1. William Kent
13 Commons Blvd Cell: 518-618-5735
Halfmoon, NY 12065 wrk00@yahoo.com
LEAN Equipment and Process Engineering Manager / Process Engineer / Manufacturing Environment
SUMMARY OF WORK EXPERIENCE: Fifteen years as semiconductor process engineer; Ten years high volume manufacturing engineering
management of up to seventy equipment and process engineers and technicians - Three direct report section managers and administrative
assistant. CORE Competencies: Titles: Engineering Manager, Equipment / Process Engineering Manager/ Maintenance Supervisor, Process
Engineer; Budget Management and reduction using lean manufacturing, value stream principles; responsible for up to a $34 million annual
budget; saved $50 M capital spending over three years by tool repurposing, Equipment Maintenance Budget reduced 66% saving $1.4 million
annually; Personnel Management: Process, Equipment Engineers, Equipment Maintenance Technicians, Administrative Assistants: Individualized
career development, performance reviews and progress updates, established cross training program implemented site wide, defined new
positions, methods for goal setting, and career path development plus empowerment; team goal setting and vision, manage daily work and
projects; Project Management: Capacity improvement, cost reduction and quality improvement, continuous process and equipment
improvement, factory start up, tool selection, purchase specification, vendor negotiation, source inspection, installation, qualification, release to
manufacturing; Manufacturing management: Capacity modeling, tool dedication, process qualification, daily product movement, WIP bottleneck
reduction, operator specification, workspace optimization; Engineering Methods: Practical application of: Statistical Process Control, Design of
Experiments, Six Sigma Methods, Failure Mode and Effects Analysis, Total Productive Maintenance, Overall Equipment Effectiveness, Lean, 3S and
6S, 8D, Fishbone, Process Control Set-up, Correlation of in-line and tool monitoring to product performance, Quality Systems Management, and
Safety Compliance
CAREER ACCOMPLISHMENT HIGHLIGHTS:
• Leading team of Process Engineers developing leading edge etch processes across multiple technologies at GLOBALFOUNDRIES
• Capital repurposing at GLOBALFOUNDRIES saving $50 million over 3 years.
• Best in class defect performance across owned toolsets at GLOBALFOUNDRIES
• Staffed and coordinated start-up training for all Etch shift technicians and engineers at GLOBALFOUNDRIES
• Budget reduced within one quarter to save $1.4 million annually at Hynix
• 50% increase in module production capacity that reduced line cycle time by 7% at International Rectifier
• Implemented site-wide 2nd
source parts program saving $2.5 million annually with no quality impact at IDT
• 8” Factory start-up, tool purchase contract negation, installation and qualification; ISO9000/14000 lead & internal auditor at Hyundai
Semiconductor
• Defensive Publication for polysilicon doping with phosphorous process: Rs uniformity 50% better at Motorola
• Cross-functional team builder, effective in many roles, work with integrity and vision, produces strong income in all positions
PROFESSIONAL EXPERIENCE:
Senior Section Manager Process Engineering – Fab 8 Etch 2013– Present
Global Foundries, Malta, NY
Responsible for the development and performance of a team of process engineers covering BEOL RIE Etch processes. Responsibilities over
100+ chambers across 6 platforms include cost reduction, tool qualification, yield, capacity improvements, excursion prevention, project
prioritization and management. Accomplish focus tasks via collaboration internally with shift support and Equipment Engineering, externally
with OEM, plus Industrial, QA, Customer, and Yield Engineering. Close relationship with Product Integration working toward yield
improvements. Hit all process indices, defect reduction and scrap related goals. Repurposed three tool platforms saving $50 million in capital.
Leading effort to provide training for shift support on key projects such as FDC implementation, ERF comprehension, process knowledge and
OCAP application. Driving priority projects such as chamber matching, SPC maturity, improved in-line measurement correlation to product
physical attributes.
Section Manager Manufacturing Operations – Fab 8 Etch 2010 – 2012
Global Foundries, Malta, NY
Responsible for staffing and training a team of engineers and technicians to successfully start-up the Etch area, qualify tools for production
release and support product movement 24x7. Set vision of cooperation and mutual success with clear expectations of performance. Defined
training goals, measure certification progress, analyze training gaps, improve the coverage and training opportunities, and successfully control
our process and tool performance. Lead cross-functional teams to achieve modular alignment on training goals and tracking, job descriptions
and requirements. Supported engineering by generating specifications for tool maintenance and process OCAPs; Established key financial
tracking indices to meet module spending goals. Lead team responsible for manufacturing Fab 8 start up wafers in Fab1.
Equipment and Process Engineering (Module) Manager - Etch 2007 to 2009
Hynix Semiconductor, Eugene, OR
 Equipment Maintenance Budget reduced 66% saving $1.4 million
 Tool Uptime Improved 3% in two quarters, established facility
 Scrap reduced 82% saving $370K Quarter to Quarter
Promoted from Diffusion Equipment Section Manager to Etch Module manager; Responsible for quality product from the Etch Processing
Module of 140 complex production tools, in a high volume, vigorous DRAM environment. Lead a team of ninety technical support personnel:
one process and two equipment section managers, twenty-three process and equipment engineers, sixty technicians, and administrators,
manage an annual budget of over $34 million; Defined ownership and roles, reorganized group and shift coverage for better manufacturing
floor coverage, set expectations, and provided daily direction; Established training certification matrix for Equipment and Process Technicians;
focused on team work and improved group interaction to foster a cooperative, empowered environment; Hit WIP movement, and tool
availability goals, implement an organized, transparent, 2nd
source spare parts qualification program; Implemented systematic engineering for
continuous improvement, root cause analysis, corrective action, daily task follow-up

2. William Kent
Equipment and Process Engineering (Module) Manager - Diffusion Fab 1 & 2 2002 to 2007
International Rectifier, Temecula, CA
 Increased equipment availability by 5% while absorbing a 20% reduced headcount.
 Reduced product scrap 50% quarter to quarter
 Improved module specific tool uptime 30% via targeted tool refurbishment investment
 Increased module WIP throughput by 35%
 50% capacity increase on atmospheric processes, reduced total line cycle time by 7%
 Two orders of magnitude defect reduction at polysilicon deposition, results in 2% IGSS scrap reduction
 Reduced silane gas usage by 25% saving $100K annually
Recruited by IR Executive Management to update Diffusion Engineering practices to match higher technology devices recently
introduced into the product line; promoted 2004 to manage both Fab 1 and 2. Responsible for Engineering Management and
Manufacturing Support of the Diffusion Area in a high volume semiconductor production facility; Management of Technical
personnel, Budget control, and Engineering Support. Manage budget of $3,000,000 annually. Twenty-nine direct reports
including: one Process and two Equipment Engineers, twelve Equipment Maintenance Technicians, six Process Technicians, four
Technical Operators, and four Operator Specialists. Tools: Bruce Technologies International 7351 and 7355 horizontal furnaces,
Polyflow vertical quartz washers, APEX and JGA data capturing systems. Integrated personnel between two fabrication
facilities, implemented a preventative maintenance based program of certification and cross training later implemented company-
wide, implemented state of the art semiconductor practices, increased capacity, drove process improvement, in a cost effective
manner; Developed and base lined new wet and dry oxidation, drive, doping, LTO, and TEOS processes. Die yield
improvement projects include: reduction of field oxide stacking faults, reduction of EPI crystal slippage, and reduced formation
of poly ox voids. Participated in cross-functional teams to address customer returns, in-line product yield issues, product
development and release to manufacturing; Worked closely with R&D Design Engineering to develop and program new recipes
for furnace processing on Radiation Hardened, Power MOSFET, FRED, and Trench IGBT devices
Etch Equipment Engineering Section Manager 2000-2002
Integrated Device Technology, Hillsboro, OR
Responsible for Etch Equipment performance with a team of sixteen technicians and three engineers; reduced four million dollar
annual budget by 75%, improved MTBC by 20%, reduced poly etch defects by 50%, developed and drove site-wide second
source parts program that saved the company 4 million annually.
Initially Process Staff Engineer assisted to photo, changed control method to ten lot rolling average for X, Y and rotational offsets
by device, layer, and stabilized yield on CAM device 15% higher. Responsible for LAM, TEL and AMAT, Fusion etchers and
support equipment used for CAM, CIM, and SRAM device fabrication
Diffusion Equipment Engineering Section Manager 1996-2000
Hyundai Semiconductor America, Eugene, OR
From LPCVD Furnace Process Owner to Manager 1998; Successful Fab startup responsible for TEL Alpha 8 Furnaces; Managed
25 equipment technicians, 8 equipment engineers, 2 equipment supervisors, and vendors to improve tool performance, streamline
a 10 million dollar annual budget, achieve ISO 9000 & 14000 certification 1st
attempt, only U.S. Based Hyundai engineering
module rated best in company (including Korean Fabs) by Korean-based QA.
Senior Process Engineer 1989-1996
Motorola Semiconductor Products Sector, Austin, TX
Process Owner for gate, polysilicon deposition/doping, APCVD BPSG, Wet Bench Processing; used SPC, Taguchi and DOE
experiments to improve gate characteristics to 0 fails in 10000 write/erase cycles on EEPROM, article published on BPSG defect
reduction (below), drove cross-functional team of operators, equipment technicians to improve shift performance to fab best.
Sustained Eaton 1080 and Varian 6200 implanters with spectra, beam form, surface damage, four-pt probe and surface roughness
analysis
Engineer in Training, Process Engineer 1983-1985 & 1987-1988
Cypress Semiconductor, Honeywell Solid State Electronics Division, RCA Solid State Division
Sustained Diffusion, Implant and Metal Deposition manufacturing lines, drove process improvement via SPC, DOE, improved
poly uptime by 10% with faster thermal stabilization during profile via PID optimization with Cohen-Coon-Ziegler methods,
optimized atmospheric and LPCVD recipes, value sequencing, worked in cross-functional manner on Thermco TMX Furnaces,
PECVD, Eaton and Nova Implanters, Varian Metal Sputtering
Junior Engineer
Kaiser Engineers, Arlington, VA 1986-1987
Designed chemical clean line for US Navy Trident Refit Facility in King’s Bay, GA; Assured military specification (MIL) and
OSHA compliance in design for safety, purchase specification, cleaning materials and waste treatment and disposal; Also
performed machining tools shop floor layout, special foundation design, and on-site inspections.

3. William Kent
EDUCATION:
B.S. Chemical Engineering Degree, University of Alabama, Tuscaloosa, AL
Responsible for college tuition financed through full time employment
PUBLICATIONS/AWARDS:
“The Prevention of Auto Doping Induced Threshold Voltage Shifts”
SPIE The International Society for Optical Engineering; October 1, 1995
“APCVD Defects - Part 2: A Team and Design-of-Experiment Solution”
Semiconductor International; July 1995
“APCVD Defects - Part 1: Finding and Identifying the Culprit”
Semiconductor International; June 1995
“Two-Step Polysilicon Doping” Defensive Publication Award SC01629A
Motorola Technical Developments; April 1994
“Defect Reduction and Process Robustness Improvement Via Interdisciplinary D.O.E. in Atmospheric BPSG Films”
Technology and Business News; February 1994
“Defect Reduction and Process Robustness Improvement Via Interdisciplinary D.O.E. in Atmospheric BPSG Films”
Contamination Control - Symposium on Minienvironments and Symposium on Biocontamination Control Proceedings; May
1993
REFERENCES:
Upon Request