1. Bruce Gittleman
6370 S. Jasmine Way, Centennial, CO 80111, 720-626-2173, brucegitt@comcast.net
Professional Summary and Qualifications
PhD with expertise in thin film deposition/device manufacturing, failure analysis, management of technical staff,
process/measurement equipment physics,thin film metrology, business/market development, customer and vendor relationships
Expertise in thin film coating of metals, alloys, nitrides, oxides, dielectrics, and optical films and use of scientific method to
optimize unit processes and manufacturing process flows
Experience managing, training, and mentoring engineers and technicians.
Ability to set the vision for and plan production operations, establish operating procedures, and set priorities
Strong communication skills utilized for program leadership, presentations, teaminteractions, customer engagement, and
explaining complex issues
Ability to promote company technology to expand current business and create new markets
Experience
Applied Science and Technology Consulting, LLC 2014 – present
Provider of expertise in thin film coating, process integration,Li ion thin film device fabrication, thin film capital equipment and
service industry business development,technical marketing, and customer engagement
Chief scientist for thin film Li ion optical device start-up.Responsible for creating and execution of strategic vision for product
fabrication, patent creation, investorcommunications, and vendorrelationship management.
Market/applications development (solar, thin film battery) for microwave annealing equipment company. Obtained demo
samples by educating prospective customers on unique attributes of product.
Developed pinhole defect detection application and marketing material for cathodluminescence equipment company
Analytical services provider business development
ITN Energy Systems, Littleton, CO 2011- 2014
Developer of green energy device technologies for creation of spin-off companies
Program Manager, Staff Scientist
Management responsibilities for Li ion thin battery and electrochromics projects. Mentored/supervised engineers.
Key interface with Fortune 50 company for battery fabrication as ITN program manager. Maintained customer satisfaction with
strategic planning, status reporting,meeting milestone and battery shipment deadlines, metric development, SOP creation.
Assisted with business development by bringing in new battery customer and meeting with prospective customers
Drove company-wide deposition equipment improvement effort resulting in uniform R2R processes,fasterequipment
turnaround,improved RF power delivery, 50x reduction in RF emissions, and elimination of critical equipment failures
Led program to improve quality and lead time of sputtertargets and substrates
Infinite Power Solutions, Littleton and Golden, CO 2008 – 2011
Start-up manufacturer of Li ion thin film batteries on flexible substrates
Process Engineering Manager
Managed process and equipment development, manufacturing operations,engineers / technicians, and SOP creation
Provided guidance to VP on manufacturing capability, resolving equipment issues,and cost and risk mitigation.
Managed team of consultants,software,hardware and engineers to improve production equipment. Effort increased productivity
5x, production throughput 3x, decreased downtime by 90%, enabling company to meet sales commitments.
Developed strategic plans to increase manufacturing output up to 10x and initiated plan implementation
Resolved production issues,including root cause analysis of product defect generation and equipment failures; implemented
metrics to monitor product quality and track known yield detractors.
Used statisticalanalysis to resolve process integration issues,understand impact of air exposure time on product performance,
and develop distribution of yielding cells as a function of as-fabricated open circuit voltage
Responsible for creating and implementing near and long term manufacturing and development schedules / priorities
HyperNex Inc. and Nova Measuring Instruments Microstructure Division, State College, PA 2004 - 2007
Start-up producer of automated x-ray diffraction metrology equipment for the semiconductor industry
Technical Marketing and Applications Engineering Manager
Supported sales through international and domestic travel with sales manager and CTO, creation of technical marketing collateral
and product demos. Managed customer applications support to produce a high level of customer satisfaction.
Key player in achieving equipment sales to top tier semiconductor companies that doubled installed base
Provided guidance to CTO and CEO on product penetration strategy,roadmap development, and new applications
Played pivotal role in identifying emerging nickel-silicide technology as killer application for product and driving product
changes necessary to meet customer requirements for application
Point of contact between customer engineers and company technologists for product feedback and future product specification
requirements. Educated customer engineers on company technology to obtain buy-in for new sales.
2. Tokyo Electron Arizona, Gilbert AZ 1998 - 2004
Second largest semiconductor equipment supplier. Division developed ionized PVD sputtering equipment for Cu metallization
Metrology Manager and Principal Engineer 2002 - 2004
Led metallization process development for customer engagement. Managed joint development with electroplating technology
partners. Responsible for uptime and scheduling of metrology and selection of vendors for outsourced analysis.
Created demo processes that produced high via chain yields, resulting in first customer module orders
Established TEL technology as a viable market product by performing comparative analysis of TEL and competitor technology
performance for TEL management
Developed process and metrology for Cu-oxide RIE
Developed in-house technique for quantifying via opening that reduced outsourced metrology costs by ~50%
Principal Engineer 1998 - 2002
Leader of technology development on R&D platform. Directed process development and hardware testing activities for second
generation tool. Developed budget for and managed analysis outsourcing.
Developed low via resistance diffusion barrier process that became an industry standard and created IP for company
Drove process and hardware development activities that established baseline operating space of first generation equipment and
resulted in creation of IP
Directed day shift development and demo activities on 2nd generation platform. Responsible for hand-off to second shift.
Led teams that identified the root cause of module deposition instability, particle defect generation, power transfer and software
issues.Resolved issues by working with engineering and software groups.
Materials Research Corporation, Semiconductor Sputtering Division, Gilbert, AZ 1995 - 1997
Manufacturer of magnetron sputtering equipment for the semiconductorindustry (purchased by Tokyo Electron in 1998)
Project Leader, Gilbert, AZ 1996 - 1997
Led development of Al metallization technology on production and concept equipment. Provided technical expertise to field process
organization to support customerbase.
Leadership role in transfer of technology from NY to AZ within schedule constraints
Key driver in bringing new deposition module to functional state,enabling company to engage key customer for product demos.
Accomplished goal by coordinating activities of hardware engineering and process development groups
Senior Process Engineer, Congers, NY 1995 - 1996
Led development of Al and barrier processes.Liaison to field process group to document process/equipment issues and monitor
competitor technology.Supported sales by producing technical marketing collateral and leading product demos.
Created white papers and marketing collateral for customer base. Presented at international customer education seminar.
Led team verifying long term performance of advanced module technology – documentation and presentation of results to
engineering organization resulted in production release and marketing collateral for marketing/sales team
Coordinated testing of product upgrades at customer sites that increased production yield by 3%, reduced wafer breakage and
decreased time between PMs, decreasing tool COO
Developed Ti/TiON and Ti/TiN diffusion barrier processes for US logic and memory companies that were put into production.
Obtained US patent for Ti/TiON process.
Education
PhD Applied Physics Rensselaer Polytechnic Institute, Troy, NY
Corporate and Government Sponsored Research projects
Bausch and Lomb
Successfully completed failure evaluation of multilayer optical coatings 6 months ahead of 2 year target; presentation
of results to division executives helped drive change to coatings,increasing product reliability
Ion assisted evaporation of low and high refractive index films and metals for optical multilayer coatings
IBM - Engineering of nickel microstructure to increase reliability of wire bonding
M.S. Physics University of Arizona, Tucson, AZ, B.S. Engineering Physics Lehigh University, Bethlehem, PA
Co-holder of 7 US Patents and 1 patent application
Co-author of chapter in "Modeling, characterization, and production of nanomaterials: electronics, photonics and energy
applications"
Committee member for IEEE conference Reliability Science for Advanced Materials and Devices