIR and interpretation of the results.
Projects:
 Effect of Surface Treatment on the Mechanical Properties of Woven Abaca Reinforced Composites
(Undergraduate Thesis)
o Authored and presented the paper in front of a panel. Conducted literature review on the
project. Conducted surface treatment on the woven abaca fibers using Silane and Alkaline
solutions. Fabricated composites from unsaturated polyester and treated woven abaca fibers
using hand layup process. Prepared test specimens for SEM, FTIR and Mechanical Testing.
Conducted mechanical testing (tensile and flexural), SEM and FTIR on samples and
interpreted the results.
 Utilization of Waste Rubber Tire Crumb for Construction Application
o Prepared rubber paved tiles with different formulations by compression molding using a
hydraulic press. Prepared test specimens for tensile and chemical resistance testing.
Conducted chemical resistance test using different solutions.
Academic Coach and Office Staff (Part-time), Excel Custom Education Lab, Inc
October 2009 - January 2010
Responsibilities:
 Prepared exercises and drills for Math subjects. Prepared session tests in Chemistry. Coached Grade
7 and high school students in Basic Mathematics, Basic and Advanced Algebra, Trigonometry,
Geometry, Chemistry and Physics

3. TECHNICAL PAPERS
Fine Pitch Mold Compound Development
2013 Asia Packaging Conference (Taipei, Taiwan)
July 11 – 12, 2013
 Co-authored and presented a paper focusing on the journey for the down selection of new molding
compound for fine pitch wire bond applications. Criteria for the down selection process included
moldability, tested thru wire sweep and post mold wire clearance measurements, manufacturability,
tested thru continuous multiple shots, moisture reliability, component level reliability, extended
capability which included material and process corner runs and a single mold compound must work
on both pBGA and nFBGA packages.
0.8mil PCC ARC Rule Set Definition
2013 Asia Packaging Conference (Taipei, Taiwan)
July 11 – 12, 2013
 Co-authored a paper focusing on the definition of ARC rule set for 0.8mil PCC wire on nFBGA
packages. Deliverables included capabilities on wire length, loop height, wire length over die, wire
density and wire angle at die corners. Won 1st Prize, Best Paper/Presentation Award
Effects of Surface Treatment on the Mechanical Properties of Woven Abaca Fibers/Polyester
Composites (Thesis w/ Defense)
 Produced a new composite material using unsaturated polyester as matrix and surface treated
woven abaca fibers as reinforcements. Characterized the new material thru mechanical testing
(tensile and flexural), SEM and moisture determination.
The Manufacturing Plant of Polyol Ester Based Thermal Paste Filled with Multi-Walled Carbon
Nanotube by Therme Gluten Packaging, Inc (Plant Design Course)
 Co-authored a paper focusing on the company profile, market study, technical study, and financial
study of a new manufacturing plant.
EDUCATION AND SPECIALIZED TRAINING
Bachelor of Science in Materials Science and Engineering (Specialization in Semiconductors)
Mapua Institute of Technology, Manila
October 2011
Patent Database Trainings
 Thomson Innovation - Hide & Seek: Find Patents Meant to Stay Hidden; Optimizing Productivity with
IP Workflow Tools; Beyond Boolean: The Next Generation of Patent Search in Thomson Innovation;
Classy Searching: Classification Searching in Thomson Innovation; IP Bullying: The Potential Impact
of the Patent Transparency and Improvements Act; Alerting and Exporting in Thomson Innovation;
Patent Analytics in Thomson Innovation; Non-Patent Prior Art on Thomson Innovation; Thomson
Data Analyzer Overview and Thomson Innovation Analyst Level Enhancements
 Innography – Introduction to Innography
Material Trainings – Texas Instruments Philippines Inc
 Role of Palladium in Reliability Improvement of PCC Wirebond on Aluminum Pad; Polymer
Chemistry; Organic Chemistry; Materials Science
Process Trainings – Texas Instruments Philippines Inc

4.  Optimizing Wirebond Reliability in Humidity Test by Optimizing Bonding Process, Process
Engineering Learning Series and Coaching, OMAP4460 TMV SME Certification; Plasma Process
Training; Process Failure Mode and Effects Analysis; Advanced Product Quality Planning; Error
Proofing Training; Equipment Failure Mode and Effects Analysis; Semiconductor Molding Process
Quality Trainings - Texas Instruments Philippines Inc
 Design of Experiments; M Shell Methodology: Countermeasure for Human Error; Measurement
System Analysis; Basic Failure Analysis; Reliability Statistics; 8D Scoring; DMAIC for Engineers; Basic
Reliability; Corrective Action/Preventive Action; Problem Solving and 3x5 Why; Quality Control Plan;
7QC Tools
Statistical Trainings - Texas Instruments Philippines Inc
 JMP; Spotfire; Minitab; Basic SQL (Database Query)
Soft Skills: Professional Business Communication, Personal Empowerment, Dale Carnegie Course, Improving
Personal Productivity
SPECIALIZED EXPERIENCE
 Software/Database: MS Office (Word, Excel, Powerpoint), Adobe Acrobat, Basic Auto CAD, JMP,
Spotfire, Minitab, Thomson Innovation, Thomson Data Analyzer, Innography
 Analytical Techniques: Optical Inspection and Imaging, Cross-Sectioning, Mechanical testing using
Universal Testing Machine (UTM), Chemical Resistance Testing, SEM, EDX, FTIR, XRD, XRF, AFM, DSC,
TGA, TMA, B-SCAN and X-RAY
 Fabrication Techniques: Hand Lay-up Process, Injection Molding, Compression Molding, Transfer
Molding
 Travel:
o Supplier Visit and Molding Equipment Evaluation for Fine Pitch Mold Technology Selection
(Japan – Kurume and Kyoto): March 18 – 24, 2013
o Technical Paper Presentation, 1st Asia Packaging Conference 2013
National Taiwan University (Taipei, Taiwan): July 11 – 12, 2013