Facial Recognition Technology Market Research Report (Japanese)VIA Embedded
The latest advances in Facial Recognition Technology have been attracting a large audience. VIA’s aim is to understand the growing demand in the FRT market in order to provide better service for our customers
Facial Recognition Technology Market Research Report (Traditional Chinese)VIA Embedded
The latest advances in Facial Recognition Technology have been attracting a large audience. VIA’s aim is to understand the growing demand in the FRT market in order to provide better service for our customers
Facial Recognition Technology Market Research ReportVIA Embedded
The latest advances in Facial Recognition Technology have been attracting a large audience. VIA’s aim is to understand the growing demand in the FRT market in order to provide better service for our customers
VIA conducted an investigative survey to discover first-hand the emerging active optical cable trends. The survey questions concentrated on the broad themes of optical cable usage, desired optical cable properties and the likelihood of purchase.
VIA Technologies Inc. - In-Vehicle System Design & DevelopmentVIA Embedded
Rapid advances in computing, connectivity, and human-machine interfaces are redefining traditional vehicle usage and ownership models and stimulating demand for smart in-vehicle systems that enable trucking companies, taxi operators, and logistics providers to leverage the IoT to increase the efficiency of their fleets and deliver innovative new customer services. In addition to examining the key technology trends that are enabling the smart car revolution, this presentation will outline the holistic approach that embedded and IoT developers need to take in order to overcome the specific system design, development, and deployment challenges for smart in-vehicle applications across a broad spectrum of industries.
Remote Management of Embedded Android DevicesVIA Embedded
This presentation given by Tonny Shen, VIA Embedded Project Manager, provides an introduction to the standard Android application deployment process focusing on OTA update technology and then shifts to focus on how to make key modifications to meet the requirements for embedded deployments. The presentation ends with a look at the VIA DMS (Device Management System) and how it can effectively improve system maintenance efficiency and reduce total cost of ownership.
Breaking Through: Gaining Access to Legacy I/O Devices with AndroidVIA Embedded
This presentation given by Lunar Zhang, VIA Embedded Senior Engineer, focuses on the Android framework, starting with the basics of the HAL (Hardware Abstraction Layer) and how it interacts with JNI (Java Native Interface), to enable access to Android device drivers. Finally the presentation will introduce our VIA Smart ETK for Android, which provides a unified interface to enable I/O support across different hardware platforms, allowing developers to focus on their high level applications.
This presentation given by Zhaolin Wang, VIA Embedded Software Manager, provides an overview of the Android multimedia framework and then moves on to tackle critical areas such as enabling full support for RTSP and HTTP protocols, and optimizing the Android multimedia framework to match streaming server parameters, as well as shortening processing time (from start to initial playback) to ensure smooth playback, how to solve problems of clock drift (out of sync audio and video), and improving fault tolerance to avoid crashes and freezes due to corrupt data.
Selection and Integration of Embedded Display DevicesVIA Embedded
This presentation given by Jerry Wang, VIA Embedded Project Manager, provides a rundown of the most popular display devices used for embedded applications, then moves on to explain the fundamentals behind the display integration process including preparing the frame data, programming the GPU to communicate with a variety display interfaces, and finally optimizing the output display through debugging.
Skinning Android for Embedded ApplicationsVIA Embedded
This presentation given by Jack Liu, VIA Embedded Senior Software Manager, looks at some of the most commonly requested modifications we receive in order to make Android achieve the required behavior, look and feel for an embedded scenario, including changing the start-up screen image with a custom logo or animation, how to directly boot into an application, and removal of system bars to achieve full screen display mode behavior.
This presentation given by Jason Chen, VIA Embedded Technical Marketing Manager, provides our overall strategy and framework for enabling the rapid development of embedded Android devices for applications as diverse as industrial automation, HMI, entertainment, signage, and multi-screen video monitoring.
Presentation from the Embedded Conference Scandinavia (ECS2014) about the merits of the different embedded computing form factors... and the difficulties they have! There's one that we think comes out first among them!
VIA EPIA-P910-A Front I/O extender cardVIA Embedded
Hardware manual the Front I/O extender card for our popular EPIA-P910 quad-core x86 Pico-ITX board.
Get them at
http://www.viaembeddedstore.com/boards/x86-boards/via-epia-p910-10q-pico-itx.html
セル生産方式におけるロボットの活用には様々な問題があるが,その一つとして 3 体以上の物体の組み立てが挙げられる.一般に,複数物体を同時に組み立てる際は,対象の部品をそれぞれロボットアームまたは治具でそれぞれ独立に保持することで組み立てを遂行すると考えられる.ただし,この方法ではロボットアームや治具を部品数と同じ数だけ必要とし,部品数が多いほどコスト面や設置スペースの関係で無駄が多くなる.この課題に対して音𣷓らは組み立て対象物に働く接触力等の解析により,治具等で固定されていない対象物が組み立て作業中に運動しにくい状態となる条件を求めた.すなわち,環境中の非把持対象物のロバスト性を考慮して,組み立て作業条件を検討している.本研究ではこの方策に基づいて,複数物体の組み立て作業を単腕マニピュレータで実行することを目的とする.このとき,対象物のロバスト性を考慮することで,仮組状態の複数物体を同時に扱う手法を提案する.作業対象としてパイプジョイントの組み立てを挙げ,簡易な道具を用いることで単腕マニピュレータで複数物体を同時に把持できることを示す.さらに,作業成功率の向上のために RGB-D カメラを用いた物体の位置検出に基づくロボット制御及び動作計画を実装する.
This paper discusses assembly operations using a single manipulator and a parallel gripper to simultaneously
grasp multiple objects and hold the group of temporarily assembled objects. Multiple robots and jigs generally operate
assembly tasks by constraining the target objects mechanically or geometrically to prevent them from moving. It is
necessary to analyze the physical interaction between the objects for such constraints to achieve the tasks with a single
gripper. In this paper, we focus on assembling pipe joints as an example and discuss constraining the motion of the
objects. Our demonstration shows that a simple tool can facilitate holding multiple objects with a single gripper.
【DLゼミ】XFeat: Accelerated Features for Lightweight Image Matchingharmonylab
公開URL:https://arxiv.org/pdf/2404.19174
出典:Guilherme Potje, Felipe Cadar, Andre Araujo, Renato Martins, Erickson R. ascimento: XFeat: Accelerated Features for Lightweight Image Matching, Proceedings of the 2024 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) (2023)
概要:リソース効率に優れた特徴点マッチングのための軽量なアーキテクチャ「XFeat(Accelerated Features)」を提案します。手法は、局所的な特徴点の検出、抽出、マッチングのための畳み込みニューラルネットワークの基本的な設計を再検討します。特に、リソースが限られたデバイス向けに迅速かつ堅牢なアルゴリズムが必要とされるため、解像度を可能な限り高く保ちながら、ネットワークのチャネル数を制限します。さらに、スパース下でのマッチングを選択できる設計となっており、ナビゲーションやARなどのアプリケーションに適しています。XFeatは、高速かつ同等以上の精度を実現し、一般的なラップトップのCPU上でリアルタイムで動作します。