This document contains a resume for Nethyanathan Subramaniam, a 27-year-old Malaysian citizen seeking a position in engineering. He has a Bachelor's degree in Electronics majoring in Telecommunications from Multimedia University and over 5 years of experience working in semiconductor manufacturing. His most recent role is as a Process Engineer at Samsung SDIEM, where he works to control manufacturing processes and enhance yields through design of experiments and quality improvement projects.

1. NETHYANATHAN SUBRAMANIAM
No.24, Lorong 4, Taman Sri Permata,
71450 Sungai Gadut, Negeri Sembilan,
Malaysia.
Mobile Number: +60102099544
Email: netzz89_klikz@yahoo.com.my
To obtain a challenging career and growth oriented position in an organization that recognizes
and values individual contribution.
 An enthusiastic graduate with more than a year of working experience in semiconductor
field and also in Electronics & Energy field.
 Having Bachelors of Engineering (Hons) Electronics majoring in Telecommunications.
 Acquired with highly motivated and leadership skills and always willing to innovate the
new things which can improve the existing technology.
 Skilled in Circuit implementation the electronic components and Energy based devices.
 Eager to learn the new trends and techniques of electronic methodologies.
Examination Institution Years of Passing Grading
B.Eng (Hons)Electronics
majoring in
Telecommunications
Multimedia University,
Malacca
2015 2.41
Diploma in
Telecommunication
Engineering
Multimedia College,Kuala
Lumpur
2009 3.04
SPM Rantau Secondary School 2006 4 A’s and 4 B’s
PMR Rantau Secondary School 2004 2 A’s and 6 B’s
Career Objectives
Profile Summary
Education

2. A part of academic program, I also have been participated in extra-curricular activities such as:
 Certificate of Free Movement Martial Arts Academy : 1998
 Winner of poem writing competition in Tamil language carnival in state level : 2001
 Best student award in Program After UPSR : 2001
 Certificate of participation in Tamil language carnival in district level : 2005
 Prefect Leadership program at Sri Menanti Resort : 2005
 Winner of district level debate competition : 2006
 Certificate of participation in district level English drama competition : 2006
 High committee of Tamil Schools Transformation Program (NGO) : Since 2011
 High committee of Youth Revolution (NGO) : Since 2011
 Member of Engineer Society in Multimedia University : 2012
 Champion of Intervarsity Dance Competition in 2013 : 2013
 Director of national level Tamil Classical Instrument competition : 2012
 Certificate of achievement in Wirebond Yield Enhancement Project from
Texas Instruments Electronics Malaysia (TIEM) : 2014
 First Level of 7 QC Tool (SAMSUNG SDIEM) : 2015
The university final year project was fully based on semiconductor yield enhancement project as
below:
TITLE: Design of Ground Wire Removal for QFN 48 Leads and above packages
DESCRIPTION:
This project fully has been taken place at one of the established semiconductor company which
is Texas Instrument Electronics Malacca. QFN is one of the demanded package in TIEM and
also most of the semiconductor industry in worldwide. The ideal concern of the project is QFN
package which contains 64 leads. On 2013, there was plenty of lot scrap cases on QFN recorded
due to wire touching defects with history and design rule check failure on wire crossing issues.
The aim of the project is an enhancement of wire layout in terms of designing a new wire layout
by removing ground wires which match on historical and design rule failure. On the other hand,
this project is also to eliminate lot scrap due to wire touching defects at test department. Overall
this project upgraded the quality of QFN package with zero wire touching defects in Texas
Instruments.
Achievements
Project Profile

3. General Skills
I am a quick learner with the ability to grasp new updates. Adapt to situation and work load in a
quite fast and effective manner is my added ability. Deal with working colleagues and customers
in a diplomatic way, and willing to work as part of a team and also independently. Moreover, I
have good organizational and administrative skills.
Computer Skills
Microsoft Word, Power Point, Windows, Excel, Access, Multimedia, Visual basic 6.0,C and
C++ Language, Eagle 6.3, Mathlab, Scilab and PSpice Software.
Tools and System Analysis Skills
7 QC Tools, 6 Sigma, MiniTab, DMAIC, DOE, SEM Analysis, VM Analysis, CT Scan, AQMS
System and PLM System.
Language Proficiency
Language Speaking Writing
English Excellent Excellent
Malay Excellent Excellent
Tamil Excellent Excellent
French Beginner Beginner
Skills and Languages

4.  Name of School : S, J, K, (T) Rantau, Rantau, Negeri Sembilan
Year : 2007 (April – July)
Position : Teacher
Salary : RM 37.50(per day)
Reason of Leaving : To continue higher studies
 Name of Industry : NXP Semiconductors
Year : 2010 ~2011 (1 year 6 months)
Department : Assembly Production (Front End)
Position : Technician
Salary : RM 1250.00
Reason of Leaving : To continue undergraduate studies
Job Description : The job taken place at front of line (FOL) production
department where primal semiconductor
process such as wafer fabrication, die attach and wire
bonding being execute. As a technician the concern is
programming the die attach and wirebonding placement
according to the package and device requirement and
also troubleshooting the machine.
Working Experience

5.  Name of Industry : Texas Instruments Electronics Malaysia (TIEM)
Year : 2014 (February – June)
Department : Front of Line Process Engineering (FOL)
Employment Status : Internship trainee
Position : Process Engineer (Trainee)
Allowance : RM 900.00
 Name of Industry : Texas Instruments Electronics Malaysia (TIEM)
Year : From 2014 (June) until 2015(February)
Department : Front of Line Process Engineering (FOL)
Employment Status : Project Holder
Position : Process Engineer
Description : Mainly focused on Assembly Wirebond projects which
known as Design of Ground Wire Removal for QFN
48 Leads and above packages.Analyze the wirebonding
layout and restructured back with enhanced layout
which could improve the process yield. Deals with
DOE’s,FA report,VM analysis and DMAIC.

6.  Name of Industry : SAMSUNG SDIEM
Year : May 2015 until Present
Department : Polymer Process Engineering
Position : Process Engineer
Basic Salary : RM 2900.00
Job Description : SAMSUNG is a Cell manufacturing company.
Therefore, as a Process Engineer always have to control
the process by finding or implementing advance method
to reduce the defects. Deal with Capacity, Resistance
and Current to enhance the process flow in an
innovative way. Also, troubleshoot the machine to
reduce the machine failures and shutdown problem.
Hands on with more DOEs in project basis.

7. Date of Birth : 01 February 1989
Age : 27
Nationality : Malaysian
Marital Status : Unmarried
Sex : Male
Location Preference : Anywhere
Expected Salary : RM3500 (within Malaysia)
SGD3000 (Singapore and other Overseas)
Madam. Shamini Sachithanandan
Asistant Manager/Lecturer
Education Unit
Multimedia College
Jalan Gurney Kiri, 54100
Kuala Lumpur, Malaysia.
Tel (H/P): 0132015808
Dato V.S. MOGAN
B. Ed Majlis Mesyuarat Kerajaan Negeri Sembilan
(N.S. State Executive Councillor)
ADUN Jeram Padang,
Pengerusi Jawatankuasa Bertindak
Hal Ehwal Perladangan, Sumber Manusia,
Alam Sekitar dan Pengaduan Awam.
Tingkat 1, Blok C,
Wisma Negeri,
70503 Seremban,
Negeri Sembilan Darul Khusus.
Tel (H/P): 0126613966
Additional Information
References